CN103379760A - Electronic product outer shell and manufacturing method thereof - Google Patents
Electronic product outer shell and manufacturing method thereof Download PDFInfo
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- CN103379760A CN103379760A CN201210127954XA CN201210127954A CN103379760A CN 103379760 A CN103379760 A CN 103379760A CN 201210127954X A CN201210127954X A CN 201210127954XA CN 201210127954 A CN201210127954 A CN 201210127954A CN 103379760 A CN103379760 A CN 103379760A
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Abstract
The invention provides an electronic product outer shell which comprises an amorphous substrate and ceramic patterns embedded in the substrate. The invention further provides a manufacturing method for the electronic product outer shell. According to the electronic product outer shell, the ceramic patterns are embedded in a specified portion in amorphous materials, the function of decoration is performed, and the shielding of signals by the outer shell made of the amorphous materials can be further improved. Further, due to the fact that ceramic is a high-end decorative product and is brittle and fragile, the ceramic is mixed with the amorphous materials, the advantages of both the ceramic and the amorphous materials can be achieved, and additional value of the overall product is improved.
Description
Technical field
The invention belongs to the electronic product field, relate in particular to a kind of electronic product casing and preparation method thereof.
Background technology
Non-crystalline material is a kind of high strength, high resiliency, wear-resistant, corrosion-resistant, high apparent mass, isotropic alloy, this kind material can be realized the newly net forming technology, can realize that Complex Parts is one-body molded, the precision part one-shot forming, can be the engineering staff better design freedom is provided, for parts are realized miniaturization, multifunction provides may.
The application major part of non-crystalline material concentrates on rotating shaft, slide rail etc. the vulnerable part at present.Because the product of non-crystalline material has the advantages such as intensity height, quality are light, its application in electronic product casing will be tending towards increasing.But because the interiors of products atomic arrangement of non-crystalline material is unordered, radiofrequency signal there is larger shielding action, can affects the electronic product signal.
Summary of the invention
The present invention provides good electronic product casing of a kind of signal and preparation method thereof for the technical problem of the electronic product casing shielded radio frequency effect of signals signal of solution non-crystalline material.
The invention provides a kind of electronic product casing, described shell comprises noncrystal substrate and is embedded in ceramic pattern in the matrix.
The present invention also provides a kind of preparation method of electronic product casing of the present invention, and the method comprises the injection molding that ceramic pattern is placed non-crystalline material, and then injection moulding namely obtains electronic product casing of the present invention.
The privileged site of electronic product casing of the present invention in non-crystalline material embeds ceramic pattern, not only play decoration function, and can improve the shell of non-crystalline material to the shielding of signal, pottery is high-end ornament in addition, easily split frangible, itself and high-intensity non-crystalline material are combined, both advantage of can getting both, the annex that improves overall product is worth.
Embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of electronic product casing, described shell comprises that the noncrystal substrate memory is embedded in the ceramic pattern in the matrix.
According to electronic product casing provided by the present invention, in order to make electronic product casing have better intensity, resistance to wear and corrosion resistance, preferably, described noncrystal substrate contains the aluminium of 3.2-3.8 Wt%, the Cu of 23-28 Wt%, 5.0-6.0 the Ni of Wt%, the impurity of＜3 Wt%, surplus is Zr.
According to electronic product casing provided by the present invention, have better intensity, resistance to wear and corrosion resistance in order to make electronic product casing, preferably, described noncrystal substrate resistivity is 1.8-1.9*10
-6Ω m.
According to electronic product casing provided by the present invention, have better intensity, resistance to wear and corrosion resistance in order to make electronic product casing, preferably, the bending strength of described noncrystal substrate is 2200-2500MPa; Hot strength is 950-1050MPa; Compression strength is 1450-1550MPa; Fatigue strength is 950-1050MPa.
According to electronic product casing provided by the present invention, have better intensity, resistance to wear and corrosion resistance in order to make electronic product casing, preferably, the impact toughness of described noncrystal substrate is 120-130KJ/m
2
According to electronic product casing provided by the present invention, have better intensity, resistance to wear and corrosion resistance in order to make electronic product casing, preferably, the Vickers hardness of described noncrystal substrate is 450-500Hv.
According to electronic product casing provided by the present invention, have better intensity, resistance to wear and corrosion resistance in order to make electronic product casing, preferably, described noncrystal substrate density: 6.8g/cm
3Thermal conductivity: 3-4W/m.K; Thermal coefficient of expansion: 7-13*10
-6K
-1Specific heat capacity: 1800-2200J/(Kg*K); Fusing point: 833-837 ℃; Tg:430-432 ℃; Magnetic permeability: 0.95-1.05.The modulus of described noncrystal substrate: 95-105GPa; Poisson's ratio: 0.34-0.36; Elastic strain: 1.8-2.2%;
According to electronic product casing provided by the present invention, described ceramic pattern can be LOGO, decorative pattern, geometric figure etc., and preferably, described ceramic pattern is paraffin, polyformaldehyde, Zirconium oxide powder and binding agent injection mo(u)lding.
The present invention also provides a kind of preparation method of electronic product casing of the present invention, and the method comprises the injection molding that ceramic pattern is placed non-crystalline material, and then injection moulding namely obtains electronic product casing of the present invention.
According to preparation method provided by the present invention, for make the electronic product smooth surface, preferably, Cai described method is carried out surface treatment to electronic product after also being included in the injection moulding.Described surface treatment comprises by polishing removes all burrs, and the polishing product surface reaches unanimity non-crystalline material matrix surface and ceramic pattern surface quality.
According to preparation method provided by the present invention, preferably, the preparation method of described ceramic pattern is for being paraffin, polyformaldehyde, Zirconium oxide powder and binding agent batch mixing, subsequently through extruding, injection moulding, degreasing, extraction, sintering.
Described batch mixing refers to burn according to product design the requirement of mistake rate, disposes according to a certain percentage material powder and binding agent, then evenly mixes in high-speed mixer, and mixing time can not be long, and temperature can not be too high, otherwise bonding agent can volatilize in a large number;
Described injection moulding refers to the rotation by screw rod, produces high-pressure, and the mixed material that certain fluidity is arranged in the screw rod is squeezed in the mold cavity, obtains having the process of the ceramic blank of definite shape after the cooling;
Described extraction is by physics, chemical method, with the process of the removal of the binding agent in the ceramic blank;
Described sintering refers to the ceramic blank except no-bonder is inserted in the sintering furnace, under hot conditions, and ceramic molecule generation lattice displacement, the space diminishes, and progressively fine and close process after sintering is finished, can obtain having the ceramic of higher hardness and intensity.
Electronic product casing of the present invention embeds ceramic pattern in the non-crystaline amorphous metal matrix, not only play effect attractive in appearance, improves the amorphous housing to the signal shielding effect of electronic product because pottery has simultaneously.
Below by specific embodiment the present invention is further described in detail.
Embodiment 1
The paraffin, polyformaldehyde, Zirconium oxide powder and the binding agent that configure are inserted in the high-speed mixer, 145 ℃ of material temperatures, the burning mistake rate of design is 15.18%, mixing time 30min;
Mixed material after handling well is placed injecting machine material tube, 60 ℃ of mould temperature are set, 160 ℃ of material temperatures, injection pressure are 100T, penetrate time 1.5s, cooling 10s; Mold closing injection ceramic powders mixed material, product is taken out in die sinking after the cooling, obtains ceramic blank;
The ceramic blank that injection moulding is finished places glass beaker, adds the salpeter solution of 30% volumetric concentration, until flood ceramic blank, at room temperature places 1h, makes that binding agent in the ceramic blank fully decomposes, stripping; Taking-up is dried;
Ceramic blank after will drying is placed in the sintering furnace, and setting the highest sintering temperature is 1500 ℃, and sintering 40h in air atmosphere takes out behind the insulation 2h, obtains the finished product ceramic pattern;
To cool off completely that ceramic pattern places non-crystalline material injection mo(u)lding mould, mould structure is that side is advanced glue, and material is special firm steel.Set clamp force 80T, one section 960 ℃ of fusion temperatures, two sections 1050 ℃, vacuum degree 150,100 ℃ of barrel temperatures, pumpdown time 12s, cooling time 2s, product is taken out in die sinking; Described noncrystal substrate contains the aluminium of 3.2 Wt%, the Cu of 25Wt%, and the Ni of 5.0Wt%, the impurity of 2Wt%, surplus is Zr.Resistivity is 1.9*10
-6Ω m.Bending strength is 2200MPa; Hot strength is 1000MPa; Compression strength is 1500MPa; Fatigue strength is 1000MPa.Impact toughness is 120KJ/m
2Hardness is 450Hv.
The die-cut water port of product that removes, burrs on edges is removed in polishing, and the polishing product surface, namely obtains phone housing A1.
Embodiment 2
The Zirconium oxide powder and the binding agent that configure are inserted in the high-speed mixer, 145 ℃ of material temperatures, the burning mistake rate of design is 15.18%, mixing time 30min;
Mixed material after handling well is placed injecting machine material tube, 60 ℃ of mould temperature are set, 160 ℃ of material temperatures, injection pressure are 100T, penetrate time 1.5s, cooling 10s; Mold closing injection ceramic powders mixed material, product is taken out in die sinking after the cooling, obtains ceramic blank;
The ceramic blank that injection moulding is finished places glass beaker, adds the salpeter solution of 30% volumetric concentration, until flood ceramic blank, at room temperature places 1h, makes that binding agent in the ceramic blank fully decomposes, stripping; Taking-up is dried;
Ceramic blank after will drying is placed in the sintering furnace, and setting the highest sintering temperature is 1500 ℃, and sintering 40h in air atmosphere takes out behind the insulation 2h, obtains the finished product ceramic pattern;
To cool off completely that ceramic pattern places non-crystalline material injection mo(u)lding mould, mould structure is that side is advanced glue, and material is special firm steel.Set clamp force 80T, one section 960 ℃ of fusion temperatures, two sections 1050 ℃, vacuum degree 150,100 ℃ of barrel temperatures, pumpdown time 12s, cooling time 2s, product is taken out in die sinking; Described noncrystal substrate contains the aluminium of 3.8 Wt%, the Cu of 23Wt%, and the Ni of 6.0Wt%, the impurity of 2.5Wt%, surplus is Zr.Resistivity is 1.85*10
-6Ω m.Bending strength is 2500MPa; Hot strength is 950MPa; Compression strength is 1450MPa; Fatigue strength is 1050MPa.Impact toughness is 130KJ/m
2Hardness is 500Hv.
The die-cut water port of product that removes, burrs on edges is removed in polishing, and the polishing product surface, namely obtains phone housing A2.
Embodiment 3
The Zirconium oxide powder and the binding agent that configure are inserted in the high-speed mixer, 145 ℃ of material temperatures, the burning mistake rate of design is 15.18%, mixing time 30min;
Mixed material after handling well is placed injecting machine material tube, 60 ℃ of mould temperature are set, 160 ℃ of material temperatures, injection pressure are 100T, penetrate time 1.5s, cooling 10s; Mold closing injection ceramic powders mixed material, product is taken out in die sinking after the cooling, obtains ceramic blank;
The ceramic blank that injection moulding is finished places glass beaker, adds the salpeter solution of 30% volumetric concentration, until flood ceramic blank, at room temperature places 1h, makes that binding agent in the ceramic blank fully decomposes, stripping; Taking-up is dried;
Ceramic blank after will drying is placed in the sintering furnace, and setting the highest sintering temperature is 1500 ℃, and sintering 40h in air atmosphere takes out behind the insulation 2h, obtains the finished product ceramic pattern;
To cool off completely that ceramic pattern places non-crystalline material injection mo(u)lding mould, mould structure is that side is advanced glue, and material is special firm steel.Set clamp force 80T, one section 960 ℃ of fusion temperatures, two sections 1050 ℃, vacuum degree 150,100 ℃ of barrel temperatures, pumpdown time 12s, cooling time 2s, product is taken out in die sinking; Described noncrystal substrate contains the aluminium of 3.5 Wt%, the Cu of 28Wt%, and the Ni of 5.5Wt%, the impurity of 1Wt%, surplus is Zr.Resistivity is 1.80*10
-6Ω m.Bending strength is 2300MPa; Hot strength is 1050MPa; Compression strength is 1550MPa; Fatigue strength is 950MPa.Impact toughness is 125KJ/m
2Hardness is 465Hv.The die-cut water port of product that removes, burrs on edges is removed in polishing, and the polishing product surface, namely obtains phone housing A3.
Comparative Examples 1
In non-crystalline material injection mo(u)lding mould, mould structure is that side is advanced glue, and material is special firm steel.Set clamp force 80T, one section 960 ℃ of fusion temperatures, two sections 1050 ℃, vacuum degree 150,100 ℃ of barrel temperatures, pumpdown time 12s, cooling time 2s, product is taken out in die sinking;
The die-cut water port of product that removes, burrs on edges is removed in polishing, and the polishing product surface, namely obtains phone housing B1.
Method of testing and result
The strong and weak test of signal: electronic product casing A1-A3 and B1 are contained in respectively on the same mobile phone, are not that good place dials 10086 at a signal then, and the signal of testing mobile phone the results are shown in Table 1.
Table 1
| ? | Signal |
| A1 | Signal is normal |
| A2 | Signal is normal |
| A3 | Signal is normal |
| B1 | Signal off and on |
As can be seen from Table 1, the phone housing that simple non-crystaline amorphous metal prepares is very strong to the shielding of signal, and the non-crystaline amorphous metal phone housing of increase ceramic pattern is very weak to the shielding of signal.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. an electronic product casing is characterized in that, described shell comprises noncrystal substrate and is embedded in ceramic pattern in the matrix.
2. electronic product casing according to claim 1 is characterized in that, described noncrystal substrate contains the aluminium of 3.2-3.8 Wt%, the Cu of 23-28 Wt%, and the Ni of 5.0-6.0 Wt%, less than the impurity of 3Wt%, surplus is Zr.
3. electronics according to claim 1 produces shell, it is characterized in that described noncrystal substrate resistivity is 1.8-1.9*10
-6Ω m.
4. electronic product casing according to claim 1 is characterized in that, the bending strength of described noncrystal substrate is 2200-2500MPa; Hot strength is 950-1050MPa; Compression strength is 1450-1550MPa; Fatigue strength is 950-1050MPa.
5. electronic product casing according to claim 1 is characterized in that, the impact toughness of described noncrystal substrate is 120-130KJ/m
2
6. electronic product casing according to claim 1 is characterized in that, the hardness of described noncrystal substrate is 450-500Hv.
7. electronic product casing according to claim 1 is characterized in that, described ceramic pattern is paraffin, polyformaldehyde, Zirconium oxide powder and binding agent injection mo(u)lding.
8. the preparation method of an electronic product casing claimed in claim 1 is characterized in that, the method comprises the injection molding that ceramic pattern is placed non-crystalline material, and then injection moulding namely obtains electronic product casing of the present invention.
9. preparation method according to claim 8 is characterized in that, described method also is included in injection and just after the moulding electronic product casing is carried out surface treatment.
10. preparation method according to claim 8 is characterized in that, the preparation method of described ceramic pattern is paraffin, polyformaldehyde, Zirconium oxide powder and binding agent batch mixing, subsequently through extruding, injection moulding, degreasing, extraction, sintering forms.
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| CN201210127954XA CN103379760A (en) | 2012-04-27 | 2012-04-27 | Electronic product outer shell and manufacturing method thereof |
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| CN201210127954XA CN103379760A (en) | 2012-04-27 | 2012-04-27 | Electronic product outer shell and manufacturing method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104746000A (en) * | 2013-12-31 | 2015-07-01 | 比亚迪股份有限公司 | Method for surface treatment of amorphous alloy |
| CN108220826A (en) * | 2017-12-29 | 2018-06-29 | 东莞颠覆产品设计有限公司 | A kind of non-crystaline amorphous metal shell |
| CN108213392A (en) * | 2018-01-22 | 2018-06-29 | 安徽新美格包装发展有限公司 | A kind of preparation process of novel can |
| CN108251766A (en) * | 2018-01-19 | 2018-07-06 | 东莞市坚野材料科技有限公司 | A kind of non-crystaline amorphous metal stent and preparation method thereof |
| CN108251767A (en) * | 2018-01-26 | 2018-07-06 | 深圳市锆安材料科技有限公司 | A kind of non-crystaline amorphous metal stent and preparation method thereof |
| CN108481653A (en) * | 2018-01-29 | 2018-09-04 | 东莞市立华塑胶制品有限公司 | A kind of production method and cell phone rear cover of cell phone rear cover |
| CN110777307A (en) * | 2019-09-30 | 2020-02-11 | 东莞市逸昊金属材料科技有限公司 | Amorphous alloy material, amorphous alloy structural member using amorphous alloy material and application of amorphous alloy structural member |
| CN110814505A (en) * | 2019-11-06 | 2020-02-21 | 成都精铖电子设备制造有限公司 | Manufacturing method of shell with high pressure resistance |
| CN113427005A (en) * | 2021-07-08 | 2021-09-24 | 深圳市泛海统联智能制造有限公司 | Metal powder injection molding feed, metal powder injection molding method and amorphous surgical clip |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104746000A (en) * | 2013-12-31 | 2015-07-01 | 比亚迪股份有限公司 | Method for surface treatment of amorphous alloy |
| CN104746000B (en) * | 2013-12-31 | 2018-10-16 | 比亚迪股份有限公司 | A kind of method of non-crystaline amorphous metal surface treatment |
| CN108220826A (en) * | 2017-12-29 | 2018-06-29 | 东莞颠覆产品设计有限公司 | A kind of non-crystaline amorphous metal shell |
| CN108251766A (en) * | 2018-01-19 | 2018-07-06 | 东莞市坚野材料科技有限公司 | A kind of non-crystaline amorphous metal stent and preparation method thereof |
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| CN108251767A (en) * | 2018-01-26 | 2018-07-06 | 深圳市锆安材料科技有限公司 | A kind of non-crystaline amorphous metal stent and preparation method thereof |
| CN108481653A (en) * | 2018-01-29 | 2018-09-04 | 东莞市立华塑胶制品有限公司 | A kind of production method and cell phone rear cover of cell phone rear cover |
| CN110777307A (en) * | 2019-09-30 | 2020-02-11 | 东莞市逸昊金属材料科技有限公司 | Amorphous alloy material, amorphous alloy structural member using amorphous alloy material and application of amorphous alloy structural member |
| CN110814505A (en) * | 2019-11-06 | 2020-02-21 | 成都精铖电子设备制造有限公司 | Manufacturing method of shell with high pressure resistance |
| CN113427005A (en) * | 2021-07-08 | 2021-09-24 | 深圳市泛海统联智能制造有限公司 | Metal powder injection molding feed, metal powder injection molding method and amorphous surgical clip |
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