CN103378023A - Electric apparatus with excellent exothermic and re-work performance and manufacture method thereof - Google Patents
Electric apparatus with excellent exothermic and re-work performance and manufacture method thereof Download PDFInfo
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- CN103378023A CN103378023A CN2013101294296A CN201310129429A CN103378023A CN 103378023 A CN103378023 A CN 103378023A CN 2013101294296 A CN2013101294296 A CN 2013101294296A CN 201310129429 A CN201310129429 A CN 201310129429A CN 103378023 A CN103378023 A CN 103378023A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Abstract
According to the electric apparatus, the cured film of silicone composition with thermal conductivity of more than 1.0 W/mK is formed with a thickness from 10 to 300 micrometers on an exothermic member and a heat-generating electronic component formed on the exothermic member and sealingly matched with the cured film. The performance is excellent, according to the manufacture method, CPU and other electric components are fixedly connected with radiators, radiation fins and other exothermic members tightly matched with silicone composition with thickness from 10 to 300 micrometers.
Description
Technical field
The present invention relates to exothermicity and excellent electronic installation and the manufacture method thereof of functionality (rework) again.
Background technology
The electronic units such as CPU of installing at printed base plate are because sending out thermogenetic temperature and rise sometimes hydraulic performance decline or breakage, therefore good heat release sheet material, the heat release fat of use thermal conductivity between electronic unit and heat release blade etc. when using.The heat release sheet material has the advantage that can install easily/remove, even but a glance of the surface of CPU, heat release blade etc. looks level and smooth, also have concavo-convex in the microcosmic observation, therefore actual fail to make heat release sheet material and these by positively driving fit of commissure, the air pocket layer, there is the rough sledding that does not have to bring into play exothermal effect as expectation in the result.In order to address this problem, also to have proposed to arrange on the surface of heat release sheet material pressure-sensitive adhesive layer etc. adaptation is improved, but not yet obtained sufficient result.Heat release fat is not subjected to the concavo-convex impact on the surface of CPU and heat release blade etc., follow well these by commissure, bring adaptation, but pollute other parts, if long-time use then the problems such as outflow of fat usually occur, and owing to be fat, therefore can not resemble and install simply/remove the sheet material, in the situation about removing, must be with wipings such as solvents.For loss of preventing fat etc., heat-curing type fat has also been proposed, but because it is being followed and fat is coated the heat generation electronic unit is disposing the program that makes its curing behind the heat release member, when therefore removing, must use the wipings such as solvent same with fat before solidifying, if will remove after solidifying, its solidfied material is destroyed, can not recycle.In addition, also propose in advance the exothermic material of heat-curing type to be coated the method for heat release member, but owing to need heating process, therefore needed cost and the time of heating process.
Have again, as the prior art related with the present invention, can enumerate following document.
The prior art document
Patent documentation
Patent documentation 1: JP 61-157569 communique
Patent documentation 2: Unexamined Patent 8-208993 communique
Patent documentation 3: No. 3580366 communique of patent
Patent documentation 4: No. 3948642 communique of patent
Patent documentation 5: JP 2011-138857 communique
Summary of the invention
The problem that invention will solve
Therefore, the object of the invention is to overcome above-mentioned shortcoming, provide exothermicity excellent and again electronic installation and the manufacture method thereof of functionality excellence.
Be used for solving the means of problem
The inventor to achieve these goals, repeatedly further investigation, found that, by on the surface of the heat release members such as radiator or fin with the room-temperature moisture cured type heat-conductive silicone composition thickness of film coated to 10～300 μ m in advance, do not carry out heating process and make its curing, then be disposed at the heat generation electronic unit, in this case, at heat release members such as radiator or fin, the room-temperature moisture cured type heat-conductive silicone oil/fat composition that adopts silk screen printing or metal mask printing will have the above thermal conductivity of 1.0W/mK is applied to the thickness of 10～300 μ m, should not carry out heating process by heat-conductive silicone composition, change the heat-conductive silicone solidfied material into, thereby can access exothermicity and the electronic installation of functionality excellence again, finish the present invention.
Therefore, provide following electronic installation and manufacture method thereof.
[1] electronic installation, it possesses: the cured film that on the heat release member, will have a room-temperature moisture cured type heat-conductive silicone composition of the thermal conductivity more than the 1.0W/mK form radiator body that 10～300 μ m thickness form and with the heat generation electronic unit of the above-mentioned cured film driving fit configuration of this radiator body.
[2] [1] described electronic installation, it is characterized in that above-mentioned room-temperature moisture cured type heat-conductive silicone composition contains: (A) two ends contain the organopolysiloxane, (B) curing agent, (C) thermal conductivity filler of hydroxyl or alkoxyl and (D) condensation catalyst.
[3] [2] described electronic installation, wherein, above-mentioned room-temperature moisture cured type heat-conductive silicone composition also contain by the organosilan shown in the following general formula (2) and/or by the organopolysiloxane shown in the following general formula (3) as the wetability improver,
R
2 aR
3 bSi（OR
4）
4-a-b （2）
In the formula, R
2Be the alkyl of carbon number 6～15, R
3Be the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, R
4Be the alkyl of carbon number 1～6, a be 1,2 or 3, b be 0～2 integer, the integer of a+b=1～3,
In the formula, R
5Have and R
4Identical implication, R
6Be the alkoxyl of carbon number 1～4, c is 5～100 integer.
[4] each described electronic installation of [1]～[3], wherein, the hardness after the curing of room-temperature moisture cured type heat-conductive silicone composition in the time of 25 ℃, adopt hardometer A type hardness tester meter, hardness is below 90.
[5] each described electronic installation of [1]～[4], wherein, the surface roughness after the curing of heat-conductive silicone composition is below the 10 μ m with center line average roughness (Ra) meter.
[6] manufacture method of electronic installation, it is characterized in that, after the heat-conductive silicone composition that will have an above thermal conductivity of 1.0W/mK is coated the heat release members such as radiator or fin and is reached the thickness of 10～300 μ m, in atmosphere, place, do not carry out heating process and after changing the heat-conductive silicone solidfied material into, the driving fit of heat generation electronic unit is disposed at this organosilicon solidfied material.
[7] manufacture method of [6] described electronic installation, it is characterized in that above-mentioned room-temperature moisture cured type heat-conductive silicone composition contains: (A) two ends contain the organopolysiloxane, (B) curing agent, (C) thermal conductivity filler of hydroxyl or alkoxyl and (D) condensation catalyst.
[8] manufacture method of [7] described electronic installation, wherein, above-mentioned room-temperature moisture cured type heat-conductive silicone composition also contain by the organosilan shown in the following general formula (2) and/or by the organopolysiloxane shown in the following general formula (3) as the wetability improver
R
2 aR
3 bSi（OR
4）
4-a-b （2）
In the formula, R
2Be the alkyl of carbon number 6～15, R
3Be the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, R
4Be the alkyl of carbon number 1～6, a be 1,2 or 3, b be 0～2 integer, the integer of a+b=1～3,
In the formula, R
5Have and R
4Identical implication, R
6Be the alkoxyl of carbon number 1～4, c is 5～100 integer.
[9] each described manufacture method of [6]～[8] wherein, adopts silk screen printing or metal mask printing that above-mentioned heat-conductive silicone composition is carried out film coated.
The effect of invention
According to electronic installation of the present invention, the room-temperature moisture cured type heat-conductive silicone composition film coated that will have the above thermal conductivity of 1.0W/mK reaches the thickness of 10～300 μ m in heat release members such as radiator or fin, then do not carry out heating process and after it is solidified, be disposed at the heat generation electronic unit, if because the configuration of this heat release member, arrange wrong, in the time of perhaps must removing for a certain reason, because the heat-conductive silicone solidfied material has solidified driving fit on the heat release member, even therefore remove the heat release member, the heat-conductive silicone solidfied material can not damage yet, to again dispose, when arranging, needn't again coating as heat release fat etc.It is like this, of the present invention that to remake usefulness (install/remove) property very excellent.The again functionality of heat release sheet material is also excellent, but for treatability is become well, makes sheet material self hardening, perhaps has to make its to a certain extent thickening in the situation of soft sheet material.In the situation of hard sheet material since with the adaptation variation of heat release member, so contact heat resistance variation lacks exothermicity.In addition, in the situation of soft sheet material, from the viewpoint of treatability, how can not become below the 300 μ m, in any case must make its thickening.If thickening, because the thermal resistance rising, so it also lacks exothermicity.Both excellences of again functionality of the present invention, exothermicity.
In addition, according to the manufacture method of above-mentioned electronic installation of the present invention, the radiator body crimping such as the radiator by the heat-conductive silicone solidfied material of the electronic unit such as CPU and 10～300 μ m thickness being solidified driving fit, fin are fixed, and can assemble.
Description of drawings
Fig. 1 is the longitudinal section of the semiconductor device that uses in the embodiments of the invention.
Fig. 2 is the longitudinal section of second half conductor means of using in the embodiments of the invention
The explanation of Reference numeral
1 substrate
2CPU
3 heat release members (fin)
The solidifying film layer of 4 heat-conductive silicone compositions
5 clips
6 substrates
7CPU
The solidifying film layer of 8 heat-conductive silicone compositions
9 heat release members
Embodiment
The present invention is electronic installation, wherein in advance the room-temperature moisture cured type heat-conductive silicone composition more than the 1.0W/mK is coated the thickness that the heat release member films such as radiator or fin reach 10～300 μ m, then, do not carry out heating process and after it is solidified, the radiator body that obtains is disposed at the heat generation electronic unit.
In addition, the thermal conductivity of this heat-conductive silicone composition is more than the 1.0W/mK, is preferably more than the 2.0W/mK, is generally the scope of 2.0～7.0W/mK.If too small, can't obtain required exothermic character.Have, the determination method of thermal conductivity is put down in writing like that among the embodiment as described later again.When the heat release member carried out film coated, coating process can be so-called printing-type with this heat-conductive silicone composition, preferred silk screen printing or metal mask printing.If the style of calligraphy characterized by hollow strokes etc. thinner than 10 μ m, occurs in the coating thickness of this heat-conductive silicone composition during coating, can not be coated with well, if thicker than 300 μ m, exothermicity lacks, and therefore can be 10～300 μ m, preferred 20～200 μ m.20～100 μ m more preferably.
Hardness after the curing of this heat-conductive silicone composition, fixed with hardometer A type hardness tester instrumentation in the time of 25 ℃, if hardness ratio 90 is hard, then with the adaptation variation of heat generation electronic component, preferred below 90.More preferably below 80.There is no particular restriction for its lower limit, is generally more than 1, is in particular more than 5.Surface roughness after the curing of heat-conductive silicone composition is with center line average roughness (Ra) meter, if large than 10 μ m, then with the adaptation variation of heat generation electronic component, so below the preferred 10 μ m.More preferably below the 5 μ m.There is no particular restriction for its lower limit, can be more than the 0 μ m.
Above-mentioned heat-conductive silicone composition, for example, contain:
(A) two ends contain hydroxyl or alkoxyl organopolysiloxane,
(B) curing agent,
(C) the thermal conductivity filler,
(D) condensation catalyst.
This heat-conductive silicone solidfied material obtains by at room temperature leaving standstill after coating, solidifying.The thermal conductivity of said composition is substantially the same with the thermal conductivity of the solidfied material that obtains.Below said composition is described.
(A) two ends contain the organopolysiloxane of hydroxyl or alkoxyl
(A) composition is the base polymer (host) of this composition, is the organopolysiloxane that two ends contain hydroxyl or alkoxyl.As the alkoxyl of the end that is positioned at this base polymer, can enumerate such as methoxyl group, ethyoxyl, isopropoxy, butoxy etc., from easiness, the cost aspect grade of making, preferred methoxyl group, in addition, 1～3 alkoxyl and terminal Si atomistic binding.As long as two ends have hydroxyl or alkoxyl, structure beyond it is not particularly limited, can be the curing such as organopolysiloxane of common straight chain shape and give elastomeric organopolysiloxane, as with the substituting group of silicon atom bonding, can enumerate methyl, ethyl, propyl group, butyl, amyl group, hexyl, the alkyl such as heptyl, the cycloalkyl such as cyclohexyl, vinyl, the thiazolinyls such as pi-allyl, phenyl, the carbon numbers such as aryl 1～8 such as tolyl, 1 valency alkyl of preferred carbon number 1～7, perhaps part or all of the hydrogen atom of these 1 valency alkyl is by the chlorine atom, fluorine atom, the chloromethyl that the halogen atoms such as bromine atoms replace, the 3-chloropropyl, the halo alkyl such as trifluoromethyl etc.
(A) viscosity under 25 of composition ℃ is 0.1～1,000Pas, is preferably 0.3～100Pas, more preferably 0.5～50Pas.If lower than 0.1Pas, the excess stickiness of final heat-conductive silicone composition reduces, and (C) sedimentation of the thermal conductivity filler of composition is accelerated.If higher than 1,000Pas, heat-conductive silicone composition becomes high viscosity, so coating worsens.Should illustrate that this viscosity is the value (together lower) with rotary viscosity design determining.(A) composition can use separately a kind, also can will also use more than 2 kinds.
(B) curing agent
(B) composition is silane compound, its (part) hydrolysate or (part) hydrolytic condensate that has in 1 molecule more than 3 with the hydrolyzable groups of silicon atom bonding, plays a role as the crosslinking agent of the present composition.As this silane compound, the preferred silane compound that uses by following general formula (1) expression.
R
1 eSiX
4-e （1）
In the above-mentioned formula (1), R
1Be carbon number carbon number 1～10 that do not replace or replace, preferred, more preferably 1～6, further preferred 1～3 1 valency alkyl independently, as the example, can enumerate straight chain shape alkyl, branch's chain-like alkyl, cyclic alkyl, thiazolinyl, aryl, aralkyl, haloalkyl, cyano group alkyl.As straight chain shape alkyl, can enumerate for example methyl, ethyl, propyl group, hexyl, octyl group.As branch's chain-like alkyl, can enumerate for example isopropyl, isobutyl group, the tert-butyl group, 2-ethylhexyl.As cyclic alkyl, can enumerate for example cyclopenta, cyclohexyl.As thiazolinyl, can enumerate for example vinyl, pi-allyl.As aryl, can enumerate for example phenyl, tolyl.As aralkyl, can enumerate for example 2-phenylethyl, 2-methyl-2-phenylethyl.As haloalkyl, for example can enumerate 3,3,3-trifluoro propyl, 2-(nine fluorine butyl) ethyl, 2-(17 fluorine octyl groups) ethyl.As the cyano group alkyl, can enumerate for example cyano ethyl.As R
1, be preferably methyl, phenyl, vinyl.
X is hydrolization group, but illustration alkoxyl, alkoxyl alkoxyl, alkene oxygen base, ketoxime base, acyloxy, amino, acylamino-, aminooxy group etc.As alkoxyl, alkoxyl alkoxyl, can be the group that halogen atom replaces, can enumerate for example methoxyl group, ethyoxyl, isopropoxy, butoxy, β-chloroethoxy, 2,2,2-trifluoro ethoxy, δ-chlorine butoxy, methoxy ethoxy etc.As alkene oxygen base, can enumerate such as different propenyloxy group etc.As the ketoxime base, can enumerate such as dimethyl ketone oximido, methyl ethyl ketone oximido, metacetone oximido etc.As acyloxy, can enumerate such as acetoxyl group, propionyloxy etc.As amino, can enumerate such as dimethylamino, diethylamino, normal-butyl are amino, cyclohexyl is amino etc.As acylamino-, can enumerate such as N-methyl acetylamino, N-ethyl acetylamino, N-butyl acetylamino, N-cyclohexyl acetylamino etc.As aminooxy group, can enumerate for example N, N-dimethyl aminooxy group, N, N-diethyl aminooxy group etc.As X, alkene oxygen base particularly preferably.
E is 0 or 1.
As these silane compounds, the concrete example of its (part) hydrolysate or (part) hydrolytic condensate, can enumerate tetramethoxy-silicane, tetraethoxysilane, methyltrimethoxy silane, ethyl trimethoxy silane, vinyltrimethoxy silane, 3,3,3-trifluoro propyl trimethoxy silane, the beta-cyano ethyl trimethoxy silane, tetraisopropoxysilan, four butoxy silanes, phenyltrimethoxysila,e, the octadecyl trimethoxy silane, four (β-chloroethoxy) silane, four (2,2, the 2-trifluoro ethoxy) silane, propyl group three (δ-chlorine butoxy) silane, the alkoxyl silicone alkanes such as methyl three (methoxy ethoxy) silane, the ethyl polysilicates, the oxyalkylsiloxane classes such as dimethyl tetramethoxy disiloxane, methyl three (methyl ethyl ketone oximido) silane, vinyl three (methyl ethyl ketone oximido) silane, phenyl three (methyl ethyl ketone oximido) silane, methyl three (metacetone oximido) silane, the ketoximinosilanes classes such as four (methyl ethyl ketone oximido) silane, methyl three (cyclohexyl is amino) silane, the amino silane classes such as vinyl three (normal-butyl is amino) silane, methyl three (N-methyl acetylamino) silane, methyl three (N-butyl acetylamino) silane, the acylamino-silanes such as methyl three (N-cyclohexyl acetylamino) silane, methyl three (N, N-diethyl aminooxy group) the aminooxy group silanes such as silane, methyl three (different propenyloxy group) silane, vinyl three (different propenyloxy group) silane, the alkene TMOS classes such as phenyl three (different propenyloxy group) silane, methyl triacetoxysilane, the acyloxy silane classes such as vinyltriacetoxy silane etc., their (part) hydrolysate, (part) hydrolytic condensate.
(B) composition can use separately a kind, also can will also use more than 2 kinds.
Being somebody's turn to do the use level of (B) composition, with respect to 100 mass parts (A), if lack than 1 mass parts, then not solidifying, if more than 30 mass parts, then be difficult to solidify, is the scope of 1～30 mass parts therefore, is preferably the scope of 1～20 mass parts.
(C) thermal conductivity filler
The thermal conductivity filler that has thermal conductivity as (C) composition, if the thermal conductivity that this filler has is less than 10W/m ℃, then the thermal conductivity self of room-temperature moisture tackify type heat-conductive silicone oil/fat composition diminishes, the thermal conductivity of therefore using filler as more than 10W/m ℃, preferred filler more than 15W/m ℃.As such thermal conductivity filler, can enumerate aluminium powder, copper powders may, silver powder, nickel by powder, bronze end, alumina powder, Zinc oxide powder, magnesium oxide powder, aluminium nitride powder, boron nitride powder, alpha-silicon nitride powders, diamond dust, carbon dust etc., if thermal conductivity is more than 10W/m ℃, it can be any filler, can be a kind, also can will mix more than 2 kinds.
If the average grain diameter of thermal conductivity filler is less than 0.1 μ m, sometimes do not become smectic, become the product that lacks extensibility, if larger than 300 μ m, sometimes the homogeneity of this heat-conductive silicone composition lacks, therefore, the scope of preferred 0.1～300 μ m, the more preferably scope of 0.1～200 μ m.The shape of filler can be unsetting, can be sphere, can be any shape.Should illustrate that the mensuration of average grain diameter is put down in writing like that among the embodiment as described later.
The loading of thermal conductivity filler, with respect to 100 mass parts (A) composition, if lack than 100 mass parts, then can't obtain required thermal conductivity, if than 2,000 mass parts is many, does not sometimes become smectic, becomes the product that lacks extensibility, therefore be 100～2, the scope of 000 mass parts is preferably the scope of 200～1,500 mass parts.
In addition, also can according to circumstances add fine silica powder end etc.
The fine silica powder end is the composition of giving the composition shape maintains.As the fine silica powder end, preferably use the surface treatment fumed silica.By carrying out surface treatment, for the dispersiveness raising of (A) composition, Uniform Dispersion becomes possibility.In addition, by between the surface treatment fumed silica and the surface treatment fumed silica with (A), the interaction of (B) composition, can give shape maintains.
As its surface conditioning agent, chlorosilane, silazane, siloxanes etc. are effective.As the concrete example of surface conditioning agent, can enumerate methyl trichlorosilane, dimethyldichlorosilane, trim,ethylchlorosilane, hexamethyldisiloxane, octamethylcy-clotetrasiloxane, α, ω-trimethyl silyl dimethyl polysiloxane etc.
In addition, the specific area at fine silica powder end (BET method) is preferably 50m
2More than/the g, be particularly preferably 100m
2More than/the g.If less than 50m
2/ g, the initial stage excess stickiness of this heat-conductive silicone composition raises sometimes, and workability worsens.Should illustrate, as specific area (BET method), from the rising of shape maintains performance, preferred 500m
2Below/the g, be particularly preferably 300m
2Below/the g.
The addition at fine silica powder end, with respect to 100 mass parts (A) composition, if lack than 10 mass parts, then can not have shape maintains, if more than 100 mass parts, then not become smectic, become the product that lacks extensibility, therefore be the scope of 10～100 mass parts, be preferably the scope of 10～50 mass parts, more preferably the scope of 10.1～45 mass parts.
(D) condensation catalyst
As (D) composition, use condensation catalyst.Wherein, but illustration dibutyltin diacetate, dibutyl tin laurate, the tin alkyl ester compounds such as two sad dibutyl tins, tetraisopropoxy titanium, four titanium n-butoxide, four (2-ethyl hexyl oxy) titanium, two (acetyl acetone) titaniums of dipropoxy, the titanate esters such as isopropoxy ethohexadiol titanium, two (ethyl acetoacetate) titaniums of diisopropoxy, two (methyl acetoacetate) titaniums of diisopropoxy, two (acetylacetone,2,4-pentanedione) titaniums of diisopropoxy, two (ethyl acetoacetate) titaniums of dibutoxy, the titanium chelate compounds such as two (ethyl acetoacetate) titaniums of dimethoxy, zinc naphthenate, zinc stearate, 2-ethyl zinc octoate, 2 ethyl hexanoic acid iron, the 2 ethyl hexanoic acid cobalt, 2 ethyl hexanoic acid manganese, cobalt naphthenate, the organic metal such as alkoxy aluminum compound (zinc, iron, cobalt, manganese, aluminium) compound, APTES, the aminoalkyl substituted alcoxyl base silanes such as N-β (amino-ethyl) gamma-amino propyl trimethoxy silicane, hexylamine, amines and the salt thereof such as phosphoric acid lauryl amine, the quaternary ammonium salts such as benzyl triethyl ammonium ammonium acetate, potassium acetate, sodium acetate, the alkali-metal lower aliphatic hydrochlorate such as lithium oxalate, dimethyl hydroxyl amine, the dialkyl group hydroxylamines such as diethyl hydroxylamine, tetramethyl guanidine radicals propyl trimethoxy silicane, tetramethyl guanidine radicals propyl group methyl dimethoxysilane, tetramethyl guanidine radicals propyl group three (trimethylsiloxy) silane etc. contains the silane of guanidine radicals or siloxanes etc., these are not limited to its a kind, and the mixture that can be used as more than 2 kinds or 2 kinds uses.Wherein, preferably use tetramethyl guanidine radicals propyl trimethoxy silicane, tetramethyl guanidine radicals propyl group methyl dimethoxysilane, tetramethyl guanidine radicals propyl group three (trimethylsiloxy) silane etc. to contain the silane of guanidine radicals or siloxanes etc.
(D) addition of composition is with respect to 100 mass parts (A) composition, if less than 0.01 mass parts, then becoming is difficult to solidify, if for surpassing the amount of 20 mass parts, then uneconomical, therefore be the scope of 0.01～20 mass parts, be preferably the scope of 0.1～10 mass parts.
Other compositions
In above-mentioned composition, also can as required, beyond above-mentioned neccessary composition, add as required the compositions such as wetability improver, bonding agent and heat-resisting improver.
For example, in order to improve the wetability of thermal conductivity filler and silicone ingredients, can use as required by following general formula (2):
R
2 aR
3 bSi（OR
4）
4-a-b （2）
(in the formula, R
2Be the alkyl of carbon number 6～15, R
3Be the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, R
4Be the alkyl of carbon number 1～6, a be 1,2 or 3, b be 0～2 integer, the integer of a+b=1～3.）
Shown organosilan.
As by the R in the general formula (2)
2The concrete example of the alkyl of shown carbon number 6～15 can be enumerated such as hexyl, octyl group, nonyl, decyl, dodecyl, myristyl etc.If carbon number is too small, then insufficient with the wetability of filler, if excessive, then this organosilan solidifies at normal temperatures, therefore process inconvenience, and the low-temperature characteristics of the composition that obtains reduces.In addition, a is 1,2 or 3, is particularly preferably 1.In addition, the R in the above-mentioned formula
3For the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, can enumerate such as alkyl, cycloalkyl, thiazolinyl etc., more specifically, can enumerate the alkyl such as methyl, ethyl, propyl group, hexyl, octyl group; The cycloalkyl such as cyclopenta, cyclohexyl; The thiazolinyl such as vinyl, pi-allyl; The aryl such as phenyl, tolyl; 2-phenylethyl, the 2-methyl-aralkyl such as 2-phenylethyl, 3,3,3-trifluoro propyl, 2-(nine fluorine butyl) ethyl, 2-(17 fluorine octyl groups) the halo alkyl such as ethyl, rubigan, particularly preferably methyl, ethyl.R
4Be the one kind or two or more alkyl of the carbon numbers 1～6 such as methyl, ethyl, propyl group, butyl, amyl group, hexyl, particularly preferably methyl, ethyl.
As the concrete example by the organosilan shown in the above-mentioned general formula (2), can enumerate following organosilan.
C
6H
13Si(OCH
3)
3、
C
1OH
21Si(OCH
3)
3、
C
12H
25Si(OCH
3)
3、
C
12H
25Si(OC
2H
5)
3、
C
10H
21Si(CH
3)(OCH
3)
2、
C
10H
21Si(C
6H
5)(OCH
3)
2、
C
10H
21Si(CH
3)(OC
2H
5)
2、
C
10H
21si(CH=CH
2)(OCH
3)
2、
C
10H
21Si(CH
2CH
2CF
3)(OCH
3）
2
As other compositions that can cooperate arbitrarily, can enumerate for example following general formula (3)
(in the formula, R
5Have and R
4Identical implication, R
6Be the alkoxyl of carbon number 1～4, c is 5～100 integer.) etc.
Use level when cooperating the wetability improver, with respect to 100 mass parts (A) composition, if lack than 0.1 mass parts, then effect is not enough sometimes, can not exhibit adhesiveness, if more than 50 mass parts, then do not observe fusible raising, also be uneconomic, so the scope of preferred 0.1～50 mass parts, the more preferably scope of 0.1～20 mass parts.
In addition; as bonding agent; in this heat-conductive silicone composition of the present invention, can cooperate to have to be situated between by carbon atom and the functional group that is selected from amino, epoxy radicals, sulfydryl, acryloyl group and methacryl of silicon atom bonding, and have silane compound and/or its partial hydrolysis condensation product with the hydrolization group of silicon atom bonding.This composition plays the fusible effect that improves the present composition and coating surface.
Exist in the situation of above-mentioned functional group more than 2 in this silane compound and partial hydrolysis condensation product thereof, they can be situated between by different carbon atoms and silicon atom bonding, also can be situated between by same carbon atom and silicon atom bonding.In addition, this silane compound and partial hydrolysis condensation product thereof have preferred 1～3, more preferably 2～3 hydrolization groups.As hydrolization group, but the illustration group same with the hydrolization group X in (B) formula of composition (1), wherein preferred alkoxyl.
Concrete example as above-mentioned silane compound; can enumerate 3-aminopropyl dimethoxy-methyl silane; the 3-TSL 8330; APTES; the 3-(2-aminoethylamino) propyl group dimethoxy-methyl silane; the 3-(2-aminoethylamino) propyl trimethoxy silicane; 2-aminoethylamino methyl dimethoxy oxygen ylmethyl silane; 2-aminoethylamino methyltrimethoxy silane etc. contains amino silanes; γ mercaptopropyitrimethoxy silane; γ-sulfydryl propyl-triethoxysilicane; γ-sulfydryl propyl group methyl dimethoxysilane; γ-sulfydryl propyl group methyldiethoxysilane etc. contains the silanes of sulfydryl; the 3-glycidoxypropyltrimewasxysilane; 3-glycidoxypropyl dimethoxy-methyl silane; 3-glycidoxypropyl ethyl trimethoxy silane; 3-glycidoxypropyl ethyl dimethoxy-methyl silane etc. contains the silanes of epoxy radicals, methacryloxypropyl trimethoxy silane; the methacryloxypropyl triethoxysilane; the methacryloxypropyl methyl dimethoxysilane; the acryloxy propyl trimethoxy silicane; acryloxy propyl-triethoxysilicane etc. contains the silanes of (methyl) acryloyl group etc.In addition, be not limited to a kind, the mixture that can be used as more than 2 kinds or 2 kinds uses.
Use level when cooperating bonding agent, with respect to 100 mass parts (A) composition, if lack than 0.01 mass parts, then effect is not enough sometimes, can not exhibit adhesiveness, if more than 30 mass parts, then do not observe fusible raising, also be uneconomic, so the scope of preferred 0.01～30 mass parts, the more preferably scope of 0.1～20 mass parts.
Among the present invention, except mentioned component, in the scope of not damaging purpose of the present invention, can add as the known additive of the additive of this heat-conductive silicone composition.As this additive, can enumerate such as the enhancements such as calcium carbonate, non-enhancement filler, as polyethers of thixotropy improver etc.In addition, can add pigment, dyestuff etc. as required.
Room-temperature moisture tackify type heat-conductive silicone oil/fat composition of the present invention can be modulated by adopting known method that above-mentioned each composition is mixed.Initial stage viscosity under 25 ℃ of this heat-conductive silicone composition that obtains is preferably 10～400Pas, is particularly preferably 50～300Pas.
The manufacture method of electronic installation of the present invention is to adopt silk screen printing or metal mask printing etc. that the above-mentioned composition printing is coated on fin or the radiator, then is not heating and curing, and obtains the heat-conductive silicone solidfied material.Room temperature after the coating is different because of the environment of coating thickness and placement standing time, about preferred 1 day～7 weeks.After the fin that obtains or the coating layer on the radiator be configured in heat generation electronic unit face, by making its driving fit or using the clamping such as clip and fixed press.
The exothermicity of the electronic installation that obtains like this is good, and functionality is excellent again.
Embodiment
By the following examples the present invention is described in further detail.
Respectively be determined as follows described carrying out shown in embodiment, the comparative example.
Carry out about test of the present invention is as described below.The mensuration of viscosity is used the model PC-1TL(10rpm of the マ of Co., Ltd. Le コ system society system) carry out, the TPA-501 that thermal conductivity adopts capital of a country electronics industry Co., Ltd. system all carries out under 25 ℃.In addition, particle size determination is the cumulative mean particle diameter of employing as the volume reference of the マ イ Network ロ ト ラ ッ Network MT3300EX mensuration of the grain size analysis meter of Nikkiso Company Limited's system.
Again functionality test:
For the semiconductor device with the formation shown in Fig. 1, PC is applied the voltage of 12.0V, with (the infrared radiation thermometer IT-2-50 of strain) キ ー エ Application ス society measures the heating temp of fin.Measuring temperature is the temperature that reads after heatsink temperature is stablized.
With implemented embodiment 1～8 and comparative example 1,2 fin installation, remove and repeat 5 times, relatively the 1st time and the 5th of the temperature of fin.At this moment, the replacing of exothermic material or again the coating etc. do not carry out fully.
Determination of Hardness after the curing:
Be coated with heat-conductive silicone composition so that thickness is 3mm at the vinyl plastics sheet material.Become smoothly the surface this moment, then left standstill, places 1 week under 23 ± 2 ℃/50 ± 5%RH environment, and heat-conductive silicone composition is solidified.After the thermal conductivity solidfied material that solidifies peeled off from the vinyl plastics sheet material, with 2 overlapping, as to decide solidfied material with hardometer A type hardness tester instrumentation hardness.Should illustrate that the temperature during mensuration is 25 ℃.
Center line average roughness after the curing of heat-conductive silicone composition (Ra) is measured:
Use noncontact surface roughness measurement device, the model NH120S of Mitaka Kohki Co., Ltd.'s system, measure center line average roughness (Ra).But, significantly scar etc. is removed from measure.
Form 1～8
(A)～(D) composition with the mixing as described below of the use level shown in the table 2, has been obtained the composition of embodiment and comparative example.Namely, in 5 liters of gate mixers (Co., Ltd. of aboveground making institute system, trade name: pack into 5 liters of planetary-type mixers (5 リ ッ ト Le プ ラ ネ タ リ ミ キ サ ー)) (A), (C) composition, further add as required the fine silica powder end, 150 ℃ of lower degassed mixing 3 hours.Then, be cooled to become normal temperature, add (B), (D) composition, and then add as required wetability improver or bonding agent, at room temperature degassed mixing is to reach even.For the composition that obtains, adopt the hardness after the method evaluation viscosity shown in above-mentioned, thermal conductivity, the curing.
(A) composition
Viscosity under A-1:25 ℃ is 5Pas, two terminal with hydroxy-end capped dimethyl polysiloxane
Viscosity under A-2:25 ℃ is 20Pas, two terminal with hydroxy-end capped dimethyl polysiloxane
Viscosity under A-3:25 ℃ is 1Pas, two terminal dimethyl polysiloxanes with the trimethoxysilyl end-blocking
Viscosity under A-4:25 ℃ is 20Pas, two terminal dimethyl polysiloxanes with the trimethoxysilyl end-blocking
(B) composition
B-1: phenyl three (different propenyloxy group) silane
B-2: vinyl three (different propenyloxy group) silane
(C) composition
Use 5 liters of gate mixers (Co., Ltd. of aboveground making institute system, trade name: 5 liters of planetary-type mixers), the thermal conductivity filler shown in following is at room temperature stirred 15 minutes with the mixing ratio shown in the following table 1, thereby obtained C-1, C-2.
The alumina powder of average grain diameter 10 μ m (thermal conductivity: 27W/m ℃)
The aluminium powder of average grain diameter 15 μ m (thermal conductivity: 236W/m ℃)
The Zinc oxide powder of average grain diameter 1.0 μ m (thermal conductivity: 25W/m ℃)
[table 1]
(D) composition
D-1: tetramethyl guanidine radicals propyl trimethoxy silicane
D-2: two (ethyl acetoacetate) titaniums of diisopropoxy
Fine silica powder end 1
The F-1:BET specific area is 120m
2/ g, carried out the dry type fumed silica that hydrophobization is processed with dimethyldichlorosilane
Wetability improver 1
By the organosilan shown in the following formula
C
10H
21Si（OCH
3）
3
Be the organopolysiloxane of 0.03Pas by the viscosity under 25 ℃ shown in the following formula
(Me: methyl)
Bonding agent 1
The following silane that contains amino
APTES
[table 2]
[embodiment 1]
Use the metal mask printing of thick 50 μ m, being coated on the fin with the square heat-conductive silicone composition printing that will obtain with the composition 1 of table 1 of 30mm * 30mm on the fin, at room temperature leave standstill, place a week.The center line average roughness (Ra) of this moment is 4.2 μ m.Use it to carry out remaking with test.
[embodiment 2]
Except the composition 2 with table 1 has carried out the metal mask printing of thick 70 μ m, carried out all the program identical with embodiment 1.The center line average roughness (Ra) of this moment is 4.8 μ m.
[embodiment 3]
Carried out all the program identical with embodiment 1 with the composition 3 of table 1.The center line average roughness (Ra) of this moment is 4.1 μ m.
[embodiment 4]
Except the composition 4 with table 1 has carried out the metal mask printing of thick 100 μ m, carried out all the program identical with embodiment 1.The center line average roughness (Ra) of this moment is 4.0 μ m.
[embodiment 5]
Except the composition 5 with table 1 has carried out the metal mask printing of thick 30 μ m, carried out all the program identical with embodiment 1.The center line average roughness (Ra) of this moment is 3.9 μ m.
[embodiment 6]
Carried out all the program identical with embodiment 1 with the composition 6 of table 1.The center line average roughness (Ra) of this moment is 4.2 μ m.
[embodiment 7]
Carried out all the program identical with embodiment 1 with the composition 7 of table 1.The center line average roughness (Ra) of this moment is 4.3 μ m.
[embodiment 8]
Carried out all the program identical with embodiment 1 with the composition 8 of table 1.The center line average roughness (Ra) of this moment is 4.1 μ m.
[comparative example 1]
Use the metal mask printing of thick 50 μ m, be coated on the fin printing with the square heat-conductive silicone fat with viscosity 170Pas, thermal conductivity 3.1W/mK of 30mm * 30mm on the fin.The center line average roughness (Ra) of this moment is 4.2 μ m.
[comparative example 2]
The hardness 80 of use hardometer A type, the heat conductive sheet of thermal conductivity 5W/mK, thick 200 μ m are as exothermic material.The center line average roughness (Ra) of this moment is 1.9 μ m.
[table 3]
[table 4]
Even after confirming embodiment all low and the 5th being installed temperature rise also little, even remake with after also can guarantee required exothermicity.
[embodiment 9]
Fig. 1 is the longitudinal section of the semiconductor device of an example of expression electronic installation of the present invention.As shown in fig. 1, this semiconductor device is by the CPU2 that installs at substrate 1, consist of at the solidifying film layer 4 of heat release member 3 that CPU2 arranges, the heat-conductive silicone composition that arranges between these CPU2 and heat release member 3.Heat release member 3 is essentially aluminum, improves exothermic effects for surface area is broadened, and becomes blade-carrying structure.In addition, heat release member 3 and substrate 1 usefulness clip 5 clamps and fix, heat release member 3 print in advance be coated with afterwards, the solidfied material layer 4 of the heat-conductive silicone composition that is heating and curing is being pushed between CPU2 and heat release member 3.The thickness of the heat-conductive silicone solidfied material of this moment is 50 μ m.
[embodiment 10]
Fig. 2 is the longitudinal section of the semiconductor device of another example of expression electronic installation of the present invention.By the CPU7 that installs at substrate 6, consist of at the CPU7 heat release member 9 that solidifying film layer 8 by heat-conductive silicone composition arranges that is situated between.The heat-conductive silicone solidfied material here is to be coated with product rear, that be heating and curing in 9 printings of heat release member in advance.At this, heat release member 9 is copper, at surface-coated nickel.The thickness of the heat-conductive silicone solidfied material of this moment is 25 μ m.
Claims (9)
1. electronic installation, it possesses: the cured film that on the heat release member, will have a room-temperature moisture cured type heat-conductive silicone composition of the thermal conductivity more than the 1.0W/mK form radiator body that 10～300 μ m thickness form and with the heat generation electronic unit of the above-mentioned cured film driving fit configuration of this radiator body.
2. electronic installation claimed in claim 1 is characterized in that, above-mentioned room-temperature moisture cured type heat-conductive silicone composition contains:
(A) two ends contain hydroxyl or alkoxyl organopolysiloxane,
(B) curing agent,
(C) the thermal conductivity filler and
(D) condensation catalyst.
3. electronic installation claimed in claim 2, wherein, above-mentioned room-temperature moisture cured type heat-conductive silicone composition also contain by the organosilan shown in the following general formula (2) and/or by the organopolysiloxane shown in the following general formula (3) as the wetability improver,
R
2 aR
3 bSi（OR
4）
4-a-b （2）
In the formula, R
2Be the alkyl of carbon number 6～15, R
3Be the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, R
4Be the alkyl of carbon number 1～6, a be 1,2 or 3, b be 0～2 integer, the integer of a+b=1～3,
In the formula, R
5Have and R
4Identical implication, R
6Be the alkoxyl of carbon number 1～4, c is 5～100 integer.
4. claim 1 or 2 described electronic installations, wherein, the hardness after room-temperature moisture cured type heat-conductive silicone composition solidifies in the time of 25 ℃, adopt hardometer A type hardness tester meter, hardness is below 90.
5. claim 1 or 2 described electronic installations, wherein, the surface roughness after the curing of heat-conductive silicone composition is below the 10 μ m with center line average roughness (Ra) meter.
6. the manufacture method of electronic installation, it is characterized in that, after the room-temperature moisture cured type heat-conductive silicone composition that will have an above thermal conductivity of 1.0W/mK is coated the heat release members such as radiator or fin and is reached the thickness of 10～300 μ m, in atmosphere, place, do not carry out heating process and after changing the heat-conductive silicone solidfied material into, the driving fit of heat generation electronic unit is disposed at this organosilicon solidfied material.
7. the manufacture method of electronic installation claimed in claim 6 is characterized in that, above-mentioned room-temperature moisture cured type heat-conductive silicone composition contains:
(A) two ends contain hydroxyl or alkoxyl organopolysiloxane,
(B) curing agent,
(C) the thermal conductivity filler and
(D) condensation catalyst.
8. the manufacture method of electronic installation claimed in claim 7, wherein, above-mentioned room-temperature moisture cured type heat-conductive silicone composition also contain by the organosilan shown in the following general formula (2) and/or by the organopolysiloxane shown in the following general formula (3) as the wetability improver
R
2 aR
3 bSi（OR
4）
4-a-b （2）
In the formula, R
2Be the alkyl of carbon number 6～15, R
3Be the alkyl of saturated or undersaturated 1 valency of carbon number 1～8, R
4Be the alkyl of carbon number 1～6, a be 1,2 or 3, b be 0～2 integer, the integer of a+b=1～3,
In the formula, R
5Have and R
4Identical implication, R
6Be the alkoxyl of carbon number 1～4, c is 5～100 integer.
9. each described manufacture method of claim 6～8 wherein, adopts silk screen printing or metal mask printing that above-mentioned heat-conductive silicone composition is carried out film coated.
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| JP2012093733A JP2013222836A (en) | 2012-04-17 | 2012-04-17 | Electronic device excellent in heat dissipation and reworkability and manufacturing method thereof |
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| WO2016068138A1 (en) * | 2014-10-31 | 2016-05-06 | 住友化学株式会社 | Transparent coating film |
| KR102553617B1 (en) | 2014-10-31 | 2023-07-07 | 스미또모 가가꾸 가부시키가이샤 | Transparent coating film |
| KR102500899B1 (en) | 2014-10-31 | 2023-02-16 | 스미또모 가가꾸 가부시키가이샤 | Water-repellant/oil-repellant coating composition |
| JP6705752B2 (en) | 2014-11-12 | 2020-06-03 | 住友化学株式会社 | Water- and oil-repellent coating composition and transparent film |
| JP2016125004A (en) * | 2015-01-06 | 2016-07-11 | 信越化学工業株式会社 | Room temperature moisture curable heat conductive silicone grease composition |
| US10174237B2 (en) | 2015-03-02 | 2019-01-08 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone composition |
| JP2016219599A (en) | 2015-05-20 | 2016-12-22 | 株式会社リコー | Electronic equipment and heat spreader |
| JP2017101171A (en) * | 2015-12-03 | 2017-06-08 | 信越化学工業株式会社 | Thermal conductive room temperature curable organopolysiloxane composition and member |
| WO2018061447A1 (en) * | 2016-09-30 | 2018-04-05 | デンカ株式会社 | Heat dissipation sheet having high load carrying capacity and high thermal conductivity |
| KR102498951B1 (en) * | 2018-01-11 | 2023-02-15 | 다우 실리콘즈 코포레이션 | Methods of Applying Thermally Conductive Compositions on Electronic Components |
| US10968351B2 (en) * | 2018-03-22 | 2021-04-06 | Momentive Performance Materials Inc. | Thermal conducting silicone polymer composition |
| JP6957435B2 (en) * | 2018-10-23 | 2021-11-02 | 信越化学工業株式会社 | Thermally conductive silicone composition and its cured product |
| EP3878911A4 (en) * | 2018-11-09 | 2022-08-10 | Sekisui Polymatech Co., Ltd. | Thermally conductive composition, thermally conductive member, method for producing thermally conductive member, heat dissipation structure, heat generating composite member, and heat dissipating composite member |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080096030A1 (en) * | 2006-10-18 | 2008-04-24 | Shin -Etsu Chemical Co., Ltd. | Room temperature-curable, heat-conductive silicone rubber composition |
| CN101815772A (en) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | Thermally conductive composition |
| JP2011138857A (en) * | 2009-12-28 | 2011-07-14 | Shin-Etsu Chemical Co Ltd | Method of manufacturing electronic device with excellent heat dissipation and rework properties, and electronic device |
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2012
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2013
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080096030A1 (en) * | 2006-10-18 | 2008-04-24 | Shin -Etsu Chemical Co., Ltd. | Room temperature-curable, heat-conductive silicone rubber composition |
| CN101815772A (en) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | Thermally conductive composition |
| JP2011138857A (en) * | 2009-12-28 | 2011-07-14 | Shin-Etsu Chemical Co Ltd | Method of manufacturing electronic device with excellent heat dissipation and rework properties, and electronic device |
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