CN103366858A - Silver paste for LED (Light-Emitting Diode) lamp aluminum oxide base and application thereof - Google Patents
Silver paste for LED (Light-Emitting Diode) lamp aluminum oxide base and application thereof Download PDFInfo
- Publication number
- CN103366858A CN103366858A CN2013102856712A CN201310285671A CN103366858A CN 103366858 A CN103366858 A CN 103366858A CN 2013102856712 A CN2013102856712 A CN 2013102856712A CN 201310285671 A CN201310285671 A CN 201310285671A CN 103366858 A CN103366858 A CN 103366858A
- Authority
- CN
- China
- Prior art keywords
- silver
- aluminium oxide
- led lamp
- powder
- oxide pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 50
- 239000004332 silver Substances 0.000 title claims abstract description 50
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 title abstract 4
- 239000011521 glass Substances 0.000 claims abstract description 25
- 238000005245 sintering Methods 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 229920002521 macromolecule Polymers 0.000 claims abstract description 8
- 239000006259 organic additive Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000000654 additive Substances 0.000 claims abstract description 7
- 230000000996 additive effect Effects 0.000 claims abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 92
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 30
- 239000002002 slurry Substances 0.000 claims description 29
- 239000000428 dust Substances 0.000 claims description 15
- 239000010946 fine silver Substances 0.000 claims description 10
- 229910001312 Amalgam (dentistry) Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000000448 dental amalgam Substances 0.000 claims description 7
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 5
- 150000002170 ethers Chemical class 0.000 claims description 5
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 8
- 229910001316 Ag alloy Inorganic materials 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000498 ball milling Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000010791 quenching Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 3
- MBAXJHVTNGBISL-UHFFFAOYSA-N C(C)(=O)OCCCCC.C(CCC)OCCOCCO Chemical compound C(C)(=O)OCCCCC.C(CCC)OCCOCCO MBAXJHVTNGBISL-UHFFFAOYSA-N 0.000 description 2
- LVGKNOAMLMIIKO-UHFFFAOYSA-N Elaidinsaeure-aethylester Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC LVGKNOAMLMIIKO-UHFFFAOYSA-N 0.000 description 2
- 229940072049 amyl acetate Drugs 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LVGKNOAMLMIIKO-QXMHVHEDSA-N ethyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC LVGKNOAMLMIIKO-QXMHVHEDSA-N 0.000 description 2
- 229940093471 ethyl oleate Drugs 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- -1 repefral Chemical compound 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000009967 tasteless effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Abstract
The invention discloses silver paste for an LED (Light-Emitting Diode) lamp aluminum oxide base and an application thereof. The silver paste consists of the following components in percentage by weight: 50-80 percent of ultrafine silver powder, 2-10 percent of silver alloy powder, 2-10 percent of glass powder, 1-10 percent of inorganic additive, 2-15 percent of macromolecule resin, 10-40 percent of solvent and 1-10 percent of organic additive. The silver paste for the LED aluminum oxide base disclosed by the invention is used for preparing an aluminum oxide base circuit board, has the advantages of high printing performance and continuous and bright silver surface after sintering, and has high adhesion force, excellent electric performance and high-temperature welding resistance after being sintered.
Description
Technical field
The present invention relates to field of electronic materials, particularly a kind of LED lamp aluminium oxide pedestal is starched and is used with silver.
Background technology
The electronic silver slurry is to be a kind of electric conducting material that dip-coating and silk screen process use in the electronics industry, is set electron, chemical industry, metallurgical Trinitarian high-tech product, is one of main foundation material in the electronics industry.The present invention is the basic material of LED lamp aluminium oxide pedestal wiring board, and the silver slurry is through techniques such as silk screen printing, levelling, oven dry, sintering, and sintering forms conducting film on alumina substrate, makes the wiring board of LED lamp.The wiring board that present LED lamp adopts mostly is the PCB wiring board, the radiating effect of this wiring board is relatively poor, reduced widely the useful life of LED lamp, and adopt the wiring board of aluminium oxide ceramics pedestal printing can solve well heat dissipation problem, electric conductivity is also very excellent, and then improves the useful life of LED lamp.
Along with the wiring board of LED lamp gradually to the development of aluminium oxide pedestal wiring board, market can be increasing with the demand of silver slurry to LED lamp aluminium oxide pedestal, has good market prospects therefore LED lamp aluminium oxide pedestal is starched with silver.And LED lamp aluminium oxide pedestal requires the silver slurry to have good electrical property, high temperature soldering resistance, high adhesion force behind sintering with silver slurry, and this is several technological difficulties of LED silver slurry exploitation, and at present domestic also do not have enterprise can produce LED aluminium oxide pedestal with the silver slurry.
Summary of the invention
For overcoming shortcoming of the prior art, the invention provides a kind of LED lamp aluminium oxide pedestal and starch with silver, it has good electrical property, high temperature soldering resistance and high adhesion force.
Another object of the present invention provides the application that above-mentioned LED lamp aluminium oxide pedestal is starched with silver.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of LED lamp aluminium oxide pedestal is starched with silver, count by weight percentage, prescription forms and comprises following component: super fine silver powder 50～80%, alloy for dental amalgam 2～10%, glass dust 2～10%, inorganic additive 1～10%, macromolecule resin 2～15%, solvent 10～40%, organic additive 1～10%.
Described super fine silver powder be purity greater than 99.95%, granularity is less than the powder of the spherical of 10 μ m or nearly ball-type.
Described alloy for dental amalgam is selected from one or more in silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, the silver-colored titanium valve.
Described glass dust is B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3Glass system; Preferably, described B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3In the glass system: B
2O
35～30Wt%, SiO
25～25Wt%, Bi
2O
340～85Wt%, Al
2O
32～20Wt%, Mn
2O
35～15Wt%, glass transition temperature is 650～700 ℃.
Described inorganic additive is selected from Fe
2O
3, ZrO, TiO
2, Nb
2O
5, V
2O
5In one or more.
Described macromolecule resin is selected from one or more in ethyl cellulose, acrylic resin, the polyvinyl alcohol resin.
Described solvent is the ester class, and in the ethers, alcohols, hydrocarbon compound at least a kind.
Described organic additive is selected from one or both mixing in organosilicon-modified acrylate or the polyacrylate.
Above-mentioned LED lamp aluminium oxide pedestal is starched in the application for preparing on the aluminium oxide pedestal wiring board with silver.
Above-mentioned application is characterized in that: LED lamp aluminium oxide pedestal descended dry 1-6 minute at 200-250 ℃ after being printed on the aluminium oxide pedestal with the silver slurry, carried out sintering, 800 ℃～830 ℃ of the highest sintering temperatures again.
Silver slurry of the present invention has good printing performance in the high solids content situation, silver-colored face continuously behind the sintering, bright, adhesive force is high, have good electrical property and high temperature soldering resistance.
Embodiment
The present invention is that a kind of LED lamp aluminium oxide pedestal is starched with silver, count by weight percentage, prescription forms and comprises following component: super fine silver powder 50～80%, alloy for dental amalgam 2～10%, glass dust 2～10%, inorganic additive 1～10%, macromolecule resin 2～15%, solvent 10～40%, organic additive 1～10%.
Described super fine silver powder is that commercially available purity is greater than 99.95%, granularity is less than the powder of the spherical or nearly ball-type of 10 μ m, have good dispersion, high-tap density, can make slurry that good rheological property is arranged, effective control electrode bed thickness is thin, raising electrode surface evenness, and there are good compactness and glossiness in dry rear electrode surface, and sintering shrinkage is little, have good conductivity, guarantee that silver-colored face is continuous, bright, adhesive force is high, electrical property is excellent.In the prescription, super fine silver powder 50～80%, preferred 60～80%, more preferably 65～75%.
Described alloy for dental amalgam is selected from one or more in commercially available silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, the silver-colored titanium valve.Alloyed powder requires good dispersion, granularity less than the powder of the spherical or nearly ball-type below the 10 μ m.The present invention forms on the basis of (silver powder, glass dust, organic carrier) at the conventional silver slurry formula, added innovatively alloy for dental amalgam, regulate silver slurry high temperature soldering resistance and electrical property by it, making behind the silver slurry sintering can be 480 ℃ of welding, and has extremely low resistance.Described glass dust is the inorganic bond phase, preferred B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3Glass system, preferred, B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3In the glass system: B
2O
35～30Wt%, SiO
25～25Wt%, Bi
2O
340～85Wt%, Al
2O
32～20Wt%, Mn
2O
35～15Wt%, glass transition temperature is 650～700 ℃.During preparation, each component is mixed with jar mill in proportion, 430-470 ℃ of preheating 20-40min, 1150-1250 ℃ of melting 50-70min quenches, ball milling to granularity less than 5 μ m, filtering drying gets final product.The used glass powder of the present invention is not leaded, cadmium and compound thereof, meets the environmental requirement of the RoHS of European Union.In the prescription, glass dust 2～10%, preferred 3～8%, more preferably 3～6%.
Described inorganic additive is selected from Fe
2O
3, ZrO, TiO
2, Nb
2O
5, V
2O
5In one or more, improved mechanical strength and the chemical stability of glass, also guaranteed electrical property and the chemical property of glass, be convenient to rete and be attached on the substrate securely at silver layer behind the sintering.Have high adhesion force behind the present invention's silver slurry sintering, adhesive force is greater than 50N.
The organic carrier that macromolecule resin, organic solvent and organic additive etc. form can satisfy the silk-screen printing technique requirement of slurry in LED lamp aluminium oxide pedestal.Behind the organic carrier drying sintering, can be completely decomposed of volatile, can not have residue, bring negative effect to product.Wherein:
Described macromolecule resin is selected from one or more in ethyl cellulose, acrylic resin, the polyvinyl alcohol resin, selects according to the powder body material that reality is used.
Described solvent is the lower ester class of toxicity, and in the ethers, alcohols, hydrocarbon compound at least a kind, make it have difficult volatilization under the low temperature, volatile characteristic under the high temperature, can conveniently in printing process, keep good printing performance like this, after guaranteeing silver slurry sintering, the smooth gloss of silver layer surface, pore-free.Wherein lipid is for must add class, and it can give the silver slurry good lubrification, guarantees the printing performance of silver slurry; More than at least a kind, be used for adjusting silver slurry sintering character in ethers, alcohols, the hydrocarbon compound, behind the assurance silver slurry sintering, the smooth gloss of silver layer surface, pore-free.Applicable ester class, ethers, alcohols, hydrocarbon compound can be selected from fat hydrocarbon solvent, tasteless gasoline, mixed type dibasic acid dimethyl ester such as DBE, terpinol, ethyl oleate, diethylene glycol butyl ether, repefral, diethylene glycol ether amyl acetate, diethylene glycol butyl ether amyl acetate etc.
Described organic additive is selected from one or both mixing in organosilicon-modified acrylate or the polyacrylate.The present invention has added organosilicon-modified acrylate, polyacrylate surfactant in organic carrier, allow organic carrier abundant wetting parcel inoganic solids in rolling the slurry process, make silver powder and glass dust reach sufficient dispersion, improve the dispersiveness of solid powder, the flowability of slurry, whole fineness with the silver slurry is controlled at below the 10 μ m simultaneously, guarantee that the silver slurry in the high solids content situation, has good printing performance, form required figure on the substrate so that slurry is transferred to.
Below the present invention is further elaborated by concrete example, but the present invention is not limited to this specific examples.
Embodiment 1
1, the preparation of glass dust
B by mass percentage
2O
315Wt%, SiO
215Wt%, Bi
2O
360Wt%, Al
2O
33.5Wt%, Mn
2O
35Wt%, ZrO1.5%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min quench, ball milling to granularity less than 5 μ m, filtering drying.
2, the preparation of organic carrier
Ethyl cellulose 20%, terpinol 30%, diethylene glycol butyl ether 30%, ethyl oleate 10%, organosilicon-modified acrylate 10% after above each thing mixes, 80 ~ 100 ° of C heating for dissolving, gets transparent glue.
3, mix 73% super fine silver powder, 2% palladium-silver alloy powder, 4% glass dust, 1%TiO
2, be made into powder, after stirring, add 20% organic carrier, after the high speed dispersion, through three-high mill be rolled to fineness less than 10 μ m below, add diluent, adjust viscosity.
Embodiment 2
1, the preparation of glass dust
B by mass percentage
2O
310Wt%, SiO
220Wt%, Bi
2O
355Wt%, Al
2O
35Wt%, Mn
2O
38Wt%, ZrO2%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min quench, ball milling to granularity less than 5 μ m, filtering drying.
2, the preparation of organic carrier
Ethyl cellulose 25%, terpinol 45%, diethylene glycol butyl ether amyl acetate 20%, polyacrylate 10% after above each thing mixes, 80～100 ° of C heating for dissolving, gets transparent glue.
3, mix 69% super fine silver powder, 9% yellow gold powder, 4% glass dust, 1%Nb
2O
5, be made into powder, after stirring, add 17% organic carrier, after the high speed dispersion, through three-high mill be rolled to fineness less than 10 μ m below, add diluent, adjust viscosity.
Embodiment 3
1, the preparation of glass dust
B by mass percentage
2O
310Wt%, SiO
215Wt%, Bi
2O
365Wt%, Al
2O
32Wt%, Mn
2O
36Wt%, ZrO2%.Mix with jar mill, 450 ° of C preheating 30min, 1200 ° of C melting 60min quench, ball milling to granularity less than 5 μ m, filtering drying.
3, the preparation of organic carrier
Ethyl cellulose 15%, diethylene glycol ether amyl acetate 22%, diethylene glycol butyl ether 43%, repefral 10%, organosilicon-modified acrylate 10% after above each thing mixes, 80 ~ 100 ° of C heating for dissolving, gets transparent glue.
4, mix 75% super fine silver powder, 5% silver-nickel powder, 5% glass dust, 1%Nb
2O
5, be made into powder, after stirring, add 14% organic carrier, after the high speed dispersion, through three-high mill be rolled to fineness less than 10 μ m below, add diluent, adjust viscosity.
Experimental example
The silver slurry using method of embodiment 1-3:
1. silk screen printing (is annotated: standard printing condition: mesh: 250 orders) on alumina substrate
2.. drying condition: 230 ℃ 3 minutes
3.. sintering condition: sintering temperature: 800 ℃ ~ 830 ℃
Sintering condition in this experimental example: the highest 810 ℃, kept 10 minutes the high-temperature region, 60 minutes altogether.
4.. carry out performance test behind the sintering, corresponding product is randomly drawed 10, and the soldering resistance method of testing is pressed GB/T17473.7-2008 and implemented, and the adhesive force test is pressed GB/T17473.4-2008 and implemented, and the sheet resistance test is pressed GB/T17473.3-2008 and implemented.Data such as table 1.
Table 1.
Claims (10)
1. a LED lamp aluminium oxide pedestal is starched with silver, count by weight percentage, prescription forms and comprises following component: super fine silver powder 50～80%, alloy for dental amalgam 2～10%, glass dust 2～10%, inorganic additive 1～10%, macromolecule resin 2～15%, solvent 10～40%, organic additive 1～10%.
2. LED lamp aluminium oxide pedestal according to claim 1 is characterized in that with the silver slurry: described super fine silver powder be purity greater than 99.95%, granularity is less than the powder of the spherical or nearly ball-type of 10 μ m.
3. LED lamp aluminium oxide pedestal according to claim 1 is starched with silver, and it is characterized in that: described alloy for dental amalgam is selected from one or more in silver-bearing copper powder, silver-colored palladium powder, silver-colored nickel powder, the silver-colored titanium valve.
4. LED lamp aluminium oxide pedestal according to claim 1 is starched with silver, and it is characterized in that: described glass dust is B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3Glass system; Preferably, described B
2O
3-SiO
2-Bi
2O
3-Al
2O
3-Mn
2O
3In the glass system: B
2O
35～30Wt%, SiO
25～25Wt%, Bi
2O
340～85Wt%, Al
2O
32～20Wt%, Mn
2O
35～15Wt%, glass transition temperature is 650～700 ℃.
5. LED lamp aluminium oxide pedestal according to claim 1 is starched with silver, and it is characterized in that: described inorganic additive is selected from Fe
2O
3, ZrO, TiO
2, Nb
2O
5, V
2O
5In one or more.
6. LED lamp aluminium oxide pedestal according to claim 1 is starched with silver, and it is characterized in that: described macromolecule resin is selected from one or more in ethyl cellulose, acrylic resin, the polyvinyl alcohol resin.
7. LED lamp aluminium oxide pedestal according to claim 1 is with the silver slurry, and it is characterized in that: described solvent is the ester class, and in the ethers, alcohols, hydrocarbon compound at least a kind.
8. LED lamp aluminium oxide pedestal according to claim 1 is starched with silver, and it is characterized in that: described organic additive is selected from one or both mixing in organosilicon-modified acrylate or the polyacrylate.
9. the described LED lamp of arbitrary claim aluminium oxide pedestal is starched in the application for preparing on the aluminium oxide pedestal wiring board with silver among the claim 1-8.
10. application according to claim 9 is characterized in that: LED lamp aluminium oxide pedestal descended dry 1-6 minute at 200-250 ℃ after being printed on the aluminium oxide pedestal with the silver slurry, carried out sintering, 800 ℃～830 ℃ of the highest sintering temperatures again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285671.2A CN103366858B (en) | 2013-07-08 | 2013-07-08 | A kind of LED aluminium oxide pedestal silver slurry and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310285671.2A CN103366858B (en) | 2013-07-08 | 2013-07-08 | A kind of LED aluminium oxide pedestal silver slurry and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103366858A true CN103366858A (en) | 2013-10-23 |
| CN103366858B CN103366858B (en) | 2015-10-14 |
Family
ID=49368015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310285671.2A Active CN103366858B (en) | 2013-07-08 | 2013-07-08 | A kind of LED aluminium oxide pedestal silver slurry and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103366858B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049675A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | Conductive printing ink of copper series |
| CN101720311A (en) * | 2007-06-29 | 2010-06-02 | E.I.内穆尔杜邦公司 | Conductor paste for ceramic substrate and electric circuit |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| CN102543260A (en) * | 2012-02-27 | 2012-07-04 | 江苏科技大学 | Silver paste for electrode of solar cell and method for preparing silver paste |
| CN102569603A (en) * | 2012-01-13 | 2012-07-11 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) ceramic substrate and production method thereof |
| JP2013041683A (en) * | 2011-08-11 | 2013-02-28 | Tamura Seisakusho Co Ltd | Conductive material |
-
2013
- 2013-07-08 CN CN201310285671.2A patent/CN103366858B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1049675A (en) * | 1990-03-06 | 1991-03-06 | 北京市印刷技术研究所 | Conductive printing ink of copper series |
| CN101720311A (en) * | 2007-06-29 | 2010-06-02 | E.I.内穆尔杜邦公司 | Conductor paste for ceramic substrate and electric circuit |
| CN101986390A (en) * | 2010-11-23 | 2011-03-16 | 肇庆市羚光电子化学品材料科技有限公司 | Silver paste for disk capacitor electrode |
| CN102222536A (en) * | 2011-03-28 | 2011-10-19 | 彩虹集团公司 | Environment-friendly silver conductive paste for surface mounting of semiconductor chips and preparation method of environment-friendly silver conductive paste |
| JP2013041683A (en) * | 2011-08-11 | 2013-02-28 | Tamura Seisakusho Co Ltd | Conductive material |
| CN102569603A (en) * | 2012-01-13 | 2012-07-11 | 张家港市金港镇东南电子厂 | Light emitting diode (LED) ceramic substrate and production method thereof |
| CN102543260A (en) * | 2012-02-27 | 2012-07-04 | 江苏科技大学 | Silver paste for electrode of solar cell and method for preparing silver paste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103366858B (en) | 2015-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101986390B (en) | Silver paste for disk capacitor electrode | |
| CN102568704B (en) | Environment-friendly lead-free semiconductor ceramic capacitive electrode silver paste and preparation method thereof | |
| CN101377966B (en) | Method for preparing leadless silver electrode slurry for glass substrates | |
| CN102354544B (en) | Silver conductive paste for front electrode of crystalline silicon solar cell and preparation method thereof | |
| CN1329926C (en) | Electrode thick liquid without lead and silver and mfg. method thereof | |
| CN103177791B (en) | A kind of aluminum conductive electric slurry used for solar batteries and preparation method thereof | |
| CN110217998B (en) | Lead-free conductive silver paste capable of being sintered at low temperature and preparation method and application thereof | |
| CN102097154A (en) | Back surface field aluminium paste for solar cells | |
| CN111564234B (en) | Titanate-based lead-free silver electrode slurry and preparation and use methods thereof | |
| CN1216380C (en) | Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate | |
| CN112509727B (en) | Inner electrode copper paste for low-temperature co-fired ceramic and preparation method and application thereof | |
| WO2008014678A1 (en) | Rare earth base-metal resistance slurry for rare earth thick-film circuit based on metal substrate and producing process thereof | |
| CN106851872A (en) | A kind of aluminium alloy base plate large power thick film circuit intermediate sintering temperature silver palladium resistance slurry and preparation method thereof | |
| CN114230360B (en) | AMB silver-copper slurry for water-soluble ceramic metallization and preparation method thereof | |
| CN106653145A (en) | Medium-and-high temperature thick film circuit conductor paste and preparation method thereof | |
| CN101354926B (en) | Method for preparing conductor slurry containing carbon and silver | |
| TW201802827A (en) | Preparation method of nano-silver pastes capable of increasing bonding strength of the nano-silver paste by adding silver precursor | |
| CN103366858B (en) | A kind of LED aluminium oxide pedestal silver slurry and application thereof | |
| CN114783652B (en) | Gold conductor wiring slurry co-fired with microwave dielectric ceramic at low temperature and preparation method thereof | |
| CN113782250B (en) | High-thixotropy low-temperature co-fired ceramic inner electrode silver paste and preparation method and application thereof | |
| CN104318979A (en) | Composite-material-based thick-film circuit rare earth electrode slurry and preparation process thereof | |
| CN108766619A (en) | A kind of electronic component electrode slurry and preparation method thereof | |
| CN113628780B (en) | Low-cost low-resistance thick film resistor paste | |
| CN114121336B (en) | High-wear-resistance paste | |
| CN112700905B (en) | Multi-element conductive phase compound, thick film circuit resistor paste and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Silver paste for LED (Light-Emitting Diode) lamp aluminum oxide base and application thereof Effective date of registration: 20200426 Granted publication date: 20151014 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20151014 Pledgee: China Co. truction Bank Corp Zhaoqing branch Pledgor: GUANGDONG LINGGUANG NEW MATERIAL Co.,Ltd. Registration number: Y2020440000098 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |