CN103360081B - Method for removing integral type ceramic mould resin mold - Google Patents
Method for removing integral type ceramic mould resin mold Download PDFInfo
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- CN103360081B CN103360081B CN201310289468.2A CN201310289468A CN103360081B CN 103360081 B CN103360081 B CN 103360081B CN 201310289468 A CN201310289468 A CN 201310289468A CN 103360081 B CN103360081 B CN 103360081B
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Abstract
The invention discloses a method for removing an integral type ceramic mould resin mold. The method comprises the following steps of: immersing refrigerant integral type ceramic mould body into liquid nitrogen, separating the resin mold from ceramic mould by utilizing big difference of thermophysical parameters of the resin and a ceramic material at a low temperature, promoting a light-cured resin mold to generate brittle rupture at the low temperature, and then stripping fragments of the resin mold. The process is simple and efficient to remove surface resin mold of the ceramic body, the problems that the removing process is slow by utilizing a chemical corrosion method and the mechanical property of the ceramic mould can be affected are avoided, and generation of plenty of harmful gases during ignition lost of the resin mold and the acting force on the ceramic mould by the mold are also avoided.
Description
Technical field
The invention belongs to quick cast field, relate to a kind of method of removing monoblock type ceramic-mould resin die.
Background technology
Along with the development of rapid shaping technique, the part that Stereolithography can any complex construction of precise forming, and widely apply in the industry such as quick cast, fast mould.In the quick cast process based on Stereolithography technology, the ceramic-mould base substrate vacuum lyophilization of first being prepared by gel injection, then ceramic-mould base substrate is carried out to skimming treatment.
In the time of base substrate lyophilize, in base substrate, ice crystal distillation produces a large amount of water vapour, easily produces in the inside of base substrate the phenomenon of feeling suffocated, and base substrate shell inside is cracked.
Tradition is removed resin type shell side method and is mainly chemical corrosion and burns and lose, the subject matter of chemical corrosion be removal process slowly and corrosive fluid infiltration ceramic body may affect its mechanical property and cause size distortion etc.Burning the subject matter of losing is that burning produces obnoxious flavour and the reactive force of mould to casting mold, the Ceramics Material Heat Expansion Coefficient of resin shell and its parcel is different, cause that in ablation process, the two exists interaction force, a large amount of gases that can produce in resin ablation process in addition, this all can cause ceramic-mould base substrate interior detail minor structure generation fracture failure.Just seem particularly important so inquire into a kind of method that is applicable to remove fast ceramic body surface resin shell but do not affect the mechanical property of base substrate own.
Summary of the invention
The problem that the present invention solves is to provide a kind of method of removing monoblock type ceramic-mould resin die, and the method can solve chemical corrosion method or burn the problem that resin die may bring of losing.
The present invention is achieved through the following technical solutions:
Remove a method for monoblock type ceramic-mould resin die, comprise following operation:
1) after the gel injection ceramic slurry curing pouring in light-cured resin minus mould, the ceramic body that obtains being wrapped up by resin die; Then by ceramic body precooling at-40 DEG C~-60 DEG C, the free water in ceramic body is freezed for ice crystal;
2) ceramic body after precooling is immersed to 5~10s in liquid nitrogen, then ceramic body is taken out, at room temperature the resin die that is wrapped in ceramic body surface is divested fast; For residual resin die, the operation that repetition immersion liquid nitrogen, room temperature divest fast, finally obtains the biscuit of ceramics that resin die is removed completely.
Described liquid-nitrogen temperature is-196 DEG C.
Described in the time that ceramic body immerses in liquid nitrogen, the larger difference of the thermal physical property parameter of resin die and stupalith, thus resin die is separated with biscuit of ceramics, and impel resin die that brittle rupture occurs at low temperatures.
The described resin die fragment of at room temperature rooting out fast, for residual resin die, repeats to soak liquid nitrogen 1~3 time to remove resin die completely.
Described ceramic body precooling at-40 DEG C~-60 DEG C more than two hours, is as the criterion taking the free water fully charge in ceramic body as ice crystal.
Describedly in light-cured resin minus mould, pour into gel injection alumina-based ceramic slurry, treat its in-situ solidifying, the ceramic body that obtains being wrapped up by resin die.
Compared with prior art, the present invention has following useful technique effect:
The method of removal monoblock type ceramic-mould resin die provided by the invention, the monoblock type ceramic-mould base substrate of precooling is immersed in liquid nitrogen, utilize the larger difference of the thermal physical property parameter of resin and stupalith under low temperature, thereby resin die is separated with ceramic-mould, and impel light-cured resin mould that brittle rupture occurs at low temperatures, be easy to just resin shell to be divested by very little power; Technological design is reasonable, simple to operate, is applicable to actual production.The monoblock type ceramic-mould of processing by the present invention not only can be removed rapidly the resin die of monoblock type ceramic-mould efficiently, and the mechanical property of base substrate itself is not affected to (liquid nitrogen is processed front blank strength 50~60mpa, and liquid nitrogen is processed blank strength 50~60mpa afterwards).Avoided resin die to ceramic-mould base substrate exhaust body restraining effect and the stress at vacuum-drying and skimming processes.Finally reach the probability that has reduced ceramic-mould blank cracking, improve the effect of the small structure integrity of ceramic-mould base substrate.
The method of removal monoblock type ceramic-mould resin die provided by the invention, does not need to utilize chemical corrosion method to remove Stereolithography resin die, has avoided corrosion process too slowly and corrosive fluid may be on the impact of the mechanical property of ceramic body.
The method of removal monoblock type ceramic-mould resin die provided by the invention, does not need to utilize and burns the method for losing resin die, has avoided resin burning to produce obnoxious flavour and the reactive force of mould to casting mold.
The method of removal monoblock type ceramic-mould resin die provided by the invention, also avoid the restraining effect of surface resin mould to ceramic-mould base substrate draining steam in the time of vacuum-drying, avoided in base substrate possible feel suffocated phenomenon and the tiny characteristics structure problems such as fracture that are hit.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, and the explanation of the invention is not limited.
Remove a method for monoblock type ceramic-mould resin die, comprise following operation:
1) after the gel injection ceramic slurry curing pouring in light-cured resin minus mould, the ceramic body that obtains being wrapped up by resin die; Then by ceramic body precooling at-40 DEG C~-60 DEG C, the free water in ceramic body is freezed for ice crystal;
2) ceramic body after precooling is immersed to 5~10s in liquid nitrogen, then ceramic body is taken out, at room temperature the resin die that is wrapped in ceramic body surface is divested fast; For residual resin die, the operation that repetition immersion liquid nitrogen, room temperature divest fast, finally obtains the biscuit of ceramics that resin die is removed completely.
Provide specific embodiment below.
Embodiment 1
The method of removing monoblock type ceramic-mould resin die, comprises following operation:
1) prepare monoblock type ceramic-mould light-cured resin minus mould, set up CAD mold former, with rapidform machine making light-cured resin minus mould.In resin minus mould, pour into gel injection alumina-based ceramic slurry, treat its in-situ solidifying, solidify the ceramic body that obtains being wrapped up by resin die.
2) pre-freeze ceramic body
Monoblock type ceramic-mould base substrate is put among the refrigeration chamber of-40 DEG C~-60 DEG C, freezing more than three hours, the concrete time is so that the free water fully charge in ceramic body becomes crystal water to be as the criterion.
3) ceramic body is removed to the processing of light-cured resin mould
It is that in the liquid nitrogen of-196 °, soak time is 5~10 seconds that monoblock type ceramic-mould base substrate is immersed to temperature.Ceramic body is taken out, remove rapidly resin die with shelling shovel at room temperature, complete knockout course.
To the resin die that could not once remove, repeat above-mentioned immersion liquid nitrogen and remove resin die process.Finally obtain the biscuit of ceramics that resin die is removed completely.Last presintering obtains the ceramic of some strength.
Embodiment 2
The method of removing monoblock type ceramic-mould resin die, comprises following operation:
1) prepare monoblock type ceramic-mould light-cured resin minus mould, set up CAD mold former, with rapidform machine making light-cured resin minus mould.In resin minus mould, pour into gel injection alumina-based ceramic slurry, treat its in-situ solidifying, solidify the ceramic body that obtains being wrapped up by resin die.
2) pre-freeze ceramic body
Monoblock type ceramic-mould base substrate is put among the refrigeration chamber of-50 DEG C~-60 DEG C, freezing more than two hours, the concrete time is so that the free water fully charge in ceramic body becomes crystal water to be as the criterion.
3) ceramic body is removed to the processing of light-cured resin mould
It is that in the liquid nitrogen of-196 °, soak time is 5~10 seconds that monoblock type ceramic-mould base substrate is immersed to temperature.Ceramic body is taken out, remove rapidly resin die with shelling shovel at room temperature, complete knockout course.
To the resin die that could not once remove, repeat above-mentioned immersion liquid nitrogen and remove resin die process.Finally obtain the biscuit of ceramics that resin die is removed completely.Last presintering obtains the ceramic of some strength.
Vacuum-drying biscuit of ceramics (vacuum tightness is 10~30Pa).Again dried ceramic is put into debinding furnace degreasing presintering, sintering temperature is 1250 DEG C.The small structure that obtains is complete and without the ceramic of cracking
Embodiment 3
The method of removing monoblock type ceramic-mould resin die, comprises following operation:
1) prepare monoblock type ceramic-mould light-cured resin minus mould, set up CAD mold former, with rapidform machine making light-cured resin minus mould.In resin minus mould, pour into gel injection alumina-based ceramic slurry, treat its in-situ solidifying, solidify the ceramic body that obtains being wrapped up by resin die.
2) pre-freeze ceramic body
Monoblock type ceramic-mould base substrate is put among the refrigeration chamber of-50 DEG C~-60 DEG C, freezing more than three hours, the concrete time is so that the free water fully charge in ceramic body becomes crystal water to be as the criterion.
3) ceramic body is removed to the processing of light-cured resin mould
It is that in the liquid nitrogen of-196 °, soak time is 5~10 seconds that monoblock type ceramic-mould base substrate is immersed to temperature.Ceramic body is taken out, remove rapidly resin die with shelling shovel at room temperature, complete knockout course.
To the resin die that could not once remove, repeat above-mentioned immersion liquid nitrogen and remove resin die process.Finally obtain the biscuit of ceramics that resin die is removed completely.Last presintering obtains the ceramic of some strength.
Vacuum-drying biscuit of ceramics (vacuum tightness is 10~30Pa).Again dried ceramic is put into debinding furnace degreasing presintering, sintering temperature is 1350 DEG C.The small structure that obtains is complete and without the ceramic of cracking.
Claims (4)
1. a method of removing monoblock type ceramic-mould resin die, is characterized in that, comprises following operation:
1) after the gel injection ceramic slurry curing pouring in light-cured resin minus mould, the ceramic body that obtains being wrapped up by resin die; Then by ceramic body precooling at-40 DEG C~-60 DEG C, the free water in ceramic body is freezed for ice crystal;
2) ceramic body after precooling is immersed to 5~10s in liquid nitrogen, then ceramic body is taken out, in the time that ceramic body immerses in liquid nitrogen, the larger difference of the thermal physical property parameter of resin die and stupalith, thereby resin die is separated with biscuit of ceramics, and impel resin die that brittle rupture occurs at low temperatures; At room temperature the resin die that is wrapped in ceramic body surface is divested fast; For residual resin die, the operation that repetition immersion liquid nitrogen, room temperature divest fast, finally obtains the biscuit of ceramics that resin die is removed completely;
Ceramic body precooling at-40 DEG C~-60 DEG C more than two hours, is as the criterion taking the free water fully charge in ceramic body as ice crystal.
2. the method for removal monoblock type ceramic-mould resin die as claimed in claim 1, is characterized in that, described liquid-nitrogen temperature is-196 DEG C.
3. the method for removal monoblock type ceramic-mould resin die as claimed in claim 1, is characterized in that, at room temperature roots out fast resin die fragment, for residual resin die, repeats to soak liquid nitrogen 1~3 time to remove resin die completely.
4. the method for removal monoblock type ceramic-mould resin die as claimed in claim 1, is characterized in that, in light-cured resin minus mould, pours into gel injection alumina-based ceramic slurry, treats its in-situ solidifying, the ceramic body that obtains being wrapped up by resin die.
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1483778A (en) * | 2003-07-01 | 2004-03-24 | 郑州大学 | Corrosion-resisting wear-resisting powder coating for metal |
CN101649184A (en) * | 2008-08-12 | 2010-02-17 | 索尼株式会社 | Antistatic agent for thermoplastic resin and antistatic resin composition |
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2013
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1483778A (en) * | 2003-07-01 | 2004-03-24 | 郑州大学 | Corrosion-resisting wear-resisting powder coating for metal |
CN101649184A (en) * | 2008-08-12 | 2010-02-17 | 索尼株式会社 | Antistatic agent for thermoplastic resin and antistatic resin composition |
Non-Patent Citations (2)
Title |
---|
吴海华等.快速铸造收缩-扩张形气膜孔空心涡轮叶片.《材料科学与工艺》.2011,第19卷(第6期),143-148. * |
快速铸造收缩-扩张形气膜孔空心涡轮叶片;吴海华等;《材料科学与工艺》;20111231;第19卷(第6期);143-148 * |
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