CN103357546B - IGBT package casing glue spreading apparatus and method - Google Patents
IGBT package casing glue spreading apparatus and method Download PDFInfo
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- CN103357546B CN103357546B CN201210085009.8A CN201210085009A CN103357546B CN 103357546 B CN103357546 B CN 103357546B CN 201210085009 A CN201210085009 A CN 201210085009A CN 103357546 B CN103357546 B CN 103357546B
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- package casing
- gluing
- information
- igbt package
- glue spreading
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Abstract
The present invention provides a kind of IGBT package casing glue spreading apparatus and method.Wherein said device includes collecting unit, coordinates measurement unit and control unit.Described collecting unit is for gathering shape and the dimension information of IGBT package casing pre-coated surface.Described coordinates measurement unit generates gluing path for the information gathered according to described collecting unit.Described control unit performs component for moving gluing according to described gluing path, gluing performs the colloid that component uniformly discharges and is coated on described IGBT package casing.Present invention achieves the full-automatic of IGBT package casing gluing, and gluing effect is good, it is to avoid the problems of manual gluing, and then ensure that the sealing of IGBT package casing.
Description
Technical field
The present invention relates to coating technique, particularly relate to a kind of IGBT package casing glue spreading apparatus and method.
Background technology
IGBT (InsulatedGateBipolarTransistor, insulated gate bipolar transistor) there is altofrequency, high voltage, big electric current, the performance characteristics that especially easily turns on and off, it it is the most representational product of the Power Electronic Technique third time revolution generally acknowledged in the world, so far having evolved to for the 6th generation, commercialization had evolved to for the 5th generation.At present, IGBT is widely used in the every profession and trade of national economy.
IGBT module is when encapsulation, it is necessary to assemble a shell for chip etc. is protected.And the selection of shell colloid and coating are one of key technologies of IGBT module encapsulation technology.Traditional shell gluing is to be extruded by the colloid of toothpaste-like with hands, spreads upon on housing uniformly, then installs housing again.Manual gluing there is a problem in that manual painting micelle colloid is uneven, and after installing shell, colloid is distributed in inside and outside shell, affects product quality.It addition, manual gluing process is easily generated bubble so that the colloid having been coated with has discontinuously, the effect that impact seals.
Summary of the invention
The present invention provides a kind of IGBT package casing glue spreading apparatus and method, to improve the uniformity of colloid coating.
The first aspect of the invention is to provide a kind of IGBT package casing glue spreading apparatus, including:
Collecting unit, for gathering shape and the dimension information of IGBT package casing pre-coated surface；
Coordinates measurement unit, for generating gluing path according to the information gathered；
Control unit, performs component for moving gluing according to described gluing path, gluing performs the colloid that component uniformly discharges and is coated on described IGBT package casing.
The second aspect of the invention is to provide a kind of IGBT package casing glue spreading method, including:
Gather shape and the dimension information of IGBT package casing pre-coated surface；
Gluing path is generated according to the information gathered；
Move gluing according to described gluing path and perform component, gluing is performed the colloid that component uniformly discharges and is coated on described IGBT package casing.
The glue spreading apparatus having the technical effect that employing said structure of first aspect of the present invention can realize the full-automatic of gluing, and gluing is uniform, effective, and can be effectively prevented from the problems that manual gluing exists, and then ensure that the sealing of IGBT package casing.
Having the technical effect that of second aspect of the present invention adopts above-mentioned glue spreading method can effectively improve the uniformity of gluing, and the colloid caused because bubble produces when being avoided that manual gluing is interrupted, and gluing effect is intact.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of IGBT package casing glue spreading apparatus embodiment one provided by the invention；
Fig. 2 is the schematic diagram of IGBT package casing glue spreading apparatus embodiment two provided by the invention；
Fig. 3 is the schematic diagram of IGBT package casing glue spreading apparatus embodiment three provided by the invention；
Fig. 4 is the schematic diagram of IGBT package casing glue spreading apparatus embodiment four provided by the invention；
Fig. 5 is the structural representation of a concrete IGBT package casing example；
Fig. 6 is the schematic flow sheet of IGBT package casing glue spreading method embodiment one provided by the invention；
Fig. 7 is the schematic flow sheet of IGBT package casing glue spreading method embodiment two provided by the invention.
Detailed description of the invention
As it is shown in figure 1, the schematic diagram of IGBT package casing glue spreading apparatus embodiment one provided by the invention.Glue spreading apparatus described in the present embodiment includes: collecting unit 1, coordinates measurement unit 2 and control unit 3.Wherein, described collecting unit 1 is for gathering shape and the dimension information of IGBT package casing pre-coated surface.Described coordinates measurement unit 2 generates gluing path for the information gathered according to described collecting unit 1.Described control unit 3 moves gluing for the gluing path generated according to described coordinates measurement unit 2 and performs component, gluing performs the colloid that component uniformly discharges and is coated on described IGBT package casing.
Glue spreading apparatus described in the present embodiment achieves the full-automatic of gluing, and gluing effect is good, it is to avoid the problems of manual gluing, and then ensure that the sealing of IGBT package casing.
In actual applications, in above-described embodiment, described collecting unit can be image acquisition device, such as photographing unit or image first-class.Described coordinates measurement unit can be the processor with image processing function.Described control unit can be able to drive gluing to perform component and realize driving equipment or the mechanism of straight line and/or curve movement.
As in figure 2 it is shown, the schematic diagram of IGBT package casing glue spreading apparatus embodiment two provided by the invention.The present embodiment is additionally arranged detection unit 4 on the basis of embodiment one.This detection unit 4 is for detecting the characteristic information of described IGBT package casing, and exports this characteristic information to described control unit 3.The characteristic information that described control unit 3 is additionally operable in the present embodiment according to receiving selects and changes colloid.Wherein, described characteristic information is colouring information and/or the surfacing information of IGBT package casing.The present embodiment can select most suitable colloid according to the specific features of IGBT package casing, to improve the sealing effectiveness of IGBT package casing.
Glue spreading apparatus embodiment three provided by the invention, this embodiment three, on the basis of embodiment one or embodiment two, is additionally arranged man-machine interaction unit 5.Fig. 3 merely illustrate set up on the basis of embodiment two as described in the schematic diagram of man-machine interaction unit.Man-machine interaction unit 5 is for receiving the command information of user's input, and updates the gluing path in described control unit 3 according to this command information.Wherein, described command information includes: path procedure information and/or parameter setting information.Described parameter setting information includes: IGBT package casing dimensional parameters information, gluing perform component translational speed parameter setting information and colloid model parameter information.
Adopt the IGBT package casing glue spreading apparatus of structure described in the present embodiment, user can directly input the path procedure information gluing path to update in control unit by man-machine interaction unit, also can directly the individual parameters in the gluing path generated be updated, to be applicable to the situation that gluing path is had certain particular/special requirement.Additionally, when rubberization thickness is required, gluing can be performed component translational speed parameter by man-machine interaction unit and reset by user.When the model of colloid is had special requirement, colloid model parameter information can be set by user by man-machine interaction unit.The present embodiment can meet the individual demand of different package casing gluing by arranging described man-machine interaction unit, is effectively improved the practicality of IGBT package casing glue spreading apparatus.
Further, for improving practicality and the convenience of IGBT package casing glue spreading apparatus, the various embodiments described above also should include the memory element 6 for storing the gluing path that described coordinates measurement unit generates, as shown in Figure 4.The present embodiment is by arranging memory element, the gluing path currently generated can be carried out real-time storage, when again run into there is or that geomery all identical package casing similar with this shape time, can directly read from memory element, it is not necessary to the shape and size parameter information again gathering package casing generates gluing path.Gluing path when the identical package casing of the IGBT package casing shape stored in memory element and currently treat gluing, user only need to transfer this gluing path by man-machine interaction unit, then some the dimensional parameters information in this gluing path is modified.Certainly, if having stored the gluing path of the package casing all identical with the IGBT package casing shape and size currently treating gluing in memory element, user only need to directly transfer this gluing path by man-machine interaction unit, it is not necessary to changes any parameter.
The gluing path procedure example of a concrete IGBT shell example and this example is presented herein below.The shape and size of this IGBT shell example are as shown in Figure 5.
(1) corresponding single-piece program is as follows:
<Main>mastery routine
Position2,2；
Zf=0；
Z0=-15；
Zd=z0+1；
Zs=zd+3；
Amout=1；
A=70；
B=35；
Vd=2；
Vp=2；
SubmacroX；
<X>subprogram
Axyz1,0,0,0,0,0；
Axyz1,0,10, Zs, 0,0
Ponoff1；
Dispon4,0,2,0.2, z0, vd, vp, amout, A, B, Zd, Zs, 0；
Axyz0,0,40, Zd, 0,0；
Cirle20,0,0,0,180,90,0,0,2,1,0；
Axyz0,90,50, Zd, 0,0；
Cirle20,0,0,0,90,0,0,0,2,1,0；
Axyz0,100,10, Zd, 0,0；
Cirle20,0,0,0,0,270,0,0,2,1,0；
Axyz0,10,0, Zd, 0,0；
Cirle20,0,0,0,270,180,0,0,2,1,0；
Ponoff0；
Dispoff2,0,0,0, Vd ,-10,0.8, Vd, Zf, 0.01.
As shown in Figure 6, the schematic flow sheet of IGBT package casing glue spreading method embodiment one provided by the invention.IGBT package casing glue spreading method described in the present embodiment can adopt each IGBT package casing glue spreading apparatus embodiment of above-mentioned offer to realize, and specifically includes:
Step S1, the shape gathering IGBT package casing pre-coated surface and dimension information；
The information that step S2, foundation gather generates gluing path；
Obtained the shape in gluing path by the shape information gathered, the concrete dimension information of line segment or the camber line constituting described gluing path can be obtained by the dimension information gathered, to generate gluing path accurately.
Step S3, move gluing according to described gluing path and perform component, gluing is performed the colloid that component uniformly discharges and is coated on described IGBT package casing.
Adopting the glue spreading method described in the present embodiment can effectively improve the uniformity of gluing, and the colloid caused because bubble produces when being avoided that manual gluing is interrupted, gluing effect is intact.
On IGBT package casing, the colloid kind of coating, has important impact to the sealing of IGBT package casing.Therefore the invention provides the second of glue spreading method embodiment, as shown in Figure 7.Embodiment two, on the basis of embodiment one, adds step S2 ': detects the characteristic information of described IGBT package casing, and selects according to described characteristic information and change colloid.Wherein, described characteristic information is colouring information and/or the surfacing information of IGBT package casing.Step S2 ' completed before step S3.Fig. 2 illustrate only this kind of situation before this step step S3 upon step s 2.The present embodiment method can specifically adopt above-mentioned IGBT package casing glue spreading apparatus embodiment two to realize.
Further, individual demand for satisfied different package casing gluings, it is effectively improved the practicality of IGBT package casing glue spreading apparatus, in above-mentioned each IGBT package casing glue spreading method embodiment, also should include step: receive the command information of user's input, and update the gluing path generated according to described command information.Wherein, described command information includes: path procedure information and/or parameter setting information.Described parameter setting information includes: IGBT package casing dimensional parameters information, gluing perform component translational speed parameter setting information and colloid model parameter information.
Yet further, in above-mentioned each IGBT package casing glue spreading method embodiment, it is also possible to including: the gluing path that storage has generated.The present embodiment is by storing the gluing path generated, to when identically shaped or that size shape is all identical IGBT package casing is carried out gluing, it is not necessary to regenerate gluing path, directly read the gluing path stored.
One of ordinary skill in the art will appreciate that: all or part of step realizing above-mentioned each embodiment of the method can be completed by the hardware that programmed instruction is relevant.Aforesaid program can be stored in a computer read/write memory medium.This program upon execution, performs to include the step of above-mentioned each embodiment of the method；And aforesaid storage medium includes: the various media that can store program code such as ROM, RAM, magnetic disc or CDs.
Last it is noted that various embodiments above is only in order to illustrate technical scheme, it is not intended to limit；Although the present invention being described in detail with reference to foregoing embodiments, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein some or all of technical characteristic is carried out equivalent replacement；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (4)
1. an IGBT package casing glue spreading apparatus, it is characterised in that including:
Collecting unit, for gathering shape and the dimension information of IGBT package casing pre-coated surface；
Coordinates measurement unit, for generating gluing path according to the information gathered；
Control unit, performs component for moving gluing according to described gluing path, gluing performs the colloid that component uniformly discharges and is coated on described IGBT package casing；
Described IGBT package casing glue spreading apparatus, also includes detection unit；
Described detection unit, for detecting the characteristic information of described IGBT package casing, and by this characteristic information output to described control unit；
Described control unit, is additionally operable to the characteristic information according to receiving and selects and change colloid；
Wherein, described characteristic information is colouring information and/or the surfacing information of IGBT package casing；
Described IGBT package casing glue spreading apparatus, also includes man-machine interaction unit；This man-machine interaction unit, for receiving the command information of user's input, and updates the gluing path in described control unit according to described command information；
Wherein, described command information includes: path procedure information and/or parameter setting information；Described parameter setting information includes: IGBT package casing dimensional parameters information, gluing perform component translational speed parameter setting information and colloid model parameter information.
2. IGBT package casing glue spreading apparatus according to claim 1, it is characterised in that also include memory element, this memory element is for storing the gluing path that described coordinates measurement unit generates.
3. an IGBT package casing glue spreading method, it is characterised in that including:
Gather shape and the dimension information of IGBT package casing pre-coated surface；
Gluing path is generated according to the information gathered；
Move gluing according to described gluing path and perform component, gluing is performed the colloid that component uniformly discharges and is coated on described IGBT package casing；
Described IGBT package casing glue spreading method, component is performed moving gluing according to described gluing path, perform gluing also to include before the colloid that component uniformly discharges is coated on described IGBT package casing: detect the characteristic information of described IGBT package casing, and select according to described characteristic information and change colloid；Wherein, described characteristic information is colouring information and/or the surfacing information of IGBT package casing；
Described IGBT package casing glue spreading method, also includes: receives the command information of user's input, and updates the gluing path generated according to described command information；
Wherein, described command information includes: path procedure information and/or parameter setting information；Described parameter setting information includes: IGBT package casing dimensional parameters information, gluing perform component translational speed parameter setting information and colloid model parameter information.
4. IGBT package casing glue spreading method according to claim 3, it is characterised in that also include: the gluing path that storage has generated.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210085009.8A CN103357546B (en) | 2012-03-27 | 2012-03-27 | IGBT package casing glue spreading apparatus and method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210085009.8A CN103357546B (en) | 2012-03-27 | 2012-03-27 | IGBT package casing glue spreading apparatus and method |
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| CN103357546A CN103357546A (en) | 2013-10-23 |
| CN103357546B true CN103357546B (en) | 2016-07-06 |
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| CN116818063B (en) * | 2023-08-30 | 2023-11-14 | 江铃汽车股份有限公司 | Method and device for detecting coating quality of automobile chip heat dissipation glue and readable storage medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102133565A (en) * | 2011-01-27 | 2011-07-27 | 深圳市鹰眼在线电子科技有限公司 | Control method and system for COB (Chip on Board) glue sealing machine based on visual orientation technology |
| CN202079012U (en) * | 2011-04-29 | 2011-12-21 | 赫比（上海）通讯科技有限公司 | Image-sensing precise-positioning dispensing equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4641672B2 (en) * | 2001-07-02 | 2011-03-02 | 関西ペイント株式会社 | Coating equipment management system |
| JP5266208B2 (en) * | 2006-05-09 | 2013-08-21 | アドヴァンスト リキッド ロジック インコーポレイテッド | Droplet treatment system |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102133565A (en) * | 2011-01-27 | 2011-07-27 | 深圳市鹰眼在线电子科技有限公司 | Control method and system for COB (Chip on Board) glue sealing machine based on visual orientation technology |
| CN202079012U (en) * | 2011-04-29 | 2011-12-21 | 赫比（上海）通讯科技有限公司 | Image-sensing precise-positioning dispensing equipment |
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