CN103349539B - Endoscope, adapter - Google Patents

Abstract

The invention provides endoscope, adapter.This endoscope possesses: endoscope's inner matter; Framework, it keeps described endoscope inner matter; And resin material, it is coated between described framework and described endoscope inner matter, described endoscope inner matter is fixed on the inner peripheral surface of described framework, between described framework and described endoscope inner matter, accompany described resin material and air, the described inner peripheral surface of described framework forms the face shape with heat sinking function.

Description

Endoscope, adapter

The application is the applying date: JIUYUE in 2009 29 days, application number are: 200910175730.4, denomination of invention is the divisional application of the application for a patent for invention of " endoscope, adapter ".

Technical field

The present invention relates to endoscope and adapter.

Background technology

Endoscope's extensive use in medical field and industrial field.The endoscope used in the medical field can be inserted in treatment instrument and runs through the treatment instrument inserted in passage and carry out various disposal by being inserted elongated insertion section to observe endoceliac internal organs or use as required to run through in the body cavity of subject.

Further, the endoscope used in industrial field can by inserting the damage of observing the tested position in subject in the jet engine of subject or in the pipe arrangement of factory etc. and corrosion etc. or carrying out various disposal etc. using elongated insertion section.

In these endoscopies used in medical field, industrial field, in the leading section of the insertion section of endoscope, be provided with the imaging apparatus such as objective lens optical system, CCD, to the light-emitting components such as the LED thrown light in tested position and the endoscope's inner matter such as substrate of transmitting-receiving carrying out the signal of telecommunication relative to imaging apparatus.

Herein, in Japanese Unexamined Patent Publication 2009-22636 publication, following endoscope is disclosed: the thermal component be made up of many elongated wire rods runs through in the mode of the base end side that front end is positioned near light-emitting component, cardinal extremity is positioned at insertion section and is inserted in insertion section.

But even if be used in thermal component disclosed in Japanese Unexamined Patent Publication 2009-22636 publication, heat also can conduct to objective lens optical system or the inner matter such as imaging apparatus, substrate via framework.Consequently, due to the thermal expansion of inner matter, likely produce the stress giving inner matter from framework.

In addition, above situation is not limited to endoscope, even if light-emitting component and photoconduction are located in the adapter such as leading section handling optics adapter freely of insertion section, because the heat of light-emitting component and photoconduction can conduct to via framework the adapter inner matter such as objective lens optical system and substrate be fixed in the frame of adapter, therefore same with above-mentioned situation, likely can produce heat affecting.

Summary of the invention

Therefore, expect to realize a kind ofly can reduce heat conducts to the inner matter be fixed in framework situation via framework, and endoscope, the adapter of the stress of inner matter are given in the thermal expansion that can reduce due to inner matter from framework.

Endoscope involved by present embodiment possesses: endoscope's inner matter; Framework, it keeps described endoscope inner matter; And resin material, it is coated between described framework and described endoscope inner matter, described endoscope inner matter is fixed on the inner peripheral surface of described framework, it is characterized in that, between described framework and described endoscope inner matter, accompany described resin material and air.

Further, the adapter involved by present embodiment possesses: adapter inner matter; Framework, it keeps described adapter inner matter; And resin material, it is coated between described framework and described adapter inner matter, described adapter inner matter is fixed on the inner peripheral surface of described framework, it is characterized in that, between described framework and described adapter inner matter, accompany described resin material and air.

More than the present invention and other object, feature and advantage clearly can be understood from referring to the description of the drawings.

Accompanying drawing explanation

Fig. 1 is the partial sectional view of the structure in the leading section of the front of the insertion section of the endoscope that expression first embodiment is summarily shown.

Fig. 2 is the sectional view along the hard tip parts of II in Fig. 1-II line, adhesive linkage and lens.

Fig. 3 illustrates in the adhesive linkage of Fig. 2, the sectional view of the state that the bubble in resin material combines in resin material and the interface of inner peripheral surface of hard tip parts and the interface of the outer peripheral face of resin material and lens.

Fig. 4 illustrates the axonometric chart to the outer peripheral face of the lens of Fig. 1 structure of application of resin material partly.

Fig. 5 is the sectional view along the hard tip parts of the V-V line in Fig. 4, adhesive linkage and lens.

Fig. 6 is the sectional view illustrated by making the thickness of resin material local different the hard tip parts, adhesive linkage and the lens that form the structure of adhesive linkage.

Fig. 7 is the partial sectional view of the Sketch in the leading section handling adapter freely of the insertion section in endoscope that expression second embodiment is shown together with the leading section of insertion section.

Fig. 8 is the partial sectional view in the leading section of the front of the insertion section of the endoscope of the structure of the variation that Fig. 1 is summarily shown.

Fig. 9 is the sectional view of the hard tip parts of the structure of the variation that Fig. 2 is shown, adhesive linkage and lens.

Figure 10 is the sectional view of the hard tip parts of the structure of the variation that Fig. 3 is shown, adhesive linkage and lens.

Figure 11 is the axonometric chart of the lens of the structure of the variation that Fig. 4 is shown.

Detailed description of the invention

Below, with reference to accompanying drawing, embodiments of the present invention are described.

(the first embodiment)

Fig. 1 is the partial sectional view of the structure in the leading section of the front of the insertion section that the endoscope representing present embodiment is summarily shown.

As shown in Figure 1, leading section 4 is positioned at the front of the direction of insertion S of the insertion section 2 of endoscope 1, is provided with framework and the hard tip parts 5 of the substantial cylindrical shape being such as formed as lengthwise on direction of insertion S in this leading section 4.

In the substantial middle of hard tip parts 5, be formed with through hole 5k along direction of insertion S, in through hole 5k, be provided with following endoscope inner matter: the optics (hereinafter referred to as lens 3) for observing subject be made up of multiple lens 3; By making to inject by the picture of the subject of this optics optically focused the imaging apparatus 6 that sensitive surface takes subject; And the electric base 7,8 etc. of the transmitting-receiving of the signal of telecommunication is carried out relative to this imaging apparatus 6.That is, hard tip parts 5 keep these endoscope's inner matters.

In addition, optics also can be made up of lens.And, imaging apparatus 6 is positioned at the image space of multiple lens 3 in through hole 5k mode with sensitive surface is located at the rear (being only called rear below) of the direction of insertion S of multiple lens 3, in addition, electric base 7,8 is located at the rear of imaging apparatus 6 in through hole 5k.

Further, multiple lens 3, imaging apparatus 6 and electric base 7,8 is fixed on the inner peripheral surface 5n formed by through hole 5k of hard tip parts 5 via any one adhesive linkage in adhesive linkage 15 described later, adhesive linkage 21, adhesive linkage 29.

In addition, inner peripheral surface 5n is formed as the face shape with heat sinking function.Specifically, because through hole 5k is usually by the formation such as machining or mould, if therefore existing mirror process is not implemented upon formation in the surface of inner peripheral surface 5n, is then formed as very coarse face shape, such as there is multiple concavo-convex shape.Thus, inner peripheral surface 5n is such as formed as the shape as being provided with radiating fin, becomes the face shape with heat sinking function.

Further, the outer peripheral face 5g due to hard tip parts 5 needs to be arranged on accurately in leading section 4 usually, therefore after being formed by machining or mould etc., implements mirror finish.

Thus, the surface roughness of inner peripheral surface 5n is larger than the surface roughness of outer peripheral face 5g.In other words, the surface area of inner peripheral surface 5n becomes large.In addition, hard tip parts 5 are made up of the parts that the pyroconductivity of thermal conductivity ratio resin material described later 16,25 is high, such as when resin material 16,25 is made up of the bonding agent of epoxies, hard tip parts 5 are made up of the high plastics of the pyroconductivity of this bonding agent of thermal conductivity ratio or metal.

In addition, multiple lens 3, imaging apparatus 6 and electric base 7,8 describes later relative to the fixture construction of inner peripheral surface 5n.

Be located at such as being connected electrically in electric base 7,8 by scolding tin from the position that insulation crust resin strips out of the front end of the multiple shooting wires 9 in shooting cable 10.

For shooting cable 10, its periphery is used for the not shown metal wire rod of noise counter plan by braiding and forms, and this shooting cable 10 runs through in the insertion section 2 being inserted in endoscope 1, not shown operating portion and general flexible cord.In addition, the rear ends of wire 9 of many of shooting cable 10 shootings are electrically connected with the Computer image genration circuit etc. of image procossing, and described Computer image genration circuit etc. is arranged in the not shown apparatus main body that is connected with endoscope 1.Transmission, the reception of image pickup signal is carried out between the substrate of the Computer image genration circuit of the image procossing of many shooting wires 9 in imaging apparatus 6 and apparatus main body etc.Further, electric base 7,8 is equipped with the not shown electronic unit such as capacitor and IC.

Further, near the periphery of the front end face of hard tip parts 5, be provided with the groove 5m of all shapes, be provided with in this groove 5m: subject is irradiated to the light-emitting components 11 such as the such as LED of illumination light; And expand irradiating the illumination light come from this light-emitting component the lighting lens 12 irradiated towards subject.

Be connected electrically in light-emitting component 11 from the front end of power feed line 13 come that internally extends of apparatus main body via general flexible cord, operating portion, insertion section 2.In addition, in hard tip parts 5, be provided with along direction of insertion S the hole 5q running through insertion for power feed line 13.

Below, use Fig. 2 ~ 6 that the fixture construction of endoscope's inner matters such as multiple lens 3, imaging apparatus 6 and electric base 7,8 relative to the inner peripheral surface 5n of hard tip parts 5 is described.

Fig. 2 is the sectional view along the hard tip parts of II in Fig. 1-II line, adhesive linkage and lens, Fig. 3 illustrates in the adhesive linkage of Fig. 2, the sectional view of the state that the bubble in resin material combines in resin material and the interface of inner peripheral surface of hard tip parts and the interface of the outer peripheral face of resin material and lens.

And, Fig. 4 illustrates the axonometric chart to the outer peripheral face of the lens of Fig. 1 structure of application of resin material partly, Fig. 5 is the sectional view along the hard tip parts of the V-V line in Fig. 4, adhesive linkage and lens, and Fig. 6 is the sectional view illustrated by making the thickness of resin material local different the hard tip parts, adhesive linkage and the lens that form the structure of adhesive linkage.

In addition, the example of the fixture construction of lens 3 is below enumerated so that the fixture construction of endoscope's inner matter relative to the inner peripheral surface 5n of hard tip parts 5 to be described.

As shown in Fig. 2 ~ Fig. 6, between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5, be provided with the adhesive linkage clipping resin material and air.

Specifically, as shown in Figure 2, between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5, be provided with adhesive linkage 15, this adhesive linkage 15 is made up of the resin material 16 be fixed on by the outer peripheral face 3g of lens 3 on the inner peripheral surface 5n of hard tip parts 5 and the bubble 17 be mixed in resin material 16.

In other words, be formed as by bubble 17 structure accompanying resin material 16 and air between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5.

In addition, resin material 16 by a kind of organic solvent class bonding agent of liquid, elastic adhesive, moment bonding agent, aqueous adhesive etc. form, or to be made up of the hybrid epoxidized class bonding agent etc. of two kinds of liquid.Certainly, resin material 16 also can be made up of materials more than three kinds of liquid.

Further, when resin material 16 is made up of a kind of bonding agent of liquid, in resin material 16, bubble 17 is produced by stirring a kind of bonding agent of liquid; When resin material 16 is made up of the bonding agent of two kinds of liquid, when mixing two kinds of liquid, use whizzer etc. that two kinds of liquid low speed rotation are stirred two kinds of liquid, thus produce bubble 17 in resin material 16.

In addition, as shown in Figure 3, also can be formed with air layer 18 at resin material 16 and the interface of the interface of the inner peripheral surface 5n of hard tip parts 5 and the outer peripheral face 3g of resin material 16 and lens 3, multiple bubbles 17 that this air layer 18 floats towards each interface in resin material 16 combine and are formed.In this case, be formed as by bubble 17 and air layer 18 structure accompanying resin material 16 and air between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5.

In addition, as mentioned above, when the surface roughness of the inner peripheral surface 5n of front end hard part 5 is formed thicker, be more prone to produce air layer 18 at resin material 16 and the interface of inner peripheral surface 5n.

And, as the example different from Fig. 2, Fig. 3, as shown in Figure 4, Figure 5, enumerate following structure: be coated with by arranging the outer peripheral face 3g of lens 3 the area of application A and the non-coated area B that this outer peripheral face 3g are fixed on the resin material 25 on the inner peripheral surface 5n of hard tip parts 5, thus be provided with between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5 by being coated in the resin material 25 of the area of application A and being clipped in the adhesive linkage 21 that the air layer 26 in the B of non-coated area forms.In this case, be formed as by air layer 26 structure accompanying resin material 25 and air between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5.

Further, as the structure arranging the area of application A and non-coated area B, the structure shown in preferred Figure 11.Figure 11 is the axonometric chart of the lens of the structure of the variation that Fig. 4 is shown.

In the structure shown in this Figure 11, in the outer peripheral face 3g of lens 3, the area of application A is formed with throughout the complete cycle of lens 3 respectively in the front of direction of insertion S and base end side, simultaneously, in direction of insertion S, be formed with non-coated area B in the mode that coated region A clips, and respectively resin material 25 be set at each the area of application A, thus, air layer 26 maintains air-tight state by each resin material 25.Consequently, even if lens 3 are heated, because air layer 26 is compressed between the outer peripheral face 3g and the inner peripheral surface 5n of front-end architecture parts 5 of lens 3, therefore, it is possible to suppress the inclination of lens 3 further.

In addition, same with resin material 16, resin material 25 by a kind of organic solvent class bonding agent of liquid, elastic adhesive, moment bonding agent, aqueous adhesive etc. form, or to be made up of the hybrid epoxidized class bonding agent etc. of two kinds of liquid.Certainly, resin material 25 also can be made up of materials more than three kinds of liquid.

Further, different from Fig. 2, Fig. 3, be not mixed into bubble 17 in the resin material 25 in this structure.But, in this configuration, the resin material 16 of bubble 17 also can be mixed in the area of application A coating.

In addition, in this configuration, non-coated area B due to resin material 25 is present between the inner peripheral surface 5n of hard tip the parts 5 and outer peripheral face 3g of lens 3, therefore, compared with the structure shown in Fig. 2, Fig. 3, lens 3 decline relative to the adhesive strength of hard tip parts 5, but, enough intensity has been become as by lens 3 intensity settings be fixed on hard tip parts 5, in addition, bonding with not using in the past, by means of only against being fixed on by lens 3 compared with the structure on hard tip parts 5, there is enough constant intensities.

In addition, as the example different from Fig. 2 ~ Fig. 5, as shown in Figure 6, following structure can be listed: relative to the outer peripheral face 3g of lens 3, a part for resin material 25 is applied thinner, between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5, be provided with the adhesive linkage 29 be made up of resin material 25 and air layer 27 thus, described air layer 27 is formed by following space: the space formed by applying thinner than the interval between outer peripheral face 3g and inner peripheral surface 5n by a part for this resin material 25.In this case, be formed as by air layer 27 structure accompanying resin material 25 and air between the inner peripheral surface 5n and the outer peripheral face 3g of lens 3 of hard tip parts 5.

And, when lens 3 due to heat and in expanded radially time, shown in Fig. 2 ~ Fig. 6 be clipped in bubble 17 in resin material 16,25, air layer 18,26,27 makes the easy plastic deformation of resin material 16,25, the compression stress of lens 3 is given in the expansion that can reduce thus along with lens 3 from front end hard part 5.

In addition, imaging apparatus 6, electric base 7,8 are also identical relative to the fixture construction of the inner peripheral surface 5n of hard tip parts 5 with the outer peripheral face 3g of above-mentioned lens 3 relative to the fixture construction of inner peripheral surface 5n.

That is, imaging apparatus 6, electric base 7,8 are bonded on inner peripheral surface 5n via any one adhesive linkage in adhesive linkage 15,21,29.In addition, also can be lens 3, at least one in imaging apparatus 6, electric base 7,8 be bonded on inner peripheral surface 5n via any one adhesive linkage in adhesive linkage 15,21,29.That is, do not need all endoscope's inner matters are all bonded on inner peripheral surface 5n via any one adhesive linkage in adhesive linkage 15,21,29.

Like this, show endoscope's inner matter to be in the present embodiment fixed on the inner peripheral surface 5n of hard tip parts 5 via any one adhesive linkage accompanied in the adhesive linkage 15,21,29 of resin material and air between endoscope's inner matter such as inner peripheral surface 5n and lens 3, imaging apparatus 6, electric component 7,8 of hard tip parts 5.

According to this situation, because the air be clipped in any one adhesive linkage of adhesive linkage 15,21,29 suppresses the heat produced along with the luminescence of light-emitting component 11 to be delivered to endoscope's inner matter via hard tip parts 5, therefore, it is possible to suppress the thermal expansion of endoscope's inner matter.

In addition, in the present embodiment, the inner peripheral surface 5n of hard tip parts 5 forms the face shape with heat sinking function, and hard tip parts 5 are made up of the material that the pyroconductivity of thermal conductivity ratio resin material 16,25 is high, thus, even if endoscope's inner matter is heated, the hot parts that also can be discharged into other efficiently via hard tip parts 5.

Such as, therefore, when endoscope's inner matter is multiple lens 3, owing to can suppress the inclination of lens 3, therefore, it is possible to effectively prevent the birefringence produced between lens and other lens, therefore imaging apparatus 6 can take the image of fine.

Further, when endoscope's inner matter is imaging apparatus 6, can not only prevent imaging apparatus 6 from breaking down, and the situation producing noise in the image at the tested position taken by imaging apparatus 6 can be suppressed.

In addition, when endoscope's inner matter is electric base 7,8, except can suppress to produce in the electronic circuit of substrate 7,8 bad except, the electronic unit be mounted on substrate can also be suppressed to produce fault.

And, even if the heat such as produced along with the driving of imaging apparatus 6 in through hole 5k, be directly conducted to lens 3 thus lens 3 in expanded radially, by being clipped in the air in any one adhesive linkage of adhesive linkage 15,21,29, adhesive linkage 15,21,29 becomes easy plastic deformation, therefore the resin material 16,25 in adhesive linkage plays function as padded coaming, therefore, with do not accompany the situation of air in adhesive linkage compared with, the compression stress of giving lens 3 from front end hard part 5 can be reduced.

As mentioned above, the endoscope 1 possessing following structure can be provided: heat can be suppressed to conduct to via hard tip parts 5 endoscope's inner matter of being fixed on hard tip parts 5 and the stress of endoscope's inner matter is given in the thermal expansion that can reduce due to endoscope's inner matter from front end hard part 5.

In addition, below variation is shown.In the present embodiment, showing lens 3, imaging apparatus 6 and electric base 7,8 as endoscope's inner matter citing, but be not limited to this, also can be other parts.Further, endoscope's inner matter is not limited to the parts in the leading section 4 of insertion section 2, also can be the parts of the inside at other positions of insertion section 2, also can be the parts in operating portion.In this case, as the framework keeping endoscope's inner matter, also can be the parts beyond hard tip parts 5.

Further, show lens 3, imaging apparatus 6 and substrate 7,8 in the present embodiment and be fixed on hard tip parts 5, but be not limited to this, also can be separately fixed in different frameworks.In addition, multiple lens 3 also can be separately fixed in different frameworks.

In addition, Fig. 8 is below used to be described variation.

Fig. 8 is the partial sectional view in the leading section of the front of the insertion section of the endoscope of the structure of the variation that Fig. 1 is summarily shown.

As shown in Figure 8, in the structure of the leading section 4 of the insertion section 2 of endoscope 1, also the lens 3 being positioned at the front of direction of insertion S can be formed as less than the lens 3 shown in Fig. 1 in radial direction, and the half part of the front of the direction of insertion S of outer peripheral face 3g only in the front of the direction of insertion S of lens 3 arranges resin material 16 in the mode of the inner peripheral surface 5n of the outer peripheral face 3g and distal end constituting part 5 that bury lens 3.In addition, air layer 107 is provided with in the half part of the base end side of the direction of insertion S of outer peripheral face 3g.According to this structure, easily watertight can be maintained in the front of insertion section 2.

Further, Fig. 9, Figure 10 variation to other is below used to be described.

Fig. 9 is the sectional view of the hard tip parts of the structure of the variation that Fig. 2 is shown, adhesive linkage and lens, and Figure 10 is the sectional view of the hard tip parts of the structure of the variation that Fig. 3 is shown, adhesive linkage and lens.

As shown in Figure 9, Figure 10, also can from the outer peripheral face 5g of front end hard part 5 until inner peripheral surface 5n arranges through hole 300.

If form this structure, due to can through hole 300 from the outer peripheral face 5g being located at hard tip parts 5 towards inner peripheral surface 5n resin by injection material 16, therefore, it is possible to lens 3 are fixed on hard tip parts 5 by workability well.

Further, the fixing means of lens 3 and hard tip parts 5 is not limited to above-mentioned embodiment, in the front end of hard tip parts 5, when side face 5n is provided with the structure of ladder difference, preferably forms resin material 16 in the following manner within it.That is, the resin material 16 that the ratio being located at air layer in the resin material 16 at the abutting part place between an interarea of lens 3 and the ladder difference being located at inner peripheral surface 5n or bubble is located between the side of lens 3 and the ladder difference being located at inner peripheral surface 5n is few.In this case, more reliably can not only carry out fixing between lens 3 and hard tip parts 5, even and if the ladder difference portion of hard tip parts is out of shape due to external stress, also can suppress by air layer or bubble impact that lens 3 are caused.

In addition, by utilizing metal glass to form hard tip parts 5, and making the thermal coefficient of expansion of lens 3 and hard tip parts 5 close, following effect can be obtained.That is, involved according to the present embodiment resin material 16, compared with not accompanying the resin material of air layer or bubble, easily there is plastic deformation in resin material 16, therefore, it is possible to suppress the impact caused lens 3 further.

(the second embodiment)

Fig. 7 is the partial sectional view of the Sketch illustrated together with the leading section of insertion section in the leading section handling adapter freely of the insertion section in endoscope representing present embodiment.

Compared with the endoscope of the first embodiment shown in above-mentioned Fig. 1 ~ Fig. 6, when the structure of the adapter of this second embodiment is in framework adapter inner matter being fixed on adapter, use this point of bonding structure be fixed on by endoscope's inner matter in framework shown in the first embodiment different.Therefore, only this difference is described, gives identical label to the structure same with the first embodiment and omit the description.

In the present embodiment, leading section 114 is positioned at the front of the direction of insertion S of the insertion section 102 of endoscope 101, is provided with framework and the hard tip parts 115 of the substantial cylindrical shape being such as formed as lengthwise on direction of insertion S in this leading section 114.

In the substantial middle of hard tip parts 115, be formed with through hole 115k along direction of insertion S, in through hole 115k, be provided with following endoscope inner matter: by multiple lens 103 form for the optics observed in subject (hereinafter referred to as lens 103); By making to inject by the picture of the subject of this optics optically focused the imaging apparatus 116 that sensitive surface takes subject; And the electric base 117,118 etc. of the transmitting-receiving of the signal of telecommunication is carried out relative to this imaging apparatus 116.That is, hard tip parts 115 keep these endoscope's inner matters.

In addition, optics 103 also can be made up of lens.And, imaging apparatus 116 is positioned at the image space of multiple lens 103 in through hole 115k mode with sensitive surface is located at the rear (being only called rear below) of the direction of insertion S of multiple lens 103, in addition, electric base 117,118 is located at the rear of imaging apparatus 116 in through hole 115k.

Further, endoscope's inner matter such as multiple lens 103, imaging apparatus 116 and electric base 117,118 is fixed on the inner peripheral surface 115n of hard tip parts 115 via any one adhesive linkage in the adhesive linkage 15 shown in the first above-mentioned embodiment, adhesive linkage 21, adhesive linkage 29.

Therefore, in the present embodiment, also same with the first embodiment, except the air be clipped in adhesive linkage 15, adhesive linkage 21, adhesive linkage 29 can be utilized to suppress heat to conduct to except endoscope's inner matter via hard tip parts 115, can also suppress by the air be clipped in adhesive linkage 15, adhesive linkage 21, adhesive linkage 29 stress giving endoscope's inner matter due to the thermal expansion towards radial direction of endoscope's inner matter from front end hard part 115.

Further, inner peripheral surface 115n is same with the inner peripheral surface 5n of the first embodiment, and form the face shape with heat sinking function, in addition, same with the first embodiment, the surface roughness of inner peripheral surface 115n is larger than the surface roughness of outer peripheral face 115g.In other words, the surface area of inner peripheral surface 115n becomes large.

In addition, hard tip parts 115 are made up of the parts that the pyroconductivity of the above-mentioned resin material 16,25 of thermal conductivity ratio is high, such as when resin material 16,25 is made up of the bonding agent of epoxies, hard tip parts 115 are made up of the high plastics of the pyroconductivity of this bonding agent of thermal conductivity ratio or metal.

Be located at such as being connected electrically in electric base 117,118 by scolding tin from the position that insulation crust resin strips out of the front end of many shooting wires 9 in shooting cable 10.

Further, the front end face of hard tip parts 115 is formed groove 115p, and electrical connection section 168 is located in groove 115p.Be connected electrically in electrical connection section 168 from the front end of power feed line 103 come that internally extends of apparatus main body via general flexible cord, operating portion, insertion section 102.In addition, in hard tip parts 115, be provided with along direction of insertion S the hole 115q be communicated with groove 115p running through insertion for power feed line 113.

In addition, in the present embodiment, lens 103, imaging apparatus 116 and substrate 117,118 also can be separately fixed in different frameworks, and in addition, multiple lens 103 also can be separately fixed in different frameworks.

The adapters such as optics adapter 50 load and unload freely relative to the outer peripheral face of the leading section 114 formed like this.

Adapter 50 possesses the adapter main body 60 as framework in inside, and is provided with outer mounting cover 61 in the periphery of adapter main body 60.Further, be formed with through hole 60k in the substantially central portion of adapter main body 60 along direction of insertion S, the multiple lens 63 as optics are located in this through hole 60k.

In other words, adapter main body 60 keeps multiple lens 63.In addition, optics also can be made up of lens.Further, lens 63 form adapter inner matter.In addition, lens 63 are fixed on adapter main body 60 via any one adhesive linkage in the adhesive linkage 15 shown in the first above-mentioned embodiment, adhesive linkage 21, adhesive linkage 29.

Be provided with inside at the base end side of adapter main body 60 and there is space and the foot 60m extended to the rear of direction of insertion S, and, be provided with handling ring 62 in the periphery of foot 60m, this handling ring 62 has relative to the external thread spiro fastening be formed on the periphery of leading section 114 female thread freely.In addition, when adapter 50 is assemblied on leading section 114, leading section 114 embeds in the space of the space of the inside of foot 60m and the inside of handling ring 62.

Substrate 64 and light-emitting component 65 is provided with at the front end face of adapter main body 60.In adapter main body 60, except through hole 60k, be also provided with roughly parallel with this through hole 60k through hole 60h, electrical connection section 68 is located in this through hole 60h.This electrical connection section 68 is connected electrically on the electrode 67 of light-emitting component 65.

Electrical connection section 68 has following structure: when adapter 50 is assemblied on leading section 114, and this electrical connection section 68 is electrically connected with the electrical connection section 168 be located on leading section 114.

In the adapter 50 formed by this way, because lens 63 are via the adhesive linkage 15 shown in the first above-mentioned embodiment, adhesive linkage 21, any one adhesive linkage in adhesive linkage 29 is fixed on adapter main body 60, therefore, same with the first embodiment, can by being clipped in adhesive linkage 15, adhesive linkage 21, air in adhesive linkage 29 suppresses the heat of light-emitting component 65 to conduct to lens 63 via adapter main body 60, in addition, can also by being clipped in adhesive linkage 15, adhesive linkage 21, air in adhesive linkage 29 suppresses the stress giving lens 63 due to the thermal expansion towards radial direction of lens 63 from adapter main body 60.

In addition, effect is in addition same with the first above-mentioned embodiment.Therefore, the adapter 50 possessing following structure can be provided: heat can be suppressed to conduct to via adapter main body 60 the adapter inner matter be fixed on adapter main body 60, and the stress of adapter inner matter is given in the thermal expansion that can reduce due to adapter inner matter from adapter main body 60.

Further, in the present embodiment, with lens 63 for being illustrated adapter inner matter, but be not limited thereto, adapter inner matter also can be other parts, such as substrate 64 etc.In this case, as long as be fixed on outer mounting cover 61 via any one adhesive linkage in adhesive linkage 15, adhesive linkage 21, adhesive linkage 29 by substrate 64, just the effect same with present embodiment can be obtained.In addition, multiple lens 63 also can be separately fixed on different frames.

Although be illustrated the preferred embodiment of the present invention with reference to accompanying drawing, but should be understood to the present invention and be not limited to above-mentioned embodiment, those skilled in the art when not departing from the spirit or scope of the present invention that claims limit, can carry out various changes and modifications to this.

Claims (4)

1. an endoscope, described endoscope has:

Endoscope's inner matter;

Framework, it keeps described endoscope inner matter; And

Resin material, it is coated between described framework and described endoscope inner matter, is fixed on the inner peripheral surface of described framework by described endoscope inner matter,

It is characterized in that,

Described resin material and air is accompanied between described framework and described endoscope inner matter,

The described inner peripheral surface of described framework forms the face shape with heat sinking function,

Described endoscope inner matter is optics for observing subject, imaging apparatus or carry out the electric base of signal of telecommunication transmitting-receiving relative to imaging apparatus.

2. endoscope according to claim 1, is characterized in that,

The surface roughness of the described inner peripheral surface of described framework is larger than the surface roughness of the outer peripheral face of described framework.

3. an adapter, it loads and unloads freely in endoscope,

Described adapter has:

Adapter inner matter;

Framework, it keeps described adapter inner matter; And

Resin material, it is coated between described framework and described adapter inner matter, is fixed on the inner peripheral surface of described framework by described adapter inner matter,

It is characterized in that,

Described resin material and air is accompanied between described framework and described adapter inner matter,

The described inner peripheral surface of described framework forms the face shape with heat sinking function,

Described framework is made up of the material that conduction of heat ratio is higher than the pyroconductivity of described resin material.

4. adapter according to claim 3, is characterized in that,

The surface roughness of the described inner peripheral surface of described framework is larger than the surface roughness of the outer peripheral face of described framework.