CN103348416B - For providing the material of conductive contact layer, there is the contact element of above-mentioned layer, the purposes of the method and above-mentioned material for providing contact element - Google Patents
For providing the material of conductive contact layer, there is the contact element of above-mentioned layer, the purposes of the method and above-mentioned material for providing contact element Download PDFInfo
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- CN103348416B CN103348416B CN201280007441.3A CN201280007441A CN103348416B CN 103348416 B CN103348416 B CN 103348416B CN 201280007441 A CN201280007441 A CN 201280007441A CN 103348416 B CN103348416 B CN 103348416B
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- 239000000463 material Substances 0.000 title claims abstract description 200
- 239000011159 matrix material Substances 0.000 claims abstract description 82
- 229910052709 silver Inorganic materials 0.000 claims abstract description 46
- 229910052718 tin Inorganic materials 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims description 54
- 229910052738 indium Inorganic materials 0.000 claims description 26
- 238000005240 physical vapour deposition Methods 0.000 claims description 26
- 239000011780 sodium chloride Substances 0.000 claims description 25
- 150000003839 salts Chemical class 0.000 claims description 24
- 239000010931 gold Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 18
- 229910001507 metal halide Inorganic materials 0.000 claims description 16
- 150000005309 metal halides Chemical group 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 15
- 229910052741 iridium Inorganic materials 0.000 claims description 14
- 229910052762 osmium Inorganic materials 0.000 claims description 14
- 229910052703 rhodium Inorganic materials 0.000 claims description 14
- 229910052707 ruthenium Inorganic materials 0.000 claims description 14
- CPELXLSAUQHCOX-UHFFFAOYSA-M bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 12
- 229910052803 cobalt Inorganic materials 0.000 claims description 12
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 claims description 12
- PJXISJQVUVHSOJ-UHFFFAOYSA-N Indium(III) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 10
- 229910052702 rhenium Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910052976 metal sulfide Inorganic materials 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 37
- 239000010410 layer Substances 0.000 description 93
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 56
- 239000010944 silver (metal) Substances 0.000 description 47
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 23
- 239000010949 copper Substances 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
- 239000004332 silver Substances 0.000 description 14
- RWSOTUBLDIXVET-UHFFFAOYSA-N dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 10
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000005987 sulfurization reaction Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 239000010948 rhodium Substances 0.000 description 7
- 239000011135 tin Substances 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 5
- 229910000510 noble metal Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 241000122205 Chamaeleonidae Species 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000000875 corresponding Effects 0.000 description 4
- 231100000078 corrosive Toxicity 0.000 description 4
- 231100001010 corrosive Toxicity 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000036961 partial Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- -1 silver-indium Chemical compound 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- ADZWSOLPGZMUMY-UHFFFAOYSA-M Silver bromide Chemical compound [Ag]Br ADZWSOLPGZMUMY-UHFFFAOYSA-M 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000001419 dependent Effects 0.000 description 2
- 230000003628 erosive Effects 0.000 description 2
- 230000002349 favourable Effects 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910002677 Pd–Sn Inorganic materials 0.000 description 1
- MSFPLIAKTHOCQP-UHFFFAOYSA-M Silver iodide Chemical compound I[Ag] MSFPLIAKTHOCQP-UHFFFAOYSA-M 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-M Sodium 2-anthraquinonesulfonate Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)[O-])=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-M 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atoms Chemical group 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003203 everyday Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000001967 indiganyl group Chemical group [H][In]([H])[*] 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009114 investigational therapy Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 230000000670 limiting Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N oxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229940045105 silver iodide Drugs 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Abstract
A kind of for providing the material of conductive contact layer, material be included as in Ag, Cu, Sn, Ni any one, the matrix material of the alloy of its first a kind of slaine or one or more.Material also comprises: the In in the range of 0.01at.% to 10at.%；Pd in the range of 0.01at.% to 10at.%；Sn in the range of 0.01at.% to 10at.%, unless matrix material has comprised the Sn of higher amount.From such material, it is provided that have the corrosion resistance of improvement and the contact layer (6) of low contact resistance compared with the coating of only matrix material.Also disclose that: include that substrate (4) and the conductive contact element (2) of the contact layer (6) comprising material, the method being used for providing contact element (2) and the material that are coated on are as contact layer and the purposes of target material.
Description
Technical field
Present disclosure is usually directed to conductive contact layer, and relates to provide the material of such layer.
Background
Conductive contact element, is i.e. suitable for the element such as plug-in connector and slip of arrangements of electric connection or fixing contact
The element of part, generally includes the metal master of conduction, and in order to improve some performance, such as electrical property and/or barrier propterty, leads
Electric contacting layer covers at least contact area of contact element.Protection can be about having its application with wherein contact element
Abrasion, corrosion or other the harmful chemical reaction that environment occurs together.
Gold is to be generally suitable as contact layer but a kind of material of costliness.Potential golden substitute is silver.But, silver is not
As generally will desired or inertia as needing, and accordingly, it may be desirable to improvement some performances such as corrosion resistance further,
Especially comprising Cl-And/or H2In the environment of S, otherwise Cl-And/or H2S trends towards reacting with silver and producing the electricity with deterioration
The surface layer of performance.
In WO 2010/005382 A1, the surface of strip substrate provides the In by 1-10% by weight and presses
The Ag of weight meter 90-99%, the biography of the silver-indium alloy being especially made up of the In of by weight 5% and the Ag of by weight 95%
The property led layer.The electrical property of alloy is good, and is difficult to and the reaction of Salmon-Saxl in surrounding air.
EP1489193 discloses by In and Sn of 0.01-5.0% by weight, the In of the most by weight 0.5% and pressing
The Sn of weight meter 0.5%, with the sputtering target of the alloy based on silver that the remaining part being made up of silver forms.
US6565983 discloses to be had with connecing that the layer reducing friction comprising slaine that 0.001 μm to 1mm is thick covers
Touching the electric contacts on surface, slaine is metal halide or metal sulfide.
US7670689 discloses the silver based coatings of a kind of sulfuration resistant effect, and silver based coatings includes being made up of silver matrix material
A main layer and the heap of an oxide film between 10nm and 1 μm.
T.R.Long, Platinum Metals Rev., 1976,20,46-47 disclose, by the Pd group more than 20wt.%
The alloy based on silver become has the corrosion resistance of improvement.
Summary of the invention
More than in view of, the purpose of present disclosure is to propose a kind of solution overcome or at least reduce the problems of the prior art
Certainly scheme, or a kind of alternative solution is at least proposed.It is aimed more particularly at proposition one to provide to comprise and lead
The solution of the conductive contact layer of electric metal matrix material, wherein contact element itself is made with by conducting metal matrix material
Contact element compare the corrosion resistance with improvement.
Have been found that conductive substrate material is especially by adding In and Sn (up to 10at.%, i.e. atomic percentage)
Silver can be modified about resistance to sulfuration (corrosive chameleon) corrosivity, but salt fog resistance is not by desired the best.Before
It has been found that high Pd content (> 20wt.%) material improvement of based on silver corrosion resistance.But, the high valency of Pd
Lattice make such material the most less make people interested.Therefore, the material having less Pd content is probably excellent
Choosing, but for H2The corrosion resistance of S is the most enough.The investigation of the material based on silver comprising In+Sn and Pd shows
Showing, the corrosion resistance effect from In+Sn and Pd can mutually have the opposite effect, such as, do not have Pd phase with at use In+Sn
Ratio, Pd can negatively affect sulfuration resistant effect.Therefore, a challenge is the material found and have In+Sn and Pd, this material energy
Enough sufficiently improve the corrosion resistance for sulfurization and salt air corrosion.It moreover has been found that can use based on slaine ratio
If the material of silver salt is as matrix material itself or as the additive in material, replace material based on metal such as fine silver,
It is thus possible to strengthen corrosion resistance and reduce the coefficient of friction of material, keep low contact resistance simultaneously.Although investigating
Concentrating on the silver of the metal as matrix material, In+Sn and Pd additive can also be used together with other matrix material metal,
Generally it is used together with silver, copper, stannum, nickel or cobalt, its first a kind of slaine or its alloy.
The present invention is limited by appended independent claims.Embodiment in the dependent claims and is retouched following
State and state in accompanying drawing.
Therefore, from following description by obvious above and other purpose and benefit it is:
According to by a kind of first aspect for providing the material of conductive contact layer to realize, material be included as Ag, Cu,
In Sn, Ni, Co any one, the matrix material of the alloy of its any one the first slaine or its any one or more
Material, wherein said material also comprises: the In in the range of 0.01at.% to 10at.%；0.01at.%'s to 10at.%
In the range of Sn, unless matrix material has comprised the Sn of higher amount；And the choosing in the range of 0.01at.% to 10at.%
From at least one element of the group including Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or its combination in any, unless at least one is first
In element Already in matrix material.
Such as, if matrix material is Sn, material is further included in the In in the range of 0.01at.% to 10at.%
The such as Pt in the range of 0.01at.% to 10at.%.
From such material, it is provided that have the corrosion resistance of improvement and low compared with the coating of only matrix material
The contact layer of contact resistance.Here, about matrix material refer to constituent material at least 50at.% and for for improve corrosion resistant
The material of the target (target) of erosion property.
Matrix material can be Ag.In one embodiment, material can comprise less than or the In of about 5at.%, be less than
Or the Sn of about 10at.% and less than or at least one element of about 5at.% or the combination of element.Material may be embodied in
Matrix material in the range of 70at.% to 99.7at.% so that the summation of all the components in material is 100at.%.This
Refer to the contact layer compositions of the Pt of Sn and 10at.% of In, 10at.% for comprising such as 10at.%, remaining part
70at.% will be made up of selected matrix material.
According to by a kind of second aspect for providing the material of conductive contact layer to realize, material be included as Ag, Cu,
In Sn, Ni any one, the matrix material of the alloy of its first a kind of slaine or one or more, wherein said material
Material also comprise: the In in the range of 0.01at.% to 10at.%, the Pd in the range of 0.01at.% to 10at.% with
And the Sn in the range of 0.01at.% to 10at.%, unless matrix material has comprised the Sn of higher amount.Such as, if base
Body material is Sn, and material is further included in the In in the range of 0.01at.% to 10at.% and at 0.01at.% extremely
Pd in the range of 10at.%.
Matrix material can be Ag.In one embodiment, material can comprise less than or the In of about 1.5at.%, little
In or the Sn of about 1.5at.%, less than or the Pd of about 3at.%.
Material can also comprise the sulfuration of second slaine of at least about 0.01at.%, preferably metal halide or metal
Thing.By the interpolation of the second slaine, corrosion resistance can be improved further.Second slaine can comprise in following metal
One or more: Ag, Sn and Cu.Second slaine can be to include the metal halide of one or more in following halogenide
Thing: iodide, chloride and bromide.
In one embodiment, the first a kind of slaine in Ag, Cu, Sn, Ni is matrix material and the first metal
Salt is one or more in iodide and bromide.First slaine can be AgI or AgBr.
In one embodiment, material be further included in the range of 0.01at.% to 10at.% selected from including
At least one element of the group of Au, Ag, Pt, Rh, Ir, Ru, Os, Re or its combination in any, unless at least one element has been deposited
It is in matrix material.
Such material can comprise less than or at least one element of about 10at.% or the combination of element so that Pd and
The summation of the combination of at least one element or element is for being less than or about 10at.%.
In one embodiment, material may be embodied in the matrix material in the range of 70at.% to 99.7at.%,
The summation making all the components in material is 100at.%.
According to the third aspect realized by a kind of material providing conductive contact layer, material be included as Ag, Cu, Sn,
In Ni, Co any one, the matrix material of the alloy of its any one the first slaine or its any one or more, its
Described in material also comprise: In in the range of 0.01at.% to 10at.%, in the scope of 0.01at.% to 10at.%
Interior Pd and the Sn in the range of 0.01at.% to 10at.%, unless matrix material has comprised the Sn of higher amount.
Matrix material can be Ag.
In one embodiment, material be further included in the range of 0.01at.% to 10at.% selected from including
At least one element of the group of Au, Ag, Pt, Rh, Ir, Ru, Os, Re or its combination in any, unless at least one element has been deposited
It is in matrix material.
Such material can comprise less than or at least one element of about 10at.% or the combination of element so that Pd and
The summation of the combination of at least one element or element is for being less than or about 10at.%.
In one embodiment, material may be embodied in the matrix material in the range of 70at.% to 99.7at.%,
The summation making all the components in material is 100at.%.
According to by a kind of fourth aspect for providing the material of conductive contact layer to realize, material be included as Ag, Cu,
In Sn, Ni, Co any one, the matrix material of the alloy of its any one the first slaine or its any one or more
Material, wherein said material also comprises: In in the range of 0.01at.% to 10at.% and at 0.01at.% to 10at.%
In the range of selected from including at least one element of group of Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or its combination in any, remove
In non-at least one element Already in matrix material.
Matrix material can be Ag.In one embodiment, material can comprise less than or the In of about 5at.% and little
In or at least one element of about 5at.% or the combination of element.
In one embodiment, material may be embodied in the matrix material in the range of 80at.% to 99.8at.%,
The summation making all the components in material is 100at.%.
According to by a kind of the 5th aspect for providing the material of conductive contact layer to realize, material be included as Ag, Cu,
In Sn, Ni, Co any one, the matrix material of the alloy of its any one the first slaine or its any one or more
Material, wherein said material also comprises: the Sn in the range of 0.01at.% to 10at.%, unless matrix material has been included relatively
The Sn of a large amount and in the range of 0.01at.% to 10at.% selected from include Au, Ag, Pd, Pt, Rh, Ir, Ru, Os or its
At least one element of the group of meaning combination, unless at least one element Already in matrix material.
Matrix material can be Ag.Material can comprise less than or the Sn of about 10at.% and less than or about 5at.% extremely
Few a kind of element or the combination of element.
In one embodiment, material is included in the matrix material in the range of 80at.% to 99.8at.% so that
The summation of all the components in material is 100at.%.
According to the 6th aspect, aforementioned and other purpose and benefit by include substrate and be coated on comprise material
The conductive contact element of contact layer realizes.At this and hereinafter, any one in aforesaid material is referred to about " material ".
Conductive contact element can also comprise deposition exterior cover sheets on the contact layer, wherein said exterior cover sheets base
It is made up of Si, O and C on Ben.
Refer to, about " essentially constituting ", the layer that (only) is grouped into by one-tenth, reach actual
In the case of attainable degree.
Conductive contact element can also comprise deposition exterior cover sheets on the contact layer, wherein said exterior cover sheets base
It is made up of Indium sesquioxide. and stannum oxide on Ben.
Such exterior cover sheets protection contact layer so that it is not by the damage faded during the storage of such as contact element
Evil, and be not in contact with any of resistance and substantially reduce.
According to the 7th aspect, above and other purpose and benefit by real for providing the method for conductive contact element
Existing, including providing substrate and providing the step of contact layer for substrate, wherein contact layer comprises material.
Contact layer can be by evaporation, preferably by physical vapour deposition (PVD), and preferably from the target material comprising material
It is coated on substrate.Such as, the physical gas phase deposition technology used can be magnetically controlled DC sputtering and high power pulse magnetic control
Sputtering (HIPIMS).Other possible painting method is plating, chemical plating and plasma spraying, rolling (rolling) etc..
Method also includes with by the polymer coating being substantially made up of Si, O and C or by substantially by Indium sesquioxide. and oxidation
The step on the surface of exterior cover sheets coating contact layer produced by PVD or CVD of the metal-oxide of stannum composition.
The material use as the contact layer of conductive contact element is passed through according to eighth aspect, above and other purpose and benefit
Way realizes.
According to the 9th aspect, above and other purpose and benefit by material as by evaporation, preferably passing through
The purposes of target material that physical vapour deposition (PVD) carries out depositing realizes.
Accompanying drawing is sketched
With reference to appended schematic diagram, by property set forth below and nonrestrictive detailed description, it is better understood with this
Bright above and other side, purpose and benefit.
The schematic partial cross section figure of the embodiment of Fig. 1 a-Fig. 1 b display conductive contact element.
Fig. 2 is the block diagram of the step being schematically illustrated in the method for providing conductive contact element.
Fig. 3 showed before and after making element experience salt air corrosion test and makes element be exposed to corrosive chameleon environment
Before and after, from the experimental result of assessment of the embodiment of conductive contact element.
In the drawings, even during the feature in Ref. No. refers to different embodiment, identical Ref. No. is used for
Feature identical, similar or corresponding.
Describe in detail
Fig. 1 a shows and includes substrate 4a, 4b and the contact layer 6 comprising the material being discussed in detail below being coated on
The schematic partial cross section figure of conductive contact element 2.Substrate 4a can be the copper with plating nickel alloy 4b thereon
Alloy or be there is the rustless steel of the nickel alloy 4b being coated on by PVD.Meanwhile, other type of substrate is probably other material
Material and/or include only one layer or more than the heap of two-layer.Generally, it is possible to use the conductive contact element substrate of any routine.Very
Well it is appreciated that electric contacts is generally used for wherein being desirable to produce in a repeatable fashion and/or disconnect be electrically connected
In the various different application connect.The application that can use this solution include the most common adapter, switch and decoupler,
Contact in the application of power connector, intelligent card connector, battery terminal contact, the charge contact of mobile phone, consumption electronic product,
Commercial Application, automobile application, defence and territorial sky application in electric contacts and for signal application electric contacts, and
Including low-voltage, medium voltate and high voltage applications.Conductive contact element 2 is substituted for the electrical contact unit of any routine
Part.Any one or its first a kind of slaine or the conjunction of one or more that material is included as in Ag, Cu, Sn, Ni, Co
The matrix material of gold, material also comprises the In from 0.01 up to 10at.%, from the Sn of 0.01 up to 10at.% (unless Sn is with relatively
High-load is a part for matrix material) and from the Pd of 0.01 up to 10at.%.Therefore, the amount each of in In, Sn and Pd
For at least above 0, at least 0.01at.% at this, although actually effective dose will be generally at least 0.1at.%.Matrix material leads to
Often basically constitute the remainder of material, or at least to the most possible degree.However, it is possible to it is possible that
If not being that the extra additive of the dry measure of any one the part in matrix material, In, Sn and Pd exists in material
In, but the effect provided by the matrix material combining In, Sn and Pd should not had any substantial adverse effect, i.e. with
Wherein the situation of the material being substantially made up of matrix material, In, Sn and Pd is compared by material, to contact resistance and corrosion resistance
Not there is any substantial adverse effect.In any case, at least 50at.% of constituent material answered by matrix material.Material
The embodiment being described in more detail will hereinafter.
Generally, contact layer 6 is formed by material, and therefore can be substantially made up of material, but in some embodiments,
Material can be part, is for example, made up of material or the subregion (sub area) of the contact layer 6 that comprises material or sublayer
(sub layer).Contact layer 6 can also comprise the extra sample of the part not being material itself, such as sample can portion
Ground is divided to be present in contact layer, to provide some extra performance or functions.One of such contact layer 6 illustrates in greater detail
Example will be given below.
The thickness of contact layer 6 is usually more than 10nm, but less thickness is also possible.It is preferable, however, that thickness is less than
1 μm, or about 0.3 μm.
In some embodiments, material can comprise less than or about 5at.% In and/or 5at.% Sn and/or
The Pd of 5at.%, or be even less than or the In of about 1.5at.% and/or less than or the Sn of about 1.5at.% and/or less than about
The Pd of 3at.%.Such as, the model of the wherein amount of Sn, In and Pd compared with all material A-M labelling in table 1 below
Embodiment within enclosing is possible.
| Sn | In | Pd | |
| A | ≤ 10at.% | ≤ 10at.% | ≤ 10at.% |
| B | ≤ 10at.% | ≤ 5at.% | ≤ 10at.% |
| C | ≤ 5at.% | ≤ 10at.% | ≤ 10at.% |
| D | ≤ 5at.% | ≤ 5at.% | ≤ 5at.% |
| E | ≤ 5at.% | ≤ 5at.% | ≤ 3at.% |
| F | ≤ 5at.% | ≤ 5at.% | ≤ 10at.% |
| G | ≤ 5at.% | ≤ 5at.% | ≤ 3at.% |
| H | ≤ 5at.% | ≤ 1.5at.% | ≤ 10at.% |
| I | ≤ 5at.% | ≤ 1.5at.% | ≤ 3at.% |
| J | ≤ 1.5at.% | ≤ 5at.% | ≤ 10at.% |
| K | ≤ 1.5at.% | ≤ 5at.% | ≤ 3at.% |
| L | ≤ 1.5at.% | ≤ 1.5at.% | ≤ 10at.% |
| M | ≤ 1.5at.% | ≤ 1.5at.% | ≤ 3at.% |
The example of table 1-possible range
Amount according to the A-M in table 1 be possible with for any one in Ag, Cu, Sn, Ni, Co, its first a kind of gold medal
Any matrix material belonging to salt each of is used together amount, but when matrix material is Ag, can be of special interest.
It can be favourable for keeping the relation between In+Sn and Pd so that the at.% of Pd is less than the In+ of at least about twice
Sn amount based on at.%, or it is even less than the In+Sn of the about 1.5 times amount based on at.%.
In an embodiment particularly, substrate 4a is the nickel that PVD is coated with the Ni comprising at least 72at.%
304 grade stainless steels such as grade of alloy, this nickel alloy defines on it with the substrate layer 4b of PVD coating contact layer 6.Contact layer by
The silver alloy of the Pd comprising Sn and 2.5at.% of In, 1at.% of Ag, 1at.% of 95.5at.% is formed.
Noticing, substrate needs not to be conduction, and can be nonconducting the most in some embodiments.
In the embodiment of any one the first slaine during matrix material comprises Ag, Cu, Sn, Ni wherein, the
One slaine is preferably one or more in iodide and bromide, such as AgI or AgBr.
In one embodiment, matrix material is Ag and AgI (ratio about 1:1) under 95.5at.%, and material is also
Can comprise about the Sn and the Pd of about 2.5at.% of the In of 1at.%, about 1at.%.
When matrix material comprise be not other material i.e. Cu and/or Sn and/or Ni and/or Co of Ag time, In, Sn and Pd's
Amount can be i.e. with of a relatively high amount, more weak than Ag preferably to compensate these materials selected from the upper part of respective range A-M
Inertia.
In some embodiments, material can also comprise at least about 0.01at.%, or the most typically at least about
Second slaine of 0.1at.%, preferably metal halide or metal sulfide.Preferably, during metal is silver, stannum and copper
One or more, and any one during preferably halogenide is iodide, chloride and bromide.
In one embodiment, matrix material is Ag, and material comprises the Sn peace treaty of the In of about 1at.%, about 1at.%
The Pd of 2.5at.%, and also comprise the AgI (silver iodide) of 45%, remaining part is substantially made up of matrix material Ag.
(test used is the most consistent with IEC 60068-2-11 tested K a) and sulfuration is exposed relating to salt fog
The environmental corrosion test of hydrogen exposure (test used is the most consistent with IEC 60068-2-60 tested K e) is assessed and sets
It is equipped with the conductive contact element 2 of the contact layer 6 of different composition.For environmental corrosion test conductive contact element 2 corresponding to figure
Conductive contact element 2 shown in 1a, wherein substrate 4a is the 304 of the 0.3 μm nickel alloy being coated with the Ni comprising at least 72at.%
Deng grade stainless steel, this nickel alloy defines the substrate 4b coating 0.3 μm contact layer 6 thereon.
Salt fog exposes test and relates to, within 48 hours periods, making the conductive contact element 2 being placed under room temperature in hermetic container
Experience salt spray (5% (w/w) NaCl in water) 5-10 time every day.Afterwards, conductive contact unit is rinsed in deionized water
Part 2.In hydrogen sulfide exposes test, conductive contact element 2 is fixed on and exceeds 50ml Na2The surface 10-of S (22.8g/l) solution
In the beaker of 100mm, continue 24 hours.Beaker is positioned in hermetic container at room temperature.
After salt fog exposes, the electrical property of inspection conductive contact element 2 and the corrosion resistance of the contact layer 6 of described element 2.
After being exposed to hydrogen sulfide, the corrosion-resistant discolouration (tarnish resistance) of inspection contact layer 6, i.e. it resists
Sulfurization.Corrosive chameleon causes the contact resistance of the increase of conductive contact element 2.Some contact layer 6 compositionss are being exposed to
Show unconspicuous light yellow fade after hydrogen sulfide, but fade and do not negatively affect the electrical property of conductive contact element 2.
The conductive contact element 2 of the contact layer 6 being provided with pure Ag (100at.%) is being exposed to salt fog and hydrogen sulfide
By going through corrosion.By being added to by Pd in contact layer 6, Ag-Pd (90-10at.%) realizes more much better than pure Ag contact layer 6
Salt fog resistance and the sulfuration resistant effect being slightly improved.As it is generally known, even higher level in Ag compositions
Pd can also result in the sulfuration resistant effect of improvement.
By In and Sn is added in matrix material, it is less than 5at.% for Sn up to 10at.% and for In, arranges
There is the corrosion resistance of conductive contact element 2 of the contact layer 6 comprising the Ag as matrix material about for corrosive chameleon being increasing
Strong.But, for such contact layer 6 compositions, do not improve salt fog resistance.
Even for very low concentration of Pd and In (In of Pd and 1at.% of 0.5at.%), it is provided with Ag-Pd-In's
The conductive contact element 2 of contact layer 6 compositions does not has to show the corrosion that can detect that after being exposed to salt fog, and is being exposed to sulfur
Change and show unconspicuous light yellow fade after hydrogen, but, fade and do not negatively affect the electrical property of conductive contact element 2.Right
In contact layer 6 compositions of the Ag-Pd-Sn of the most very low concentration of Pd and Sn (Sn of the Pd of 0.5at.%, 1at.%), also
Obtain identical result.
For comprising contact layer 6 compositions of Ag, Pd, In and Sn, the corrosion resistance effect of In+Sn and Pd can mutually rise
Retroaction.If compared with only using In+Sn, Pd can negatively affect corrosion-resistant discolouration.The Pd with 0.01at.% contains
Contact layer 6 compositions of the Ag-Pd-In-Sn of amount and In/Sn level in interval specified above causes and the contacting of pure Ag
The corrosion-resistant discolouration of the improvement that layer 6 is compared, but without result in significantly improved salt fog resistance.Have at Ag-Pd-In-
, after salt fog or hydrogen sulfide expose, there is not signs of corrosion in the Pd level of the increase of the 0.5at.% in Sn compositions.Therefore,
Such contact layer 6 shows the salt fog resistance more much better than pure Ag and hydrogen sulfide corrosion-resistant and compared with Ag-In-Sn
The salt fog resistance improved.Pd in the range of 0.01at.% and 5at.%, Ag-Pd-In-Sn compositions causes ratio pure
Hydrogen sulfide corrosion-resistant that Ag is good and salt fog resistance.Pd content in the range of 0.1at.% to 5at.% causes with pure
The hydrogen sulfide corrosion-resistant of the improvement that contact layer 6 compositions of Ag is compared and salt fog resistance, and with Ag-In-Sn compositions
The salt fog resistance of the improvement compared.By changing the content of Sn and In in Ag-Pd-In-Sn compositions, find 0.01
Sn level to 10at.% causes the improvement compared with pure Ag with the In level in the range of 0.01 to 5at.%
Corrosion resistance.
In above-mentioned interval, for having the Ag-In-Sn alloy of other noble metal not being Pd or being combined with Pd, at ring
Border test obtains the result being similar to.For comprising Ag-Ru-Pd-In-Sn (97.5-0.25-0.25-1-1at.%), Ag-Pt-
Contact layer 6 compositions of In-Sn (97.5-0.5-1-1at.%) and Ag-Au-In-Sn (97.5-0.5-1-1), any one environment
Test does not the most exist signs of corrosion.All three contact layer 6 compositions is shown that the contact layer 6 than Ag-In-Sn or pure Ag is high and is obtained
Many corrosion resistances.If these results indicate that compared with using pure Ag or Ag-In-Sn compositions, in Ag-In-Sn compositions
Any noble metal of middle interpolation includes that the combination of Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or noble metal can strengthen the resistance to of contact layer 6
Corrosivity.
As discussed above, contact layer 6 compositions comprising Ag-Pd-In causes the corrosion resistant of the improvement compared with pure Ag
Erosion property.Therefore, above with respect to use in Ag-In-Sn compositions any noble metal include Au, Ag, Pd, Pt, Rh, Ir, Ru,
The determination instruction of the combination of Os, Re or noble metal should can be applicable to Ag-In compositions.Contact layer group for Ag-Sn
Compound, is suitable for identical reasoning.
Think it is possible that comprise the combination of other matrix material such as Cu, Sn, Ni, Co or matrix material of not being Ag
Contact layer 6 compositions also generation is had compared with the conductive contact element 2 of the contact layer 6 only with matrix material itself
The conductive contact element 2 of the corrosion resistance improved.By forming the alloy of two or more metals, significantly improve and have persistently
Or the corrosion resistance of matrix material of contact resistance improved be possible.Such as, it is well known in the art that due to such as with list
The enhanced corrosion resistance that only Cu with Ni compares, it has been found that the alloy of Cu and Ni being widely used in marine vessel applications.
Fig. 1 b shows and includes substrate 4a, 4b and the schematic local of the conductive contact element 2 of contact layer 6 being coated on
Cross-sectional view.Shown in these partial responses of structure in the structure of Fig. 1 a, and corresponding part can be as about Fig. 1 a upper
The same or analogous part that literary composition is discussed.Additionally, Fig. 1 b includes the exterior cover sheets 8 being deposited on contact layer 6.Exterior cover sheets
8 can be by the polymer coating being mainly made up of Si, O and C or the metal-oxide being mainly made up of Indium sesquioxide. and stannum oxide
PVD or CVD produce, see for example M.Grischke, A.Hieke, F.Morgenweck, H.Dimigen, Diamonds
and Related Materials,1998,7,454-458.Polymer coating thickness can be less than 20nm.Metal oxide layer
Coating layer thickness can be less than 100nm.
By the deposition of polymeric layer, protective layer 8 can be formed so that it includes being included Si, O, C, F by what deposition produced
Outside (top) part, and/or permissible during by following contact layer 6 deposition forming at least part of protective layer 8
There is reaction.
Generally, the plating of contact layer such as Au layer deposits.Material according to present disclosure can also be plated,
But advantageously deposit with evaporation technique especially physical vapour deposition (PVD) (PVD).The benefit forming this includes that coating is difficult to electroplate
The probability of material such as rustless steel and aluminum, this benefit allows to better control over the composition of layer and thickness, and can more environment
Deposit with open arms.When protective coating 8 is produced by the deposition of polymeric layer, use the PVD with single room to be coated with and cover
Standby is favourable, and the contact element 4 wherein with the contact layer 6 coated in one chamber is moved to for armor coated 8
Later room.The PVD equipment of the applicantWithCan advantageously be made
With and be suitable for producing in a large number, a large amount of produce always compared to the shortcoming of evaporation technique of plating.
In addition to paint-on technique as mentioned above, contact layer can independently form and then be attached such as by weldering
Receive on contact element.Can use other conventional technique, the line being such as such as made up of material by one piece material rolls
(rolling down) is in the surface of substrate 4 or providing in substrate in step before to parent material
In the contact layer existed.
Fig. 2 is the block diagram of the step being schematically illustrated in the method for manufacturing conductive contact element.In step 102
Middle offer substrate, substrate can be the one in substrate previously discussed.Step 102 can include that substrate is such as in advance
On the substrate 4a produced as discussed above in the coating of layer 4b such as by PVD, it is also possible to include providing the most in advance
The substrate produced, the contact element that such as substrate can be made up of parent metal (base metal) or metal alloy.Then,
At step 104, with contact layer 6 coated substrate 4a, 4b, wherein contact layer includes as at material previously discussed.As
Mentioning, step 104 is preferably by evaporation, preferably by physical vapour deposition (PVD) (PVD), and preferably from comprising material
Target material is carried out.However, it is also possible to use multiple target such as the target of each of material composition.Below some enter one
In the detailed description of step, discuss how to provide the target material comprising material.In last optional step, connect with the coating of Si-O-C layer
Contact layer 6, also preferably passes through PVD so that result is the exterior cover sheets 8 of the thickness being generally of below about 20nm.Such
Protective layer is discussed above.
The material of present disclosure can produce the most in advance, in order to is further used as using PVD to come
The coating material of depositing contact layers, i.e. can provide with the form of target material and be used as target material.In one embodiment,
Composite material is alloying, i.e. melts and mixes in the liquid state and then cool down.In other embodiment, in composition
The form of one or more powder to be sintered provides, including the powder of cold or hot isobaric compacting (CIPing or HIPing)
End.Then, at about 200-400 DEG C, the powder of heat treatment compacting, continues 1-4 hour.In other embodiment, comprise material
The target material of material is made up of the parent material of the alloy for simple metal or portion of material, such as, matrix material is used as initial material
Material, then provides remaining composition by diffusion in the baking oven residing for parent material, vacuum chamber or chemical bath.
Fig. 3 shows to come the assessment of an embodiment of the conductive contact element 2 before and after comfortable environmental testing
Experimental result.In each group, the post on the left side represents that the result of deposition, middle post represent at salt fog exposure (IEC 60068-
Result and the post on the right after 2-11 tested K a) represent at the mixed gas exposure (knot after IEC 60068-2-60 tested K e)
Really.The conductive contact element of assessment is consistent with Fig. 1 a, and wherein substrate 4a is 0.3 μm used and comprised at least 72at.%Ni
304 grade stainless steels such as grade of nickel alloy coating, this nickel alloy defines the substrate layer coating 0.3 μm contact layer 6 on it with PVD
4b.Contact layer is formed by the Ag alloy of the Pd of Sn and 2.5at.% of In, 1at.% of Ag, the 1at.% comprising 95.5at.%.
Salt fog exposes and relates within the period of 48 hours, makes conductive contact element 2 experience under 35 DEG C and 90-95% relative humidity (RH)
Salt fog.Mixed gas exposes and relates to making conductive contact element experience mixed gas (H2S 0,1ppm+SO20,5ppm, 25 DEG C,
Under 75%RH), continue 2 to 96 hours.
The material in the present disclosure of composite can be regarded as and refer to that i.a. includes the mixture of constitution element, i.e. base
In material or the metal mixture of metal, such as but need not be in the alloy, and do not require mixing composition completely all
Even distribution.Such as, when material provides with the form of contact layer 6 discussed previously, the such as Sn of some in constitution element
Can be present in the surface portion of layer with higher concentration with In.Whole connect it is still possible that have be made up of material
Other change of composition in contact layer, the such as change of other in concentration, such as gradient, and layer can include the knot of multilamellar
Structure, such as, include the atom thin layer with some constituent materials pressed layer by layer of other constituent material.
Being all known with the abbreviation of chemical element in this disclosure, each is clearly corresponding to chemistry unit
Element: Ag (silver-colored), Au (golden), Ni (nickel), Sn (stannum), In (indium), Pd (palladium), Cu (copper), Si (silicon), C (carbon), O (oxygen), F (fluorine)
Na (sodium), Cl (chlorine), Br (bromine), I (iodine), S (sulfur), H (hydrogen), cobalt (Co).
Any illustrating and describing in the drawings and in aforementioned word will be considered as exemplary and nonrestrictive.This
Bright it is not limited to disclosed embodiment.
The present invention is defined by the claims, and when implementing the present invention for required protection, such as attached by study
Figure, disclosure and claim, it will be appreciated by those skilled in the art that and realize the change about disclosed embodiment
Change.The use that vocabulary in the claims " comprises (comprising) " is not excluded for other elements or step, and article "
(a) " or the use of " (an) " be not excluded for plural number.The feature itself occurred in different dependent claims is not excluded for these
The combination of feature.Any reference marks in the claims is for strengthening intelligibility, and is not construed as limiting power
The scope that profit requires.
Claims (41)
1., for providing the material of conductive contact layer, described material comprises matrix material, described matrix material is Ag, Cu,
In Ni, Co any one, its any one the first slaine or the alloy of its any one or more, wherein said material
Also comprise: In and being selected from the range of 0.01at.% to 10at.% in the range of 0.01at.% to 10at.% are wrapped
At least one of group including Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or its combination in any is different from the unit of described matrix material
Element.
2. material as claimed in claim 1, wherein said material comprises less than the In of 5at.% or 5at.% and is less than
5at.% or 5at.% selected from include Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or its combination in any group described at least
A kind of element being different from described matrix material.
3. material as claimed in claim 1, wherein said material is included in the institute in the range of 80at.% to 99.8at.%
State matrix material so that the summation of all the components in described material is 100at.%.
4. material as claimed in claim 2, wherein said material is included in the institute in the range of 80at.% to 99.8at.%
State matrix material so that the summation of all the components in described material is 100at.%.
5. the material as according to any one of aforementioned claim 1-4, wherein said matrix material is Ag.
6. the material as according to any one of claim 1-4, wherein said material also comprises second gold medal of at least 0.01at.%
Belonging to salt, described second slaine is metal halide or metal sulfide.
7. material as claimed in claim 6, wherein said second slaine comprise one or more in following metal: Ag,
Sn and Cu.
8. material as claimed in claim 6, wherein said second slaine is to include one or more in following halogenide
Metal halide: iodide, chloride and bromide.
9. material as claimed in claim 7, wherein said second slaine is to include one or more in following halogenide
Metal halide: iodide, chloride and bromide.
10., for providing the material of conductive contact layer, described material comprises matrix material, described matrix material is Ag, Cu,
In Ni, Co any one, its any one the first slaine or the alloy of its any one or more, wherein said material
Also comprise: the In in the range of 0.01at.% to 10at.%, the Sn in the range of 0.01at.% to 10at.% and
Being selected from the range of 0.01at.% to 10at.% includes Au, Ag, Pd, Pt, Rh, Ir, Ru, Os, Re or its combination in any
At least one of group be different from the element of described matrix material.
11. materials as claimed in claim 10, wherein said material comprises the In less than 5at.% or 5at.%, is less than
The Sn of 10at.% or 10at.% and less than 5at.% or 5at.% selected from include Au, Ag, Pd, Pt, Rh, Ir, Ru, Os,
The group of Re or its combination in any described at least one be different from the element of described matrix material.
12. materials as claimed in claim 10, wherein said material is included in the range of 70at.% to 99.7at.%
Described matrix material so that the summation of all the components in described material is 100at.%.
13. materials as claimed in claim 11, wherein said material is included in the range of 70at.% to 99.7at.%
Described matrix material so that the summation of all the components in described material is 100at.%.
14. materials as according to any one of aforementioned claim 10-13, wherein said matrix material is Ag.
15. materials as according to any one of claim 10-13, wherein said material also comprises the of at least 0.01at.%
Two slaines, described second slaine is metal halide or metal sulfide.
16. materials as claimed in claim 15, wherein said second slaine comprises one or more in following metal:
Ag, Sn and Cu.
17. materials as claimed in claim 15, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
18. materials as claimed in claim 16, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
19. 1 kinds for providing the materials of conductive contact layer, described material comprises matrix material, described matrix material is Ag, Cu,
In Ni, Co any one, its any one the first slaine or the alloy of its any one or more, wherein said material
Also comprise: Sn and being selected from the range of 0.01at.% to 10at.% in the range of 0.01at.% to 10at.% are wrapped
At least one of group including Au, Ag, Pd, Pt, Rh, Ir, Ru, Os or its combination in any is different from the element of described matrix material.
20. materials as claimed in claim 19, wherein said material comprises less than the Sn of 10at.% or 10at.% and is less than
5at.% or 5at.% selected from include Au, Ag, Pd, Pt, Rh, Ir, Ru, Os or its combination in any group described at least one
It is different from the element of described matrix material.
21. materials as claimed in claim 19, wherein said material is included in the range of 80at.% to 99.8at.%
Described matrix material so that the summation of all the components in described material is 100at.%.
22. materials as claimed in claim 20, wherein said material is included in the range of 80at.% to 99.8at.%
Described matrix material so that the summation of all the components in described material is 100at.%.
23. materials as according to any one of aforementioned claim 19-22, wherein said matrix material is Ag.
24. materials as according to any one of claim 19-22, wherein said material also comprises the of at least 0.01at.%
Two slaines, described second slaine is metal halide or metal sulfide.
25. materials as claimed in claim 24, wherein said second slaine comprises one or more in following metal:
Ag, Sn and Cu.
26. materials as claimed in claim 24, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
27. materials as claimed in claim 25, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
28. 1 kinds for providing the materials of conductive contact layer, described material comprise the matrix material of Sn, its first slaine or its
Alloy, wherein said material also comprises: In in the range of 0.01at.% to 10at.% and at 0.01at.% extremely
At least one element selected from the group including Au, Pd, Pt, Rh, Ir, Ru, Os or its combination in any in the range of 10at.%.
29. materials as claimed in claim 28, wherein said material is included in the range of 80at.% to 99.8at.%
Described matrix material so that the summation of all the components in described material is 100at.%.
30. materials as according to any one of claim 28-29, wherein said material also comprises the of at least 0.01at.%
Two slaines, described second slaine is metal halide or metal sulfide.
31. materials as claimed in claim 30, wherein said second slaine comprises one or more in following metal:
Ag, Sn and Cu.
32. materials as claimed in claim 30, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
33. materials as claimed in claim 31, wherein said second slaine is to include the one or many in following halogenide
The metal halide planted: iodide, chloride and bromide.
34. 1 kinds of conductive contact elements (2), described conductive contact element (2) includes substrate (4) and the contact layer being coated on
(6), described contact layer (6) comprises the material as according to any one of aforementioned claim 1-33.
35. conductive contact elements (2) as claimed in claim 34, described conductive contact element (2) also includes being deposited on described
Exterior cover sheets (8) on contact layer (6), described exterior cover sheets (8) comprises Si, O and C.
36. conductive contact elements (2) as claimed in claim 34, described conductive contact element (2) also includes being deposited on described
Exterior cover sheets (8) on contact layer, described exterior cover sheets (8) comprises Indium sesquioxide. and stannum oxide.
37. 1 kinds are used for the method providing conductive contact element (2), said method comprising the steps of:
(102) substrate (4) is provided；And
Thering is provided (104) contact layer (6) for described substrate, wherein said contact layer comprises as according to any one of claim 1-33
Material.
38. methods as claimed in claim 37, wherein said contact layer passes through physical vapour deposition (PVD) from comprising such as claim
The target material of the material according to any one of 1-33 is applied on described substrate.
39. methods as according to any one of claim 37-38, wherein said method is further comprising the steps of:
Coat the surface of described contact layer (6) with exterior cover sheets (8), described exterior cover sheets (8) is by being made up of Si, O and C
Polymer coating or PVD or CVD of metal-oxide by being made up of Indium sesquioxide. and stannum oxide produced.
40. materials as according to any one of claim 1-33 are as the purposes of the contact layer (6) of conductive contact element (2).
41. materials as according to any one of claim 1-33 are as the target for carrying out depositing by physical vapour deposition (PVD)
The purposes of material.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161440978P | 2011-02-09 | 2011-02-09 | |
| US61/440,978 | 2011-02-09 | ||
| SE1150101A SE536911C2 (en) | 2011-02-09 | 2011-02-09 | Material for providing an electrically conductive contact layer, a contact element with such layer, method for providing the contact element, and use of the material |
| SE1150101-2 | 2011-02-09 | ||
| PCT/EP2012/052222 WO2012107524A1 (en) | 2011-02-09 | 2012-02-09 | Material for providing an electrically conducting contact layer, a contact element with such layer, method for providing the contact element, and uses of the material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103348416A CN103348416A (en) | 2013-10-09 |
| CN103348416B true CN103348416B (en) | 2016-11-30 |
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