CN103347369A - Three-dimensional circuit board and preparation method thereof - Google Patents
Three-dimensional circuit board and preparation method thereof Download PDFInfo
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- CN103347369A CN103347369A CN2013103216249A CN201310321624A CN103347369A CN 103347369 A CN103347369 A CN 103347369A CN 2013103216249 A CN2013103216249 A CN 2013103216249A CN 201310321624 A CN201310321624 A CN 201310321624A CN 103347369 A CN103347369 A CN 103347369A
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Abstract
The invention discloses a three-dimensional circuit board and a preparation method thereof. The preparation method comprises the following steps of: step one. three-dimensionally stacking components on a transparent material which is doped with metallic atoms and can be solidified; step two. integrally solidifying; step three. carrying out laser ablation, wherein the metallic atoms, after being subjected to the laser ablation, inside the transparent material are directly formed and conduct electricity. According to the technical scheme, the circuit board is developed from two-dimension to three-dimension, so that the intensity of devices can be greatly improved, and wiring is shortened; lots of components are encapsulated in small space; the circuit board has very high market application value.
Description
Technical field
The present invention relates to circuit board, in particular, a kind of three-dimensional circuit board and preparation method thereof.
Background technology
State of development based on present electronic devices and components, large-scale elements such as resistance, electric capacity, inductance can't be integrated, must when going out PCB figure, the Application Engineer be placed on the PCB on a plane, because the difference of component size, cause the processing procedure (PCBA) of PCB when final the installation, to waste very valuable space, and improved the difficulty of PCB design and increased the restriction that PCB designs.
Along with the complexity of present application circuit is more and more higher, and require more and more lower to power consumption, requirement to volume also is more and more littler, and existing developing direction is to use lower voltage so that element can be done is littler, and it is thinner that circuit is done, but it is because the restriction of technology all the time, device and connecting line all can not infinitely be done little, even if Moore's Law is also soon being walked to be at the end recently, the 28nm integrated circuit is towards the 3Dization development, therefore, wiring board also is inevitable towards the 3Dization development.
There has been manufacturer to begin to attempt at present, make some simple two-dimensional curved surface wiring boards, typical representative is German Le Puke company (LPKF), its laser direct forming (LDS) technology, can directly realize the circuit board of various curved surfaces, but remain the technology based on two dimension, but can be understood as the three-dimensional surface technology at curved surface forming.
Company such as LPKF D. O. O., Saudi Basic Industries Corporation has made opaque doping metals atom and curable material, belong to thermoplastic composite, for example, the LNP Thermocomp thermoplastic composite of Saudi Basic Industries Corporation, can provide the satisfactory performance attribute for the electronic application product, comprise that possessing high impact properties improves the product durability, and the high bending coefficient of suitable thin-walled application and good dimensional stability are provided.This composite material based on polycarbonate/acrylonitrile-butadiene-phenylethene copolymer (PC/ ABS) not only provides roomy process window, also is easy to electroplate.
The LDS technology is used above-mentioned doping metals atom and curable material, and this material contains certain activated metal atom, and behind the process laser ablation, its surface can have the characteristic of electrodepositable, and the place that does not have to ablate can not be electroplated; So with behind this forming materials, the circuit that can use laser directly to ablate out needs connects, and with its plating, circuit has just formed again, and for example, using maximum at present is antenna for mobile phone.
But this only is based on the three-dimensional surface technology of two dimension, is not the circuit board of true three-dimensional moulding, and therefore, there is defective in prior art, needs to improve.
Summary of the invention
Technical problem to be solved by this invention provides a kind of novel three-dimensional circuit board and preparation method thereof.
Technical scheme of the present invention is as follows: a kind of preparation method of three-dimensional circuit board, and it may further comprise the steps: S1, solid stacks each components and parts on doping metals atom and curable transparent material; S2, integrally curing; S3, laser ablation, the interior metal atom of described transparent material be straight forming and conduction behind laser ablation.
Preferably, among the described step S1, also carry out following steps S11: the light path that pre-sets described laser ablation.
Preferably, among the described step S1, also carry out following steps S12: in described light path periphery at least one protector is set.
Preferably, among the described step S11, on the light path of described laser ablation, at least one refractor and/or at least one reflector are set.
Preferably, among the described step S3, adopt at least beam of laser to carry out described laser ablation.
Preferably, among the described step S1, in transparent vessel, place described transparent material and each components and parts.
Preferably, among the described step S1, in Clear glass bottles and jars, place described transparent material and each components and parts.
Preferably, among the described step S1, according to the default control mode, solid stacks components and parts on doping metals atom and curable transparent material.
Preferably, among the described step S2, whole spontaneous curing; Perhaps, among the described step S2, integral body is heating and curing and/or ultra-violet curing.
A kind of three-dimensional circuit board, it adopts arbitrary above-mentioned preparation method's preparation.
Adopt such scheme, the present invention develops by two dimension circuit board to three-dimensional, can greatly improve the closeness of device, shortens line, and encapsulates a large amount of elements in little space, has very high market using value.
Description of drawings
Fig. 1 is the schematic diagram of one embodiment of the present of invention.
Embodiment
For the ease of understanding the present invention, below in conjunction with the drawings and specific embodiments, the present invention will be described in more detail.Provided preferred embodiment of the present invention in the accompanying drawing.But the present invention can realize with many different forms, be not limited to the described embodiment of this specification.On the contrary, provide the purpose of these embodiment be make the understanding of disclosure of the present invention comprehensively thorough more.
Need to prove that when element is called as " being fixed in " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be to be directly connected to another element or may to have element placed in the middle simultaneously.The employed term of this specification " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, the employed all technology of this specification are identical with the implication that belongs to those skilled in the art's common sense of the present invention with scientific terminology.In this specification in specification of the present invention employed term be not for restriction the present invention just in order to describe the purpose of specific embodiment.The employed term of this specification " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
As shown in Figure 1, one embodiment of the present of invention are, a kind of preparation method of three-dimensional circuit board, and it may further comprise the steps.
S1, solid stacks each components and parts on doping metals atom and curable transparent material; The doping metals atom that this step is related and curable transparent material, the optical signature of transparent material comprises two classes: a class is transmission characteristic, comprises the seeing through of light, reflection, refraction etc.; Another kind of is the transfer characteristic of light, comprise the absorption, photo-thermal of light, photochemical, photoelectricity, photochromic etc., also there is not out of this world material at present, the light transmittance of any transparent material does not all reach 100%, even the light transmittance of the best optical glass of the transparency generally also is difficult to surpass 95%; But there are a lot of materials to realize and support each embodiment of the present invention, for example, adopt polyolefin as transparent material, comprise polyethylene, polypropylene etc., and for example, adopt polycarbonate, polyethylene terephtalate, polyvinylchloride, polystyrene PS etc., as transparent material.For example, be example with the polymetylmethacrylate, its light transmittance is generally 93%, reflectivity is 3.9%, absorptivity is about 3.1%.Preferably, the light transmittance of described transparent material is 90% to 100%, in other words conj.or perhaps infinitely near 100%, because can not reach 100% basically; Preferably, the light transmittance of described transparent material is 95% to 100%; Preferably, the light transmittance of described transparent material is 96% to 99%.Need to prove that described transparent material is homogeneous or heterogeneous homogenous material or composite material; Preferably, for doping metals atom and curable transparent material, also at predeterminated position some light transmittances being set is 0.000001% to 95% trnaslucent materials, as refractor or reflector; Preferably, the light transmittance of described trnaslucent materials is 0.001% to 90%; Preferably, the light transmittance of described trnaslucent materials is 0.001% to 80%.
For example, described transparent material is polystyrene, the metal of doping below 10%, for example alcoxyl metal, for example aluminium isopropoxide, four titanium n-butoxide, triethoxy yttrium or three isopropoxy neodymiums etc.; For example, in doping metals atom and the curable transparent material, the tenor of doping is below 8%.Preferably, the tenor of doping is below 5%.And for example, the total content of metal is below 2%.Wherein, described percentage is mass percent.And for example, polyaniline, its metal below 10% that mixes is made compound with polymer such as PET, PVC, PS, PVAC polyvinylalcohol, nylon PA and/or PMMA then; That is to say, polyaniline, its metal below 10% that mixes, then with PET, PVC, PS, PVA, PA, PMMA in one or the multinomial transparent composite of making.For example, the PA/PVA/PA/PVA multilayer is alternately compound.And for example, V. G. Kulkarni and M. Angelopoulos have prepared the transparent thermal curable coating of polyaniline, with matrix good adhesiveness are arranged, and resist chemical, wear-resistant, are applicable to antistatic occasion.The present invention does not limit the use of these polymer or compound, and these materials can be the selected doping metals atom of various embodiments of the present invention and curable transparent material; And along with development of technology, the transparent rate of these polymer or compound can strengthen gradually, makes that the effect trend of each embodiment of the present invention is better.
Preferably, among the described step S1, also carry out following steps S11: pre-set the light path of described laser ablation, for example, according to the three-dimensional circuit layout requirement, pre-set the light path of described laser ablation; For example, described light path forms a sphere, and and for example, the example of an image is that described light path is formed the Eiffel Tower model.In the practical application, for three-dimensional circuit board and three-dimensional circuit thereof, the design light path also is a very crucial job.
Preferably, among the described step S11, on the light path of described laser ablation, at least one refractor and/or at least one reflector are set.For example, on described light path, one or more refractors are set, are used for the refract light path, the components and parts of avoiding needing protection will only be ablated focus and not influential to other points after the light beam focusing, and the path is shortened in perhaps arrival nearby, improves treatment effeciency; For example, refractor is a default glass, and and for example, refractor is a default polymer.And for example, on described light path, one or more reflectors are set, are used for adjusting light path, the components and parts of avoiding needing protection will only be ablated focus and not influential to other points after the light beam focusing, and the path is shortened in perhaps arrival nearby, improves treatment effeciency; For example, reflector is a default glass, and and for example, reflector is a default polymer.And for example, on described light path, one or more reflectors are set, and one or more refractor.Need to prove that refraction or reflector all are the operable a kind of instruments of various embodiments of the present invention, but be not limited to this kind instrument.
Preferably, among the described step S1, also carry out following steps S12: in described light path periphery at least one protector is set, for example, protector is heat-resistant tube or sheet metal etc.Protector is used for the components and parts that need protection are protected, and the focus of only ablating after will light beam focusing on and not influential to other points can be guaranteed the accuracy of circuit like this.
Preferably, among the described step S1, in transparent vessel, place described transparent material and each components and parts; For example, among the described step S1, in Clear glass bottles and jars, place described transparent material and each components and parts.Preferably, among the described step S1, according to the default control mode, solid stacks components and parts on doping metals atom and curable transparent material.
S2, integrally curing; Preferably, among the described step S2, whole spontaneous curing.Perhaps, among the described step S2, integral body is heating and curing and/or ultra-violet curing.For example, be heated to 100 to 150 degrees centigrade and be cured 2 hours.Concrete condition of cure is according to situations such as the material of practical application, the sizes of three-dimensional circuit board and determine; Each embodiment of the present invention does not all make particular determination to this.
Preferably, before the described step S1, also carry out following steps S0: pre-set the light path bolster model, be used for placing transparent material and each components and parts; When having trnaslucent materials, refractor or reflector, this light path bolster model also is used for placing trnaslucent materials, refractor and/or reflector.Wherein, the light path in this light path bolster model is in the subsequent step, the light path of laser ablation.And described step S2 also carries out following steps S21: clear up described light path bolster model.For example, described light path bolster model is hot melt material, and heating is fused and is removed in solidification process, and after perhaps solidifying, the heating fusion is also cleaned out, and stays light path, uses for follow-up laser ablation step.For example, described light path bolster model is wax material, and in solidification process or after solidifying, fusion (or being called thawing) is also cleaned out.Preferably, among the described step S01, on described light path, at least one refractor and/or at least one reflector are set.Like this, clear up after the described light path bolster model, can obtain a theoretical light transmittance and be 100% light path, be conducive to laser ablation step thereafter, obtain three-dimensional circuit panel products more flexibly thereby can design.
Perhaps, preferred, among the described step S1, solid stacks each components and parts and light path support on doping metals atom and curable transparent material, and described step S2 also carries out following steps S22: clear up described light path support.Similar with last example, the light path support is hot melt material, and heating is fused and is removed in solidification process, and after perhaps solidifying, the heating fusion is also cleaned out, and stays light path.Perhaps, adopt the transparent material of containing metal atom, himself to be used as support component and light path, the place that short of device blocks namely can be used as light path, or be called light path, in such cases, do not need specific thing to make light path, only need when putting device, stay optical path in advance and get final product.
S3, laser ablation, the interior metal atom of described transparent material be straight forming and conduction behind laser ablation.Preferably, among the described step S3, adopt at least beam of laser to carry out described laser ablation.For example, adopt multiple laser to carry out described laser ablation simultaneously, can accelerate treatment effeciency like this.
Another example is that by this material being placed a transparent vessel, then according to preposition, solid stacks components and parts, thereafter with its integrally curing; At this moment circuit does not also form, and then uses a branch of or multiple laser is ablated to it, thereby forms circuit; So far, the 3D circuit board is just finished.
A kind of three-dimensional circuit board, it adopts as arbitrary above-mentioned preparation method's preparation.Like this, change circuit connection lines into three-dimensional line arbitrarily by two dimensional surface, element is piled up arbitrarily put, improved density of components greatly, three-dimensional wiring board is because of many dimensions, so integrated level has the lifting of matter.And make line shorter, and saved space and material, increased the degree of freedom and the flexibility of design greatly, especially be fit to make precision instrument and equipment.
Further, embodiments of the invention can also be, each technical characterictic of the various embodiments described above, the preparation method of that be combined to form mutually, enforceable three-dimensional circuit board, and the three-dimensional circuit board that adopts this preparation method to obtain.Various embodiments of the present invention adopt transparent doping metals atom and curable material, and interior metal atom straight forming behind laser ablation, and do not need re-plating to conduct electricity, and, the focus of only ablating after will light beam focusing on and not influential to other points has high market using value.
Need to prove that above-mentioned each technical characterictic continues combination mutually, forms the various embodiment that do not enumerate in the above, all be considered as the scope of specification record of the present invention; And, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (10)
1. the preparation method of a three-dimensional circuit board is characterized in that, may further comprise the steps:
S1, solid stacks each components and parts on doping metals atom and curable transparent material;
S2, integrally curing;
S3, laser ablation, the interior metal atom of described transparent material be straight forming and conduction behind laser ablation.
2. according to the described preparation method of claim 1, it is characterized in that, among the described step S1, also carry out following steps S11: the light path that pre-sets described laser ablation.
3. according to the described preparation method of claim 2, it is characterized in that, among the described step S1, also carry out following steps S12: in described light path periphery at least one protector is set.
4. according to the described preparation method of claim 2, it is characterized in that, among the described step S11, on the light path of described laser ablation, at least one refractor and/or at least one reflector are set.
5. according to the described preparation method of claim 1, it is characterized in that, among the described step S3, adopt at least beam of laser to carry out described laser ablation.
6. according to the described preparation method of claim 5, it is characterized in that, among the described step S1, in transparent vessel, place described transparent material and each components and parts.
7. according to the described preparation method of claim 5, it is characterized in that, among the described step S1, in Clear glass bottles and jars, place described transparent material and each components and parts.
8. according to the described preparation method of claim 1, it is characterized in that among the described step S1, according to the default control mode, solid stacks components and parts on doping metals atom and curable transparent material.
9. according to the described preparation method of claim 1, it is characterized in that, among the described step S2, whole spontaneous curing; Perhaps, among the described step S2, integral body is heating and curing and/or ultra-violet curing.
10. a three-dimensional circuit board is characterized in that, adopt arbitrary as claim 1 to 9 as described in preparation method preparation.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029197A (en) * | 2015-09-16 | 2018-05-11 | 捷普有限公司 | For utilizing system, the device and method of surface mounting technique on plastic base |
| CN110831340A (en) * | 2019-11-25 | 2020-02-21 | 浙江清华柔性电子技术研究院 | Manufacturing method of circuit board and circuit board prepared by using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241815A (en) * | 2007-02-07 | 2008-08-13 | 李尔公司 | Electrical switch |
| US7514643B1 (en) * | 2005-07-19 | 2009-04-07 | Judco Manufacturing, Inc. | Lighted pushbutton switch assembly |
| US20100151146A1 (en) * | 2007-03-30 | 2010-06-17 | Peter Torben Tang | Preparation of a polymer article for selective metallization |
| CN102586764A (en) * | 2011-01-14 | 2012-07-18 | Lpkf激光和电子股份公司 | Method for selectively metallizing a substrate and circuit board produced by this method |
-
2013
- 2013-07-29 CN CN201310321624.9A patent/CN103347369B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7514643B1 (en) * | 2005-07-19 | 2009-04-07 | Judco Manufacturing, Inc. | Lighted pushbutton switch assembly |
| CN101241815A (en) * | 2007-02-07 | 2008-08-13 | 李尔公司 | Electrical switch |
| US20100151146A1 (en) * | 2007-03-30 | 2010-06-17 | Peter Torben Tang | Preparation of a polymer article for selective metallization |
| CN102586764A (en) * | 2011-01-14 | 2012-07-18 | Lpkf激光和电子股份公司 | Method for selectively metallizing a substrate and circuit board produced by this method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108029197A (en) * | 2015-09-16 | 2018-05-11 | 捷普有限公司 | For utilizing system, the device and method of surface mounting technique on plastic base |
| CN110831340A (en) * | 2019-11-25 | 2020-02-21 | 浙江清华柔性电子技术研究院 | Manufacturing method of circuit board and circuit board prepared by using same |
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| CN103347369B (en) | 2016-04-27 |
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Address after: 518000 Guangdong Province, Shenzhen city Longhua District Guanlan Street No. 5 Wu Lu Sheng Keng community view science and Technology Building No. 1 South and west of the factory floor Patentee after: SHENZHEN JPT OPTO-ELECTRONICS CO., LTD. Address before: 518000 Guangdong city of Shenzhen province Baoan District Guanlan Street Guanlan high-tech park Tellhow (Shenzhen) Industrial Park building, third floor South West Patentee before: Shenzhen Jpt Electronics Co., Ltd. |