CN103342023A - Method for manufacturing novel high temperature resistant mica plate - Google Patents

Method for manufacturing novel high temperature resistant mica plate Download PDF

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Publication number
CN103342023A
CN103342023A CN2013102202573A CN201310220257A CN103342023A CN 103342023 A CN103342023 A CN 103342023A CN 2013102202573 A CN2013102202573 A CN 2013102202573A CN 201310220257 A CN201310220257 A CN 201310220257A CN 103342023 A CN103342023 A CN 103342023A
Authority
CN
China
Prior art keywords
mica
plate
high temperature
epoxy resin
micarex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013102202573A
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Chinese (zh)
Inventor
何国平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG TIANXIN ELECTRICAL APPLIANCE CO Ltd
Original Assignee
ZHENJIANG TIANXIN ELECTRICAL APPLIANCE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG TIANXIN ELECTRICAL APPLIANCE CO Ltd filed Critical ZHENJIANG TIANXIN ELECTRICAL APPLIANCE CO Ltd
Priority to CN2013102202573A priority Critical patent/CN103342023A/en
Publication of CN103342023A publication Critical patent/CN103342023A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a method for manufacturing a novel high temperature resistant mica plate. The method comprises the steps: firstly, carrying out high temperature hot pressing molding of a mica thin plate and an epoxy resin thin film, then bonding the molded plate with an organic glass fiber plate by an organic silicone glue, and heating to press into the plate. A mica thin plate material is formed by sticking mica paper or natural mica by an organic glue. The thickness of the epoxy resin thin film is about a quarter of that of the mica thin plate. With the epoxy resin film, the mechanical strength of the mica plate can be increased during use, and the defect that the pressure resistance of a single mica plate is weaker is overcome by utilizing a multilayer composite structure. With the organic glass fiber plate, the high temperature resistance of the mica plate is improved, so the mica plate can be further applied to the manufacture of home appliances, metallurgy and chemical industries and other fields, and enables the scope of application to be expanded. The manufacturing method is simple, and can greatly reduce enterprise production cost.

Description

A kind of novel fire resistant micarex manufacture method
Technical field
The present invention relates to a kind of sheet material, particularly a kind of novel fire resistant micarex belongs to electrical equipment and makes the field.
Background technology
Micarex has good bending strength, environmental-protecting performance and processing characteristics, micarex bending strength height, and toughness is fabulous, and micarex can be processed the energy different shape and not stratified with dashing to order.Extensively applied to electrical equipment manufacturing, industrial circles such as chemical metallurgy.But, though the insulating properties of micarex are good, can but be not to give prominence to especially aspect resistance to elevated temperatures.Restricted its application development to a certain extent.
Summary of the invention
The objective of the invention is to propose a kind of manufacture method of novel fire resistant micarex in order to overcome above deficiency, improve the micarex resistance to elevated temperatures, enlarge its scope of application.
The measure of purpose of the present invention is: earlier that mica thin plate and epoxy resin thin film elevated temperature heat is molded.Sheet material and the lucite fiberboard of inciting somebody to action moulding pasted again, and heating is pressed into plate.
Above-mentioned a kind of novel fire resistant micarex, wherein, sheet material and organic fiber plate are pasted by organosilicon glue.
The invention has the advantages that: the effect by epoxy resin thin film can strengthen micarex mechanical strength in use, utilizes multi-layer compound structure, breaks through the more weak deficiency of single micarex withstand voltage properties.By the effect of lucite fiberboard, improve the resistance to elevated temperatures of micarex, can further be applied to the household electrical appliances manufacturing, fields such as chemical metallurgy enlarge the scope of application.
The specific embodiment
The manufacture method of a kind of novel fire resistant micarex of the present invention, earlier that mica thin plate and epoxy resin thin film elevated temperature heat is molded.The sheet material of moulding that again will be and lucite fiberboard are undertaken bonding by organosilicon glue, heating is pressed into plate.
Described mica thin plate is that mica paper or natural mica form by organic glue stickup.
Described epoxy resin thin film thickness is about 1/4th of mica lamella thickness.
A kind of novel fire resistant micarex of the present invention manufacture method, the effect by epoxy resin thin film can strengthen micarex mechanical strength in use, utilizes multi-layer compound structure, breaks through the more weak deficiency of single micarex withstand voltage properties.By the effect of lucite fiberboard, improve the resistance to elevated temperatures of micarex, can further be applied to the household electrical appliances manufacturing, fields such as chemical metallurgy enlarge the scope of application, and manufacture method of the present invention is simple, can improve enterprise's production cost greatly.
The prepared a kind of novel fire resistant micarex serviceability temperature of the present invention reaches as high as 1000 ℃.
Performance data such as the following table of the prepared a kind of novel fire resistant micarex of the present invention:
The performance data of the prepared a kind of novel fire resistant micarex of table 1 the present invention
Test event Unit Index
Hardness Degree 75
Hot strength Mpa 15
Elongation at break % 145
Compression strength Mpa 15
High temperature resistant degree 1000
Above embodiment only is used for the present invention is further specified; can not be interpreted as limiting the scope of the invention, some nonessential improvement that those skilled in the art's foregoing according to the present invention is made and adjustment all belong to protection scope of the present invention.

Claims (4)

1. a novel fire resistant micarex is characterized in that, and is earlier that mica thin plate and epoxy resin thin film elevated temperature heat is molded.
2. the sheet material of moulding that again will be and lucite fiberboard are undertaken bondingly by organosilicon glue, and heating is pressed into plate.
3. a kind of novel fire resistant micarex according to claim 1 is characterized in that, described mica thin plate is that mica paper or natural mica form by organic glue stickup.
4. a kind of novel fire resistant micarex according to claim 1 is characterized in that, described epoxy resin thin film thickness is about 1/4th of mica lamella thickness.
CN2013102202573A 2013-05-31 2013-05-31 Method for manufacturing novel high temperature resistant mica plate Pending CN103342023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013102202573A CN103342023A (en) 2013-05-31 2013-05-31 Method for manufacturing novel high temperature resistant mica plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013102202573A CN103342023A (en) 2013-05-31 2013-05-31 Method for manufacturing novel high temperature resistant mica plate

Publications (1)

Publication Number Publication Date
CN103342023A true CN103342023A (en) 2013-10-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013102202573A Pending CN103342023A (en) 2013-05-31 2013-05-31 Method for manufacturing novel high temperature resistant mica plate

Country Status (1)

Country Link
CN (1) CN103342023A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113831877A (en) * 2021-09-27 2021-12-24 湖北晟特新材料有限公司 Modified epoxy resin adhesive and application thereof in hard mica plate

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675235A (en) * 1986-01-09 1987-06-23 Corning Glass Works Laminated synthetic mica articles
US5540969A (en) * 1992-12-28 1996-07-30 Asea Brown Boveri Ltd. Insulating tape and method of producing it
CN102173164A (en) * 2011-02-17 2011-09-07 东毓(宁波)油压工业有限公司 Heat insulation pressure-resistant plate structure
CN202120696U (en) * 2011-06-02 2012-01-18 天津市银山电缆材料科技有限公司 Novel environmental friendly natural one side fireproof mica belting
CN102398395A (en) * 2011-07-18 2012-04-04 四川东材科技集团股份有限公司 One-side glass cloth reinforced rich gelatine powder mica tape, manufacturing method thereof and purpose thereof
CN102412041A (en) * 2011-10-27 2012-04-11 苏州巨峰电气绝缘系统股份有限公司 Preparation method of high-permeability mica tape
CN202282172U (en) * 2011-06-27 2012-06-20 衡阳恒缘电工材料有限公司 Novel reinforcement micanite
CN102693791A (en) * 2012-05-29 2012-09-26 苏州巨峰电气绝缘系统股份有限公司 High-heat conducting high-air permeability less-glue mica tape and preparing method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675235A (en) * 1986-01-09 1987-06-23 Corning Glass Works Laminated synthetic mica articles
US5540969A (en) * 1992-12-28 1996-07-30 Asea Brown Boveri Ltd. Insulating tape and method of producing it
CN102173164A (en) * 2011-02-17 2011-09-07 东毓(宁波)油压工业有限公司 Heat insulation pressure-resistant plate structure
CN202120696U (en) * 2011-06-02 2012-01-18 天津市银山电缆材料科技有限公司 Novel environmental friendly natural one side fireproof mica belting
CN202282172U (en) * 2011-06-27 2012-06-20 衡阳恒缘电工材料有限公司 Novel reinforcement micanite
CN102398395A (en) * 2011-07-18 2012-04-04 四川东材科技集团股份有限公司 One-side glass cloth reinforced rich gelatine powder mica tape, manufacturing method thereof and purpose thereof
CN102412041A (en) * 2011-10-27 2012-04-11 苏州巨峰电气绝缘系统股份有限公司 Preparation method of high-permeability mica tape
CN102693791A (en) * 2012-05-29 2012-09-26 苏州巨峰电气绝缘系统股份有限公司 High-heat conducting high-air permeability less-glue mica tape and preparing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113831877A (en) * 2021-09-27 2021-12-24 湖北晟特新材料有限公司 Modified epoxy resin adhesive and application thereof in hard mica plate
CN113831877B (en) * 2021-09-27 2023-08-11 湖北晟特新材料有限公司 Modified epoxy resin adhesive and application thereof in hard mica plate

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Application publication date: 20131009