CN103341988A - Forming process of integrated cellular board with sealed edges - Google Patents

Forming process of integrated cellular board with sealed edges Download PDF

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Publication number
CN103341988A
CN103341988A CN2013103023138A CN201310302313A CN103341988A CN 103341988 A CN103341988 A CN 103341988A CN 2013103023138 A CN2013103023138 A CN 2013103023138A CN 201310302313 A CN201310302313 A CN 201310302313A CN 103341988 A CN103341988 A CN 103341988A
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cellular board
fiber
epoxy resin
formpiston
paraffin
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CN103341988B (en
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陈锦祥
何成林
顾承龙
刘建勋
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Southeast University
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Abstract

The invention relates to a forming process of an integrated cellular board with sealed edges. The forming process of the integrated cellular board with sealed edges is characterized by comprising the following steps of: cleaning a mold, and coating an oily mold release agent on the mold surface of a male mold, and airing; spraying a dry mold release agent uniformly on the mold surface of a female mold; inserting a paraffin male mold into a female mold positioning hole; then adding fiber and resin materials by adopting different methods according to the fiber content; curing, and demoulding; and putting a test sample after demoulding into a baking oven, and fusing the paraffin male mold, thereby obtaining an integrated cellular board test sample. The integrated cellular board with sealed edges, obtained by adopting the forming process disclosed by the invention is not provided with a panel-core layer cementing surface, and the final damage is controlled by material damage; and the forming process of the integrated cellular board with sealed edges has favorable flat crush resistance and bending property, and can develop performances of the materials well.

Description

The moulding process of the integrated cellular board of band edge sealing
Technical field
The present invention relates to a kind of moulding process with the integrated cellular board of edge sealing, can copy the preceding fin structure of beetle preferably.
Background technology
Along with continuous progress in science and technology and development, people have higher requirement to the development of material and structure.Wish structure when having higher-strength and rigidity, the requirement of can satisfy lightweight again, saving material.Therefore the exploitation of light-weight high-strength material can arrive the purpose that economizes on resources, increases economic benefit, has far-reaching social effect again.And (honeycomb) sandwich plate has been widely used in industry, a kind of integrated have the bionical sandwich plate of post honeycomb also to propose the several years (patent No.: ZL.03116503.6), but in the past honeycomb board all is by bonding or inlays and wait how body formed technology making.Although aforementioned patent has proposed about 10 years, for this outstanding bionical cellular board, in imitated process, face a lot of difficulties, the imitated sheet material that can only obtain to have only pillar and not have honeycomb in recent years differs greatly with this body structure of beetle fore wing.
Summary of the invention
Inventor's purpose is to provide a kind of moulding process of integrated bionic cellular board, the natural one of bionical cellular board structure that makes, there is not any seam, and has a good mechanical performance, and need not by bonding, nail or mechanical edge sealing method such as inlay, overcome the shortcoming of existing cellular board globality difference.
For solving the problems of the technologies described above, the present invention realizes like this
The moulding process of band edge sealing integrated bionic cellular board may further comprise the steps:
(1) mould is prepared: before using with alcohol with the die surface wiped clean, and coat oil-based release agent on the male mold surface, dry; Take off the agent of dryness mould in the even spraying of former die surface; So that test specimen and mould separate smoothly after the moulding.
(2) formpiston preparation: will pour in the male mold after the fusing of formpiston material heating paraffin, and when treating paraffin cooling deliquescing upper surface be struck off, and be cooled to after room temperature paraffin solidifies, form removal can make the paraffin formpiston, and the paraffin formpiston is inserted in the former locating hole.
(3) glue preparation: according to epoxy resin: the mass ratio preparation epoxy resin of curing agent: diluent=10:3:1.In technology of the present invention, solved the problem of integrated cellular board molding time long (about 10 hours) before this by selecting the appropriate resin glue.
(4) lay down fibre, impregnation: adopt following two kinds of methods to add fiber and resin material according to fiber content: when fiber quality content 10% or when following, the epoxy resin of fiber and preparation is stirred, mixture has better flowability, can directly pour in the former; When fiber content is higher than 10%, in the former locating hole, insert in the formpiston, import fiber toward the inside, a side space of inserting formpiston, import effect to save the importing time and to improve, after all being inserted into former Deng the paraffin formpiston, (these fibers can be used the basalt short fiber, the basalt long fiber at male mold surfaces layer overlay fiber again, geotextiles, fiber cloth or their lamination); Pour the epoxy resin adhesive liquid that step (3) is prepared into then in cavity block, resin adhesive liquid should be added, to guarantee that fiber is soaked into fully.To overflow unnecessary resin during the capping pressurization, it can not influence sample performance.In mould, add an amount of short fiber in advance by the present invention and improve fiber content, can overcome before this in the integrated cellular board problems such as fiber content is lower, fiber skewness.
(5) vacuumize: in order to allow the abundant combination of fiber and resin, import the end back at step (4) material and implement to vacuumize processing.
(6) solidify, the demoulding: mould is put into air dry oven was heating and curing 1 hour at 55-60 ℃, carry out the demoulding after waiting resin solidification fully.
(7) melt paraffin: the sample after the demoulding is put into 120-150 ℃ of baking oven, the formpiston fusion that paraffin is made, and after solidifying 1 hour, can make integrated cellular board sample.
Thermosetting resin matrix commonly used in the polymer matrix composites has epoxy resin, unsaturated polyester resin, phenolic resins and vinyl ester resin etc., wherein most widely used general with epoxy resin, its major advantage is that cohesive force is strong, good with the fortifying fibre surface wettability, cure shrinkage is little, higher hear resistance is arranged, and curing molding is convenient.Contain unique epoxy radicals in the epoxy resin, and hydroxyl, ehter bond isoreactivity group and polar group, thereby has a performance of many excellences, in all epoxy resin, what be most widely used is bisphenol A type epoxy resin, account for 90% of epoxy resin total output, of the present invention is bisphenol A type epoxy resin.
Epoxy resin itself is thermoplastic linear structure, must add curing agent in epoxy resin, carries out cross-linking and curing reaction, generates cancellated high polymer (thermosetting resin).
Brittle break takes place in epoxy resin casting matrix immediately that do not add diluent after load reaches maximum, no obvious sign before destroying has very big emergentness.Add diluent and can directly participate in the curing reaction of epoxy resin, become the part of epoxy resin cured product cross-linked network, to the performance not influence basically of solidfied material.This shows, a small amount of reactive diluent be added in the toughness that has increased solidfied material when not influencing condensate performance substantially.Make technology of the present invention have certain advance.
Under the bending load effect, the legacy cellular plate mostly is the destruction of coming unstuck, the interface that how body formed cellular board is described is weak part, the integrated cellular board of band edge sealing that the present invention adopts the integrated molding die device to obtain, do not exist panel-sandwich layer to glued joint face, final destruction by material damage control has flat crush resistance and bending resistance preferably, can be good at bringing into play the performance of material.
Description of drawings
Fig. 1 is process chart of the present invention;
Fig. 2 is the used mould photo of the present invention: (a) male mold assembly drawing; (b) positive mold is taken figure and formpiston apart; (c) formpiston assembly drawing; (d) former formpiston assembly drawing.
Fig. 3 is the prepared sample drawing of the present invention: (a) the integrated cellular board of pure resin; (b) contain the integrated cellular board of basalt fibre.
Fig. 4 is the load-displacement curve in the cellular board mechanics: (a) concora test; (b) crooked experiment.
Fig. 5 is cellular board compression test result's typical failure mode figure: (a) honeycomb core destroys fine structure; (b) situation is destroyed in the cellular board side.
Fig. 6 is cellular board failure mode in the crooked experiment: (a) (coming unstuck) destroyed in the cellular board side; (b) honeycomb panel is destroyed.
The destruction situation at glued place in the one-sided glued cellular board three-point bending experiment of Fig. 7: (a), (c) be top panel; (b), (d) be the integrated molding thing of sandwich layer and lower panel.
The specific embodiment
The present invention is described in further detail below in conjunction with the specific embodiment.
Embodiment 1
Fig. 1 is process chart of the present invention, and with reference to shown in Figure 1, the moulding process of the bionical cellular board of integrated band edge sealing may further comprise the steps:
(1) mould is prepared: before using with alcohol with the die surface wiped clean, uniformly spray the dryness releasing agent at the former die surface then, dry, coat oil-based release agent on the male mold surface, so that test specimen and mould separate smoothly after the moulding.
(2) formpiston preparation: will pour in the male mold (Fig. 2) after the fusing of formpiston material heating paraffin, when treating paraffin cooling deliquescing upper surface is struck off, be cooled to after room temperature paraffin solidifies, form removal can make paraffin formpiston (shown in Fig. 2 b right side), the formpiston that makes is placed in the former in order (Fig. 2 c, 2d).
(3) glue preparation: according to epoxy resin: the mass ratio preparation epoxy resin of curing agent: diluent=10:3:1.Selected epoxy resin is bisphenol A type epoxy resin (the E51 epoxy resin that Wuxi resin processing plant of stars new chemical materials Co., Ltd produces) in this experiment; The curing agent that adopts (curing agent 593 that the large magnificent environmental friendly material in Wuxi Co., Ltd produces) is the linear long chain structure, impels the resin high resilience after the curing, has increased the toughness of resin.The diluent that adopts is the reactive diluent 501 that the magnificent chemical industry of Wuxi City product Co., Ltd produces.Brittle break takes place in epoxy resin casting matrix immediately that do not add diluent after load reaches maximum, no obvious sign before destroying has very big emergentness.And the epoxy resin casting matrix that adds 10% diluent is after reaching maximum, and sample does not destroy immediately, certain plastic deformation occurred.But the shear strength of casting matrix and compressive strength hang down 1.5% and 3% respectively than the epoxy resin casting matrix that does not add diluent.Because the diluent 501 that uses in this experiment is reactive diluent, it can participate in the curing reaction of epoxy resin directly, becomes the part of epoxy resin cured product cross-linked network, to the performance not influence basically of solidfied material.This shows, a small amount of reactive diluent be added in the toughness that has increased solidfied material when not influencing condensate performance substantially.Therefore, according to epoxy resin viscosity test result, shearing test and compression test result, the proportioning of the epoxy resin adhesive liquid that the present invention adopts is epoxy resin: curing agent: diluent=10:3:1(mass ratio);
(4) lay down fibre, impregnation: formpiston is inserted in the process of former in aforementioned (2), adopt following two kinds of methods to add fiber and resin material according to fiber content then: when fiber quality content 10% or when following, the epoxy resin of fiber and preparation stirs, mixture has better flowability, can directly import them in the former; When fiber content is higher than 10%, in aforementioned insertion formpiston, import fiber toward the inside, a side space of inserting formpiston, import effect to save the importing time and to improve, wait the paraffin formpiston all to be inserted into former after, (these fibers can be used short fiber at surperficial layer overlay fiber again, long fibre, geotextiles, fiber cloth or their lamination, fiber of the present invention are the basalt short fibers.After finishing, in mould, pour the epoxy resin adhesive liquid that step (3) is prepared into.Need to prove that resin should be added, to guarantee that fiber is soaked into fully.Unnecessary resin will be overflowed during the capping pressurization, and therefore sample performance can be do not influenced.The composite material interface adhesion strength directly affects the stress transmission between fiber and the resin, thereby influences the physical and mechanical property of composite macroscopic view.When interface binding intensity was more weak, the crackle of Chan Shenging was very easy to along the fiber surface expansion under external force, thereby reduced the mechanical property of composite.In order to obtain the fibre reinforced composites of better mechanical property, adopt silane resin acceptor kh-550 that the basalt fibre surface is handled, improve the interface bonding situation between fiber and the resin.
(5) vacuumize: after finish aforementioned (4), vacuumize processing, to guarantee that fiber is soaked into fully.
(6) curing, the demoulding: mould is put into air dry oven under 55-60 ℃ of condition, heated 1 hour, be cured moulding, can the demoulding after resin solidification is complete.
(7) melt paraffin: the sample after the demoulding is put into 120-150 ℃ of baking oven, the formpiston fusion that allows paraffin make is flowed out, solidify after 1 hour, can make integrated cellular board sample (the integrated cellular board of the pure resin of Fig. 3 a, Fig. 3 b add the integrated cellular board of basalt fibre).
Embodiment 2 cellular board concora tests
Present embodiment and embodiment 3, preparation contrast cellular board, lower panel and sandwich layer are one-body molded, and top panel and sandwich layer are by glueing joint combination.Thus, by such cellular board is carried out Mechanics Performance Testing, can compare the mechanical property of two kinds of different preparation methods (one method and how body formed method).
Gained cellular board concora test typical case load-displacement curve as shown in Figure 4.Under the flat compressed load action, cellular board load-displacement curve starting stage is linear, load slowly rises, after bonding layer was compacted, panel closely contacted with the honeycomb sandwich layer, and load-displacement curve is sharp increase linearly, when load reaches peak value, obviously distortion appears in honeycomb wall, and load descends to some extent, but after this load fluctuation changes.Reason is because the original upload stage, because the existence of bonding layer, and glued membrane has certain thickness, so the starting stage slope of a curve is less.When first peak value appearred in load-displacement curve, destroying appearred in the part honeycomb wall, and load slightly descends, but the honeycomb sandwich layer still can continue carrying, and the load fluctuation is risen.Hence one can see that, if traditional two-sided glued cellular board, the displacement meeting of starting stage can be bigger than one-sided glued plate in this experiment.Integrated cellular board is not then because there being glued layer, with regard to the displacement of this starting stage that can not occur occurring because of glued layer.Thereby the ability with better initial stiffness and resistance to deformation.
The cellular board concora test the results are shown in Table 1.
Table 1 concora test result
Figure BDA00003529871200081
The flat crush resistance of composite wood stock column/foamed plastics sandwich structure relatively sees Table 2 in the flat crush resistance of the cellular board that integral process of the present invention obtains and the list of references.
Table 2 cellular board and composite wood stock column/foamed plastics sandwich structure relatively
Kind Density kg/m 3 Compressive strength MPa Specific strength (Nm) 2
The cellular board that embodiment 1 obtains 779 29.2 37,484
Composite wood stock column/foamed plastics sandwich structure plate 528 8.1 15,341
Annotate: the cellular board plate thickness is 2.3mm; Composite wood stock column/foamed plastics composite core material sandwich structure plate thickness is about 1.3mm.
Though the density of the cellular board of preparation is bigger than composite wood stock column/foamed plastics sandwich structure plate in this test, specific strength is about 2 times of latter's higher value.As mechanical property relatively, adopt specific strength and specific stiffness usually, under the suitable situation of quality, the specific strength of material and specific stiffness are more big, and the expression performance is more good.Therefore with regard to this index of specific strength, the prepared cellular board of the present invention has bigger specific strength.
Embodiment 3 cellular board bend tests
Cellular board bend test result and typical failure mode respectively as Fig. 5, shown in Figure 6.The typical failure mode of cellular board under the bending load effect is: (1) bonding layer destroys, be that top panel and sandwich layer come unstuck, shown in Fig. 6 (a), sample splicing face exists defective or weak side to begin to occur the phenomenon that top panel and sandwich layer are peeled off in the loading procedure, continue along with loading, release surface is constantly extended to the middle part, can obviously hear the sound that sends when peeling off in the loading procedure.This kind failure mode has a strong impact on the performance (failure mode that the legacy cellular plate occurs easily) of material property.Analyzing possible reason is that bonding quality difference causes.When bonding quality was relatively poor, the failure mode that top panel and sandwich layer come unstuck often took place more than the intensity difference of lower panel in the glue-joint strength of top panel and sandwich layer under the bending load effect.
(2) lower panel fracture is as Fig. 5 (b), shown in Fig. 6 (b).(lower panel and the sandwich layer of embodiment 2 preparations are one-body molded, and top panel and sandwich layer are by the fracture mode of the cellular board of splicing combination).When bonding quality was good, panel and sandwich layer can bulk deformations, finally are to be met or exceeded the panel hot strength and the panel rupture failure is taken place by the lower panel tension
(3) upper and lower panel is excellent basically, destroys all occurring in the honeycomb sandwich layer.From the slope of load-displacement curve (Fig. 4 b) as can be known, article two, curve straightway slope is equal substantially, though hence one can see that bonding quality has considerable influence to the bending strength of structure, but the bending stiffness influence to structure is little, by as can be known, though be similarly panel and the sandwich layer destruction of coming unstuck, breaking load is widely different.Can set about from the splicing face of how body formed top panel and sandwich layer for this reason, analyze the reason that difference produces.Fig. 7 provided in the crooked experiment cellular board top panel and sandwich layer come unstuck destroy after, the destruction situation of bonding layer.By Fig. 7 (a) as can be known, contact with the honeycomb sandwich layer part of (bonding) of top panel, existing adhesive layer is stripped from (shown in the white arrow among the figure) into strips, have adhesive layer partly to be retained in (with among the figure shown in the asterisk) of top panel again, and this distribution is comparatively even.And in Fig. 7 (c), its right side is no glue-line district (shown in the broad arrow among the figure) in blocks.The cementing status itself that can infer each sample thus has bigger difference.Therefore the cellular board of traditional how body formed technology acquisition has the weakness that easy peeling off (coming unstuck) destroyed really.
The above-mentioned specific embodiment does not limit technical scheme of the present invention in any form, and every employing is equal to replaces or technical scheme that the mode of equivalent transformation obtains all drops on protection scope of the present invention.

Claims (6)

1. be with the moulding process of edge sealing integrated bionic cellular board, it is characterized in that may further comprise the steps:
(1) mould is prepared: cleaning mold, and coat oil-based release agent on the male mold surface, dry; Evenly spray the dryness releasing agent at the former die surface;
(2) formpiston preparation: will pour in the male mold after the fusing of formpiston material heating paraffin, after paraffin solidified, form removal made the paraffin formpiston, and the paraffin formpiston is inserted into the former locating hole;
(3) preparation epoxy resin adhesive liquid;
(4) lay down fibre, impregnation: adopt following two kinds of methods to add fiber and epoxy resin adhesive liquid according to fiber content: when fiber quality content 10% or when following, the epoxy resin adhesive liquid of fiber and step (3) preparation stirred directly pours in the former; When fiber content is higher than 10%, when inserting formpiston, import fiber toward the inside, a side space of having inserted formpiston earlier, wait the paraffin formpiston all to be inserted into former after, again at surperficial layer overlay fiber; In cavity block, pour the epoxy resin adhesive liquid that step (3) is prepared into then;
(5) curing, the demoulding: mould is put into air dry oven, the moulding that is heating and curing, resin solidification is the back demoulding fully; Sample after the demoulding is put into baking oven, with the fusion of paraffin formpiston, can make the integrated cellular board sample of band edge sealing.
2. the moulding process of band edge sealing integrated bionic cellular board according to claim 1 is characterized in that in the step (3) according to epoxy resin: the mass ratio preparation glue of curing agent: diluent=10:3:1.
3. the moulding process of band edge sealing integrated bionic cellular board according to claim 1 is characterized in that curing schedule (5) vacuumizes processing to the epoxy resin adhesive liquid in the mould before after step (4) finishes.
4. the moulding process of band edge sealing integrated bionic cellular board according to claim 1 is characterized in that the condition of cure in step (5) is first 55-60 ℃ isothermal curing 1 hour, solidifies 1 hour at 120-150 ℃ after the demoulding again again.
5. the moulding process of band edge sealing integrated bionic cellular board according to claim 1 is characterized in that at the described fiber of step (4) be basalt short fiber, basalt long fiber, geotextiles, fiber cloth or their lamination.
6. the moulding process of band edge sealing integrated bionic cellular board according to claim 2 is characterized in that described epoxy resin is bisphenol A type epoxy resin.
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CN103879122A (en) * 2014-04-08 2014-06-25 苏州芳磊蜂窝复合材料有限公司 Honeycomb preparation process
CN103935053A (en) * 2014-04-08 2014-07-23 东南大学 Forming mold and forming method of fiber reinforced composite material grid rib
CN104608229A (en) * 2015-01-04 2015-05-13 安徽皇室尊尼木业有限公司 Method for manufacturing decoration plate
CN104927304A (en) * 2015-06-05 2015-09-23 山东聚智机械科技有限公司 Preparation method of basalt fiber board
CN108297163A (en) * 2018-04-03 2018-07-20 东华大学 A kind of low cost honeycomb curved-surface processing method
CN108527889A (en) * 2018-04-03 2018-09-14 东华大学 A kind of honeycomb curved surface high-efficiency machining method
CN109864012A (en) * 2019-04-12 2019-06-11 云南农业大学 A kind of artificial beeswax honeycomb production method
CN110065242A (en) * 2018-01-23 2019-07-30 波音公司 The manufacture of composite material component with both continuous and chopped strand components

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CN101797783A (en) * 2010-02-11 2010-08-11 东南大学 Mold device and method for integrally-prepared polygonal grating hollow plates
CN101885217A (en) * 2010-07-15 2010-11-17 东南大学 Die and method for integrally manufacturing solid core functional plate with polygonal gird honeycomb structure
CN202702707U (en) * 2012-07-02 2013-01-30 东南大学 Integrated durable column core edge sealing interlayer board
CN102950825A (en) * 2012-07-02 2013-03-06 东南大学 Integrated durable cylinder core edge-sealing sandwich plate

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CN101386210A (en) * 2008-10-09 2009-03-18 天津工业大学 Recombination method of basalt fiber reinforcement pre-weaving multiple layer cellular composite material
CN101797783A (en) * 2010-02-11 2010-08-11 东南大学 Mold device and method for integrally-prepared polygonal grating hollow plates
CN101885217A (en) * 2010-07-15 2010-11-17 东南大学 Die and method for integrally manufacturing solid core functional plate with polygonal gird honeycomb structure
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103879122A (en) * 2014-04-08 2014-06-25 苏州芳磊蜂窝复合材料有限公司 Honeycomb preparation process
CN103935053A (en) * 2014-04-08 2014-07-23 东南大学 Forming mold and forming method of fiber reinforced composite material grid rib
CN103935053B (en) * 2014-04-08 2017-01-04 东南大学 Fiber-reinforced composite material grid ribs mould and forming method
CN104608229A (en) * 2015-01-04 2015-05-13 安徽皇室尊尼木业有限公司 Method for manufacturing decoration plate
CN104927304A (en) * 2015-06-05 2015-09-23 山东聚智机械科技有限公司 Preparation method of basalt fiber board
CN104927304B (en) * 2015-06-05 2017-03-08 山东聚源玄武岩纤维股份有限公司 A kind of preparation method of basalt fibre plate
CN110065242A (en) * 2018-01-23 2019-07-30 波音公司 The manufacture of composite material component with both continuous and chopped strand components
CN110065242B (en) * 2018-01-23 2022-11-29 波音公司 Manufacture of composite parts having both continuous and chopped fiber components
CN108297163A (en) * 2018-04-03 2018-07-20 东华大学 A kind of low cost honeycomb curved-surface processing method
CN108527889A (en) * 2018-04-03 2018-09-14 东华大学 A kind of honeycomb curved surface high-efficiency machining method
CN109864012A (en) * 2019-04-12 2019-06-11 云南农业大学 A kind of artificial beeswax honeycomb production method
CN109864012B (en) * 2019-04-12 2021-08-13 云南农业大学 Method for manufacturing artificial beewax honeycomb

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