CN103333637A - Modified corn starch adhesive and preparation method thereof - Google Patents

Abstract

The invention relates to a modified corn starch adhesive and a preparation method thereof. The modified corn starch adhesive is mainly composed of corn starch, hydrogen peroxide, sodium hydroxide, tributyl phosphate, borax, a dispersant, a drier, polyvinyl alcohol, water and the like. The modified corn starch adhesive has the characteristics of strong adhesion, good fluidity, non-toxicity, and tastelessness; and cardboards prepared through using the modified corn starch adhesive have the characteristics of good stiffness, fast drying speed and the like.

Description

A kind of modified corn starch adhesive glue and preparation method thereof

Technical field

The present invention relates to a kind of modified corn starch adhesive glue and preparation method thereof, belong to the composite modified starch technical field.

Background technology

The amylan viscose glue is used widely as universal natural adhesive Yi Di Lai Di, and this is mainly based on two reasons, and the one, starch resource is abundant, low price, and nontoxic free from extraneous odour, pollution-free; The 2nd, along with the minimizing day by day of petroleum resources, the Chemicals that award oil and be raw material have constituted threat, thereby make many enterprises seek surrogate one after another, and the adhesive glue that uses in the cardboard industry is continued to use bubble flower alkali always, because its alkali content height, corrodibility to paper is big, the cardboard of producing gets damp easily, distortion, damaged, even corrosion internal packing commodity, and make starch structure by physico-chemical process or biochemical method, the change of physical properties and chemical property, the multiple gluing glue of denaturation cornstarch with specified property and purposes appears, this W-Gum adhesive glue has the bonding strength height, in light weight, characteristics such as non-corrosiveness, thus be subjected to extensive concern.

Because general corn starch adhesive is two common shortcomings of ubiquity in actual applications, shortcomings such as the bubble flower alkaline error that namely cardboard rate of drying and stability are more traditional.

Summary of the invention

The purpose that the present invention is is exactly at defectives such as the cardboard rate of drying of existing general corn starch adhesive existence and poor stabilities, provide that a kind of to have a bonding force strong, good fluidity, nonpoisonous and tasteless, made cardboard deflection is good, modified corn starch adhesive glue that rate of drying is fast and preparation method thereof.

The present invention is achieved through the following technical solutions, it is characterized in that this modified corn starch adhesive glue mainly by: W-Gum, hydrogen peroxide, sodium hydroxide, tributyl phosphate, borax, dispersion agent, siccative, polyvinyl alcohol, water etc. are formed.

By its weight percent be: W-Gum 18～22%; Hydrogen peroxide 1.8～2.0%; Sodium hydroxide 1.0～1.8%; Tributyl phosphate 0.1～0.2%; Borax 0.1～0.5; Dispersion agent 0.3～0.5; Siccative 4.0～6.0%; Polyvinyl alcohol 0.6～1.2%; Water 73～76% compositions such as grade.

A kind of modified corn starch adhesive glue, its preparation method is:

In the water of total amount 1/2nd, add the polyvinyl alcohol stirring and be warming up to 98 ℃, it is dissolved fully, adding W-Gum after the degraded to 60 ℃ stirs, be incubated to the 60min modification and handle, add hydrogen peroxide, sodium hydroxide stirring 30min again, add tributyl phosphate, borax, disperse complexing 40min, add dispersion agent at last, siccative stirs and gets final product.

Embodiment

(1) accurately takes by weighing W-Gum 20% by its weight percent; Hydrogen peroxide 1.8%; Sodium hydroxide 1.5%; Tributyl phosphate 0.15%; Borax 0.2%; Dispersion agent 0.3%; Siccative 6.0%; Polyvinyl alcohol 0.6%; Water 76%, standby.

The preparation method

In the water of total amount 1/2nd, add the polyvinyl alcohol stirring and be warming up to 98 ℃, it is dissolved fully, adding W-Gum after the degraded to 60 ℃ stirs, be incubated to the 60min modification and handle, add hydrogen peroxide, sodium hydroxide stirring 30min again, add tributyl phosphate, borax, disperse complexing 40min, add dispersion agent at last, siccative stirs and gets final product.

Claims (3)

1. modified corn starch adhesive glue and preparation method thereof, this modified corn starch adhesive glue mainly by: W-Gum, hydrogen peroxide, sodium hydroxide, tributyl phosphate, borax, dispersion agent, siccative, polyvinyl alcohol, water etc. are formed.

2. according to right 1 described a kind of modified corn starch adhesive glue and preparation method thereof, by its weight percent be: W-Gum 18～22%; Hydrogen peroxide 1.8～2.0%; Sodium hydroxide 1.0～1.8%; Tributyl phosphate 0.1～0.2%; Borax 0.1～0.5; Dispersion agent 0.3～0.5; Siccative 4.0～6.0%; Polyvinyl alcohol 0.6～1.2%; Water 73～76% compositions such as grade.

3. according to right 1,2 described a kind of modified corn starch adhesive glues, its preparation method is:

In the water of total amount 1/2nd, add the polyvinyl alcohol stirring and be warming up to 98 ℃, it is dissolved fully, adding W-Gum after the degraded to 60 ℃ stirs, be incubated to the 60min modification and handle, add hydrogen peroxide, sodium hydroxide stirring 30min again, add tributyl phosphate, borax, disperse complexing 40min, add dispersion agent at last, siccative stirs and gets final product.