CN103329371A

CN103329371A - Z-directed pass- through components for printed circuit boards

Info

Publication number: CN103329371A
Application number: CN2011800653854A
Authority: CN
Inventors: 凯斯·布莱恩·哈丁; 约翰·托马斯·费斯勒; 保罗·凯文·霍尔; 布莱恩·李·娜莉; 罗伯特·亚伦·奥莱斯比
Original assignee: Lexmark International Inc
Current assignee: Lexmark International Inc
Priority date: 2011-01-21
Filing date: 2011-01-21
Publication date: 2013-09-25
Also published as: WO2012099597A1; EP2666215A1; AU2011355720A1

Abstract

A Z-directed signal pass-through component for insertion into a printed circuit board while allowing electrical connection from external surface conductors to internal conductive planes or between internal conductive planes. The z-directed pass-through component is mounted within the thickness of the pcb allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body.

Description

The Z-direction that is used for printed circuit board (PCB) is passed through parts

The cross reference of related application

Present patent application relates to No. the 12508131st, the U.S. Patent application (attorney 2008-0295.01) that is entitled as " Z-directed Components for Printed Circuits Boards ", No. 12508158 (the attorney 2009-0118.00) that is entitled as " Z-directed Capacitor Components for Printed Circuits Boards ", No. 12508188 (the attorney 2009-0119.00) that is entitled as " Z-directed Delay Line Components for Printed Circuits Boards ", No. 12508199 (the attorney 2009-0120.00) that is entitled as " Z-directed Filter Components for Printed Circuits Boards ", No. 12508204 (the attorney 2009-0121.00) that is entitled as " Z-directed Ferrite Bead Components for Printed Circuits Boards ", No. 12508215 (the attorney 2009-0122.00) that is entitled as " Z-directed Switch Components for Printed Circuits Boards ", No. 12508236 (the attorney 2009-0123.00) that is entitled as " Z-directed Connector Components for Printed Circuits Boards ", No. 12508248 (the attorney 2009-0124.00) that is entitled as " Z-directed Variable Value Components for Printed Circuits Boards ", above-mentioned each U.S. Patent application was submitted on July 23rd, 2009, and the assignee who all transfers the application.

About the research of federal funding or the statement of exploitation

Nothing.

Reference to sequence table etc.

Nothing.

Background

1. invention field

The present invention relates to electronic building brick, relate more specifically to be used to the electronic building brick that is inserted into printed circuit board (PCB) and assemble method.

2. the description of background technology

Printed circuit board (PCB) (PCB) is made the main assembly that uses two types.The first type is to use the pin through hole parts of the metal lead wire that is welded to the electroplating ventilating hole among the PCB.The assembly of the second type is to be positioned on the surface of printed circuit board (PCB) and by being welded to the attached surface mounting assembly of lip-deep pad.Be very difficult to realize because the density of assembly increases and use higher frequency of operation, the design of some circuit to become.The present invention has improved component density and frequency of operation.

At present, behind the etching work procedure in manufacture process, use resistance material between two copper tracing wires, resistor can be embedded between the layer of PCB.Typical 4 layers of pcb board are comprised of two assembly parts, and each assembly parts is two-layer PCB.These used materials stick together to become complete assembly parts.Resistance region can be applied to any layer, so that might have resistive element at internal layer.Yet this way expends the more time and makes to change and is difficult to realize.The present invention is by allowing these difficulties of eliminating in the rear insertion parts of multi-layer PCB assembling.

Summary of the invention

A kind of Z-direction parts for being installed to printed circuit board (PCB) (PCB), described PCB therein (PCB) has the installing hole that the degree of depth is D, the main body and the conductor that comprise insulation, described main body has top surface, basal surface and side surface, length is L, and can be inserted into the shape of cross section in the installing hole of described PCB; Described conductor passes the length of described main body and extends between top surface and basal surface for signal is passed through wherein; And the pair of conductive trace, respectively there is one on each in top surface and basal surface, described conductive trace is electrically connected to an end of adjacent with it conductor and extends to the edge of described main body from it.The length L of described main body can be less than depth D, equal depth D or greater than depth D.

The Z-direction parts also are included in first passage and/or second channel wherein, and at least one from top surface and basal surface of this first passage and/or second channel extended towards relative surface, and has conductive surface, such as copper facing.

In the another kind of form of Z-direction parts, capacitor can be connected between first passage and the second channel, and wherein in first passage and the second channel will be connected to supply voltage, and another passage will be connected to ground.

In another embodiment, the Z-direction parts that are used for being installed to printing board PCB are disclosed, described PCB has the installing hole that the degree of depth is D therein, and the internal layer with at least two separation of conductive trace, described Z-direction parts comprise: length is main body and the conductor of the insulation of L, and described main body comprises: top surface, basal surface; Side surface between described top surface and described basal surface; The first area of described two internal layers of close described PCB; Can be inserted into the shape of cross section in the described installing hole of described PCB; And the first and second conductive channels on described side surface, the extension of described first passage from described top surface and described basal surface, another extension from described top surface and described basal surface of described second channel, when described Z-direction parts are inserted in the described installing hole, described first passage can be electrically connected in the described internal layer, and described second channel can be electrically connected to another in the described internal layer; Described conductor passes the first area of described main body and extends, and cross over interval between described two internal layers of described PCB, one end of described conductor is electrically connected to described first passage and the other end is electrically connected to described second channel, when described Z-direction parts were installed in the described installing hole, described conductor and described first passage and described second channel created and are used for making signal from a signal path that is delivered to another internal layer of described internal layer.

In other embodiments, the Z-direction parts comprise: location feature, for example have the axial projections of locating surface, the recess with locating surface, visual indicia and magnetic mark, or connection features, such as conductive welding disk, pogo pin (pogo-pin) and spring.

In another form, the Z-direction parts that are used for being installed to printing board PCB are disclosed, described PCB has the installing hole that the degree of depth is D therein, and at least one internal layer with conductive trace, described Z-direction parts comprise: length is the main body of the insulation of L, described main body comprises: top surface, basal surface, a conductive trace with the edge that extends to described main body in described top surface and the described basal surface; Side surface between described top surface and described basal surface; Can be inserted into the shape of cross section in the described installing hole of described PCB; The first area of described at least one internal layer of close described PCB; And at least one conductive channel on described side surface, described at least first passage is from the described top surface of described main body and an extension the described basal surface, when described Z-direction parts were inserted in the described installing hole, described at least one passage can be electrically connected in described at least one internal layer of described PCB.The conductor of the first area extension of passing described main body also is provided, one end of described conductor is electrically connected to described at least one passage and the other end and is electrically connected to conductive trace in the described top surface of described main body and the described basal surface one, when described Z-direction parts were installed in the described installing hole, described conductor and described at least one passage created and are used for making signal from the described top surface of described PCB and a signal path that is delivered to described at least one internal layer of described basal surface.

In another embodiment, the Z-direction parts that are used for being installed to printing board PCB are disclosed, described PCB has the installing hole that the degree of depth is D therein, and at least one internal layer with conductive trace, described Z-direction parts comprise: length is the main body of the insulation of L, described main body comprises: top surface, basal surface, a conductive trace with the edge that extends to described main body in described top surface and the described basal surface; Side surface between described top surface and described basal surface; Can be inserted into the shape of cross section in the described installing hole of described PCB; The first area of described at least one internal layer of close described PCB; And be disposed on the side surface of described main body and near at least one circumferential channel of at least one internal layer of described PCB.The present invention also provides at least one the O shape ring that is arranged in circumferential channel, and when the Z-direction parts were inserted in the installing hole, described at least one O shape ring was electrically connected in described at least one internal layer; And the conductor that extends of the first area of passing main body, one end of described conductor is electrically connected to described at least one O shape ring, the other end is electrically connected to the conductive trace in the top surface of main body and the basal surface one, when the Z-direction parts were installed in the described installing hole, described conductor created and is used for making signal from the top surface of PCB and a signal path that is delivered at least one internal layer of basal surface.In another form, can provide a plurality of O type rings and be used for holding one a plurality of circumferential passageways that are arranged on side surface of a plurality of O shapes rings.

Another embodiment shows for the Z-direction parts that are installed to printing board PCB, described PCB has the installing hole that the degree of depth is D therein, and the internal layer with at least two separation of conductive trace, described Z-direction parts comprise: length is main body and the conductor of the insulation of L, and described main body comprises: top surface, basal surface; Side surface between described top surface and described basal surface; The first area of described two internal layers of close described PCB; Can be inserted into the shape of cross section in the described installing hole of described PCB; And the circumferential channel of the first and second conductions on described side surface, when described Z-direction parts are inserted in the described installing hole, described the first circumferential channel is arranged to approach and can be electrically connected in the described internal layer, and described the second circumferential channel is arranged to approach and can be electrically connected to another in the described internal layer.Conductor also is provided, described conductor passes the first area of described main body and extends, and cross over interval between described two internal layers of described PCB, one end of described conductor is electrically connected to described the first circumferential channel and the other end is electrically connected to described the second circumferential channel, when described Z-direction parts were installed in the described installing hole, described conductor and described first passage and described second channel created and are used for making signal from a signal path that is delivered to another internal layer of described internal layer.

Accompanying drawing is described

The feature and advantage of the above and other of various embodiment of the present invention, and the mode that realizes them by will becoming with reference to the accompanying drawings more obvious, and will be better understood, wherein:

Fig. 1 is the diagram of an embodiment of Z-direction parts;

Fig. 2 is the internal structure of element that an embodiment of the Z-direction parts that comprise Fig. 1 is shown;

Fig. 3 A-3F illustrates the various shapes for the main body of Z-direction parts;

Fig. 4 A-4C illustrates the various passage configurations for the Z-direction parts;

Fig. 5 A-5H illustrates various passages and the conductor arrangement for the main body of Z-direction parts;

Various directed location or the connection features of Fig. 6 A-6D diagram Z-direction parts;

Fig. 7 A shows with 7B to have be used to the O type ring of the internal layer that is connected to PCB and the Z-direction parts with the main body in the zone that is made of similar or different materials;

Fig. 8 illustrates various elements or the electronic building brick such as resistor, diode, capacitor, its can be arranged in the main body of Z-direction parts and and conductor series connection;

Fig. 9 shows has the transistorized Z-direction parts of the 3-terminal that is connected to two conductors;

Figure 10 shows the another kind of embodiment of the transistorized Z-direction parts of 3-terminal with the passage that is connected to conductor and plating;

Figure 11 shows the cross-sectional view of the embodiment that evenly is installed on the Z-direction parts in the PCB shown in Figure 12;

Figure 12 illustrates the PCB of Figure 11 and the top view of Z-direction parts, and it shows conductive trace and the connection of being connected the Z-direction parts;

Figure 13 illustrates the grounded circuit of the Z-direction parts of Figure 11 and 12, and the Z-direction parts also comprise the decoupling capacitor of Z-in the main body of assembly;

Figure 14 is the diagram for the Z-direction parts of another internal layer of signal traces being transferred to this PCB from the internal layer of PCB;

Figure 15 is the diagram of an embodiment that comprises the Z-direction capacitor of half-cylindrical sheet;

Figure 16 is the exploded view diagram of another embodiment that comprises the Z-direction capacitor of stacked dish;

Figure 17 A-17C diagram has the alternate embodiment of the Z-direction delay line that shows the transparent surface that connects;

Figure 18 illustrates the programmable Z-direction delay line with a plurality of Z-direction delay lines that show the transparent surface that connects;

Figure 19 A-19C illustrates single conductor difference Z-direction ferrite bean, two conductor differential mode Z-direction ferrite beans, and the sectional view of two conductor common mode Z-direction ferrite beans;

Figure 20 A and 20B show the Z-direction switch module that can be rotated with the predetermined circuit paths in the connection PCB;

Figure 20 B is the sectional view along the PCB of the line 20B-20B of Figure 19 A, and wherein the Z-direction switch module is removed to show the inside tie point of PCB;

Figure 20 C is the diagram that the Z-direction switch module with inner electronic building brick of Figure 20 A is shown;

Figure 20 D is the top view of the Z-direction switch module of Figure 20 C, and it illustrates the alternative configuration of channel shape and conductive component and radial projection;

Figure 21 A-21D shows for setting up the inner Z-direction parts that connect between the trace of the different internal layers of PCB or between the trace at given internal layer, and is used for checking the supplementary features of the test path of connection;

Figure 22 A and 22B show value or the function that changes the Z-direction parts with the side slat of electroplating and partial insertion Z-direction parts;

Figure 23 is for the diagram that the Z-direction parts is inserted into the system of PCB;

Figure 24 is the diagram that has for the Z-direction parts of the adhesive tape that the Z-direction parts is installed to PCB and glue point;

Figure 25 shows the diagram of the Z-direction parts of the brilliant material of the copper kind of using and erosion resistant when electroplating the Z-direction parts.

Embodiment

Now with reference to accompanying drawing the present invention is described more fully hereinafter, more of the present invention rather than whole embodiment shown in the drawings.But should be appreciated that application of the present invention is not limited to set forth in the following description or accompanying drawing shown in the structure of assembly and the details of layout.The present invention can be embodied in many different forms, and should not be construed as limited to embodiment described in this paper, on the contrary, provides these embodiment so that the disclosure will satisfy applicable legal requiremnt.

Wording used herein and term are for the purpose of describing, and should not be considered to restrictive." comprising " used herein, " comprising " or " having " and its variant refer to comprise project and equivalent and the extra project of listing thereafter.Unless otherwise defined, the term of this paper " connection ", " coupling " and " installation " and its variant all are that broad sense is used, and comprise directly connecting, being coupled and install with being connected.In addition, term " connection " be connected coupling " and variant be not limited to physics or machinery connection or coupling.

As described at paragraph subsequently, the purpose of the specific mechanical arrangements shown in the accompanying drawing is to illustrate embodiments of the invention, and other mechanical arrangements that substitute are possible.

This specification has been described the gang's assembly that is intended to be embedded into or insert printed circuit board (PCB) (PCB).These assemblies are called as the Z-direction parts and are modeled, and the basic prototype of many assemblies described herein (but lacking surface channel) is produced to set up the concept evidence.Be not that all embodiment described herein are configured.At first provide the Z-direction parts to be planned the general introduction how to form, be provided for subsequently the configuration of Z-direction part design, include but not limited to capacitor, delay line, transistor, switch and connector.To be considered to have the useful technology of PCB of Z-direction parts to being used for assembling subsequently.The Z-direction parts occupy less space and allow higher frequency of operation for high-frequency circuit (for example, clock rate is greater than 1000MHz) on the surface of PCB.

General introduction

As used herein, used the reference frame at XYZ.X and Y-axis are described the plane of printed circuit board (PCB).Z axis is described the direction perpendicular to the plane of circuit board.The top surface of PCB has zero Z value.Assembly with value of negative Z direction represents that this assembly inserts the top surface of PCB.This assembly can (extend in the past) up, flushes, or the below of the top surface of recessed PCB and/or basal surface.Assembly with positive and negative Z direction value is inserted into the PCB surface with representing this components.The Z-direction parts are planned to be inserted in the hole or recess of printed circuit board (PCB).According to its shape and length, can be inserted into more than one Z-direction parts in the single installing hole of PCB, as be stacked on together or placed side by side.This hole can be through hole (hole from top surface to basal surface), or well (entering the inside of PCB or opening or the recess of internal layer by top surface or basal surface).

As described herein, the Z-direction parts are shown as the top surface that is inserted into PCB.For the PCB that has conductive trace at two skins, a skin is called as top surface, and another skin is called as basal surface.In addition, when only having a skin to have conductive trace, this outer surface is called as top surface.The Z-direction parts refer to have top surface, the assembly of basal surface and side surface.The top surface of Z-direction parts and the reference of basal surface are share in the convention of top surface and the basal surface of PCB.The side surface of Z-direction parts on the Z direction, and will with PCB in the also wall in the Z direction of installing hole adjacent.This usage of top, bottom and side should not be regarded as limiting the Z-direction parts can be installed to mode among the PCB.Although assembly is described to be installed in the Z direction in this article, this does not also mean that, such assembly only is restricted to and is inserted into PCB along Z axis.The Z-direction parts can be on top surface or basal surface or two surfaces perpendicular to the Plane Installation of PCB, or install at an angle with it, this depends on the size of thickness and the Z-direction parts of PCB, reaches even be inserted into the top surface of PCB and the edge of the PCB between the basal surface.

The Z-direction parts can be made by the various combinations of material commonly used in the electronic building brick.Will be from making the signal access path for the conductor of material with high conductivity.Electric conducting material includes, but not limited to copper, gold, aluminium, silver, tin, lead and many other metals.The material that has low electric conductivity by use is such as plastics, glass, FR4(epoxy resin and glass fibre), air, mica, pottery and other materials, the Z-direction parts will have need to the zone of other region insulation.Be constructed to the material that the Z-direction parts of resistor need to have the characteristic between conductor and insulator, it has the limited resistivity for the inverse of conductivity.Material such as carbon, doped semiconductor, nichrome, tin-oxide and other materials is used for its resistance characteristic.Capacitor is made by two conductive plates usually, and these two conductive plates are separated by the insulating material with high permittivity (dielectric constant).Permittivity is that expression is stored in parameter such as the ability in the material of pottery, mica, tantalum and other materials with electric field.Inductor is made at the material with high magnetic permeability on every side by the coil winding of wire or conductor usually.To be expression with magnetic field be stored in iron to magnetic permeability and such as the parameter of the ability in the material of the alloy of nickel-zinc, manganese-zinc, Ni-Fe and other metals.Transistor and FET are the electronic devices of being made by semiconductor, and this semiconductor is made with the nonlinear way activity and by silicon, germanium, GaAs and other materials.In whole application, have different materials, the performance of material or the list of references of term interchangeability that uses at material science and electric component design field at present is discussed.Because how the Z-direction parts are configured and the flexibility of operable material quantity, it is also contemplated that the Z-direction parts can be made of the material that also is not found at present or create.The main body of Z-direction parts generally is made of non-conductive material, unless outside being otherwise noted for the particular design such as the Z-direction parts of capacitor in description.

Use the PCB of Z-direction parts can be configured to have single conductive layer or a plurality of conductive layer, as known.PCB can be only on the top surface, only on basal surface, have conductive trace at top surface and basal surface simultaneously.In addition, the inner conductive trace layer of one or more centres also can exist among the PCB.

Among Z-direction parts or the PCB or on trace between connection can realize by solder technology as known in the art, screen printing technique, extrusion technique or electroplating technology.Depend on application, also can use soldering paste and assembly adhesive.In some configuration, constrictive conductive component can be used for Z-direction parts and the upper conductive trace interconnection that exists of PCB.

The Z-direction parts

The most general form of Z-direction parts comprise have top surface, the main body of basal surface and side surface, and can be inserted into the shape of cross section of the installing hole of the given depth D in the PCB, and the part of main body comprises insulator.All embodiment for the Z-direction parts described herein are based on this general type.

Fig. 1 and 2 shows the embodiment of Z-direction parts.The Z-direction parts 10 here comprise and are generally columniform main body 12, and it has top surface 12t, basal surface 12b, side surface 12s and roughly corresponding to the length L of the depth D of installing hole.Length L can less than, be equal to or greater than depth D.In front two kinds of situations, Z-direction parts 10 will be lower than the top surface of PCB and at least one in the basal surface in a kind of situation, and will be concordant with two surfaces of PCB in another kind of situation.If length L is greater than depth D, Z-direction parts 10 will can be by concordant installation.Yet, for this non homogeneity safety dress, another assembly or another PCB near Z-direction parts 10 can be used to be interconnected to and be positioned at.The through hole that installing hole normally extends between the top surface of PCB and basal surface, but it also can be blind hole.When cave in the surface that is lower than PCB, may in the hole of PCB, need other resist zone, to prevent the whole circumferential area plating around the hole.

A kind of Z-direction parts 10 of form can have at least one conductor 14 of the length extension of main body of passing 12.At end, top 14t and the bottom end 14b of conductor 14, conductive trace 16t, the 16b of top and bottom is arranged in the top end surface and

bottom end surface

12t, 12b of main body 12, and extends to the edge of Z-direction parts 10 from the respective end of conductor 14.In the present embodiment, main body 12 comprises non-conducting material.According to its function, the main body 12 of Z-direction parts 10 can be made by various materials with different qualities.These characteristics comprise the combination of conductivity, resistive, magnetic, dielectricity, semiconduction or various characteristics as herein described.The example that possesses the material of described characteristic can be respectively copper, carbon, iron, pottery or silicon.The main body 12 of Z-direction parts 10 also can comprise some different networks that function circuit is required, and this will discuss after a while.

The passage of one or more longitudinal extensions or well also can be arranged on Z-on the side surface of the main body of assembly 10.Passage can be from the top surface of main body 12 and basal surface one extends towards relative surface.Go out as shown, two concave wells or

passage

18 and 20 can be arranged in the outer surface of Z-direction parts 10, extend along the length of main body 12.When electroplating or weld, these passages allow the electrical connection to Z-direction parts 10 by PCB, and the electrical connection of arriving the internal electrically conductive layer in the

PCB.Passage

18 or 20 length can be extended less than the whole length of main body 12.

Fig. 2 illustrate with Fig. 1 in identical assembly, but all surface is transparent.Conductor 14 is shown as the cylinder of the center extension of passing Z-direction parts 10.Other shapes also can be used for conductor 14.Can see that

trace

16t and 16b extend to respectively the edge of main body 12 from

end conductor

14t and 14b, what connect top trace 16t and bottom trace 16b is conductor.Although

trace

16t and 16b are shown as be in alignment with each other (zero degree of being separated by), this does not do requirement, and they can be positioned as required for specific design.Can be separated by 180 degree or 90 degree and wherein any increments of

trace

16t and 16b for example.

Body shape can be any shape that can be fitted to the installing hole of PCB.Fig. 3 A-3F illustrates the possible body shape for the Z-direction parts.Fig. 3 A shows the main body 40 of triangular cross section, and Fig. 3 B shows the main body 42 of rectangular cross section, and Fig. 3 C shows truncated cone 44, and Fig. 3 D illustrates the cylinder 46 of oval cross-section, and Fig. 3 E illustrates cylinder 48.Fig. 3 F is that the diameter of one of them part 52 is greater than the step cylinder 50 of another part 54.Use such layout, the Z-direction parts can be installed in the surface of PCB, have simultaneously to be inserted into the part that is arranged on the installing hole among the PCB.Z-can be chamfered to the edge of assembly, inserts through hole among the PCB to help alignment Z-direction parts.Other shape also can be used for the Z-direction parts with the combination of those shapes that illustrate.

For the Z-direction parts, the passage that is used for electroplating can have various shape of cross sections and length.Unique requirement is, plating or solder material be connected with PCB with the Z-direction parts or on corresponding conductive trace carry out correct being

connected.Passage

18 or 20 for example can have, the cross section of V-arrangement, C shape or U-shaped, semicircle or oval-shaped cross section.When more than one passage was provided, each passage can have different shape of cross sections.Fig. 4 A-4C illustrates three kinds of channel shapes.V-arrangement passage 60 has been shown in Fig. 4 A.U-shaped or C shape passage 62 have been shown in Fig. 4 B.In Fig. 4 C, show the channel shape 65 of waveform or irregular cross section.

The number of plies of PCB can surpass 22 layers from one-sided changing to, and can have less than the different gross thickness in 0.051 inch to 0.093 inch or the above scope.When needs flush installation, the length of Z-direction parts will depend on the thickness of the PCB that is supposed to insert.The length of Z-direction parts also can be different along with the tolerance of the function of expecting and technique.Preferred length will be that the Z-direction parts are concordant with the surface, or extend beyond a little the PCB surface.This will stop electroplating solution to be electroplated around the inside (in some cases, can cause short circuit) in PCB hole fully.Can add anticorrosive additive material in the inner periphery in PCB hole, only to allow in required zone plating.But, certain situation also being arranged, wherein need to electroplate fully in the inner periphery in the PCB hole of the above and below of Z-direction parts.For example, if the top layer of PCB is the Vcc plane, bottom is the GND plane, if use more substantial copper to connect, then decoupling capacitor will have lower impedance.

There are many features can be added to the Z-direction parts and create different machinery and electrical characteristic.The quantity of passage or conductor can be from zero to any number change, and the passage of this any amount or conductor are so that can keep enough intensity to bear the stress that operates in insertion, plating, manufacture process and the PCB environment in its expection.The outer surface of Z-direction parts can have coating with its gluing putting in place.Flange or radial projection can be used to also prevent that the Z-direction parts are not enough to excessive insertion or insertion in the installing hole, particularly in the situation that installing hole is through hole.Coating material also can be used for promoting or hindering the migration of plating or welding material.

The Z-direction parts can be taken on several roles, and this depends on the port that need to be connected to PCB or the quantity of terminal.Some possible situations have been shown among Fig. 5 A-5H.Fig. 5 A is the Z-direction parts as plug-in unit that are configured to 0 port devices 70A, and like this, if filter or assembly are optional, then plug-in unit stops the hole to be electroplated.After PCB was manufactured, 0 port devices 70A can be removed, and another Z-direction parts can be inserted into, electroplate and be connected to circuit.Fig. 5 B-5H shows the various configurations that can be used for multi-terminal device such as resistor, diode, transistor, clock circuit.Fig. 5 B shows 1-port or single-signal Z-direction parts 70B, and it has the conductor 71 of the 72t, the 72b that are connected to top and bottom conductive trace.Fig. 5 C shows the Z-direction parts 70C of 1-port one-passage, wherein except the conductive trace 72t and 72b of conductor 71 and top and bottom, is provided with well or the passage 73 of a plating.Fig. 5 D shows the Z-direction element 70D that has two wells 73 and 75 except trace 72t, the 72b of conductor 71 and top and bottom.The Z-direction parts 70E of Fig. 5 E has three wells 73,75 and 76 except trace 72t, the 72b of conductor 71 and top and bottom.Fig. 5 F shows the Z-direction parts 70F with two conductors 71 and 77, each conductor have separately the top and trace 72t, 72b and 78t, the 78b of bottom, and do not have passage or well.Z-direction parts 70F is the equipment that is mainly used in two signals of differential signal.Fig. 5 G shows the Z-direction parts 70G with a well 73 and two conductors 71 and 77, each conductor have separately the top and trace 72t, 72b and 78t, the 78b of bottom.Fig. 5 H shows conductor 71 with trace 72t, 72b of comprising top and bottom and the Z-direction parts 70H of blind shaft or part well 78, this blind shaft or part well 78 part from top surface along side surface is extended, so that will allow plated material or scolder to stop in the given degree of depth.For those skilled in the art, the quantity of well and signal is only by space, the well size that needs and the restriction of conductor size.

In most of the cases, when being inserted into PCB, the Z-direction parts will need by correctly directed.Therefore, can provide location or alignment features and connection features.Fig. 6 A-6C illustrates the example of this location feature, and Fig. 6 D illustrates connection features.In Fig. 6 A, Z-direction parts 80A has the V-notch 81 that extends radially outward at end face.In Fig. 6 B, Z-direction parts 80B has recess 83 with directed face 84 at the end face of Z-direction member 80B.Fig. 6 C show have axial projections, the Z-direction parts 80C of bolt 85, described axial projections, bolt 85 axially stretch out and have directed face 86 from end surfaces.Such as when using camera, also can use end surfaces or the ink indicia on the side or other visions or the next directed Z-direction parts of magnetic indicator of Z-direction parts.

Shown in Fig. 6 D, Z-direction parts 80D can be assembled connection features, increases extra electric connection point (such as rack earth) to conductive welding disk, spring-loaded pogo pin or even the simple spring 88 of printed circuit board (PCB) as being used to.Spring 88 is shown as the conductor 89 that is connected to Z-direction parts 80D.

Fig. 7 A and 7B illustrate the another kind configuration of Z-direction parts of PCB that is used for having the conductive layer of top and bottom and at least one internal conductor layer that utilizes O type ring.Z-direction parts 150 are shown in the conductive tip trace 154t that has location feature 152 on its top surface 150t and extend between the edge of the main body 150d of conductor 156 and its top surface 150t.(unshowned conductivity bottom trace is arranged on the basal surface).As previously described, conductor 156 passes the part extension of main body 150d.Be positioned on the side surface 150S of main body 150D is at least one semicircular passage or path.As shown in the figure, a pair of axially spaced circumferential channel 158a, 158b are equipped with

O shape ring

160a and 160b, and it is disposed in respectively in passage 158a, the 158b.The side surface 150s that the part of O shape ring stretches out and exceeds main body 150d.

O shape ring

160a, 160b will be oriented to the one or more internal layer adjacency with PCB, with the installing hole of the Z-direction parts that are arranged on this point in one or more traces electrically contact.Depend on design, O shape ring just needn't be configured to and each internal layer adjacency.

O shape ring

160a, 160b can be conductions or nonconducting, and this depends on the design of the circuit that uses them.O type ring 160A, 160B preferably have compressibility and Z-direction parts 150 are fixed in the installing hole helping.The zone 162 of main body 150d in the middle of

O shape ring

160a, 160b can be made of different materials from the zone 164 and 166 of the main body 150d in the O shape ring outside.For example, be conduction if zone 162 material is resistive material and

O type ring

160a, 160b, what see with the internal circuit board trace of O shape loop contacts so is resistive load.

Zone 164 and 166 reaches each other and zone 162 also can be made of the material with different qualities.For example, zone 164 can be resistive, and zone 162 is capacitives, and zone 166 is perceptual.In these zones each can be electrically connected to the adjacent layer of PCB.In addition, do not need to provide conductor 156 and trace 154t, 154b.Therefore, for shown in structure, at the top layer of PCB with between first internal layer at top, resistive element may reside in the zone 164, capacity cell is between first internal layer and the second internal layer in zone 162, and inductance element is between second internal layer and bottom in zone 166.Therefore, for the signal that transmits to the second interior trace of contact conductivity O type circle 160b from the interior trace of contact conductivity O shape ring 160a, this signal can be seen inductive load.Zone 162,164,166 material can have and is selected from one group of characteristic that comprises conductivity, resistive, magnetic, dielectricity, capacitive character or semiconduction and their combination.In the situation that do not break away from spirit of the present invention, this design can extend to the circuit board that has than still less described or more internal layer.

In addition, zone 162,164,166 can have wherein electronic building brick 167,169 of embedding, 171 and such as this paper with reference to described connection of figure 7-Fig. 9.In addition, as illustrating about parts 171, an assembly can be present in one or more zones in the main body of Z-direction parts.Can provide from built-in module to

O type ring

160a, 160b inner connects.Perhaps, also can provide inner connection to the electrodepositable pad that is arranged on the side surface 150s from built-in module.

It is illustrative and not restrictive being intended to about the discussion of the various embodiment of Z-direction parts.The Z-direction parts can be made by the body material of carrying out network function maybe can have other parts that are embedded into its main body.

Z-direction parts example

Suppose that the Z-direction parts can be multi-terminal devices; clear and definite is that it can be used to carry out; but be not limited to following functions: transmission line, delay line, T-shaped filter, decoupling capacitor, inductor, common mode choke, resistor, differential pair are by device, difference ferrite bean, diode, esd protection device (piezo-resistance).Note that in addition in an assembly and combination can be put together.

The design of general Z-direction parts

Fig. 8 illustrates the various configurations of the conductor in the Z-direction parts.As shown in the figure, conductor 90 has zone 92 in the centre of end, and it comprises the material with the characteristic that is selected from the group that is made of following item: conductivity, resistive, magnetic, dielectricity, capacitive character or semiconduction and their combination.These materials form multiple assembly.In addition, assembly can be inserted into or be embedded into zone 92, and the part of conductor is extended from the terminal of this assembly.Capacitor 92a can be provided at zone 92.Similarly, diode 92b, transistor 92c, field effect transistor 92d, Zener diode 92e, inductor 92f, surge suppressor 92g, resistor 92h, the two ends combination that exchanges device 92i and variable capacitance diode 92j and these projects provides other examples at the material in the zone 92 of conductor 90.Although zone 92 is illustrated in the center of conductor 90, it is not limited to this position.

For the multi-terminal device such as three terminal device transistor 92c or field effect transistor 92d or integrated circuit 92k or transformer 92l, the part of conductor can be between the first terminal of top surface trace and device, and another part of conductor can be between the second terminal of basal surface trace and device.For other device terminal, other conductor may be provided in the interior electrical connection of arriving all the other terminals with permission of main body of Z-direction parts, or other conductive trace can be provided in the main body of Z-direction parts, between the passage of the side surface of the main body of other terminal and Z-direction parts, to allow the electrical connection of outside conductive trace.In the Z-direction parts, also can use the various connection configurations of multi-terminal device.

Fig. 9 is connected transistorized two exemplary connection configurations with Figure 10.In Fig. 9, similar to shown in Fig. 5 F, Z-direction parts 100 have two conductors 102 and 104 in main body 105.Conductor 102 comprises top 102t, bottom 102b and zone line 102i, provides transistor 108 at zone line 102i.The base stage 108b of transistor 108 is electrically connected to the top 102t of conductor 102, and emitter 108e is connected to the bottom 102b of conductor 102.Collector electrode 108c is connected to conductor 104 by conductive trace 109.In Figure 10, similar to shown in Fig. 5 C, Z-direction parts 110 have the main body 115 that comprises conductor 112 and passage 114.Conductor 112 comprises top 112t, bottom 112b and zone line 112i, provides transistor 118 at zone line 112i.The base stage 118b of transistor 118 is electrically connected to the top 112t of conductor 112, and emitter 118e is connected to the bottom 112b of conductor 112.Collector electrode 118c is connected to the passage 114 of plating by conductive trace 119.Can be extended to other passage and conductor at Fig. 8 and example shown in Figure 9, to allow to use the multiterminal electronic circuit.Described connection only is intended to for the connection that how can be implemented to the multiterminal sub-component is described, and is not intended to limit transistor and can how be connected in the Z-direction parts.

The Z-direction signal passes through assembly

With reference now to Figure 11 and 12,, it shows and is called signal by the Z-direction parts that are used for signal traces is led to from the top surface of PCB basal surface of part.Figure 11 shows along the cutaway view of the line 11-11 intercepting of Figure 12, in Figure 12, PCB200 has 4 conductive planes or layer, from the top to the bottom, be followed successively by, ground connection (GND) plane or trace 202, power plane Vcc204, the second ground connection GND plane 206 and the 3rd ground connection GND plane or trace 208, it is separated by widely used non-conductive material such as phenolic plastics (such as FR4) as known in the art.PCB200 can be used to high-frequency signal.The corresponding top surface of PCB200 and the corresponding top on basal surface 212 and 214 and bottom ground plane or trace 202 and 208 are connected to the conductive trace that leads to Z-direction parts 220.The installing hole with depth D 216 in negative Z direction is provided among the PCB200 for flushing installation Z-direction parts 220.Here, depth D is corresponding with the thickness of PCB200, but depth D can less than the thickness of PCB200, create blind hole therein.As shown in the figure, installing hole 216 is through holes of circular cross section, holding Z-direction parts 220, but can have the cross section of the insertion of holding the Z-direction parts with other main body configuration.In other words, the size of installing hole is designed to make the Z-direction parts to insert wherein.For example, have columniform Z-direction parts and can be inserted in the square installing hole, vice versa.In the Z-direction parts can not close-fitting situation, what anticorrosive additive material must be added to these parts and PCB did not wish the zone of electroplating.

Z-direction parts 220 are shown as three lead member that flush installation about the top surface 212 of PCB200 and basal surface 214.Z-direction parts 220 are shown as the cylinder-shaped body roughly 222 with length L.As shown in the figure, center conductor or go between 224 for cylindrical is shown as along the length of main body 222 and extends.Two concave wells or the

passage

226 and 228 that limit other two lead-in wires are provided on the side surface of Z-direction parts 220, extend along the length of main

body 222.Passage

226 and 228 is electroplated with the different layers from PCB200 is electrically connected to Z-direction parts 220.As shown in the figure, the ground plane trace on the PCB100 layer 202,206 and 208 is electrically connected to passage 226 and 228.Vcc plane 204 is not connected to Z-direction parts 220, has gap 219 between the wall 217 of Vcc plane 204 and installing hole 216, as shown in the figure.

Figure 12 illustrates the top view of the Z-direction parts 220 among the PCB200.Article three, conductive trace 250,252 and 254 leads to the edge of the wall 217 of installing hole 216.As shown in the figure, trace 252 is as the high-frequency signal trace that leads to basal surface 214 from the top surface 212 of PCB200 via Z-direction parts 220.Conductive trace 250 and 254 is as ground network.Central tap or conductor 224 are electrically connected to the trace 252 on the top surface 212 of PCB200 by top trace 245 and electroplated bridge 230.Top trace 245 on the top surface of Z-direction parts 220 extends to the edge of Z-direction parts 220 from the top ends 224t of conductor 224.Although not shown, the bottom side of Z-direction parts 220 and the basal surface of PCB200 214 are configured similarly by the layout with the trace shown on the top surface 212 of the PCB200 shown in Figure 12.Bottom trace on the basal surface of Z-direction parts 220 extends to the edge of Z-direction parts 220 from the bottom of conductor 224.Electroplated bridge is used in bottom trace and is arranged on to set up between another high-frequency signal trace on the basal surface of PCB200 be electrically connected.The transmission line impedance of Z-direction parts can be adjusted by the distance between control conductor size and each conductor, mates with the impedance phase with the PCB trace, thus the high speed performance of raising PCB.

In electroplating process, the wall 217 and the well 256 between

passage

226 and 228 and 258 that are formed on installing hole 216 allow plated material or scolder to be delivered to basal surface 214 from top surface 212, thereby respectively trace 250 and 254 is electrically interconnected to the

corresponding passage

226 and 228 of Z-direction parts 220, and also is delivered to ground level or trace 202,206 and 208 that the interconnect traces of the similar location on the basal surface 214 that is arranged on PCB200 connects.For the purpose of structure being shown, not shown plating.In the present embodiment, Vcc plane 204 is not connected to Z-direction parts 220.

One of challenge of high-frequency signal speed is because the signal traces transmission line impedance changes reflection and the discontinuity that causes.Because by these discontinuities of passing PCB and coming the route signal traces to cause, many PCB layouts remain on high-frequency signal on one deck as far as possible.By the necessary spaced apart segment distance of the standard through-hole of PCB, it has created high impedance between signal via and inverse signal through hole or grounding through hole.As shown in Figure 11 and 12, Z-direction parts and return ground connection or signal has the very near and controlled degree of approach, the impedance of this permission from the top surface 212 of PCB200 to the substantial constant of basal surface 214.

The Z-direction signal also can comprise decoupling capacitor by parts, and it will allow the reference planes of signal to switch to the Vcc of power plane, appointment from the GND of ground plane, appointment, and not have the high frequency discontinuity.Figure 13 shows the cutaway view of typical 4 layers of PCB300, and signal traces 302 transmits between top layer 304 and bottom 306.Z-direction parts 310 with main body 312 are similar to shown in Fig. 5 D, connect signal traces 302 by center conductor 314.Z-direction parts 310 also comprise the plating passage 316 and 318 that extends along the side surface 312s of main body 312.The top 314t of conductor 314 and bottom 314b are connected to the top 312t of main body 312 and conductive trace 318t and the 318b on the 312b of bottom.These conductive traces are connected to signal traces 302 by plating bridge 330t and the 330b of top and bottom in turn.Passage 316 and 318 will be plated to respectively GND plane 332 and Vcc plane 334.Tie point 336 and 338 illustrates respectively this electrical connection.Schematically illustrated decoupling capacitor 350 is in the inside of main body 312 and be connected between passage 316 and 318.Decoupling capacitor 350 can be the independent capacitor that is integrated in the main body 312 of Z-direction parts 310, and perhaps it can be formed by the part that the needed material with the dielectric property between conductive surface is made the main body 312 of Z-direction parts 310.

The path of signal traces 302 is shown as diagonal line hatches, and can find out from top layer 304 and advance to bottom 306.GND plane 332 and passage 316 are electrically connected at 336 places, are returned by dim spot setting-out 362 expression signal paths.Vcc plane 334 and passage 318 are electrically connected at 338 places, are returned by bright spot setting-out 364 expression signal paths.As known in the art, be not connected to the place of insertion portion at signal plane or trace, those parts and parts separate, as shown in 370.Be connected to the place of insertion parts at signal plane or trace, signal plane or trace are provided at wall or the edge of opening, allowing plated material or scolder bridge joint between them, as shown in a 330t, the 330b, 336 and 338.

Vertical dash area 380 is illustrated in by the zone of the high speed loop between signal traces 302 and GND plane 332 or Vcc plane 334 described signal traces and the return current path.Signal traces 302 on the basal surface 306 is referenced to power plane Vcc334, and it is coupled to GND plane 332 by decoupling capacitor 350.Coupling between these two planes will keep high-frequency resistance close to constant, be used for returning the plane to the transition on the plane of another different dc voltage from one.

The Z-direction components interior is installed in to greatly facilitate in the PCB uses the external ground plane for reducing the PCB technology of EMI.Utilize this technology, signal is by route on internal layer as much as possible.Figure 14 illustrates an embodiment of this technology.PCB400 is made of (from the top to the bottom) top ground plane 402, internal signal layer 404, internal signal layer 406 and bottom ground plane 408.

Ground plane

402 and 408 is on the top surface and basal surface 400t and 400b of PCB400.The installing hole 410 that is shown as through hole extends between top surface and basal surface 400t and 400b.Z-direction parts 420 are illustrated to flush and are installed in the PCB400.Z-direction parts 420 comprise main body 422, and it has two

passages

425 and 427 on central area 424 in the middle of the top of main body 422 422t and bottom 422b and the side surface 422s.

Passage 425 and 427 and the wall 411 in hole 410 form respectively and electroplate well 413 and 415.Central area 424 is located in the main body 422, and extends the distance that is approximately equal to the distance of separating two internal signal layers 404 and 406.Passage 425 extends to internal signal level 406 from the basal surface 422b of main body 422, and passage 427 extends to internal signal level 404 from the top surface 422t of main body 422.Here, passage 425 and 427 parts along the side surface 422s of main body 422 are extended.Conductor 426 extends by central area 424, but does not extend to top surface and basal surface 422t, the 422b of main body 422.Fig. 5 H illustrates the part passage, and it is similar to passage 427.Conductor 426 has conductive trace 428t and 428b, and top 426t and the bottom 426b from conductor 426 extends to passage 427 and 425 respectively.Although be shown as independent element, conductor 426 and trace 428t, 428b can be integrated conductors with passage 425,427 electric interconnections.As shown in the figure, conductive trace 428b is connected to internal signal layer 406 by electroplating passage 425 and well 413, and trace 428t is connected to internal signal level 404 by passage 427 and well 415.Ground plane 402 and 408 is not connected to Z-direction parts 420, and spaced apart with installing hole 410, as before describing about Figure 11 and 13.As passing through shown in the double-head arrow dotted line 430, signal on the signals layer 406 passes the path arriving signal layer 404(that extends from well 413, passage 425, trace 428b, conductor 426, trace 428t, passage 427 and well 415 via the Z-direction parts or vice versa), to allow signal to remain on the internal layer of PCB400, ground plane 402 and 408 provides shielding.

The Z-direction decoupling capacitor

Capacitor with Z-direction article body type can be constructed in several ways.In Figure 15, Z-direction capacitor 500 is shown as has main body 502, and this main body 502 has the conductor 504 that extends along its length and two

passages

506 and 508, be similar to previously described those.Conductor 504 is shown as and is connected to signal 526.The vertical orientated staggered partial circle cylindricality sheet 510,512 that forms the plate of Z-direction capacitor 500 is connected to such as reference voltage and the ground connection (or any other needs the signal of electric capacity) of voltage vcc and uses together with the intermediate layer of dielectric material (not shown).The sheet 510 of partial circle cylindricality is connected to electroplates passage 506, and it is shown as and is connected to ground 520.The sheet 512 of partial circle cylindricality is connected to electroplates passage 508, and it is illustrated and is connected to power source voltage Vcc 522.Sheet 510,512 can be formed by the copper with high conductivity, aluminium or other materials.Material between partial circle cylindricality sheet is the material with dielectric property.Only have a partial circle cylindricality sheet to be shown as to be connected to each in Vcc522 and the ground 520, but additional partial circle cylindricality sheet can be provided to realize required electric capacity/voltage rating.

Another embodiment of Z-direction capacitor shown in Figure 16 uses the stacking supporting member that is connected to voltage vcc or ground.Z-direction capacitor 600 is made of center conductor 601 and main body 605, and main body 605 comprises that overhead 605t, bottom member 605b, a plurality of supporting member 610(between overhead 605t and bottom member 605b are shown as dish).

Center conductor 601 extends through opening 615 and opening 602t and 602b, and opening 615 is in the Z-direction capacitor 600 of assembling, and the size of all openings all is designed to closely hold center conductor.Center conductor can be electrically connected to conductive trace 603t and the 603b on top 605t and the bottom 605b, thereby is formed for the signal path of signal 626.This connects by electroplating or the soldering realization.Conductor 601 is connected to signal 626 by conductive trace 603t.The bottom of conductor 601 is connected to the signal traces (not shown) by conductive trace 603b in a similar fashion.

Relative opening 607t and 608t are provided at the edge on the 605t of top.Bottom 607 has similar structure to top 605, and they have relative opening 607b and the 608b that is provided at the edge.Between top 605 and bottom 609 is a plurality of supporting members 610, and it provides capacitive characteristics.Each of supporting member 610 has at least one opening 613 of their outer edge and the endoporus 615 that allows conductor 602 therefrom to pass.As shown in the figure, two relative openings 613 are provided in each supporting member 610.When assembling,

relative opening

607t, 607b, 608t, 608b and 613 alignment are to form the

relative passage

604 and 608 that extends along the side surface of Z-direction capacitor 600.Passage 604 is shown as the reference voltage that is connected to such as ground 620, and passage 606 is shown as another reference voltage that is connected to such as Vcc622.Supporting member 610 can be made by dielectric material, and all can have identical or different thickness, selects when the required characteristic of design Z-direction capacitor 600 allowing.

Annular electro coating 617 is provided in the top surface of supporting member 610 and the basal surface one, perhaps if necessary, can be provided on two surfaces.As shown in the figure, annular electro coating is illustrated on the top surface of each supporting member, but the position of annular electro coating can change with supporting member.Annular electro coating 617 roughly meets the shape of supporting member, and extends towards another rim openings 613 from a rim openings, if an extra opening is provided.The diameter of annular slab 617 or size or overall dimensions are less than diameter, size or the overall dimensions of support unit attached thereto 610.Although plate 617 is described to annular, also can use other shape, as long as electrodeposited coating contact center conductor or extend to it and electroplated or the edge of supporting member attached thereto otherwise not.In the certain engagement edge opening 613 of annular slab one, but spaced apart with other opening, if more than one passage is present in the side surface of the main body of Z-direction capacitor 600.Also have opening 619 at annular slab 617, this opening 619 has the diameter greater than the opening 615 in the annular slab 617, and conductor 601 passes this opening to be passed through.Opening 619 has the diameter larger than conductor 602, so that annular slab 617 is spaced apart with conductor 602.

As shown in the figure, supporting member 610 is basic identical, except the member that when stacking, replaces with respect to above it or below the parts Rotate 180 be outside one's consideration.This can be called as the 1-1 configuration.By this way, the member that replaces will be connected to one or the other in two passages.As shown in figure 16, higher that the annular electro coating in two supporting members 610 is connected to passage 608 and voltage vcc 622, and low that the annular electro coating in two supporting members 610 is connected to passage 604 and ground 620.Also can use the layout of other support units, such as making two adjacent members be connected to identical passage, next supporting member is connected to relative passage, and this can be called the 2-1 configuration.Other configurations can comprise 2-2,3-1 configuration, are the problems of design alternative.Required electric capacity or voltage rating determine to be inserted in the quantity of the supporting member between top 605 and the bottom 609.Although not shown, consisted of by dielectric material and with the similar dielectric component of supporting member 610 shapes can be staggered with supporting member 610.Based on design alternative, can only use single passage, perhaps also can provide a plurality of passages, this annular electro coating can contact with center conductor and not contact with passage.Again, the embodiment of Z-direction capacitor is the purpose for explanation, and to be not intended to be restrictive.

For any design of Z-direction capacitor, the second conductor can be arranged in parallel with the first conductor that is disposed in the conductive plate, to create the difference decoupling capacitor.From Figure 15 or Figure 16, by one in the reference voltage that center conductor is connected to each supporting member place (also making its annular electro coating be connected to identical reference voltage), can construct another embodiment of Z-direction capacitor.This can realize by simply conductor being connected to annular electro coating, as schematically illustrated by wire jumper 621.In practice, the size of the circular opening 619 in the annular slab 617 is designed such that annular slab and conductor 602 will be electrically connected.This parts can be placed on the power pins of integrated circuit or ball under or other surface mounting assembly under be used for best decoupling and place.

The Z-direction signal delay line

Figure 17 A-17C and 18 illustrates the embodiment of Z-direction signal delay line parts.Usually, the Z-direction signal delay line comprises having the therein main body of the signal conductor of route, and signal conductor is by a kind of the making in dielectric material and the magnetic material, and it slows down by the signal of delay line propagation.Signal conductor has the segment length in the main body of being included in, and can have the length identical with the length of main body, perhaps can have the length longer than the length of main body.To the connection of signal conductor can via the passage on the side surface that is arranged on the Z-direction parts or be arranged on top surface and basal surface on conductive trace or realize by the trace of top and/or bottom and the combination of passage.In Figure 17 A, Z-direction parts 700A has main body 702, and 702t has conductive trace 703a and 703b at its top surface.Be arranged in the main body 702a is the delay line 704 that is made of a plurality of conductive legs, it comprises vertical orientated section 704a – 704d, these sections extend and are connected roughly approximate W shape by a plurality of short horizontal bar 704e with the bottom on its top separately with serial mode along the part of the length of main body 702a) connect, thus form delay line 704 with waveform or zigzag mode.(forming top and the end of the conductor of delay line) is shown as conductive trace 703a and 703b on the top surface 702t that is connected respectively to main body 702a in the upper end of section 704a and 704d.The extra length of the insertion signal path of the conductor of formation delay line 704 causes signal to propagate long distance before postponing.Connection to delay line 704 also can realize with the passage of the side 702s that is arranged on main body 702a, perhaps with top surface or basal surface on the conductive trace combination, perhaps replace the conductive trace of top and bottom.Additional section can be added to delay line 704 to increase retardation.

In Figure 17 B, Z-direction component delays line 700B has main body 702, and this main body 702 has conductive trace 703t and the 703b in top and the bottom of main body 702b.In main body 702b is delay line 705, and it comprises (finding out from Figure 16 B) C shape conductor 705a – 705d of a plurality of horizontal arrangement, and these conductors 705a – 705d is spaced apart from each other and is connected in series by a plurality of vertical leg section 705e.The side surface that C shape conductor 705a – 705d also can be described to be roughly parallel to the top surface of main body 702 or basal surface 702t, 702b arrange and supporting leg section 705 is roughly parallel to main body is arranged.The end of the supporting leg section 705e that is connected with the bottom with the top of main body 702b is connected trace 703c and the 703d on top surface and the basal surface.Again, the extra length of inserting the delay line 705 in the signal path causes signal propagation path longer, thus the signal delay of making.If between adjacent C shape conductor too much capacitive coupling is arranged, then the shielding material (not shown) can be disposed between the adjacent C shape conductor in the main body 702 and ground connection.Estimate that this will remove the most parasitic effects of this geometry.Connection between the adjacent C shape conductor is implemented as so that the magnetic flux of a C shape conductor is offset the magnetic flux of next C shape conductor.This has reduced the magnetic coupling between the C shape conductor.Can increase extra C shape conductor and increase delay.Replacedly, delay line can helical configuration be arranged.

Figure 17 C illustrates the version able to programme of the Z-direction delay line of Figure 17 B.Z-direction postpones 700C and has main body 702b, and this main body 702b has top and bottom trace 703t.The delay line 705 that is disposed in the main body 702b comprises a plurality of C shape conductors that are connected in series, as previously described.The short circuit mechanism of C shape conductor is disposed in the main body 702b or is upper and can comprise at least one short-circuiting bar.By removing selectively the part of the short-circuiting bar between the adjacent C shape conductor, can be adjusted or programme by the retardation that Z-direction component delays line 700C provides.As shown in the figure, two drillable short-circuiting bars 708,709 are illustrated, and are used for the time of delay of this part of programming.In the present embodiment, short-circuiting bar 708,709 length directions along main body 702b extend, and tangentially contact each C shape conductor.Short-circuiting bar 708 is relative on diameter each other with 709, draws like this a line between them and will divide each C shape conductor 705a – 705d equally.If need minimum delay time, then short bar 708,709 is left on the original place.If need maximum delay time, then remove short-circuiting bar 708,709 by holing or etching away electric conducting material.Because the short-circuiting bar 708 between adjacent C shape conductor, 709 part are removed, time delay will increase the incremental time of 1/2 circle or whole circle.This can be used in easily determines best signal delay in the exploitation, for the production of purpose.And each PCB is adjustable to optimize signal delay during functional test, thereby compensates the variation of other parameters in design.

By short-circuiting bar is laterally placed, intersect with vertical conductor segment 704a-704d, indicated such as line 710, one or more short-circuiting bars can be used to Z-direction delay line 700A.Yet, for this design, must before this part is inserted PCB, adjust time delay.In yet another embodiment, one or more passages can replace short-circuiting bar that short circuit mechanism is provided, and when electroplating such Z-direction delay line by using optionally electroplating technology,

delay line

704 or 705 part can be shorted together.

In Figure 18, linked together by the conductive trace on the PCB by the Z-direction delay line with any amount, can create vairable delay line 730.These surfaces are shown as transparent in connection to be shown.Among the insertion PCB740 is cylinder 750,760 and 770, its Z-direction delay line shown in can presentation graphs 17A-17C, or conductive plunger or Z-direction signal be by parts, and its top surface by PCB740 is connected the top that illustrates on the 740b and is connected conductive trace 780t, 780b with the bottom and connects with series system with basal surface 740t.Cylinder 750,760 and 770 also can be by being arranged on PCB740 the conductive trace (if present) of internal layer connected in series, or being connected by inner or outside conductive trace.If cylinder 750,760 and 770 all represents the Z-direction delay line components, the total delay of so whole delay line 730 can by with can not introduce larger delay, Z-direction parts signal replaces Z-direction component delays kind of thread elements to be changed by device or with another Z-direction component delays line with larger delay as described previously.An advantage of this configuration is, the PCB layout designs be need not to carry out any change, still allows to adjust simultaneously total signal delay.

The T-shaped filter of Z-direction/PI filter

The T-shaped filter of Z-direction and Z-direction Pi filter are three port devices with input conductor, output conductor and earthing conductor.T-shaped filter generally comprises: for low pass filter, be connected to two series resistances between input and the output, capacitor is connected between resistor and the ground, for high pass filter, two series capacitors are connected between input and the output, and resistor is connected between capacitor and the ground.Schematically, these filter class are similar to tee.Parts of Pi filter are connected between input and the output, and second component is connected between input and the ground, and the 3rd parts are connected between output and the ground.First component can be resistor, and reaching the second and the 3rd parts can be capacitor, and vice versa.Also can use inductor.These devices can Fig. 8 and transistorized similar mode shown in Figure 9 be installed in the Z-direction parts.

The Z-direction ferrite bean

Figure 19 A-19C shows the cross-sectional view of the optional embodiment of Z-direction ferrite bean.The structure of these devices is similar to that Fig. 5 B-5H illustrates and describe.Shown in Figure 19 A, being arranged in the part of main body 1000 is the cylinder 1001 of magnetic material, and it has opening, and conductor 1002 passes this opening to be passed through.Conductor 1002 extends to top surface and the basal surface of main body 1000, and it is electrically connected to the trace of top and bottom at this.Conductor also can be connected to such as the passage on the side surface of main body or two wing passages etc. as previously described.By changing the external diameter of cylinder 1001, magnetic characteristic can be changed, with the characteristic of control ferrite bean.As shown in the figure, cylinder 1001 is comprised in the main body 1000, but its excircle also may extend into the side surface of main body 1000.This Structure Creating single conductor difference Z-direction ferrite bean.

In Figure 19 B, two conductor 1002-1 and 1002-2 form two conductor differential mode Z-direction ferrite beans by two openings in the cylinder 1001 that is arranged on main body 1000.The cylinder 1001 that the conductor 1002-1 that two parallel interval are opened and 1002-2 are made of magnetic material surrounds.By changing the external diameter of cylinder 1001, magnetic characteristic can be changed, thus the characteristic of control ferrite bean.As shown in the figure, cylinder 1001 is comprised in the main body 1000, but its excircle also may extend into the side surface of main body 1000.

Shown in Figure 19 C is two conductor common mode Z-direction ferrite beans, it is substantially similar to two conductor differential mode Z-direction ferrite beans, but two conductor 1002-1,1002-2 in the cylinder 1001a are by the common opening 1003 in the magnetic material that forms cylinder 1001a.Volume in the opening 1003 is not filled magnetic material.This volume can be left a blank, and namely is full of air, or another kind of nonmagnetic substance can be used to fill the part of not filled up by conductor 1002-1,1002-2.

The Z-direction switch

Play a part that one pole unit puts or the Z-direction parts of multipole multiposition switch rotate to different positions by inserting axis around it with it, can be used to different settings is programmed among the PCB.Figure 20 A and 20B show has a plurality of interior layers 1102 of containing one or more conductive traces and the PCB1101 of a plurality of surface conductance traces 1103 on the outer surface 1104, and three surface conductance traces wherein further are designated as a, b and c.Conductive trace also can be arranged on two outer surfaces of PCB1101.In Figure 20 A, Z-direction parts 1105 are installed in the installing hole 1106 that is shown as through hole.The passage 1107 of Z-direction parts 1105 is shown as with circuit trace 1103a and aligns.Passage 1107 extends to basal surface 1105b along side surface 1105 from top surface 1105t.Yet the length of passage may be less than the principal length of Z-direction parts, and only from top and lower surface towards another extension, perhaps can be disposed in the centre of top and lower surface, such as, for example, only between two internal layers of PCB, extend.Shown insertion passage 1107 be constrictive conductive component, such as bar 1109.Be arranged on Z-direction parts 1105 top surface 1105t be rotational structure, as being used for Z-direction parts 1105 are rotated to the groove 1108 that aligns with the surface traces 1103 of expecting.Also can use other configuration, for example pair of holes or cross bath replace groove 1108.

Referring now to Figure 20 B, it is that Z-direction parts 1105 are removed, and show a plurality of inner tie point 1110-1113 along the cutaway view of the line 20B-20B intercepting of Figure 20 A.Compressibility conductive component 1109 by Z-direction parts 1105 is aimed at trace 1103a, realizes the connection between trace 1103a and the tie point 1110, as interconnects shown in this dotted line of 2.If the compressibility conductive component 1109 of Z-direction parts 1105 is aimed at trace 1103b, then trace 1103b will be connected to tie point 1111, as interconnect shown in this dotted line of 2.Similarly, if the compressibility conductive component 1109 of Z-direction parts 1105 is aimed at trace 1103c, then trace 1103c will be connected to tie

point

1112 and 1113, as the dotted line of these three points that interconnect shown in.

When the compressibility conductive component was bar, it can have less than and preferably be equal to or greater than the diameter of the diameter of passage 1107.In Figure 20 C and 20D, compressibility conducting rod 1109 is shown having the diameter larger than the diameter of passage 1107.Doing like this is in order to ensure in being inserted into passage 1107 time, and compressibility bar 1109 is compressed, because the interference engagement between bar and the passage, compressibility conducting rod 1109 will be retained in the main body of Z-direction parts 1105 to assist in ensuring that.In addition, shown in Figure 20 D, passage 1107 is positioned in the edge of Z-direction parts 1105, thereby the center line 1109a of compressibility conducting rod 1109 will be positioned in the radius R of Z-direction parts 1105 or less than a distance of this radius R, still allow simultaneously compressibility conducting rod 1109 outer surface extend beyond the side surface 1105s of Z-direction parts 1105 to carry out required electrical connection with 1109s.The band of this excircle or part 1109s are shown among Figure 20 D turgidly.It is predicted, this also will help to keep Z-direction parts 1105 to be inserted among the PCB1101.Extra passage and compressibility conducting rod also may be provided in the Z-direction parts 1105 and are arranged to as required center on the circumference of Z-direction parts 1105, to satisfy the designing requirement of the circuit that forms multipole switch.

To recognize, if the diameter of compressibility conducting rod 1109 is equal to or less than the side surface that the center line of the diameter of passage 1107 and compressibility conducting rod is positioned at or surpasses the main body of Z-direction parts 1105, bar will be tending towards dropping out from passage.Before Z-direction parts 1105 are inserted PCB1104, some instrument of needs such as in passage or the bonding agent on the part of the lip-deep compressibility conducting rod of passage when being used for that bar is inserted into passage, is retained in bar 1109 in the passage 1107.When compressibility bar 1109 has diameter less than the diameter of passage 1107, pad or other instruments, the bossing that for example is inserted in the conduit wall between channel surface and the compressibility conducting rod can be used to guarantee that the compressibility conducting rod will have the side surface 1105s part in addition that extends to Z-direction parts 1105.

In general, the shape of the shape of passage and compressibility conductive member should be mutually corresponding, and when bar is inserted in the passage, it will be kept by passage like this, and the while still allows the part of compressibility member to exceed the sidewall of Z-direction parts.Although described cylindrical channel and bar, should be appreciated that, also can use other shape.For example, shown in Figure 20 D, the cross section of passage 1120 roughly is triangle or trapezoidal, aligns with side surface in its opening summit.Being illustrated what insert passage 1120 is the compressibility conductive member 1122 of essentially rectangular, and it has the 1122w that has a waistline that the cross sectional shape by passage 1120 causes.Member 1122 also may have the triangular-section.

Use by this way Z-direction parts 1105 to allow PCB1101 to be configured with the identification mark of using minimum number of components, such as sequence number.Be arranged on well in the Z-direction parts 1105 by use, as previously described, the connection between the superficial layer of PCB1101 (no matter top surface, basal surface or both) also can be implemented to internal layer.In addition, also can come between the internal layer 1102 of PCB1101 and superficial layer, to provide a plurality of connections with being connected with one or more wells and one or more center conductor.Although it is contemplated that, in case Z-direction parts 1105 are positioned and aim at required trace, it will be plated in here, Z-direction parts 1105 also can removably be inserted in the installing hole 1106, this allows it to be similar to single shaft or the multiaxis rotary switch is aimed at again, and this depends on the number of plies among the PCB1101.Groove also can be arranged in the end surfaces of Z-direction parts, allows it by screwdriver or other similar instrument rotations.In order to keep the Z-direction member also simultaneously still to allow to be rotated in installing hole, flexible-belt or other similar instrument can be provided on the circumferential surface of Z-direction parts.When installing hole was through hole, top surface 1105t can have and can be used to prevent that when being rotated Z-direction parts from skidding off radial projection 1130 or the flange of installing hole.

When the Z-direction switch makes up, Z-direction parts 1105 can have some different circuit or the component values that covers in its main body, shown in the dotted line frame 1115 among Figure 20 C, and it is used to use as previously described passage or conductor, another in one or more trace on one deck of connection PCB (internal layer or skin) and the identical of PCB or other lip-deep many traces.By having a plurality of paths of passing the Z-direction parts, select which conductor to be bridged (between two or more tie points, having required circuit block) by rotating this part, different circuit can be selected.For example, Z-direction parts can have wherein by inserting the Z-direction parts and making it the resistance value scope of aliging to select with required conductive trace.This concept can expand to the combination in any with the electronic unit of coupling in the body volume of Z-direction parts and the conductive trace of necessity.

The Z-direction internal connector

That the transition between the PCB layer needs through hole to come transition about one of problem of very high-speed signal.Copper vias has larger surface area with respect to signal.This will cause the discontinuity of transmission line, and the discontinuity of transmission line can affect signal quality.Current high-speed PCB needs these through holes by the anti-surface area that reduces through hole that bores sometimes.An example is when carrying out signal transition between two internal layers, and then outer section of through hole may need to be removed.Drill bit is arranged in the zone of PCB for the copper between the surface of removing PCB down to this signal.Figure 21 A, 21C and 21D illustrate the another kind of structure of inner Z-direction parts connector, and it can carry out the inside connection and need not this anti-brill process.This embodiment has also illustrated the main body that test path is used for the Z-direction parts.This internal connector is used in the top of PCB or any time that bottom layer does not need to electroplate well.

In the present embodiment, Z-direction parts 1200 1200s on side surface has at least two recessed districts or

recess

1202a, 1202b, 1202c, 1202d, it will comprise the solder paste material (not shown), and this solder paste material will launch or reflux to realize required connection when

heating.Conductor

1216a, 1216b, 1216c, 1216d are provided at respectively between top surface 1200t and each the recess 1202a – 1210d.The part 1216a1-1216d1 of conductor 1216a-1216d on the 1200t of surface can be as the test point of test probe as described herein.

The cutaway view of four layers of PCB1210 shown in Figure 21 B, it has two internal layer 1211a, 1211b, each has respectively two

conductive signal trace

1212a and 1212b, 1212c and the 1212d of four interior locations of the wall 1214w that is arranged on installing hole 1214.Only for illustrative purposes, trace 1212a need to be interconnected to trace 1212c, and trace 1212b is interconnected to trace 1212d.Use the appropriate Z-direction components interior connector that designs also can connect in a similar fashion interior layer and the signal traces of other number.In Z-direction parts 1200, four accordingly the recess 1202a-1202d of location be positioned in side surface 1200s, like this when Z-direction parts 1200 insertion installing hole 1214, these recesses will be respectively with internal layer 1211a, 1211b on trace 1212a-1212d adjacent.

Recess can interconnect with variety of way as known in the art.Two examples shown in Figure 21 A and the 21C.A soldering paste that is the passage 1220 of incision side surface 1200s and

interconnect recess

1202b and 1202d can be filled in soldering paste or the recess will flow into wherein when the heating of PCB occurs.The extra passage that all recesses are interconnected can be provided, and by use be arranged in the passage 1220 by the represented removable weldering dam of dotted line 1224, recess can optionally be interconnected.This allows to determine interconnection after making the Z-direction connector.Need the place that connects between two recesses, the weldering dam 1224 of these recesses of interconnection in the passage will be removed.Can be connected conductor 1222 with 1202c and realize another connections by being arranged on interconnection recess 1202a in the main body 1200b.Use such layout, with the mode of the predetermined interconnection of needs, so that conductor is positioned between the required interconnection point.

In case Z-direction parts 1200 soldered putting in place can check by the test probe that is placed on test point 1216a1-1216d1 inner the connection.Right for illustrated connection, to interconnective recess, only need single test point for each; Yet, may expect to have a test point for the recess of each connection, as shown in the figure.

Figure 21 C is connected the Z-direction parts with 21D inside connects 1200, and it has optional embedding or is formed on the interior multiterminal subassembly 1230 of main body 1200b.Parts 1230 can be active or passive parts, and it also can be inserted in the access path of interior layer 1211a, 1211b of PCB1210.As shown in the figure, a terminal of parts 1230 is connected to the top surface 1200t of Z-direction parts 1200 via conductor 1232, the second terminal is shown as the 3rd terminal that is connected to recess 1202a and parts 1230 via conductor 1234 and is shown as via conductor 1236 and is connected to recess 1202d.Parts with terminal more or less also can be contained in the Z-direction parts 1200, and this depends on the volume that can be used for internal part and conductor.

Test path 1216a-1216d may not exist in some design.Yet test path can be used for any Z-direction part described herein, to improve testability.In addition, the top of these Z-direction parts and lower surface can have in fact and the coextensive conductive coating in surface, so that further shielding to be provided when the Z-direction parts are mounted in PCB and electroplate.

In some cases, this depends on desired function, and when partly being inserted among the PCB, the Z-direction parts can be worked best.The Z-direction parts can have the parameter such as resistivity, and it can be controlled by the degree of depth that is inserted among the PCB.Example is usually to apply uniform resistive film by the side surface in main body and the resistor that has fixing resistance value between top surface and basal surface.This illustrates at Figure 22 A and 22B, and it shows has the PCB1300 that is inserted into the Z-direction resistor 1320 of installing hole 1302 in two different degree of depth (shown in dotted line).PCB1300 is shown having the signal traces 1303,1305 on outer surface (top surface 1300t), and the signal traces 1307,1309 on another outer surface (basal surface 1300b).As all illustrating among these two figure, Z-direction resistor 1320 is interconnected to signal traces 1305 with signal traces 1303.Show two interior layers for PCB1300, the first Voltage Reference layer Vcc1311 and second voltage reference layer GND1313.The side surface 1330s of main body 1330 has two blind ends or the blind vias 1332,1334 that extends from top surface 1330t.These blind vias also can extend from basal surface 1330b.Electrodepositable bar 1340 be illustrated be arranged on main body 1330 on the side surface 1330s between top and lower surface 1330t, the 1330b.Be arranged in the main body 1330 is the conductor 1335,1336 that is electrically connected to the respective end of electrodepositable bar 1340.Conductor 1335, the other end of 1336 are electrically connected to passage 1332,1334.Line 1350 expression top surface 1300t are with respect to the position of main body 1330.The depth D 1 that Z-direction resistor 1320 inserts in the installing hole 1302, wherein part P1 represents the part of electrodepositable bar 1340 below the top surface 1300t of PCB1300, and part P2 represents the part of electrodepositable bar 1340 more than top surface 1300t.When circuit board 1300 is electroplated, the side surface 1300s of the exposure above top surface 1300t and the part P2 of electrodepositable bar 1340 will be coated with copper, thus short circuit part P2 and reduce the all-in resistance of Z-direction resistor 1320.Passage 1332,1334 end are closed, to prevent that plated material with these two passage short circuits together.In Figure 22 B, the Z-direction resistor is illustrated and is inserted into larger depth D 2.Therefore, on electrodepositable bar 1340, part P1 increases and part P2 reduces.At insertion depth D2 and after electroplate occuring, the total resistance value of Z-direction resistor 1320 is greater than the total resistance value when insertion depth is D1.

This concept can be used for any passive component that its value can be adjusted by the part of plate surface.An example is the Z-direction inductor, and wherein the winding part is exposed along the length direction of side surface.Another example is the Z-direction capacitor, and it has and is similar to those the stacked disk shown in Figure 15, but is modified in order to make annular slab 617 be free of attachment in the wing passage 604,608 any.On the contrary, one or more annular slabs 617 will be electrically connected to the corresponding conductor that is arranged in the main body 605, and the other end of conductor is exposed on the side surface of main body 605.Another example is signal delay line, shown in Figure 17 B, the part of C shape conductor 705a-705d is exposed on the side surface 702bs.Another purposes of the technology of this partial insertion is the top of the wherein different electric functions main body that is present in the Z-direction parts and the situation in the zone between the lower surface.As shown in Fig. 7 B, a plurality of devices or circuit also can be arranged in the main body 150.Inner connection can be provided in the electrodepositable pad that is arranged in the side surface.The pad that exposes will be by the mode short circuit of copper coating with similar resistor example.As discussing after a while, after PCB makes, can adjust the Z-direction parts.Circuit design can need the Z-direction parts for will being provided optional function or feature by the circuit of partial insertion PCB, and does not connect during fabrication.Subsequently, if need the Z-direction parts to add the circuit of its new function in the PCB, it will be pushed at the scene and put in place.

In another embodiment, but the bar that uses in the parts of Z-direction variable value also can have one or more etched part 1360, and it has the conductor (seeing Figure 22 A) of each end that is connected to bar.Conductor can arrange on the outer surface in the inside of article body, or the as previously shown and described combination of inside and outside connection.But by the etched part 1360 of etching bar selectively, still keep two signal paths between the conductor of end simultaneously, the value of Z-direction variable value parts can be adjusted.For example, if bar is made of resistance material, removes some this material by etching resistance value will be reduced.But according to the material in the etched part, after material was etched, the value of parts may increase or reduce.Be installed in the degree of depth among the PCB according to such parts, but still less or more etched part will be exposed to etching.The Z-direction parts are installed among the PCB

The shape of the Z-direction parts of the given recess that will be installed to PCB or through hole and the position of expection, a kind of method that realizes this placement are by using insertion system 800, and it comprises directed fixing device 802 and seben 804, as shown in figure 23.Be positioned on the directed fixing device 802 is one or more Z-direction parts 806.Directed fixing device 802 usefulness locating surfaces or other mark that is arranged on Z-direction parts 806 sebens come directed these parts to be used for inserting PCB850, PCB850 is illustrated and is positioned at directed fixing device 802 tops, and it has one or more installing holes 852, be used for Z-direction parts 806 are contained in wherein, as described previously.PCB850 is kept by the fixture (not shown).As shown in the figure, installing hole 852 is through holes, and the depth D in hole is corresponding to the length L of Z-direction parts 806.As previously described, length L can less than, be equal to or greater than depth D, install, flush and install or extend and install to allow concave type.For recessed Z-direction parts, wait that with what need that anticorrosive additive material guarantees recessed surface only those parts of being electroplated are electroplated, electroplated to avoid whole recessed surface.

Seben 804 is raised, shown in arrow 860, Z-direction parts 806 be inserted in the corresponding installing hole 852 among the PCB850 and pass the basal surface of PCB850.Seben can have cylinder, and it passes directed fixing device 802 with each parts 806 and is pressed into installing hole 852 to the correct degree of depth.These cylinders can operate separately or at one time with any line operate that is combined into.

For the convenient Z-direction parts that use, insert the interventional instrument of PCB with directed this part of needs and with them.Although not shown, should be realized that, fetching device also can be used for the Z-direction parts are inserted among the PCB.Such fetching device can insert the Z-direction parts from top or the lower surface of PCB.To need ram device that the Z-direction parts are pressed into required insertion depth among the PCB.

The Z-direction parts can be pressed into and cooperate or adhere to correct position among the PCB.The interface of PCB and Z-direction parts can comprise the brilliant material of kind that suppresses the erosion resistant of electroplating or help to promote to electroplate.Example is shown in Figure 24 and 25.In Figure 24, show Z-direction parts 900, two

passage

904a and 904b and top conductive trace 906 that it has main body 902 and extends along side surface 902s, have adhesive tape 910 or glue point 911 at side surface 902s, before plating, adhere on the wall of the installing hole among the PCB to allow Z-direction parts 900.In Figure 25, show Z-direction parts 920, two passage 924a and 924b and top conductive trace 926 that it has main body 922 and extends along side surface 920s, having the brilliant material 927(of copper kind at passage 924a, 924b is indicated by horizontal line), at the remainder of side surface 902s, conductive trace 926 has anticorrosive additive material 928(and is indicated by angle line).Conforming materials can be used for stoping the plated material migration to exceed desirable position.Part for extend on the surface that surpasses PCB can adopt kind of a brilliant copper in downward surface along side surface to PCB around the edge of Z-direction parts.

Other surperficial mounting parts can be installed in the top of these parts, even can have and make surperficial mounting parts be directly connected to their pad or soldered ball.For example, for BGA device, soldered ball can directly be attached to the top surface of Z-direction parts.The Z-direction parts also can be included in the winding belt package material.Use pick and place that vacuum head can extract these parts and with its partial insertion to PCB.Camera can be used for checking the direction of Z-direction parts, and adjusts its position before the Z-direction parts are fully inserted among the PCB.

For illustrative purposes, the foregoing description that has presented several embodiments of the present invention.Its purpose is not to be exhaustive or to limit the invention to disclosed precise forms, obviously uses for reference above-mentioned instruction, and many modifications and variations all are possible.Being intended to scope of the present invention is limited to the appended claims.

Claims (according to the modification of the 19th of treaty)

1. Z-direction parts that are used for being installed in printing board PCB, described PCB has the installing hole that the degree of depth is D therein, and has the internal layer of at least two separation of conductive trace, and described Z-direction parts comprise:

Length is the main body of the insulation of L, comprising:

Top surface;

Basal surface;

Side surface between described top surface and described basal surface;

The first area of described two internal layers of close described PCB;

Can be inserted into the shape of cross section in the described installing hole of described PCB; And

The first conductive channel on described side surface and the second conductive channel, the extension of described first passage from described top surface and described basal surface, another extension from described top surface and described basal surface of described second channel, when described Z-direction parts are inserted in the described installing hole, described first passage can be electrically connected in the described internal layer, and described second channel can be electrically connected to another in the described internal layer; And

Conductor, described conductor passes the first area of described main body and extends, and cross over interval between described two internal layers of described PCB, one end of described conductor is electrically connected to described first passage and the other end is electrically connected to described second channel, when described Z-direction parts were installed in the described installing hole, described conductor and described first passage and described second channel created and are used for making signal from a signal path that is delivered to another internal layer of described internal layer.

2. Z-direction parts according to claim 1, wherein, described first passage and described second channel are copper-plated.

3.(deletion)

4. Z-direction parts according to claim 1, wherein, described main body also comprises location feature, described location feature is selected from a kind of in the axial projections with locating surface, the recess with locating surface, visable indicia and the magnetic mark.

5. Z-direction parts according to claim 1, wherein, described main body also comprises a kind of connection features that is selected from conductive welding disk, pogo pin and the spring.

6. Z-direction parts that are used for being installed in printing board PCB, described PCB has the installing hole that the degree of depth is D therein, and has at least one internal layer of conductive trace, and described Z-direction parts comprise:

Length is the main body of the insulation of L, comprising:

Top surface;

Basal surface, a conductive trace with the edge that extends to described main body in described top surface and the described basal surface;

Side surface between described top surface and described basal surface;

Can be inserted into the shape of cross section in the described installing hole of described PCB;

The first area of described at least one internal layer of close described PCB; And

At least one conductive channel on described side surface, described at least one passage is from the described top surface of described main body and an extension the described basal surface, when described Z-direction parts were inserted in the described installing hole, described at least one passage can be electrically connected in described at least one internal layer of described PCB;

Conductor, described conductor passes the first area of described main body and extends, one end of described conductor is electrically connected to described at least one passage and the other end and is electrically connected to conductive trace in the described top surface of described main body and the described basal surface one, when described Z-direction parts were installed in the described installing hole, described conductor and described at least one passage created and are used for making signal from the described top surface of described PCB and a signal path that is delivered to described at least one internal layer of described basal surface.

7. Z-direction parts according to claim 6, wherein, described first passage and described second channel are copper-plated.

8.(deletion)

9. Z-direction parts according to claim 6, wherein, described main body also comprises location feature, described location feature is selected from a kind of in the axial projections with locating surface, the recess with locating surface, visable indicia and the magnetic mark.

10. Z-direction parts according to claim 6, wherein, described main body also comprises a kind of connection features that is selected from conductive welding disk, pogo pin and the spring.

Claims

Length is the main body of the insulation of L, comprising:

Top surface;

Basal surface;

Side surface between described top surface and described basal surface;

The first area of described two internal layers of close described PCB;

3. Z-direction parts according to claim 1, wherein, the length L of described main body is one of following: less than depth D, equal depth D and greater than depth D.

Length is the main body of the insulation of L, comprising:

Top surface;

Side surface between described top surface and described basal surface;

At least one conductive channel on described side surface, described at least first passage is from the described top surface of described main body and an extension the described basal surface, when described Z-direction parts were inserted in the described installing hole, described at least one passage can be electrically connected in described at least one internal layer of described PCB;

8. Z-direction parts according to claim 6, wherein, the length L of described main body is one of following: less than depth D, equal depth D and greater than depth D.