CN103326168B - A kind of thinning earphone socket and mobile terminal - Google Patents
A kind of thinning earphone socket and mobile terminal Download PDFInfo
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- CN103326168B CN103326168B CN201310180949.XA CN201310180949A CN103326168B CN 103326168 B CN103326168 B CN 103326168B CN 201310180949 A CN201310180949 A CN 201310180949A CN 103326168 B CN103326168 B CN 103326168B
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- thinning
- earphone socket
- earphone
- mobile terminal
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Abstract
The invention provides a kind of thinning earphone socket, this thinning earphone socket comprises body and earphone jack, and body is provided with and disconnects district, reduces the thickness space taking mobile terminal.In addition, present invention also offers a kind of mobile terminal adopting above-mentioned thinning earphone socket.Thinning earphone socket thickness provided by the invention is little, meets the requirement of mobile terminal thinning.
Description
Technical field
The present invention relates to mobile communication equipment technical field, particularly relate to a kind of thinning earphone socket and use the mobile terminal of this thinning earphone socket.
Background technology
Now, the mobile terminal products such as mobile phone are more and more universal, conveniently carry, and volume is little, thinning, lightweight, and the mobile terminal product of novel and beautiful is more welcome by user.
Conversing with earphone, listen to the music is the indispensable function of mobile terminal, and the earphone socket of adaptive earphone is necessity composition structure of mobile terminal.Fig. 1 is the structural portion view that earphone inserts prior art earphone socket.As shown in Figure 1, earphone 11 is existing commercially normally used earphone patterns, and earphone 11 is inserted in the earphone socket 10 of mobile terminal.Earphone socket 10 need take the certain thickness space in mobile terminal top, when mobile terminal thickness W1 thinning is 7mm, thickness W2 is that earphone socket 10 thickness of 4.4mm is larger, the thickness space taking mobile terminal is excessive, only the thickness of remaining 2.6mm is for other superstructures of mobile terminal, to such an extent as to before there is no enough spatial placement mobile terminals, back cover and take other structures in upper thickness space, the earphone socket of obvious prior art can not meet the requirement of mobile terminal thinning, if add the thickness of mobile terminal, the welcome in market can not be subject to again.
Summary of the invention
The invention provides a kind of thinning earphone socket and mobile terminal, mobile terminal in prior art can be solved blocked up, the technical problem that the earphone socket thickness of mobile terminal is large.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of thinning earphone socket, comprising:
Body;
Earphone jack, is arranged in body;
Wherein, body is provided with and disconnects district, disconnects district and is connected with earphone jack; Body comprises upper surface and lower surface, and disconnect district and be located at upper surface and lower surface, described lower surface is provided with long plastic cement, and described long plastic cement is parallel with described thinning earphone socket length direction, and the afterbody of described body is provided with plastic cement muscle; Body afterbody knuckle place steel disc is reinforced and is welded to and moves on to terminal top, and is connected to earphone transmission of signal with mainboard by the guide-joining plate of earphone socket inside.
Wherein, upper surface or lower surface are provided with rounding.
Wherein, earphone socket thickness is not more than 3.6mm.
For solving the problems of the technologies described above, another technical scheme provided by the invention is: a kind of mobile terminal, comprises above-mentioned middle any one thinning earphone socket.
The invention has the beneficial effects as follows: the situation being different from prior art, thinning earphone socket of the present invention comprises body and earphone jack.Body is provided with and disconnects district, and therefore earphone socket takies the thickness space of mobile terminal less, achieves the thinning design of earphone socket.Thickness of the present invention is little, meets the requirement of mobile terminal thinning.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in embodiment of the present invention, below the accompanying drawing used required in describing execution mode is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structure cutaway view that earphone inserts prior art earphone socket;
Fig. 2 is the front view of thinning earphone socket of the present invention;
Fig. 3 is the vertical view of thinning earphone socket of the present invention;
Fig. 4 is the left view of thinning earphone socket of the present invention; And
Fig. 5 is the right view of thinning earphone socket of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, be clearly and completely described the technical scheme in embodiment of the present invention, obviously, described execution mode is only a part of execution mode of the present invention, instead of whole execution modes.Based on the execution mode in the present invention, those of ordinary skill in the art, not making the every other execution mode obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 2 and Fig. 3, Fig. 2 is the front view of thinning earphone socket of the present invention, the vertical view of Fig. 3 thinning earphone socket of the present invention.
As shown in Figure 2: the thinning earphone socket 20 of present embodiment comprises body 21 and earphone jack 22, and earphone jack 22 is arranged in body 21.Thinning earphone socket 20 is built in mobile terminal and exposes earphone jack 22.When user needs with earphone call or listens to the music, earphone is inserted the thinning earphone socket 20 of mobile terminal.
Please refer to Fig. 3, thinning earphone socket 20 of the present invention is provided with at body 21 and disconnects district 23, the i.e. local hollow out of body 21, concrete, this disconnection district 23 is by being formed the upper and lower surface integral skiving of body 21, or form this disconnection district 23 by one-body molded mode, so, the integral thickness of this earphone socket 20 can be reduced.Disconnect district 23 to be connected with earphone jack 22 (see Fig. 2), make body 21 be rendered as the incomplete closing structure of partly open.Body 21 adopts plastic cement one-body molded, and afterbody knuckle place steel disc is reinforced and is welded to mobile terminal top, is connected to earphone transmission of signal with mainboard by the guide-joining plate of earphone socket inside.
Please refer to the left view that Fig. 4 and Fig. 5, Fig. 4 are thinning earphone sockets of the present invention, Fig. 5 is the right view of thinning earphone socket of the present invention.
Body 21 comprises upper surface 24 and lower surface 25, disconnects district 23 and is located at upper surface 24 or lower surface 25, also can establishes on both surfaces simultaneously, namely disconnects at upper surface 24 or lower surface 25 local.In the present embodiment, disconnect district 23 and be located at upper surface 24.
Now, the cover top portion of some mobile terminal as mobile phone adopts large rounding to design, and this is novel in design, the more users that can attract attractive in appearance are bought.For adapting to this demand, thinning earphone socket of the present invention is provided with rounding 26 at upper surface 24 or lower surface 25, and rounding 26 is arranged on upper surface 24 side in the present embodiment.
Thinning earphone socket thickness of the present invention is not more than 3.6mm.As shown in Figure 2, the thinning earphone socket 20 thickness W3 of present embodiment is 3.6mm, earphone socket 10 (as shown in Figure 1) the thickness W2 of prior art is 4.4mm, so the thin 0.8mm of earphone socket thickness of the thinning earphone socket Thickness Ratio prior art of present embodiment, this structure makes the general thickness of mobile terminal thinning.
As shown in Figure 4, Figure 5, thinning earphone socket 20 of the present invention is provided with long plastic cement 27 at lower surface 25, and long plastic cement 27 is parallel with thinning earphone socket 20 length direction, for increasing the rigidity of earphone socket lower surface 25, improves integrally-built fastness.
Equally, the afterbody of the body 21 of thinning earphone socket 20 is provided with plastic cement muscle 28, increases the rigidity of earphone base afterbody, prevent user when inserting and extracting earphone, earphone socket is subject to External Force Acting and damages.As shown in Figure 3, the side of thinning earphone socket 20 also arranges plastic cement muscle 29, is to increase earphone base rigidity equally.
Like this, when the thickness direction of earphone socket is thinning, by side, afterbody and lower surface arrange plastic cement, increases rigidity and the intensity of earphone socket, ensure earphone socket good anufacturability.
Present invention also offers a kind of mobile terminal, this mobile terminal adopts the thinning earphone socket in above-mentioned execution mode.
In sum, one of ordinary skill in the art will readily recognize that thinning earphone socket provided by the invention reduces the thickness space taking mobile terminal, achieve the thinning design of earphone socket, and the appearance design of large rounding is novel, meets mobile terminal thinning, requirement attractive in appearance.
The foregoing is only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. a thinning earphone socket, is characterized in that, comprising:
Body;
Earphone jack, is arranged in described body;
Wherein, described body is provided with and disconnects district, and described disconnection district is connected with described earphone jack;
Described body comprises upper surface and lower surface, described disconnection district is located at described upper surface and described lower surface, described lower surface is provided with long plastic cement, and described long plastic cement is parallel with described thinning earphone socket length direction, and the afterbody of described body is provided with plastic cement muscle;
Described body afterbody knuckle place steel disc is reinforced and is welded to mobile terminal top;
Described earphone socket inside is provided with the guide-joining plate be connected with mainboard to earphone transmission of signal.
2. thinning earphone socket according to claim 1, is characterized in that, described upper surface or described lower surface are provided with rounding.
3. thinning earphone socket according to claim 1, is characterized in that, described earphone socket thickness is not more than 3.6mm.
4. a mobile terminal, is characterized in that, comprises the thinning earphone socket according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180949.XA CN103326168B (en) | 2013-05-15 | 2013-05-15 | A kind of thinning earphone socket and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310180949.XA CN103326168B (en) | 2013-05-15 | 2013-05-15 | A kind of thinning earphone socket and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103326168A CN103326168A (en) | 2013-09-25 |
| CN103326168B true CN103326168B (en) | 2016-01-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310180949.XA Active CN103326168B (en) | 2013-05-15 | 2013-05-15 | A kind of thinning earphone socket and mobile terminal |
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| Country | Link |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9793641B1 (en) | 2016-08-10 | 2017-10-17 | Microsoft Technology Licensing, Llc | Plug receptacle for an electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340947Y (en) * | 2008-11-28 | 2009-11-04 | 陈桂昌 | Audio socket |
| EP2551970A2 (en) * | 2011-07-28 | 2013-01-30 | Sony Mobile Communications AB | Audio jack and electronic apparatus containing the same |
| CN202817317U (en) * | 2012-08-22 | 2013-03-20 | 东莞市星擎电子科技有限公司 | Earphone socket |
| CN202871966U (en) * | 2012-11-06 | 2013-04-10 | 上海摩软通讯技术有限公司 | Earphone socket and mobile terminal |
-
2013
- 2013-05-15 CN CN201310180949.XA patent/CN103326168B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201340947Y (en) * | 2008-11-28 | 2009-11-04 | 陈桂昌 | Audio socket |
| EP2551970A2 (en) * | 2011-07-28 | 2013-01-30 | Sony Mobile Communications AB | Audio jack and electronic apparatus containing the same |
| CN202817317U (en) * | 2012-08-22 | 2013-03-20 | 东莞市星擎电子科技有限公司 | Earphone socket |
| CN202871966U (en) * | 2012-11-06 | 2013-04-10 | 上海摩软通讯技术有限公司 | Earphone socket and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103326168A (en) | 2013-09-25 |
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Effective date of registration: 20211116 Address after: 264200 floor 5, block C, innovation and entrepreneurship base, No. 213, Torch Road, Weihai high district, Weihai City, Shandong Province Patentee after: Weihai ailaifu Semiconductor Technology Co., Ltd Address before: 516006 No. 70, Huifeng 4th Road, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee before: Huizhou TCL mobile communication Co., Ltd |