CN103310959B - Electronics module and manufacture method thereof - Google Patents
Electronics module and manufacture method thereof Download PDFInfo
- Publication number
- CN103310959B CN103310959B CN201210056393.9A CN201210056393A CN103310959B CN 103310959 B CN103310959 B CN 103310959B CN 201210056393 A CN201210056393 A CN 201210056393A CN 103310959 B CN103310959 B CN 103310959B
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- Prior art keywords
- carrier
- groove
- electronic component
- slit
- terminal
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Abstract
The present invention discloses a kind of electronics module (100), and it comprises insulating carrier (1), electronic component (2) and conducting terminal (31,41). Insulating carrier (1) has the groove (131) that is positioned at its middle part and the slit (17) that is positioned at its lateral wall. In described slit, be provided with first surface (171), described electronic component is installed in groove and has from groove and draws and press close to the enamel-covered wire to first surface. Described conducting terminal, from being mounted to insulating carrier perpendicular to first surface direction, is realized the welding between conducting terminal and conductor wire by wicking welding technology. Conducting terminal, along installing perpendicular to first surface direction, can reduce enamel-covered wire and be drawn bad possibility.
Description
[technical field]
The present invention relates to a kind of electronics module and manufacture method thereof, relate in particular to electronics module and the manufacture method thereof of utilizing wicking solder technology welding conducting terminal and enamel-covered wire.
[background technology]
US Patent specification US5,015,981 discloses a kind of electronic component and manufacture method thereof of utilizing the encapsulation of wicking welding technology. This electronic component comprises insulating carrier, enameled wire loop and conducting terminal. Enameled wire loop has flexible enamel-covered wire, and insulating carrier has and is positioned at that its lateral wall reclines for enamel-covered wire and to the first surface of downward-extension. Conducting terminal is mounted to carrier lateral wall formation module along being parallel to first surface direction, finally module wicking is realized to the welding between conducting terminal and enamel-covered wire.
Utilize the relatively previous Wound-rotor type production method of wicking solder technology, saved labor hour. But conducting terminal is mounted to carrier along being parallel to enamel-covered wire bearing of trend, easily causes breaking or damaging of enamel-covered wire.
[summary of the invention]
(1) technical problem to be solved by this invention is: adopt the conducting terminal of wicking welding technology welding stable contact with enamel-covered wire and to prevent that enamel-covered wire is subject to drawing of conducting terminal bad.
In order to address the above problem, the invention provides a kind of electronics module, it comprises carrier, electronic component and the conducting terminal of insulation, this carrier has first surface, this electronic component is fixed on carrier and has flexible conductive wire, this flexible conductive wire is drawn and presses close to the first surface to carrier from electronic component, and described conducting terminal is pressed close to conductor wire from the direction perpendicular to first surface, and conducting terminal and conductor wire utilize wicking welding technology to realize the welding between them.
Conducting terminal vertical conduction line bearing of trend of the present invention, near conductor wire, has reduced the possibility that conducting terminal is broken conductor wire or damage effectively.
Measure as a further improvement on the present invention, described electronics module also comprises the fixture of insulation, and conducting terminal is fixed on fixture and forms terminal module, and terminal module is along being mounted to carrier perpendicular to the direction of carrier first surface. By fixture, mounting terminal is to insulating carrier easily, and ensures confining force and the stability thereof of terminal.
Measure as a further improvement on the present invention, described carrier has and is positioned at the groove at its middle part and around the sidewall of groove, described electronic component is installed in groove, the inner side of a described sidewall is provided with the trunking being communicated with groove, the outside of a described sidewall is provided with slit, described first surface is positioned at slit, and described conductor wire is accommodated to slit after by trunking. Trunking is set to be convenient to wire and to arrange to slit.
Measure as a further improvement on the present invention, a described sidewall is also provided with the air guide slotted eye that runs through sidewall communication groove and slit. The rising of tin liquor face when air slot is set is conducive to wicking.
(2) technical problem to be solved by this invention is: adopt stable the contacting with enamel-covered wire and prevent that enamel-covered wire is subject to the bad preparation method of drawing of conducting terminal of conducting terminal of wicking welding technology welding.
In order to address the above problem, the invention provides a kind of manufacture method of electronics module, it comprises the steps:
1) provide the carrier of an insulation, it has first surface;
2) provide an electronic component, described electronic component has flexible conductive wire;
3) electronic component is fixed on to carrier, and makes conductor wire draw the first surface to carrier from electronic component;
4) provide a conducting terminal, it has second surface;
5) conducting terminal is mounted on to carrier with the direction perpendicular to first surface, form black box, and first surface is pressed close to second surface and have to make aforementioned conductor wire be exposed to airborne gap;
6) aforementioned black box part is invaded in solder pot, make fusion welding creep and fill aforementioned gap along aforementioned conductor wire, form welding.
The present invention with the manufacture method near conductor wire perpendicular to first surface direction, has effectively avoided enamel-covered wire to be subject to pullling of conducting terminal by conducting terminal.
[brief description of the drawings]
Fig. 1 is the stereogram that meets electronics module of the present invention, and wherein enamel-covered wire does not show.
Fig. 2 is the exploded view of electronics module shown in Fig. 1.
Fig. 3 is the further exploded view at another visual angle of electronics module shown in Fig. 2.
Fig. 4 is the stereogram that is packaged with insulating tape before the weldering of the wicking of electronics module shown in Fig. 3.
Fig. 5 is the cutaway view of electronics module shown in Fig. 1 along A-A line direction.
[main element symbol description]
| Insulating carrier | 1 | Electronics module | 100 |
| Antetheca | 11、301、403 | Rear wall | 12、302 |
| Roof | 13、303、401 | Diapire | 14、402 |
| Sidewall | 15、404 | Locating hole | 113 |
| Groove | 131、44 | Front grab | 151 |
| Rear grab | 152 | Grab | 316、45 |
| Slit | 17 | First surface | 171 |
| Trunking | 18 | Air guide slotted eye | 19 |
| Electronic component | 2 | Iron core | 20 |
| Wicking module | 200 | Front terminal module | 3 |
| Rear terminal module | 4 | The first retaining piece | 30 |
| The second retaining piece | 40 | The first terminal | 31 |
| The second terminal | 41 | Soldering portion | 311、411 |
| Connecting portion | 312 | Vertical component effect | 313 |
| Extension | 314 | Interfere holding parts | 412 |
| Installation portion | 413 | Terminal groove | 43 |
| Mating groove | 33 | Protrude post | 315 |
| Casting lug thereon | 46 | Insulating tape | 5 |
Following detailed description of the invention further illustrates the present invention in connection with above-mentioned accompanying drawing.
[detailed description of the invention]
Fig. 1-5 are depicted as a kind of electronics module 100 according to the invention, and this electronics module 100 comprises carrier 1, some electronic components 2, front terminal module 3 and the rear terminal module 4 of insulation.
Described insulating carrier 1 is roughly cuboid and comprises respectively and roof 13, the diapire 14 of antetheca 11, rear wall 12 and a pair of contrary setting of 3, the 4 corresponding cooperations of front and back ends submodule group. The middle part of roof 13 is recessed to form groove 131 to diapire 14, and described electronic component 2 is installed and is fixed in groove 131. The outside of described antetheca, rear wall 11,12 is equipped with the slit 17 being arranged with from roof 13 downwards, is provided with the first surface 171 extending from the top down in slit 17. The inner side of described antetheca 11, rear wall 12 is equipped with the trunking 18 being arranged with from roof 13 downwards, and this trunking 18 is connected with groove 131. Described antetheca 11, rear wall 12 are also provided with the air guide slotted eye 19 that is positioned at slit 17 bottoms, and these air guide slotted eyes 19 run through front and back walls 11,12(as shown in Figure 5 separately along fore-and-aft direction) and communication groove 131 and slit 17. Described antetheca 11 medium positions are also provided with a locating hole 113. Described insulating carrier 1 is provided with the two side 15 that connects antetheca, rear wall 11,12, and sidewall 15 is provided with respectively the front grab 151 and rear grab 152 that are fixed and locate with front and back ends submodule group 3,4.
Described electronic component 2 is enameled wire loop in the present embodiment, the flexible enamel-covered wire (not shown) that it comprises annular core 20 and is wound around annular core 20.
Front terminal module 3 has the first retaining piece 30 of insulation and the first terminal 31 of conduction. Rear terminal module 4 has the second retaining piece 40 of insulation and the second terminal 41 of conduction. The first retaining piece 30 is roughly the T shape on vertical direction, its top is provided with the mating groove 33 coordinating for the first terminal 31 clasps, and its rear wall 302 is provided with the grab 316 for planting the protrusion post 315 of insulating carrier 1 locating hole 113 and extending back from rear wall 302 both sides of the edge. Protrude post 315 and coordinate the location for front terminal module 3 in the vertical directions with locating hole 113, the first retaining piece 30 grabs 316 coordinate the location of realizing horizontal direction with grab 151 before insulating carrier. The second retaining piece 40 is roughly cuboid, and it is provided with and runs through the terminal groove 43 of its roof 401 to diapire 402. The two side 404 of the second retaining piece 40 is provided with groove 44, the grab 45 extending forward from groove 44 and the casting lug thereon 46 that is positioned at groove 44 both sides. The second retaining piece 40 grabs 45 coordinate the location of realizing its horizontal direction with the rear grab 152 of insulating carrier 1, and the second retaining piece 40 casting lug thereons 46 coordinate the location of realizing on vertical direction with the rear grab 152 of insulating carrier 1. Described first, second terminal 31,41 all has the second surface corresponding with slit 17 (not label).
The first terminal 31 has soldering portion 311, is parallel to the vertical component effect 313 of soldering portion 311, connects the connecting portion 312 of soldering portion 311 and vertical component effect 313, and bends rear horizontally extending extension 314 from vertical component effect 313. The second terminal 41 comprises soldering portion 411, for being mounted to the installation portion 413 of external equipment, and interference holding parts 412 between soldering portion 411 and installation portion 413. Described the first terminal 31 is assembled in respectively the mating groove 33 of the first retaining piece 30, the soldering portion 311 of the first terminal 31 is positioned at the mating groove 33 of the first retaining piece 30 rear walls 302, the connecting portion 312 of the first terminal 31 is positioned at the mating groove 33 of the first retaining piece 30 roofs 303, the vertical component effect 313 of the first terminal 31 is positioned at the mating groove 33 of the first retaining piece 30 antethecas 301, and the extension 314 of the first terminal 31 extends beyond forward the antetheca 301 of the first retaining piece 30. The second terminal 41 is inserted in the terminal groove 43 of the second retaining piece 40. The soldering portion 411 of the second terminal is positioned at the upper end of the second retaining piece 40 antethecas 403, the interference holding parts 412 of the second terminal 41 be positioned at terminal groove 43 and with the second retaining piece 40 interference engagement, the second terminal 41 installation portions 413 extend beyond the diapire 402 of the second retaining piece 40 downwards.
Assembling this electronics module 100 can be as follows: 1) electronic component 2 is mounted in the groove 131 of carrier 1, enamel-covered wire (not shown) is arranged to the slit 17 of front and back walls 11,12 along trunking 18 from groove 131, utilize tool cut off and will press close to first surface 171 places in slit. 2) first and second terminal 31,41 is mounted to respectively to first, second retaining piece 30,40 and forms front and back ends submodule group 3,4. 3) antetheca 11, the rear wall 12 that front terminal module 3, rear terminal module 4 are mounted to respectively to insulating carrier 1 form black box, wherein first, second terminal the 31, the 41st, presses close to enamel-covered wire from the direction of the first surface 171 perpendicular in slit, and aforementioned enamel-covered wire is exposed in the air gap between first surface 171 and terminal second surface. 4) a resistant to elevated temperatures insulating tape 5 is sealed to 200 (as shown in Figure 5) of the outer formation wicking of groove 131 module of insulating carrier 1, wicking module 200 is first immersed in scaling powder liquid, immersed again in solder pot and make fusion welding creep and fill aforementioned gap along aforementioned conductor wire, formed welding. 5), after wicking has welded, insulating tape 5 has been removed to the making of this electronics module 100 from insulating carrier 1.
First, second terminal 31,41 near enamel-covered wire, has avoided enamel-covered wire to be drawn bad possibility by terminal along the direction perpendicular to first surface 171 effectively. First, second terminal 31,41 is assembled respectively with first, second retaining piece 30,40 and is realized split design, facilitates the installation and the stability that keeps terminal 31,41 of terminal 31,41. The rising of tin liquor face when insulating carrier 1 arranges air guide slotted eye 19 and is conducive to wicking, the capillary physical phenomenon that this is tin liquor.
Claims (9)
1. an electronics module, it comprises carrier, electronic component and the conducting terminal of insulation, this carrier toolHave first surface, this electronic component is fixed on carrier and has flexible conductive wire, and this flexible conductive wire is from electricitySub-element is drawn and is pressed close to the first surface to carrier, it is characterized in that: described conducting terminal from perpendicular toThe direction of first surface is pressed close to conductor wire, conducting terminal and conductor wire utilize wicking welding technology realize them itBetween welding, described carrier has and is positioned at the groove at its middle part and around the sidewall of groove, described electronicsElement is installed in groove, and the inner side of described sidewall is provided with the trunking being communicated with groove, described sidewallOutside is provided with slit, and described first surface is positioned at slit, described conductor wire accommodate after by trunking toIn slit.
2. electronics module as claimed in claim 1, is characterized in that: described electronics module also comprises insulationFixture, conducting terminal is fixed on fixture and forms terminal module, terminal module is along perpendicular to carrier theThe direction on one surface is mounted to carrier.
3. electronics module as claimed in claim 1, is characterized in that: described sidewall is also provided with and runs through sidewallAnd the air guide slotted eye of communication groove and slit.
4. electronics module as claimed in claim 2, is characterized in that: described fixture comprises that first is fixingPart and the second fixture, first, second fixture is installed on respectively the two side of insulating carrier.
5. electronics module as claimed in claim 2, is characterized in that: described fixture is provided with carrier joinsClose so that the fit structure of its location.
6. electronics module as claimed in claim 1, is characterized in that: described electronic component comprises iron core,Described conductor wire is the enamel-covered wire that is wound around iron core.
7. an electronic module making method as claimed in claim 1, it comprises the steps:
1) provide the carrier of an insulation, it has first surface, and described carrier has the groove that is positioned at its middle partAnd around the sidewall of groove, the inner side of described sidewall is provided with the trunking being communicated with groove, described sidewallOutside be provided with slit, described first surface is positioned at slit;
2) provide an electronic component, described electronic component has flexible conductive wire, electronic component is installed on recessedIn groove;
3) electronic component is fixed on to carrier, and conductor wire is accommodated after electronic component is drawn by trunkingTo slit and press close to the first surface to carrier;
4) provide a conducting terminal, it has second surface;
5) conducting terminal is mounted on to carrier with the direction perpendicular to first surface, forms black box,And second surface is pressed close to first surface and has to make aforementioned conductor wire be exposed to airborne gap;
6) aforementioned black box part is invaded in solder pot, fusion welding is creeped also along aforementioned conductor wireFill aforementioned gap, form welding.
8. electronic module making method as claimed in claim 7, is characterized in that: described conducting terminalBe fixed on the fixture of an insulation.
9. electronic module making method as claimed in claim 8, is characterized in that: described electronic componentComprise iron core, described conductor wire is the enamel-covered wire that is wound around iron core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210056393.9A CN103310959B (en) | 2012-03-06 | 2012-03-06 | Electronics module and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210056393.9A CN103310959B (en) | 2012-03-06 | 2012-03-06 | Electronics module and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103310959A CN103310959A (en) | 2013-09-18 |
| CN103310959B true CN103310959B (en) | 2016-05-04 |
Family
ID=49136069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210056393.9A Expired - Fee Related CN103310959B (en) | 2012-03-06 | 2012-03-06 | Electronics module and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103310959B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5015981A (en) * | 1990-08-21 | 1991-05-14 | Pulse Engineering, Inc. | Electronic microminiature packaging and method |
| CN2651973Y (en) * | 2003-09-03 | 2004-10-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101271760A (en) * | 2007-03-21 | 2008-09-24 | 富士康(昆山)电脑接插件有限公司 | Electronic element and its producing method |
| CN102360809A (en) * | 2007-03-21 | 2012-02-22 | 富士康(昆山)电脑接插件有限公司 | Electronic component and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3800553B1 (en) * | 2005-06-23 | 2006-07-26 | Ｔｄｋ株式会社 | LAN component package and LAN pulse transformer module |
-
2012
- 2012-03-06 CN CN201210056393.9A patent/CN103310959B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5015981A (en) * | 1990-08-21 | 1991-05-14 | Pulse Engineering, Inc. | Electronic microminiature packaging and method |
| CN2651973Y (en) * | 2003-09-03 | 2004-10-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN101271760A (en) * | 2007-03-21 | 2008-09-24 | 富士康(昆山)电脑接插件有限公司 | Electronic element and its producing method |
| CN102360809A (en) * | 2007-03-21 | 2012-02-22 | 富士康(昆山)电脑接插件有限公司 | Electronic component and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN103310959A (en) | 2013-09-18 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20170306 |