CN103298239B - Optronic circuit board and its manufacturing equipment and manufacture method - Google Patents
Optronic circuit board and its manufacturing equipment and manufacture method Download PDFInfo
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- CN103298239B CN103298239B CN201210055014.4A CN201210055014A CN103298239B CN 103298239 B CN103298239 B CN 103298239B CN 201210055014 A CN201210055014 A CN 201210055014A CN 103298239 B CN103298239 B CN 103298239B
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- base material
- circuit board
- clad
- marking press
- layer
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- Optical Integrated Circuits (AREA)
Abstract
The present invention relates to a kind of optronic circuit board, it includes the first base material of a pliability, one the first clad in the first base material, one inner sandwich layer on first clad, the second clad and the second base material of a pliability on second clad that one is located on the inner sandwich layer.Fiber waveguide pattern is formed with the inner sandwich layer, the refractive index of the inner sandwich layer is more than the refractive index of first clad and the refractive index of second clad.The optronic circuit board of the present invention can be by high efficiency, large area, inexpensive making.The invention further relates to a kind of manufacturing equipment of optronic circuit board and manufacture method.
Description
Technical field
The present invention relates to the printed circuit board (PCB) processing technique field in semiconductor integrated circuit technology, more particularly to a kind of light
Electric circuit board (Optical Printed Circuit Board, OPCB) and its manufacturing equipment and manufacture method.
Background technology
With continuing to develop for electronic industry, signal transmission frequencies, transmission rate is improved constantly.It is traditionally plain conductor
Signal is transmitted, but is due to the physical characteristic of plain conductor in itself, causes that the problems such as LC delays, crosstalk can be produced, it is more next
More it is difficult to meet requirement of the signal for high-speed high frequency.Optronic circuit board due to roomy, strong antijamming capability, increasingly by
The concern of people.Present optronic circuit board typically uses hard substrate, therefore stores inconvenience.
The content of the invention
In view of this, it is necessary to which a kind of manufacturing equipment and system for storing convenient optronic circuit board and optronic circuit board is provided
Make method.
A kind of optronic circuit board, it includes the first base material of a pliability, one be located in the first base material the
One clad, one be located at first clad on inner sandwich layer, one be located at the inner sandwich layer on the second clad and
Second base material of one pliability on second clad.Fiber waveguide pattern is formed with the inner sandwich layer, it is described
The refractive index of inner sandwich layer is more than the refractive index of first clad and the refractive index of second clad.
A kind of manufacturing equipment of optronic circuit board, it includes a workbench, unreeling machine, winder, a setting
In the top of the workbench and the first roller marking press, one setting gradually along in the transmission direction of the first base material
Individual second roller marking press, a 3rd roller marking press and a 4th roller marking press.The first roller marking press bag
Include the first impressing wheel, the first feeder sleeve and the first solidification device.First feeder sleeve is used to be coated with first to the first base material
Material.The first impressing wheel and the workbench are engaged, for the first material pressure that will be coated on the substrate
Print to form first material layer.First solidification device is used to solidify the first material layer.The second roller marking press
Including the second impressing wheel, the second feeder sleeve and the second solidification device.The outer circumference surface of the second impressing wheel is provided with micro-structural pressure
It is patterned.Second feeder sleeve is used to be coated with the second material in the first material layer.Second impressing is taken turns and described
Workbench is engaged, for second material imprint being coated in the first material layer to be formed into second material layer.
Second solidification device is used to solidify the second material layer.The 3rd roller marking press includes the 3rd impressing wheel, the 3rd
Feeder sleeve and the 3rd solidification device.3rd feeder sleeve is used to in the second material layer be coated with the 3rd material.Described 3rd
Impressing wheel and the workbench are engaged, for the 3rd material imprint being coated in the second material layer to be formed
3rd material layer.3rd solidification device is used to solidify the 3rd material layer.The 4th roller marking press includes one
4th impressing wheel and a rolling wheel.The rolling wheel is used to provide second base material.The 4th impressing wheel and the workbench
It is engaged, for second base material to be pressed on into the 3rd material layer.
A kind of manufacture method of optronic circuit board, it comprises the following steps：
The first base material of one pliability of offer and the manufacturing equipment of above-mentioned optronic circuit board, the first base material is placed
On a workbench, and by the one ends wound of the base material on a unreeling machine, the other end is fixed on a winder,
It is spaced apart between the unreeling machine and the winder；
One layer of first clad is formed in the first base material using the first roller marking press；
One layer of inner core with fiber waveguide pattern is formed on first clad using the second roller marking press
Layer；
One layer of second clad is formed on the inner sandwich layer using the 3rd roller marking press；
The second base material that one layer has pliability is stamped in second clad using the 4th roller marking press
On, to form an optronic circuit board；And
The optronic circuit board is wound using the winder.
Compared with prior art, optronic circuit board of the invention and its manufacturing equipment and manufacture method, by using can
Flexible substrate replaces traditional hard substrate, can make it that the manufacture method of the optronic circuit board is simple, flexible substrate
Store convenient relative to hard substrate, and be capable of the making pliability optronic circuit board of large area and low cost, and then can pole
The production efficiency and application of the optronic circuit board are improved greatly.
Brief description of the drawings
Fig. 1 is the structural representation of the optronic circuit board of better embodiment of the present invention.
Fig. 2 is the schematic diagram of the manufacturing equipment of the optronic circuit board of better embodiment of the present invention.
Fig. 3 is the flow chart of the manufacture method of the optronic circuit board of better embodiment of the present invention.
Main element symbol description
| Optronic circuit board | 100 |
| The first base material | 10 |
| First clad | 20 |
| Inner sandwich layer | 30 |
| Fiber waveguide pattern | 30a |
| Second clad | 40 |
| Second base material | 50 |
| The manufacturing equipment of optronic circuit board | 200 |
| Workbench | 210 |
| Unreeling machine | 221 |
| Winder | 222 |
| First roller marking press | 230 |
| First feeder sleeve | 231 |
| First impressing wheel | 232 |
| First solidification device | 233 |
| Second roller marking press | 240 |
| Second feeder sleeve | 241 |
| Second impressing wheel | 242 |
| Second solidification device | 243 |
| 3rd roller marking press | 250 |
| 3rd feeder sleeve | 251 |
| 3rd impressing wheel | 252 |
| 3rd solidification device | 253 |
| 4th roller marking press | 270 |
| 4th impressing wheel | 271 |
| Rolling wheel | 272 |
| Step | S1~S7 |
Following embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Embodiment
Referring to Fig. 1, a kind of optronic circuit board 100 provided for embodiment of the present invention, it includes a first base material
10th, the first clad 20, inner sandwich layer 30, second clad 40 and second base material 50.
First clad 20 is located in the first base material 10, and the inner sandwich layer 30 is located at first clad 20
On, fiber waveguide pattern 30a is formed with the inner sandwich layer 30, second clad 40 is located on the inner sandwich layer 30, described
Second base material 50 is located on second clad 40.
The first base material 10 and second base material 50 are flexible substrate, for protecting first clad 20
And second clad 40.In the present embodiment, in the present embodiment, the first base material 10 and second base material
50 be PET (polyethylene terephthalate), in other embodiments, the first base material 10 and second base material
50 or PES（Polyethersulfone resin）.
First clad 20 and second clad 40 are used to protecting the inner sandwich layer 30, and by the transmission of light
Path is limited in the inner sandwich layer 30, prevents the leakage of light.First clad 20 and second clad 40 by
The material of low-refraction is made, such as one of polyacrylate, polysiloxanes, polyimide, makrolon, fluorinated polymer or
Its mixture of person.
The refractive index of the inner sandwich layer 30 is more than the refractive index and second clad 40 of first clad 20
Refractive index.The inner sandwich layer 30 is made up of the material of high index of refraction, such as the polyacrylate with photosensitive group, poly- silica
One of alkane, polyimide, makrolon, fluorinated polymer or its mixture.
As shown in Fig. 2 a kind of manufacturing equipment 200 of optronic circuit board, for manufacturing the optronic circuit board 100, and is wrapped
Include a workbench 210, unreeling machine 221, a winder 222, and in the top of the workbench 210 and along described
A first roller marking press 230, the second roller marking press 240, one set gradually in the transmission direction of one base material 10
Individual 3rd roller marking press 250 and a 4th roller marking press 270.The first base material 10 is placed on the workbench 210
On, and the first base material 10 one ends wound on the unreeling machine 221, the other end is fixed on the winder 222.Institute
Stating the first roller marking press 230 is used to form first clad 20 in the first base material 10.The second roller pressure
Print machine 240 is used on first clad 20 form the inner sandwich layer 30 with fiber waveguide pattern.3rd roller
Marking press 250 is used to form second clad 40 on the inner sandwich layer 30.The 4th roller marking press 270 is used for
Second base material 50 is formed on second clad 40.
The first roller marking press 230 is included from the unreeling machine 221 to setting successively on the direction of the winder 222
First feeder sleeve 231, the first impressing wheel 232 and first solidification device 233 are put, the first impressing wheel 232
Outer circumference surface is smooth surface.What first feeder sleeve 231 was melted for providing is used to form first clad 20
Raw material.The first impressing wheel 232 extrudes the first base material 10 and described described for being formed jointly with the workbench 210
The raw material of first clad 20, the first base material 10 is stamped in by the raw material for being used to be formed first clad 20
On, to form first clad 20.First solidification device 233 is used to be solidified first clad 20.
In present embodiment, first solidification device 233 is ultraviolet source.
The second roller marking press 240 is included from the unreeling machine 221 to setting successively on the direction of the winder 222
Put second feeder sleeve 241, the second impressing wheel 242 and second solidification device 243.The second impressing wheel 242
Micro-structural imprinted pattern is formed with outer circumference surface.Second feeder sleeve 241 is used to provide the described interior for being formed of melting
The raw material of sandwich layer 30.Second impressing, which takes turns 242, to be used to extrude described for forming the inner core jointly with the workbench 210
Raw material, first clad 20 and the first base material 10 of layer 30, by the original for being used to form the inner sandwich layer 30
Material is stamped on first clad 20, and the micro-structural imprinted pattern is transferred in described is used to form the inner sandwich layer
On 30 raw material, the inner sandwich layer 30 with fiber waveguide pattern is formed.Second solidification device 243 is used for the inner sandwich layer
30 are solidified.In the present embodiment, second solidification device 243 is ultraviolet source.
The 3rd roller marking press 250 is included from the unreeling machine 221 to setting successively on the direction of the winder 222
Put the 3rd feeder sleeve 251, the 3rd impressing wheel 252 and the 3rd solidification device 253.The 3rd impressing wheel 252
Outer circumference surface is smooth surface.What the 3rd feeder sleeve 251 was melted for providing is used to form second clad 40
Raw material.3rd impressing, which takes turns 252, to be used to extrude described for forming second clad 40 jointly with the workbench 210
Raw material, the inner sandwich layer 30, first clad 20 and the first base material 10, by it is described be used for form described second
The raw material of clad 40 is stamped on the inner sandwich layer 30, and to form second clad 40, the 3rd solidification device 253 is used
Solidified in by second clad 40.In the present embodiment, the 3rd solidification device 253 is ultraviolet source.
The 4th roller marking press 270 is included from the unreeling machine 221 to setting successively on the direction of the winder 222
Put one the 4th impressing wheel 271 and a rolling wheel 272.The one ends wound of second base material 50 is another on the rolling wheel 272
End bypasses the 4th impressing wheel 271 towards the side of the 3rd roller marking press 250, is then placed within the 4th impressing
In gap between wheel 271 and the workbench 210 so that the 4th impressing wheel 271 can press second base material 50
It is located on second clad 40, to form the optronic circuit board 100.The winder 222 is used for photoelectricity electricity
Road plate 100 is wound.
As shown in figure 3, a kind of manufacture method of the optronic circuit board provided for embodiment of the present invention, it uses the light
The manufacturing equipment 200 of electric circuit board manufactures the optronic circuit board 100, and comprises the following steps：
S1：The first base material 10 is provided, the first base material 10 is placed on the workbench 210, and described
The one ends wound of one base material 10 is on the unreeling machine 221, and the other end is fixed on the winder 222, the unreeling machine 221
It is spaced apart between the winder 222, then the first base material 10 is cleaned.
In the present embodiment, the first base material 10 is the flexible substrate being made up of PET, and using oxonium ion cleaning
Method is cleaned to the first base material 10.When cleaning, 221 pairs of the unreeling machine the first base material 10 is unreeled and made
The first base material 10 is obtained towards the direction of winder 222 to advance, in the process, an oxonium ion cleaner (not shown)
The first base material 10 is cleaned, finally wound by 222 pairs of the winder the first base material 10.The present invention is not
It is limited to what present embodiment was limited, it is for instance possible to use hair-dryer is cleaned to the first base material 10.
S2：First clad 20 is formed in the first base material 10 using the first roller marking press 230.Tool
Body, the first base material 10 passes through the gap between the described first impressing wheel 232 and the workbench 210 so that described the
The raw material for being used to be formed first clad 20 is stamped in the first base material 10 by one impressing wheel 232, to be formed
First clad 20, then first solidification device 233 first clad 20 is solidified.
S3：Form described with fiber waveguide figure on first clad 20 using the second roller marking press 240
Case 30a inner sandwich layer 30.Specifically, the first base material 10 for being formed with first clad 20 is imprinted by described second
Gap between wheel 242 and the workbench 210 so that the second impressing wheel 242 is used to form the inner sandwich layer by described
30 raw material is stamped on first clad 20, and the micro-structural imprinted pattern is transferred in described is used to form described
On the raw material of inner sandwich layer 30, the inner sandwich layer 30 with fiber waveguide pattern is formed, then second solidification device 243 will be described
Inner sandwich layer 30 is solidified.
S4：Second clad 40 is formed on the inner sandwich layer 30 using the 3rd roller marking press 250.Specifically
, the first base material 10 for being formed with first clad 20 and the inner sandwich layer 30 passes through the described 3rd impressing wheel 252
And the gap between the workbench 210 so that the 3rd impressing wheel 252 is used for the original of the second clad 40 of formation by described
Material is stamped on the inner sandwich layer 30, to form second clad 40, and then the 3rd solidification device 253 is by described second
Clad 40 is solidified.
S5：Second base material 50 with pliability is pressed on described using the 4th roller marking press 270
On two clads 40, so as to obtain the optronic circuit board 100.Specifically, it is described be formed with first clad 20, it is described
The first base material 10 of inner sandwich layer 30 and second clad 40 by the described 4th impressing take turns 271 with the workbench 210 it
Between gap so that second base material 50 271 is pressed on second clad 40 by the 4th impressing wheel.
S6：Wound using 222 pairs of the winder optronic circuit board 100.
S7：The optronic circuit board 100 is cut into required size.In the present embodiment, with laser knife to described
Optronic circuit board 100 is cut.
Compared with prior art, traditional hard substrate is replaced by using flexible substrate, can be caused described
The manufacture method of optronic circuit board is simple, and flexible substrate stores convenient relative to hard substrate, and being capable of large area and low
The making pliability optronic circuit board of cost, and then the production efficiency and application of the optronic circuit board can be greatly improved.
The end face flat smooth of the fiber waveguide of the optical circuit board formed be cut simultaneously after, the optical coupling with other optical circuit boards
Efficiency high, so as to effectively improve the Transfer Quality of signal.
It is appreciated that the first base material 10 is cleaned primarily to improving first clad 20 described
Adhesive force in the first base material 10.In other embodiments, if the first base material 10 is inherently relatively cleaner, it can also save
The step of the first base material 10 is cleaned.
It is understood that for the person of ordinary skill of the art, can be done with technique according to the invention design
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (4)
1. a kind of manufacturing equipment of optronic circuit board, it include one be used to supporting the workbench of the first base material, unreeling machine,
One winder, it is arranged on the top of the workbench and one first set gradually along in the first base material transmission direction
Roller marking press, a second roller marking press, a 3rd roller marking press and a 4th roller marking press；Described first
Roller marking press includes the first impressing wheel, the first feeder sleeve and the first solidification device, and first feeder sleeve is used for described first
Base material is coated with the first material, and the first impressing wheel and the workbench are engaged, for that will be coated on the first base material
First material imprint to form first material layer, first solidification device is used to solidify the first material layer；Institute
Stating the second roller marking press includes the second impressing wheel, the second feeder sleeve and the second solidification device, the excircle of the second impressing wheel
Micro-structural imprinted pattern is offered on face, second feeder sleeve is used to be coated with the second material, institute in the first material layer
State the second impressing wheel and the workbench is engaged, for second material imprint that will be coated in the first material layer
To form second material layer, second solidification device is used to solidify the second material layer；The 3rd roller marking press bag
The 3rd impressing wheel, the 3rd feeder sleeve and the 3rd solidification device are included, the 3rd feeder sleeve is used to be coated with the second material layer
3rd material, the 3rd impressing wheel and the workbench are engaged, for it will be coated in the second material layer described in
3rd material imprint is to form the 3rd material layer, and the 3rd solidification device is used to solidify the 3rd material layer；Described 4th
Roller marking press includes one the 4th impressing wheel and a rolling wheel, and the rolling wheel is used to provide second base material, the described 4th
Impressing wheel is engaged with the workbench, for second base material to be pressed on into the 3rd material layer.
2. the manufacturing equipment of optronic circuit board as claimed in claim 1, it is characterised in that the first impressing wheel, described the
The outer circumference surface of three impressing wheels and the 4th impressing wheel is smooth surface.
3. a kind of manufacture method of optronic circuit board, it comprises the following steps：
The first base material of pliability and the manufacturing equipment of optronic circuit board as claimed in claim 1 are provided, by described the
One base material is placed on the workbench, and by the one ends wound of the first base material on the unreeling machine, the other end is fixed
It is spaced apart between the unreeling machine and the winder on the winder；
One layer of first clad is formed in the first base material using the first roller marking press；
Forming one layer on first clad using the second roller marking press has in fiber waveguide micro structured pattern
Sandwich layer；
One layer of second clad is formed on the inner sandwich layer using the 3rd roller marking press；
The second base material of one layer of pliability is pressed on second clad using the 4th roller marking press, to be formed
One optronic circuit board；And
The optronic circuit board is wound using the winder.
4. the manufacture method of optronic circuit board as claimed in claim 3, it is characterised in that the manufacturer of the optronic circuit board
The step of method also includes the optronic circuit board cutting into required size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210055014.4A CN103298239B (en) | 2012-03-05 | 2012-03-05 | Optronic circuit board and its manufacturing equipment and manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210055014.4A CN103298239B (en) | 2012-03-05 | 2012-03-05 | Optronic circuit board and its manufacturing equipment and manufacture method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103298239A CN103298239A (en) | 2013-09-11 |
| CN103298239B true CN103298239B (en) | 2017-08-11 |
Family
ID=49098346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210055014.4A Expired - Fee Related CN103298239B (en) | 2012-03-05 | 2012-03-05 | Optronic circuit board and its manufacturing equipment and manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103298239B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2738524Y (en) * | 2004-05-20 | 2005-11-02 | 嘉联益科技股份有限公司 | Photoelectric integration plate |
| US7035518B2 (en) * | 2001-04-13 | 2006-04-25 | Hitachi Cable, Ltd. | Polymer waveguides and process for producing the same |
| CN102138091A (en) * | 2008-08-29 | 2011-07-27 | 日立化成工业株式会社 | Optical waveguide, opto-electric hybrid board, and optical module |
-
2012
- 2012-03-05 CN CN201210055014.4A patent/CN103298239B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7035518B2 (en) * | 2001-04-13 | 2006-04-25 | Hitachi Cable, Ltd. | Polymer waveguides and process for producing the same |
| CN2738524Y (en) * | 2004-05-20 | 2005-11-02 | 嘉联益科技股份有限公司 | Photoelectric integration plate |
| CN102138091A (en) * | 2008-08-29 | 2011-07-27 | 日立化成工业株式会社 | Optical waveguide, opto-electric hybrid board, and optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103298239A (en) | 2013-09-11 |
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