CN103293075A - Device and method for detecting grinding performance of material - Google Patents
Device and method for detecting grinding performance of material Download PDFInfo
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- CN103293075A CN103293075A CN2012100426363A CN201210042636A CN103293075A CN 103293075 A CN103293075 A CN 103293075A CN 2012100426363 A CN2012100426363 A CN 2012100426363A CN 201210042636 A CN201210042636 A CN 201210042636A CN 103293075 A CN103293075 A CN 103293075A
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- 239000000463 material Substances 0.000 title claims abstract description 181
- 238000000227 grinding Methods 0.000 title claims abstract description 169
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- 238000012360 testing method Methods 0.000 claims abstract description 67
- 238000006073 displacement reaction Methods 0.000 claims abstract description 59
- 230000033001 locomotion Effects 0.000 claims abstract description 23
- 230000000694 effects Effects 0.000 claims abstract description 18
- 238000005498 polishing Methods 0.000 claims description 147
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- 230000006698 induction Effects 0.000 description 7
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- 239000004576 sand Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
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- 239000011248 coating agent Substances 0.000 description 1
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- 238000009837 dry grinding Methods 0.000 description 1
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Abstract
The invention provides a device and a method for detecting a grinding performance of a material. The device comprises an X axis movable track, a Y axis movable track, a Z axis displacement adjusting device, a position finder, a grinding force sensing testing device, a grinding material fixing device, a grinded material fixing device, a data acquiring system, a data processing system and a data control system; the run loop of the device is as follows: a reciprocating motion from a position X1 to a position X2 in the X axis direction and an one-way movement from a position Y1 to a position Y2, namely, the device moves from the position X1 to the position X2 and then shifts a unit towards the direction Y, or moves from the position X2 to the position X1 and then shifts a unit towards the direction Y until reaching the position Y2, and whether the grinding effect can meet the set requirement is determined after the multi-grinding loop is completed; the grinding performance of the grinding material is determined according to the total grinding displacement in the Z axis direction or determined based on the grinding efficiency. According to the method, the grinding efficiency and the grinding effect are combined to be used as the evaluation basis so that the detecting result of the grinding performance of the material is objective and reasonable.
Description
Technical Field
The invention relates to a device and a method for detecting the polishing performance of a material, in particular to a device and a method for detecting the polishing performance of building putty and a polishing material.
Background
In the process of building indoor and outdoor decoration, the flatness difference of the wall is large, and putty is needed to be used for conducting batch embedding leveling treatment on the wall surface and polishing the wall surface smoothly. Therefore, the polishing efficiency and the polishing effect are very important in the whole coating construction and are closely related to the quality of the embedded material and the polishing material, and no effective method or means is available in the industry for judging and detecting.
The quality of the sanding property of the prior embedded material construction is judged by the experience of testers. The abrasiveness of the grinding material is judged by the sand falling amount of the grinding material in unit time of the grinding test equipment, the abrasion loss (lost quality) of the ground test piece or the mass of ground powder.
Thus, these methods have various disadvantages. Firstly, the sanding quality of putty (sanded material) is judged by the experience of testers, so that the judgment result has too many subjective human factors due to the experience of different testers and the difference of judgment standards, and the test result cannot be quantified (quantified). It is common for different test persons to produce opposite test results, and therefore, it is difficult to characterize when the sandability of two putties is very close, or there is a difference in the experience values (subjective sensory evaluation criteria) of the test persons.
And secondly, the sand falling amount of the grinding material in unit time and the abrasion loss (lost mass) of the ground material or the mass of ground powder are used as judgment basis. It seems that quantitative judgment can be made from the surface, but actually, the grinding material and the ground material have respective loss in the grinding process, and the quality is lost, so that the quality of ground powder is not distinguished from the quality of the grinding material, namely the sand falling of the grinding material, and the abrasion loss of the ground material, and the uncertainty of the test result is caused.
Thirdly, the sanding property is calculated by the difference of the quality of the material to be sanded before and after sanding, and the problems are solved:
firstly, the test mode is too simplified, as shown in fig. 1 and fig. 2, the main polishing modes of the current test equipment include a reciprocating type and a rotating type, the polishing material repeatedly circulates on the polished material along the same polishing track, the width W2 or the diameter D1 of the polishing material is equal to the width W1 or the width W3 of the polishing track, and the length L1 of the polishing track is the linear moving distance of the length L2 or the diameter D1 of the polishing material, and the polishing mode is too simplified and is different from the actual polishing mode (as shown in fig. 3 and fig. 4); the dressing widths W4, W5 of the actual dressing pattern are the width of the material to be dressed, not the width or diameter of the material to be dressed;
secondly, the test data is not accurate enough, as shown in fig. 5 and 6, due to the grinding mode, as the grinding depth H is continuously increased, the side surfaces of the grinding material with the same width W as the ground width are contacted simultaneously, so that the grinding force is changed and unstable, and the test result is interfered and influenced;
thirdly, the evaluation of the test results is not objective. The quality of the polished material before and after polishing is poor, and the measured data is only the index of the grinding force, but not the index of the polishing performance.
Disclosure of Invention
The invention aims to provide a device and a method for detecting the polishing performance of a material, so that the detection result of the polishing performance of the material is objective and reasonable.
A device for detecting material polishing performance is characterized by comprising an XYZ three-dimensional adjusting device, a position finder, a grinding force induction testing device, a polishing material fixing device, a polished material fixing device, a data acquisition system, a data processing system and a data control system, wherein the polishing material fixing device and the polished material fixing device are respectively arranged on the XYZ three-dimensional adjusting device so that the polishing material fixing device and the polished material fixing device can relatively move in an X axial direction, a Y axial direction and a Z axial direction, the X axial direction, the Y axial direction and the Z axial direction are mutually vertical, the grinding force induction testing device comprises grinding force induction devices in the X axial direction, the Y axial direction and the Z axial direction, and each grinding force induction device is respectively arranged on a transmission path of grinding force in the X axial direction, the Y axial direction and the Z axial direction; the position finder is arranged on the XYZ three-dimensional adjusting device to detect the Z-axis displacement of the polishing material fixing device; the data acquisition system is coupled with the grinding force sensing devices and the position finder, acquires grinding force signals detected by the grinding force sensing devices and displacement signals detected by the position finder and transmits the grinding force signals and the displacement signals to the data processing system, the data processing system is further coupled with the data control system, the data control system is further coupled with a driving module of the XYZ three-dimensional adjusting device so that the driving module is controlled by the data control system, and the data control system receives input setting signals of a user and transmits the input setting signals to the driving module.
The device for detecting the polishing performance of the material is further characterized in that the XYZ three-dimensional adjusting device comprises an X-axis moving track, a Y-axis moving track and a Z-axis displacement adjusting device, the X-axis moving track and the Y-axis moving track are respectively installed on the rack, a polishing material fixing device is installed on the X-axis moving track and can move on the X-axis moving track along the X axis, a polished material fixing device is installed on the Y-axis moving track and can move on the Y-axis moving track along the Y axis, the Z-axis displacement adjusting device is installed on the X-axis moving track and is coupled with the polishing material fixing device so that the position of the polishing material fixing device on the Z axis can move, and the polishing material fixing device, the polished material fixing device and the Z-axis displacement adjusting device are respectively coupled with the X-axis driving module, the Y-axis driving module and the Z-axis driving module.
The device for detecting the polishing performance of the material is further characterized in that the polishing material fixing device is also coupled with a rotating motor to form a rotary type grinding device.
The device for detecting the polishing performance of the material is further characterized in that the position finder is an infrared position finder.
The device for detecting the polishing performance of the material is further characterized in that the X-axis moving track crosses over the middle of the Y-axis moving track.
A method for detecting the grinding performance of a material is characterized in that the material to be ground is ground by the grinding material, the grinding range of the material to be ground is defined by a rectangular coordinate system, the rectangular coordinate system comprises X, Y, Z axial directions which are perpendicular to each other, the grinding range is from (X1, Y1) to (X2, Y1) to (X2, Y2) to (X1, Y2) to (X1, Y1) to define the region, the grinding starting point is (X1, Y1), and the method comprises the steps of
Step a, polishing towards the X-axis direction, wherein the polishing track is a straight line track from a position X1 to a position X2, and entering a step b;
b, judging whether the Y-axis direction reaches a position Y2, if not, continuing to polish in the Y-axis direction, moving one unit, continuing to polish in the X-axis direction, wherein the polishing track is a straight track from a position X2 to a position X1, and entering the step c; if position Y2 has been reached, go to step d;
c, judging whether the position Y2 is reached in the Y-axis direction, if not, continuing to polish in the Y-axis direction, moving one unit, and entering the step a; if position Y2 has been reached, go to step d;
d, judging whether the polishing effect meets the set requirement, if so, judging the polishing performance of the polishing material by using the total amount of the Z-axial grinding displacement, wherein the larger the total amount of the Z-axial grinding displacement is, the stronger the grinding capacity of the polishing material is, or the better the polishing performance of the polished material is; if not, adjusting the grinding displacement, returning to the grinding starting point, and entering the step a or finishing the grinding performance detection of the grinding material or the ground material.
The method for detecting the polishing performance of the material is further characterized in that the step d is carried out once to complete one cycle, the grinding forces in the X-axis direction, the Y-axis direction and the Z-axis direction are detected in the grinding process of each cycle,
N＝{(Nx1+Ny1+Nz1)+(Nx2+Ny2+Nz2)+…+(Nxn+Nxn+Nxn)}/n，
Nxi-X axis direction in cycle i, X axis direction measures the average of the forces,
Nyi-Y-axis direction in cycle i, Y-axis measured force average,
Nzi-Z-axis direction in cycle i, the average of the forces measured in the Z-axis direction,
i is a natural number, 1, 2, …, n;
n is the number of cycles,
n-the average grinding force,
a small N average grinding force value indicates a stronger grinding ability of the grinding material or a better grindability of the ground material.
The method for detecting the sanding property of a material is further characterized in that in step d, the sanding efficiency E, E-W/T, is also detected, wherein
E-efficiency of polishing
W-grinding work
T-total time taken for full cycle
Wherein,
W＝N*Z
n-average grinding force
The total grinding displacement in the Z-Z axial direction,
T＝t*n
t-time of one cycle
n is the number of cycles,
the higher the dressing efficiency E, the more powerful the dressing ability of the dressing material or the better the dressing ability of the material to be dressed.
An apparatus for testing the sanding performance of a material, characterized by operating in accordance with any of the methods described herein.
In fact, the grinding efficiency and effect are the important indexes for judging the grinding performance. The polishing efficiency is the time required for achieving the polishing effect in unit time and unit area, and the key points of the polished effect are two indexes of flatness and fineness. The grinding is circulated on a single grinding track according to the existing test mode, the possibility of considering the grinding effect is eliminated from the result, and the method determines the objectionability and the irrationality of the result. Therefore, the grinding force is taken as a measurable index (total grinding displacement in the Z-axis direction) to be quantitatively analyzed, and the judgment is not carried out according to the manual experience; a unidirectional polishing motion track test mode is changed into a multidirectional motion track test mode, so that the unidirectional polishing motion track test mode is more reasonable and accords with the practice; the existing evaluation mode is changed, and the polishing efficiency and the polishing effect are comprehensively evaluated according to the evaluation basis, so that the detection result of the polishing performance of the material is objective and reasonable.
Drawings
Fig. 1 is a schematic diagram of a grinding track of a conventional reciprocating linear grinding type detection method.
Fig. 2 is a schematic diagram of a grinding track of a conventional rotary linear grinding type detection method.
Figure 3 is a schematic illustration of an actual sanding trajectory for a reciprocating straight line sanding application.
Fig. 4 is a schematic diagram of an actual sanding trajectory for a rotary straight line sanding application.
Fig. 5 is a schematic view of the sanding depth of a prior art inspection method.
Fig. 6 is a plan view of the sanding state shown in fig. 5.
FIG. 7 is a top view of an apparatus for testing the polishing performance of a material in accordance with an embodiment of the present invention.
Fig. 8 is a front view of the apparatus for testing polishing performance of a material shown in fig. 7.
Fig. 9 is a top view of the device shown in fig. 7 in an initial state.
Fig. 10 is a front view of the initial state of the device shown in fig. 7.
Fig. 11 is a top view of the process state of the device shown in fig. 7.
Fig. 12 is a front view of the process state of the device shown in fig. 7.
Fig. 13 is a top view of the completed state of the apparatus shown in fig. 7.
Fig. 14 is a front view of the completed state of the apparatus shown in fig. 7.
Fig. 15 is a block diagram of a control system of the apparatus for detecting a material dressing performance.
Detailed Description
In the embodiments described later, the X axis and the Y axis are mutually perpendicular directions lying in the same plane, and the Z axis is a direction perpendicular to the plane, generally a direction perpendicular to the surface of the material to be polished.
As shown in fig. 7 and 8, in an embodiment of the present invention, the apparatus for detecting material polishing performance includes an XYZ three-dimensional adjustment apparatus (composed of an X-axis movement track 1, a Y-axis movement track 2, and a Z-axis displacement adjustment apparatus 5), a position finder 8, a grinding force sensing test apparatus 61, 62, 63, a polishing material fixing apparatus 4, a polished material fixing apparatus 3, a data acquisition system 93, a data processing system 92, and a data control system 91 (shown in fig. 15).
In other embodiments of the present invention, the XYZ three-dimensional adjustment device is not limited to the embodiments shown in fig. 7 and 8, and may be any other device that can allow the polishing material and the polished material to move relatively in X, Y, Z three directions.
The X-axis and Y- axis moving rails 1 and 2 are respectively supported by a frame 10, the X-axis moving rail 1 spans the middle of the Y-axis moving rail 2, the Y-axis moving rail 2 is composed of two guide rails, the polishing material fixing device 3 is movably mounted on the Y-axis moving rail 2, and correspondingly, the polishing material fixing device 4 is movably mounted on the X-axis moving rail 1. The Z-axis displacement adjusting device 5 is also provided on the polishing material holding device 4.
The X-axis moving rail 1 takes the reciprocating linear movement of the polishing material holding device 4 from the position X1 to the position X2 throughout the test, and the reciprocating speed S from the position X1 to the position X2 may be set in the data control system 91 in advance according to the test conditions, and is kept constant throughout the test, and the following relationship exists:
S＝X/H
s-moving speed (m/S) of X1 to X2
X-distance of movement (m) of X1 to X2
H-moving time(s) of X1 to X2.
The movement of the polishing material fixing device 4 on the X-axis moving track 1 is performed by an X-axis driving module 81, the X-axis driving module 81 may be, but is not limited to, driven by a servo motor which drives a screw-nut mechanism, in an embodiment of the present invention, the polishing material fixing device 4 is mounted on a nut, and the servo motor drives a screw which rotates to drive the nut and the polishing material fixing device 4 to move. The control command of the servo motor is from the data control system 91, and the data control system 91 controls the rotation of the servo motor according to the setting of the user, thereby controlling the movement of the polishing material fixing device 4. The speed S may be different for different sanding materials or sanded materials due to differences in sanding performance.
The Y-axis moving rail 2 carries the polishing material holding device 3 thereon, and thus it carries the unidirectional linear movement of the polishing material holding device 3 from the position Y1 to the position Y2. The polishing material fixing device 4 moves from the position X1 to the position X2, the polishing material fixing device 3 on the Y-axis moving rail 2 moves by one unit, the polishing material returns from the position X2 to the position X1, the polishing material fixing device 3 on the Y-axis moving rail 2 also moves by one unit until reaching the end position Y2, and polishing is completed once, namely, a polishing cycle is performed from the position Y1 to the position Y2, and for automatically returning to the position Y1 after completion of each cycle, the moving speed of the polishing material fixing device 3 on the Y-axis moving rail 2 can be set in the data control system in advance according to the test conditions, so that the time T of each cycle is the same, and the following relationship (each displacement is set to 50% of the width (or diameter) of the polishing material);
Ymoving device＝S1/(S2*50％)
YMoving device-number of displacements in Y-axis direction
S1-Width of the ground Material test Panel 31
S2-Width of grinding Material 41
Similarly, the movement of the polishing material fixing device 3 on the Y-axis moving track 2 is performed by a Y-axis driving module 82, the driving module 82 may be, but is not limited to, driven by a servo motor which drives a screw nut mechanism, and the polishing material fixing device 3 is mounted on a nut, the servo motor drives a screw which rotates to drive the nut and the polishing material fixing device 3 to move. The control command of the servo motor comes from a data control system, and the data control system controls the rotation of the servo motor according to the setting of a user, so that the movement of the polished material fixing device 3 is controlled. The speed may be different for different sanding materials or sanded materials due to differences in sanding performance.
The Z-axis displacement adjusting device 5 is a displacement adjusting device in the Z-axis direction, i.e., in the direction perpendicular to the horizontal plane, and there are various embodiments, for example, a screw type displacement adjusting device, and the Z-axis displacement adjusting device 5 is driven by a Z-axis driving module 83, and the driving module 83 may be controlled by a data control system, as with the driving modules 81 and 82 described above. In fig. 8, a position Z0 is a contact position of the polishing material and the material to be polished, and is also a position at the initial polishing time, and Z1 is an initial position of the 2 nd polishing cycle, and after each cycle is finished, the polishing effect is observed, and if the polishing effect is smooth and flat, the test is finished, and the displacement Z value is calculated. If the polishing material does not reach the smooth and flat state, the next cycle is performed after the Z value (namely the Z axial movement amount) of the polishing material fixing device 4 is adjusted by the Z axis displacement adjusting device 5, or the test is restarted after the polishing materials of different models are replaced, and the Z value is calculated:
z0+ Z1+ Z2+ … … + Zn ═ Z or Z0 ═ n ═ Z,
n is the number of times of displacement adjustment,
z is the total grinding displacement,
z is an important index for judging the grinding force, and the larger the Z value is, the stronger the grinding capacity of the grinding material is, or the better the grindability of the ground material is.
The position finder 8 is mounted on the Z-axis displacement adjustment device 5 for recording and displaying the total amount of grinding displacement Z from the initial position Z0 to the completion of the test, the position finder 8 is coupled to a data acquisition system 93, the data acquisition system 93 reads the displacement signal measured by the position finder 8 from the position finder 8 and transmits the displacement signal to a data processing system 92, the position finder 8 is, but not limited to, an infrared position finder.
The grinding force induction testing device comprises 3 grinding force induction testing devices which are respectively arranged in the X, Y, Z shaft direction, the grinding force from each direction is recorded and displayed, and the calculation method of the grinding force comprises the following steps:
N＝{(Nx1+Ny1+Nz1)+(Nx2+Ny2+Nz2)+…+(Nxn+Nxn+Nxn)}/n，
Nxi-X-axis direction in the i-th cycle, the grinding force sensing test device 61 measures the average value of the forces,
Nyi-Y-axis direction in the i-th cycle, the grinding force sensing test device 62 measures the average value of the forces,
Nzi-Z-axis direction in the ith cycle, the grinding force sensing test device 63 measures the average value of the force, i is a natural number, 1, 2, …, n;
n is the number of cycles,
n-the average grinding force,
a small N average grinding force value indicates a stronger grinding ability of the grinding material or a better grindability of the ground material.
The grinding force sensing test devices 61, 62 and 63 are respectively but not limited to be arranged on the grinding material fixing device 4, the ground material fixing device 3 and the Z-axis displacement adjusting device 5. The grinding force sensing test devices 61, 62, 63 are, for example, strain sensors.
The polished material 31 and the polished material 41 are mounted and fixed on the polished material fixing device 3 and the polished material fixing device 4, respectively, in a form of profile connection or screw fixation, and a motor may be mounted on one of the polished material fixing device 3 and the polished material fixing device 4 to adopt a rotary grinding mode.
The data acquisition system 93 is used for acquiring the grinding force generated during grinding and tested by the grinding force induction testing devices 61, 62 and 63 in the grinding process, the required grinding cycle number, grinding time, grinding displacement and other quantitative values, and the data acquisition system 93 also acquires the displacement signal of the position finder 8.
The data processing system 92 is coupled to the data acquisition system 93 for data manipulation and analysis.
The data control system 91 and the data processing system 92 are coupled for configuring and controlling the operation of the respective driver modules 91, 92, 93.
An embodiment of the method for detecting the polishing performance of the material according to the present invention is described below with reference to fig. 7, 8, and 9 to 14.
1. Preparing a polished material: scraping putty with a certain thickness on a test plate in batch and maintaining the putty until a specified maintenance period;
2. selection and installation of grinding materials: determining the type and model of the polishing material 41, and installing and fixing the polishing material in the polishing material fixing device 4;
3. installation of the ground material: fixing the polished test piece 31 on the polished material fixing device 3;
4. device and system adjustment: adjusting the device on the rail on which the grinding control device X, Y moves to the initial state, as shown in fig. 9 and 10, starting the position finder 8, adjusting the Z-axis displacement adjusting device 5, and confirming the contact position of the grinding material 41 and the ground material 31 to be at the grinding initial position Z0;
5. starting a data control system: setting the displacement of the polishing material 41 in the X-axis direction, setting the displacement of the polished material 31 in the Y-axis direction, and setting the displacement of the polishing material 41 in the Z-axis direction;
6. starting each driving module, the data processing system and the data acquisition system, and starting the test: the data control system respectively instructs each driving module to act, and the data acquisition system acquires the magnitude of grinding force N generated during grinding, the time t of required grinding cycle times and the grinding displacement Z value, which are tested by each grinding force sensing device in the grinding process;
7. after one cycle, X, Y the axial drive module is reset (as shown in fig. 13 and 14);
8. and (3) observing the polishing effect: if the polished area of the polished material has reached smooth flatness, the test is ended and the data processing system calculates the Z value. If the Z value does not reach the smoothness and flatness, the next cycle is carried out after the Z value is adjusted, or the test is restarted after polishing materials of different models are replaced;
and (3) observing the effect of the polishing material: if the abrasive material has worn significantly, the test is ended and the Z value is calculated. Or the test is restarted after the grinding materials of different models are replaced;
9. calculating the grinding efficiency:
E＝W/T
e-efficiency of polishing
W-grinding work
T-total time spent in the cycle
Wherein,
W＝N*Z
n-grinding power (kg)
Z-total grinding displacement (m)
T＝t*C
t-one cycle time(s)
C-number of cycles
t ═ Y shift H/S
10. And (5) judging a result:
the polishing work W is in direct proportion to the polishing efficiency E and in inverse proportion to the cycle time T, the larger the W value is, the smaller the T value is, the fewer the cycle times are, the higher the polishing efficiency is, the better the polishing performance is, and the easier the polishing is; conversely, the lower the sanding efficiency, the poorer the sanding property and the more difficult the sanding.
In summary, the embodiments shown in fig. 7 to 15 are performed in such a manner that a grinding material is ground by the grinding material, a grinding range of the grinding material is defined by a rectangular coordinate system including regions defined by X, Y, Z axes perpendicular to each other, the grinding range is (X1, Y1) to (X2, Y1) to (X2, Y2) to (X1, Y2) to (X1, Y1), and the grinding start point is (X1, Y1), and the embodiments include
Step a, polishing towards the X-axis direction, wherein the polishing track is a straight line track from a position X1 to a position X2, and entering a step b;
b, judging whether the Y-axis direction reaches a position Y2, if not, continuing to polish in the Y-axis direction, moving one unit, continuing to polish in the X-axis direction, wherein the polishing track is a straight track from a position X2 to a position X1, and entering the step c; if position Y2 has been reached, go to step d;
c, judging whether the position Y2 is reached in the Y-axis direction, if not, continuing to polish in the Y-axis direction, moving one unit, and entering the step a; if position Y2 has been reached, go to step d;
d, judging whether the polishing effect meets the set requirement, if so, judging the polishing performance of the polishing material by using the total amount of the Z-axial grinding displacement, wherein the larger the total amount of the Z-axial grinding displacement is, the stronger the grinding capacity of the polishing material is, or the better the polishing performance of the polished material is; if not, adjusting the grinding displacement, returning to the grinding starting point, and entering the step a or finishing the grinding performance detection of the grinding material or the ground material.
Further, the step d is carried out once, one cycle is completed, in the grinding process of each cycle, the grinding forces in the X-axis direction, the Y-axis direction and the Z-axis direction are detected,
N＝{(Nx1+Ny1+Nz1)+(Nx2+Ny2+Nz2)+…+(Nxn+Nxn+Nxn)}/n，
Nxi-X axis direction in cycle i, X axis direction measures the average of the forces,
Nyi-Y-axis direction in cycle i, Y-axis measured force average,
Nzi-Z-axis direction in cycle i, the average of the forces measured in the Z-axis direction,
i is a natural number, 1, 2, …, n;
n is the number of cycles,
n-the average grinding force,
a small N average grinding force value indicates a stronger grinding ability of the grinding material or a better grindability of the ground material.
Further, in step d, the grinding efficiency E is also detected,
e ═ W/T, wherein
E-efficiency of polishing
W-grinding work
T-total time taken for full cycle
Wherein,
W＝N*Z
n-average grinding force
The total grinding displacement in the Z-Z axial direction,
T＝t*n
t-time of one cycle
n is the number of cycles,
the higher the dressing efficiency E, the more powerful the dressing ability of the dressing material or the better the dressing ability of the material to be dressed.
According to the foregoing examples, the inventors performed test 1: respectively to the test analysis of interior wall putty sample A, B, C, D efficiency of polishing:
1. preparing, maintaining and installing a test plate, wherein the thickness is controlled to be 1mm (+ -0.1), and the length and the width are 1m by 1m respectively;
2. the polishing material is 240-mesh abrasive paper with the same type, and the width of the polishing material fixing device is 100 mm;
3. setting the grinding displacement speed S from X1 to X2 to be 0.5 m/S;
4. setting the Y-axis displacement as 50mm, YMoving device20 times;
5. adjusting the grinding control device X, Y to an initial state axially, starting an infrared position finder, adjusting a Z-axis displacement adjusting device, confirming the contact position of the grinding material and the ground material, and enabling the Z0 to be at the initial grinding position;
6. the displacement amount Z1 in the Z-axis direction was set to 20 μm;
7. starting a data acquisition system, starting to simulate polishing on a test piece, testing whether the system operates normally, and simultaneously recording the polishing times to ensure that data are correct;
8. starting a device for testing, observing whether the testing process is normal, and testing the 4 samples one by one;
9. observing the polishing effect, finding that the sample does not reach smoothness and flatness, continuously adjusting the Zn to be 20 mu m, and then performing the next circulation;
10. the data of the test results are respectively:
the values of the cycle times C are respectively:
the value of the primary cycle time t is:
t＝Ymoving device*H/S＝20*1/0.5＝40(s)
The grinding force N values are respectively:
NA＝(NAx1+NAy1+NAz1)+(NAx2+NAy2+NAz2)+
(NAx3+NAy3+NAz3)+(NAx4+NAy4+NAz4)/4，
＝(1.5+1.2+1.5)+(1.25+1.3+1.3)+(1.3+1.5+1.4)+(1.3+1.2+1.4)/4
＝4.04
NB＝(NBx1+NBy1+NBz1)+(NBx2+NBy2+NBz2)/2
＝(1.3+1.4+1.3)+(1.2+1.1+1.3)/2
＝3.8
NC＝(NCx1+NCy1+NCz1)+(NCx2+NCy2+NCz2)/2
＝(1.4+1.3+1.5)+(1.4+1.5+1.55)
＝4.33
ND＝(NDx1+NDy1+NDz1)+(NDx2+NDy2+NDz2)+(NDx3+NDy3+NDz3)/3
＝(1.1+1.2+1.25)+(1.3+1.2+1.4)+(1.3+1.1+1.25)/3
＝3.7
the total Z values of the grinding displacement are respectively as follows:
ZA＝ZA0*4＝20*4＝80μm
ZB＝ZB0*2＝20*2＝40μm
ZC＝ZC0*2＝20*2＝40μm
ZD＝ZD0*3＝20*3＝60μm
11. respectively calculating the polishing efficiency E value as follows:
WA＝NA*ZA＝4.04*80＝323.2
WB＝NB*ZB＝3.8*40＝152
WC＝NC*ZC＝4.33*40＝173.2
WD＝ND*ZD＝3.7*60＝222
TA＝t*CA＝40*4＝160
TB＝t*CB＝40*2＝80
TC＝t*CC＝40*2＝80
TD＝t*CD＝40*3＝120
EA＝WA/TA＝323.2/160＝2.02
EB＝WB/TB＝152/80＝1.9
EC＝WC/TC＝173.2/80＝2.17
ED＝WD/TD＝222/120＝1.85
through the calculation and the comparison, the polishing difficulty of the four samples can be rapidly and effectively distinguished, and the polishing performance of the four samples is respectively a sample C, a sample A, a sample B and a sample D from easy to difficult.
According to the preceding examples, the inventors also carried out test 2: respectively testing and analyzing the polishing efficiency of different types of 240-mesh dry sand samples E \ F \ G \ H:
1. preparing and maintaining a fixed polishing material, and mounting a test plate, wherein the thickness is controlled to be 1mm (+ -0.1), and the length and the width are respectively 1m × 1 m;
2. the polishing material is different types of 240-mesh dry-grinding abrasive paper with the same model, and the width of the polishing material fixing device is 100 mm;
3. setting the grinding displacement speed S from X1 to X2 to be 0.5 m/S;
4. setting the Y-axis displacement as 50mm, YMoving device20 times;
5. adjusting the polishing control device X, Y to an initial state, starting the infrared position measuring device, adjusting the Z-axis displacement adjusting device, and confirming the contact position of the polishing material and the polished material, wherein the Z0 is at the initial polishing position;
6. the displacement amount Z1 in the Z-axis direction was set to 20 μm;
7. starting a data acquisition system, starting to simulate polishing on a test piece, testing whether the system operates normally, and simultaneously recording the polishing times to ensure that data are correct;
8. starting a device for testing, observing whether the testing process is normal, and testing the 4 samples one by one;
9. observing the polishing effect, finding that the sample does not reach smoothness and flatness, continuously adjusting the Zn to be 20 mu m, and then performing the next circulation;
10. the data of the test results are respectively:
the values of the cycle times C are respectively:
the value of the primary cycle time t is:
t＝Ymoving device*H/S＝20*1/0.5＝40(s)
The grinding force N values are respectively:
NE＝(NEx1+NEy1+NEz1)+(NEx2+NEy2+NEz2)+(NEx3+NEy3+NEz3)/3，
＝(1.5+1.3+1.5)+(1.4+1.2+1.5)+(1.3+1.5+1.6)/3
＝4.27
NF＝(NFx1+NFy1+NFz1)+(NFx2+NFy2+NFz2)+(NFx3+NFy3+NFz3)+(NFx4+NFy4+NFz4)+
(NFx5+NFy5+NFz5)/5
＝(1.1+1.2+1.25)+(1.3+1.2+1.4)+(1.3+1.1+1.25)+(1.2+1.1+1.3)+(1.4+1.2+1.3)/5
＝3.72
NG＝(NGx1+NGy1+NGz1)+(NGx2+NGy2+NGz2)+(NGx3+NGy3+NGz3)+(NGx4+NGy4+NGz4)/4
＝(1.3+1.4+1.3)+(1.2+1.1+1.3)+(1.3+1.5+1.6)+(1.4+1.2+1.5)/4
＝4.03
NH＝(NHx1+NHy1+NHz1)+(NHx2+NHy2+NHz2)/2
＝(1.2+1.3+1.1)+(1.3+1.5+1.2)
＝3.8
the total Z values of the grinding displacement are respectively as follows:
ZE＝ZE0*4＝20*3＝60μm
ZF＝ZF0*3＝20*5＝100μm
ZG＝ZG0*2＝20*4＝80μm
ZH＝ZH0*2＝20*2＝40μm
respectively calculating the polishing efficiency E value as follows:
WE＝NE*ZE＝4.27*60＝256.2
WF＝NF*ZF＝3.72*100＝370
WG＝NG*ZG＝4.03*80＝322.4
WH＝NH*ZH＝3.8*40＝152
TE＝t*CE＝40*3＝120
TF＝t*CF＝40*5＝200
TG＝t*CG＝40*4＝160
TH＝t*CH＝40*2＝80
EE＝WE/TE＝256.2/120＝2.14
EF＝WF/TF＝370/200＝1.85
EG＝WG/TG＝322.4/160＝2.02
EH＝WH/TH＝152/80＝1.9
through the calculation and the comparison, the polishing difficulty of the four samples can be rapidly and effectively distinguished, and the polishing performance of the four samples is respectively a sample E, a sample G, a sample H and a sample F from easy to difficult.
Therefore, the method and the device can realize the rapid and simple judgment of the polishing difficulty of the building putty and the polishing material in the decoration, provide quantifiable reference data and realize the original purpose of the invention.
Claims (5)
1. A method of testing the sanding performance of a material, characterized in that the material is sanded by means of the sanding material, the sanding area of the material is defined by a rectangular coordinate system comprising X, Y, Z axes perpendicular to each other, the sanding area is (X1, Y1) to (X2, Y1) to (X2, Y2) to (X1, Y2) to the area defined by (X1, Y1), the starting point of sanding is (X1, Y1), one cycle of the sanding movement is a reciprocating movement in the range from position X1 to position X2 in the X axis direction and a unidirectional movement from position Y1 to position Y2, i.e. a unit movement in the Y direction from position X1 to position X2 or a unit movement in the Y direction from position X2 to position X1 until position Y2 is reached, after which a cycle of the sanding movement is completed, it is determined whether the sanding effect has been set, if so, judging the polishing performance of the polishing material by using the total amount of the Z-axial grinding displacement, wherein the larger the total amount of the Z-axial grinding displacement is, the stronger the grinding capacity of the polishing material is, or the better the polishing performance of the polished material is; if not, adjusting the grinding displacement in the Z-axis direction, returning to the grinding starting point, and entering the next grinding motion cycle or finishing the grinding performance detection of the grinding material or the ground material.
2. The method of claim 1, wherein the cycle of the grinding motion comprises
Step a, polishing towards the X-axis direction, wherein the polishing track is a straight line track from a position X1 to a position X2, and entering a step b;
b, judging whether the Y-axis direction reaches a position Y2, if not, continuing to polish in the Y-axis direction, moving one unit, continuing to polish in the X-axis direction, wherein the polishing track is a straight track from a position X2 to a position X1, and entering the step c; if position Y2 has been reached, go to step d;
c, judging whether the position Y2 is reached in the Y-axis direction, if not, continuing to polish in the Y-axis direction, moving one unit, and entering the step a; if position Y2 has been reached, go to step d;
d, judging whether the polishing effect meets the set requirement, if so, judging the polishing performance of the polishing material by using the total amount of the Z-axial grinding displacement, wherein the larger the total amount of the Z-axial grinding displacement is, the stronger the grinding capacity of the polishing material is, or the better the polishing performance of the polished material is; if not, adjusting the grinding displacement, returning to the grinding starting point, and entering the step a or finishing the grinding performance detection of the grinding material or the ground material.
3. The method for testing the sanding performance of a material as defined in claim 2, wherein the step d is performed once for one cycle, wherein the grinding forces in the X-axis direction, the Y-axis direction and the Z-axis direction are tested during each cycle of grinding,
N＝{(Nx1+Ny1+Nz1)+(Nx2+Ny2+Nz2)+…+(Nxn+Nxn+Nxn)}/n，
Nxi-X axis direction in cycle i, X axis direction measures the average of the forces,
Nyi-Y-axis direction in cycle i, Y-axis measured force average,
Nzi-Z-axis direction in cycle i, the average of the forces measured in the Z-axis direction,
i is a natural number, 1, 2, …, n;
n is the number of cycles,
n-the average grinding force,
a small N average grinding force value indicates a stronger grinding ability of the grinding material or a better grindability of the ground material.
4. The method for testing the sanding performance of a material of claim 3 wherein in step d, the sanding efficiency E is also tested,
e ═ W/T, wherein
E-efficiency of polishing
W-grinding work
T-total time taken for full cycle
Wherein,
W＝N*Z
n-average grinding force
The total grinding displacement in the Z-Z axial direction,
T＝t*n
t-time of one cycle
n is the number of cycles,
the higher the dressing efficiency E, the more powerful the dressing ability of the dressing material or the better the dressing ability of the material to be dressed.
5. An apparatus for testing the sanding performance of a material, characterized by operating in accordance with the method of any one of claims 1 to 4.
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