CN103278515A - Rotary X-ray layered photographic detection system and method - Google Patents
Rotary X-ray layered photographic detection system and method Download PDFInfo
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Abstract
The invention provides a rotary X-ray layered photographic detection system and method. The rotary X-ray layered photographic detection system comprises an X-ray plane detector, an object stage, a rotating platform, a motion control and data computing device and an X-ray tube, wherein the rotating platform is positioned between the X-ray tube and the X-ray plane detector, the object stage is positioned on the rotating platform, and the motion control and data computing device controls the rotating platform to rotate in the Z-axis direction and do translational motion in the X-axis direction, the object stage to do the translational motion in the X-axis direction and the Y-axis direction, and the X-ray plane detector to do the translational motion in the X-axis direction, and is used for processing X-ray images obtained by the X-ray plane detector. The detection method comprises the steps of: carrying out rotating scanning on a detected object, and obtaining multi-angle X-ray imaging of a detected object after the detected object rotates for a circle; and combining and overlapping the imaging of a horizontal section to rebuild the section of the detected object. The rotary X-ray layered photographic detection system and method can be used for determining welding spot defects according to the size of the detection horizontal area of the detected object and the set criterion, and rebuilding a three-dimensional model of the detected object.
Description
Technical field
The present invention relates to the image imaging method that industrial products detect, particularly relate to a kind of X ray layered photography detection method and system for detection of BGA solder joint and other plug connector solder joints in the circuit board assembling.
Background technology
X ray layering photography (Laminography) technology is the main flow detection technique in present circuit board multi pack field, and this technology is that the radioscopy image with a plurality of angles reconstructs the cross-sectional image on the object to be detected focal plane.Each fluoroscopy images has all comprised the cross section on the object to be detected focal plane, and be positioned at the fixed position on the X-ray detector, and the focal plane up and down the cross section of each layer on diverse location, the image of different layers is through the perspective of different angles, can cause the skew of levels image, the fluoroscopy images of stack different angles will obtain a focal plane cross-sectional image clearly.By the layering method for imaging, the cross-sectional image of the object to be detected that can obtain easily detects interior of articles concealed structure and microtexture.Along with electronic product develops to light, thin, little direction, electronic component volume on the printed circuit board (PCB) is little, distribution density is high, a large amount of BGA (ball bar array) have been adopted, CSP (wafer-level package) etc. has the novel encapsulated chip of concealed structure, and X ray layering camera work just in time remedies the shortcoming that AOI (automated optical detection) can't detect concealed structure.
In circuit board multi pack field, to distinguish according to the preparation method of different angles fluoroscopy images, X ray layering method for imaging mainly is divided into five big classes:
1) object to be detected moving linearly, X-ray tube and X-ray detector keep static, thereby obtain the radioscopy image of a plurality of angles of testee.US Patent No. 55839042 has adopted similar layering camera work, this technology need be used linear array detector, and the speed of obtaining image is slower, needs more detector to obtain high-quality image, and can not be combined with 2/2.5 dimension x-ray detection system, so such system cost is higher.
2) X-ray detector keeps relative static with X-ray tube, keeps fixing object to be detected to make synchronous circular motion around the position, and X ray penetrates object to be detected with identical angle from different directions, obtains the fluoroscopy images of a plurality of angles of object to be detected.US Patent No. 4936452 has adopted similar layering camera work, and difference is that the circumference of the electromagnetic deflection realization X ray of this system employs electron beam rotates synchronously, and the X-ray tube maintenance is motionless.But the synchronous circular motion of X-ray detector still needs complexity and accurate mechanical motion, and realizes that electromagnetic deflection needs extra device, makes system become complicated and expensive.
3) X-ray tube is done the XY plane motion and is kept relative static with X-ray detector, and object to be detected keeps the fixed position, thereby obtains the radioscopy image of a plurality of angles of testee.US Patent No. 7529336B2 and Chinese invention patent ZL200710140075.X have adopted similar layering camera work, and this system adopts three linear array detectors, need finish the detection of circuit board multi pack spare by the path scanning of appointment.Because the X-ray tube volume is bigger, being synchronized with the movement of X-ray detector and X-ray tube needs huge mechanism system.
4) object to be detected is done the XY plane motion, and it is static that X-ray tube and X-ray detector keep, thereby obtains the radioscopy image of a plurality of angles of testee.This technology need adopt a plurality of facet detectors or adopt large-area flat panel detector, and it is low to cause obtaining in the image process detector utilization factor, has improved system cost.US Patent No. 6748046 has adopted similar layering camera work.
5) object to be detected and X-ray detector are done the XY plane motion, and X-ray tube keeps the fixed position, thereby obtain the radioscopy image of a plurality of angles of testee.Jap.P. JP2011191180A (CN102192918-A) has adopted similar layering camera work, this system can set different scanning patterns according to detecting needs, realize different radioscopy angles, obtain good fluoroscopy images, but when scanning by the path of appointment, need the interlock of plane X ray detector and object to be detected, motion control is comparatively complicated, and sweep velocity is slower.
The X ray detection technique that is used for circuit board multi pack defects detection also comprises the computer tomography method, and (Computed Tomography is CT) with 2/2.5 dimension perspective method for imaging.The X ray CT detection method utilizes reconstruction algorithm to obtain cross section or the 3-D view of object to be detected, can accurately detect its defective.Yet process of reconstruction need obtain the x-ray imaging of each angle of object to be detected, too consuming time, can't reach the rate request of industrial detection, and limited by the flat pattern of circuit board multi pack product, need inspected object is carried out the part section, carry out off-line CT again and detect, make the X ray CT method can't be applied on the circuit board multi pack transfer matic.2/2.5 the photography of dimension radioscopy is by the line integral acquisition image of object to be detected to the X ray absorptivity, its image information comprises the projection of object to be detected integral body on the X ray planar detector, therefore can detect BGA quickly and efficiently and hide defectives such as obviously the snapping of solder joint, bridge joint short circuit, bubble, soldered ball size, and detailed information such as small rosin joint and general rosin joint are covered by background information easily, are difficult to detect.
X ray layering camera work detects for microscopic defects such as small rosin joint and general rosin joints has enough reliabilities, is combined with 2/2.5 dimension radioscopy camera work, can obtain efficiently, detect reliably effect.Above-mentioned the 5th class X ray layering method for imaging uses the plane X ray detector, the wherein XY plane motion of object to be detected and X-ray detector, make it can obtain to be similar to the fluoroscopy images of 2/2.5 dimension radioscopy camera chain, and guarantee that the focal plane is parallel with plane of movement, the cross section reconstruction algorithm is simplified.Therefore, be necessary the 5th class layering method for imaging is made improvements, propose a kind of have 2/2.5 dimension X ray measuring ability, sweep velocity X ray layered photography detection method and system faster.
Summary of the invention
The objective of the invention is to propose a kind of X ray layered photography detection method and system, to overcome some shortcomings of existing method and system.Detection method of the present invention and system can be applicable to the online or offline inspection of the hiding solder joints such as BGA in the circuit board multi pack.
For realizing purpose of the present invention, the present invention adopts following technical scheme:
Rotary layering photography detection system, comprise: the X ray planar detector, objective table, universal stage, motion control and data computation device, X-ray tube, set up X-axis and the Y-axis of rectangular coordinate system on the plane parallel with the objective table end face, and with the initial point of this coordinate system, X-axis and Y-axis are set up rectangular coordinate system in space, it is characterized in that universal stage is between X-ray tube and X ray planar detector, objective table is positioned on the universal stage, and object to be detected is positioned on the objective table: X ray planar detector center, the radiant S of objective table center and X-ray tube is on same straight line; Z-direction rotation and the X-direction translation of motion control and data computation device control universal stage, objective table X-direction and Y direction translation, and the X-direction translation of X ray planar detector, and handle the radioscopic image that the X ray planar detector obtains; Wherein, obtain the x-ray imaging of object to be detected multi-angle by the Z-direction rotation of universal stage.
Further, that X-ray tube is described X-ray tube radiant S foremost.
Further, the XY cross section is determined jointly by X direction of motion, the Y direction of motion of objective table and the reconstruction depth of section h that sets.
Further, described motion control and data computation device stack multi-angle x-ray imaging, the cross section of reconstruction object to be detected in the XY cross section.
Rotary layered photography detection method comprises step: tested object is rotated scanning, obtains the multi-angle x-ray imaging of object to be detected; Stack is made up in imaging to described XY cross section, to rebuild the cross section of object to be detected; Obtain the image in object to be detected XY cross section by match; According to the detection level area of section of object to be detected, judge the existing defective of object to be detected; Regional area at predetermined carries out reconstructing three-dimensional model, described three-dimensional model by the XY particular cross section of a plurality of differing heights of this regional area by the match gained.
Further, before the imaging of XY cross section superposes, calculate translation coefficient, the coefficient of rotary of every width of cloth x-ray imaging, so that image is proofreaied and correct.
Further, translation coefficient, coefficient of rotary are determined by the geometric parameter between the rotation angle of universal stage and X ray planar detector, objective table, X-ray tube radiant.
Further, the detection level cross section of described object to be detected determines according to X direction of motion, the Y direction of motion of objective table and the reconstruction depth of section h that sets.
Further, the detection level cross section of described object to be detected comprises three the detection level faces in upper, middle and lower at least.
Further, described testee comprises the BGA solder joint, and described defective comprises the rosin joint of BGA solder joint and slightly snaps.
Above-mentioned X ray layered photography detection method as the bga chip solder joint, adopts the Z-direction of testee to rotate the multi-angle ray scanning imaging of finishing the bga chip solder joint at predetermined regional area.Every width of cloth fluoroscopy images is carried out corresponding translation and correction is finished in rotation, obtain the specific cross-sectional image of solder joint by stack then.At the solder joint rosin joint, slightly snap, the present invention is according to the area of section of solder joint under three the cross section levels in upper, middle and lower, according to the decision criteria of setting, judge slightly snap, rosin joint or other welding point defects.Carry out match by the cross-sectional image boundary curve to differing heights, obtain the three-D profile of solder joint.
As preferred embodiment, the layering photography of carrying out whole bga chip solder joint detects, go forward one by one by objective table X, Y-direction, multi-angle scanning is carried out in the zone one by one, with the layering method for imaging, obtain upper, middle and lower three XY particular cross section image of each row solder joint of bga chip respectively, and according to the boundary area under the different solder joints cross section level of extracting, according to the decision criteria of setting, one by one each solder joint of regional determination whether exist slightly snap, rosin joint or other defect.
System and method for of the present invention has that forms of motion is simple, accuracy of detection is high, modularization is strong, the characteristics of economical rationality, has the structure of similar traditional 2/2.5 dimension radioscopy detection system, can realize its identical function.Compared with prior art, have following advantage:
(1) the present invention can realize 2/2.5 traditional dimension X ray detection platform said function, give full play to the short circuit of BGA solder joint bridge joint, soldered ball excessive too small, obviously snap etc. the high-speed and high-efficiency detectability, the reinforcement detectability that strengthens the rosin joint of the BGA solder joint of local presumptive area, microscopic defect such as slightly snaps by modular functionality;
(2) layer detection method of the present invention and system have tangible motion simple, detect advantage fast;
(3) layer detection method of the present invention and system can be used for hiding the rosin joint of solder joint, slightly online and offline inspection and the analysis of defective such as snap.
Description of drawings
Fig. 1 is the X ray layering camera chain synoptic diagram of the preferred embodiment of the present invention;
Fig. 2 is the X ray layering photography particular cross section image reconstruction principle schematic of the preferred embodiment of the present invention;
Fig. 3 is the X ray layering photography translation coefficient derivation synoptic diagram of the preferred embodiment of the present invention;
Fig. 4 is that the scanning of going forward one by one of the X ray layering photography of the preferred embodiment of the present invention detects synoptic diagram;
Fig. 5 A, Fig. 5 B, Fig. 5 C, Fig. 5 D are that the BGA solder joint XY particular cross section of the preferred embodiment of the present invention is rebuild synoptic diagram; Fig. 5 A is the position at the XY particular cross section place that rebuilds of the present invention, can suitably increase XY particular cross section reconstructed quantity according to detecting needs; To obtain more reliable testing result.Fig. 5 B is according to XY particular cross section on three detection levels in the upper, middle and lower that rebuild, and is respectively 503,504,505, and corresponding area of section is A
1, A
2, A
3Fig. 5 C is according to the area of section A that calculates
3=0, judge the synoptic diagram that solder joint is opened a way; Fig. 5 D is according to the area of section A that calculates
3＜setting threshold values is judged the synoptic diagram of solder joint rosin joint;
Fig. 6 is the X ray layering photography BGA solder joint testing process synoptic diagram of the preferred embodiment of the present invention.
Fig. 7 is the overlapping synoptic diagram of X ray layering photographic imagery of the preferred embodiment of the present invention.
Fig. 8 A, Fig. 8 B are X ray layering photography BGA solder joint reconstructing three-dimensional model principle and the schematic flow sheets of the preferred embodiment of the present invention.
Shown in the figure: 101-X ray plane detector, 102-objective table, the tested object of 103-, 104-motion control and data computation device, 105-X ray tube, 106-universal stage; The 401-BGA solder joint, the 402-cone-beam X-ray; The 501-BGA chip bonding pad, 502-BGA board pads, detection level on the 503-solder joint, detection level in the 504-solder joint, detection level under the 505-solder joint.
Other symbol descriptions among the figure:
S-X x radiation x point; The F-focal plane; The L-particular cross section; The rotation angle of θ-universal stage; The rotation center of the tested object of O-; O
1M
1, O
2M
2The XY particular cross section of-tested object differing heights; The projection of the tested object of OM-on the XY plane; O
1' M
1', O
2' M
2', the planar detector of O '-tested object is imaged on the projection on XZ plane; O
1" M
1", O
2" M
2", O "-imaging of tested object on planar detector; The imaging angle of β-X ray; H
0-X-radiation point S is to the distance of focal plane F; The H-planar detector is to the distance of focal plane F; H-particular cross section L is to the distance of focal plane F; O
LThe X ray that-process O is ordered and the intersection point of particular cross section L.
Embodiment
In order to understand the present invention better, the invention will be further described below in conjunction with accompanying drawing, but embodiments of the present invention are not limited thereto.
As the preferred embodiment that the present invention proposes, as shown in Figure 1, the layering camera chain of this radioscopy detection platform comprises X-ray tube 105, X ray planar detector 101, objective table 102, universal stage 106 and motion control and data computation device 104.Wherein, tested object 103 is positioned on the objective table 102; Objective table 102 is positioned on the universal stage 106; Universal stage 106 can rotate, its rotation center at the projection on objective table 102 plane of movement and X-ray tube radiant S and planar detector 101 centers on same straight line.Objective table can realize XY to precision plane motion, universal stage and X ray planar detector can be realized the translation of X-axis.Motion control and data computation device 104 are responsible for the Collaborative Control of the rotation of universal stage z direction of principal axis and X ray planar detector Image Acquisition, the control of X pick-up tube 105, universal stage 106, objective table 102 and X ray planar detector 101 relative positions, and the solder joint cross section rebuilds and the welding point defect detection.
When the tested projection O of BGA solder joint center on the F of focal plane is positioned on X-ray tube radiant S and the planar detector line of centres, by the XY particular cross section of the tested BGA solder joint of reconstruction shown in Figure 2 on particular cross section L.When Fig. 2 shows tested BGA solder joint anglec of rotation θ, the fluoroscopy images that solder joint differing heights cross section obtains in detection plane.In the rotation sweep motion, the imaging plane of X ray planar detector need guarantee vertical with the turning axle of universal stage.Simultaneously, Fig. 2 shows also that some point corresponding on the plane of delineation is O ', i.e. the center O of the plane of delineation in the vertical view ".XY particular cross section O
1M
1, O
2M
2Corresponding on the plane of delineation, be imaged as O
1' M
1', O
2' M
2', i.e. O on the plane of delineation in the vertical view
1" M
1", O
2" M
2".
In order to rebuild the XY particular cross section O of solder joint
1M
1, need the translation coefficient L of particular cross section L on the computed image plane
θ hWith coefficient of rotary S
θIts derivation is as follows:
The XY particular cross section O of solder joint
1M
1The O that is imaged as at graphics plane
1" M
1", for it is rebuild, need its imaging is moved to plane of delineation center O ".Therefore, the translation coefficient of particular cross section L on the plane of delineation.L
θh＝O
1”O”。As shown in Figure 3, O
LBe the intersection point of straight line SO ' and particular cross section L, according to triangle Δ SO
1O
LWith Δ SO
1' O ' is similar triangles, gets O
1' O '=SO
1/ SO
1' O
1O
L, simultaneously, SO
1/ SO
1'=(H
0+ h)/(H
0+ H), O
1O
L=cot β OO
1, OO
1=h, O
1' O '=O
1" O " so, the translation coefficient of particular cross section L is on the plane of delineation
L
θh＝(H
0+h)/(H
0+H)·cotβ·h。
As shown in Figure 2, the x-ray imaging angle beta determines by the relative position of X-ray tube radiant S and focal plane initial point O, and, tan β=O
0O/H
0, coordinate translation by the X-direction of universal stage 106 and X ray planar detector 101, change O
0The distance of O, thus different x-ray imaging angle betas selected.
The XY particular cross section O of solder joint
1M
1The O that is imaged as at graphics plane
1" M
1", for making O
1M
1The imaging of gained overlaps under the different rotary angle, needs its imaging is rotated to X-axis.As shown in Figure 2, O
1" M
1" ‖ OM, so the coefficient of rotary of particular cross section L is on the plane of delineation
S
θ＝θ。
Translation coefficient L according to particular cross section L on the plane of delineation after the single imaging of above derivation
θ hWith coefficient of rotary S
θComputing method, can carry out translation and rotation to the scan image of all angles, stack then just can obtain the cross-sectional image of tested solder joint XY particular cross section L.Shown in Fig. 7 A, be the imaging of tested solder joint different rotary angle gained, it is carried out translation rotation and stack, get the image shown in Fig. 7 B, wherein XY particular cross section O
1M
1Because stack is strengthened, in background, shown.
With reference to Fig. 5 A, according to translation and the convergent-divergent of above solder joint XY particular cross section imaging, can rebuild a plurality of BGA solder joint XY particular cross section that BGA goes up 502 of pads under pad 501 and the BGA.Snap difficulty with rosin joint in order to solve the tradition 2/2.5 dimension online detection of X ray faint solder joint, set up following detection method based on layering photography algorithm of the present invention.Shown in Fig. 5 B, choose BGA solder joint upper, middle and lower detection level, be respectively 503,504,505, obtaining the solder joint area of section is A
1, A
2, A
3Shown in Fig. 5 C, snap at slight solder joint and to set up decision criteria: A
3=0.As the actual A of solder joint
3, can judge that this solder joint snaps at=0 o'clock.Shown in Fig. 5 D, at the solder joint rosin joint, set up decision criteria: A
3＜setting threshold values A
SSet threshold values A
SCan be artificial setting constant or equal ξ A
0Wherein, A
0Be desirable constant threshold values, ξ is the dislocation coefficient of solder joint XY central cross-section, can be expressed as: A
2'/A
20Wherein, A
2' be the solder joint actual cross-section area A after the dislocation of solder joint XY central cross-section
2, A
20The solder joint actual cross-section area A that does not have dislocation for solder joint XY central cross-section
2Those skilled in the art should be appreciated that and set threshold values A
SBe not limited to listed method.
As shown in Figure 4, the present invention finishes directions X, Y-direction stepping by objective table 102 with step delta X, Δ Y, makes radiant S send cone-beam 402 and progressively covers tested BGA solder joint 401.
As shown in Figure 6, propose solder joint XY cross section method for reconstructing according to the present invention, finish the defects detection of whole BGA solder joint according to the following steps, special solder joint slightly snaps, the detection of rosin joint.
1) system motion control and data computation device 104 executive process 601, the initial position fix of control universal stage and stage movement and BGA that desire is detected is on the turning axle of universal stage;
2) system motion control and data computation device 104 executive process 602 are set detected parameters, as rosin joint decision threshold A
3, objective table step delta X and Δ Y, various geometric parameters etc. when progressively detecting the BGA solder joint;
3) system motion control and data computation device 104 executive process 603, this position of universal stage rotation sweep BGA solder joint obtains the x-ray imaging figure of several different angles;
4) system motion control and data computation device 104 executive process 604, the solder joint XY cross section method for reconstructing that proposes in a preferred embodiment according to the present invention is finished the cross section and is rebuild;
5) system motion control and data computation device 104 executive process 605 are by carrying out graphical analysis, calculating parameter A
1, A
2, A
3, the method for determining defects that proposes in a preferred embodiment according to the present invention carries out the determining defects of this position solder joint;
6) whether all system motion control and data computation device 104 executive process 606 judge this BGA solder joint been scanned.If condition criterion is "Yes", then carry out 608, the output testing result.If condition criterion is "No", then the control of executive process 707 system motions is finished Δ X and Δ Y stepping with data computation device 104 control objective tables 102, navigates to next detection position BGA solder joint.Then, system motion control is controlled again executive process 603 with data computation device 104.
Shown in Fig. 8 A, finish defects detection after, can carry out three-dimensional reconstruction to predetermined zone, by obtaining the XY particular cross section 801 of a plurality of differing heights of solder joint, and it is carried out match, rebuild this regional three-dimensional model.Finish three-dimensional reconstruction by step shown in Fig. 8 B.
1) system motion control and data computation device 104 executive process 801, the presumptive area of control universal stage and stage movement and BGA that desire is detected is positioned on the turning axle of universal stage;
2) setting of detected parameters is carried out in system motion control and data computation device 104 executive process 802, as XY particular cross section distance, delta h, obtain amount of images, various geometric parameters etc.;
3) system motion control and data computation device 104 executive process 803, this position of universal stage rotation sweep BGA solder joint obtains the x-ray imaging figure of several different angles;
4) system motion control and data computation device 104 executive process 804, the solder joint XY cross section method for reconstructing that proposes in a preferred embodiment according to the present invention is finished the reconstruction of a plurality of differing heights XY of solder joint particular cross section;
5) system motion control and data computation device 104 executive process 805 by a plurality of differing heights XY particular cross section are carried out match, obtain the three-dimensional model of solder joint;
6) system motion control and data computation device 104 executive process 806, the three-dimensional model of output presumptive area.
The present invention can realize the function of traditional 2/2.5 dimension X ray detection platform, give full play to its to the short circuit of BGA solder joint bridge joint, soldered ball excessive too small, obviously snap etc. the high-speed and high-efficiency detectability.Local preset detection zone at large-area circuits plate multi pack spare, especially traditional 2/2.5 dimension radioscopy detects the detection of slightly snapping of being difficult to carry out, rosin joint, a kind of layering method for imaging and welding point defect detection method and system that rebuilds solder joint XY cross section proposed, have the motion of detecting simple, detect rapidly, accuracy of detection is high, modularization is strong, the characteristics of economical rationality, alternative 2/2.5 traditional dimension radioscopy detects, and has broad application prospects.
Claims (10)
1. rotary X ray layering photography detection system, comprise: the X ray planar detector, objective table, universal stage, motion control and data computation device, X-ray tube, set up X-axis and the Y-axis of rectangular coordinate system on the plane parallel with the objective table end face, and with the initial point of this coordinate system, X-axis and Y-axis are set up rectangular coordinate system in space, it is characterized in that, universal stage is between X-ray tube and X ray planar detector, objective table is positioned on the universal stage, and object to be detected is positioned on the objective table: X ray planar detector center, the radiant S of objective table center and X-ray tube is on same straight line; Z-direction rotation and the X-direction translation of motion control and data computation device control universal stage, objective table X-direction and Y direction translation, and the X-direction translation of X ray planar detector, and handle the radioscopic image that the X ray planar detector obtains; Wherein, obtain the x-ray imaging of object to be detected multi-angle by the Z-direction rotation of universal stage.
2. rotary X ray layering photography detection system according to claim 1 is characterized in that, X-ray tube be described X-ray tube radiant S foremost.
3. rotary X ray layering photography detection system according to claim 1 is characterized in that the XY cross section is determined jointly by X direction of motion, the Y direction of motion of objective table and the reconstruction depth of section h that sets.
4. rotary X ray layering photography detection system according to claim 1 is characterized in that, described motion control and data computation device stack multi-angle x-ray imaging, the cross section of reconstruction object to be detected in the XY cross section.
5. adopt the rotary layered photography detection method of the described detection system of claim 1 to 4, it is characterized in that, comprise step: tested object is rotated scanning, obtains the multi-angle x-ray imaging of object to be detected; Stack is made up in imaging to described XY cross section, to rebuild the cross section of object to be detected; Obtain the image in object to be detected XY cross section by match; According to the detection level area of section of object to be detected, judge the existing defective of object to be detected; Regional area at predetermined carries out reconstructing three-dimensional model, described three-dimensional model by the XY particular cross section of a plurality of differing heights of this regional area by the match gained.
6. rotary layered photography detection method according to claim 5 is characterized in that, before the imaging of XY cross section superposes, calculates translation coefficient, the coefficient of rotary of every width of cloth x-ray imaging, so that image is proofreaied and correct.
7. rotary layered photography detection method according to claim 6 is characterized in that, translation coefficient, coefficient of rotary are determined by the geometric parameter between the rotation angle of universal stage and X ray planar detector, objective table, X-ray tube radiant.
8. rotary layered photography detection method according to claim 5 is characterized in that the detection level cross section of described object to be detected determines according to X direction of motion, the Y direction of motion of objective table and the reconstruction depth of section h that sets.
9. rotary layered photography detection method according to claim 5 is characterized in that, the detection level cross section of described object to be detected comprises three the detection level faces in upper, middle and lower at least.
10. rotary layered photography detection method according to claim 5 is characterized in that, described testee comprises the BGA solder joint, and described defective comprises the rosin joint of BGA solder joint and slightly snaps.
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| CN105232070A (en) * | 2015-08-27 | 2016-01-13 | 天津大学 | Multifunctional computer tomography system |
| CN106226643A (en) * | 2016-07-05 | 2016-12-14 | 国营芜湖机械厂 | The rosin joint inspection of BGA, CSP class chip spherical solder and determination methods |
| CN106226643B (en) * | 2016-07-05 | 2020-09-11 | 国营芜湖机械厂 | Insufficient soldering inspection and judgment method for BGA and CSP chip spherical soldering points |
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| CN107657588A (en) * | 2017-09-25 | 2018-02-02 | 电子科技大学 | Bearing calibration for the radioscopic image of BGA solder joints |
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| CN112200798A (en) * | 2020-10-29 | 2021-01-08 | 佛山市南海区广工大数控装备协同创新研究院 | Printed circuit board detection method based on X-ray layering technology |
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| CN113030131A (en) * | 2021-03-01 | 2021-06-25 | 浙江双元科技股份有限公司 | Image acquisition equipment and method based on X-ray imaging |
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