CN103268863A - Separating device of crystal particle - Google Patents

Separating device of crystal particle Download PDF

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Publication number
CN103268863A
CN103268863A CN2013101833200A CN201310183320A CN103268863A CN 103268863 A CN103268863 A CN 103268863A CN 2013101833200 A CN2013101833200 A CN 2013101833200A CN 201310183320 A CN201310183320 A CN 201310183320A CN 103268863 A CN103268863 A CN 103268863A
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China
Prior art keywords
cam
thimble
connecting rod
support
crystal grain
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CN2013101833200A
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Chinese (zh)
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CN103268863B (en
Inventor
朱玉萍
岑刚
朱国璋
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Jiaxing Jingyan Intelligent Equipment Technology Co Ltd
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Jiaxing Jingyan Intelligent Equipment Technology Co Ltd
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Priority to CN201310183320.0A priority Critical patent/CN103268863B/en
Publication of CN103268863A publication Critical patent/CN103268863A/en
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Publication of CN103268863B publication Critical patent/CN103268863B/en
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Abstract

The invention relates to the technical field of integrated circuit chip processing and discloses a separating device of a crystal particle. The separating device of the crystal particle comprises a machine base, a cam and an ejector pin, wherein the cam is arranged inside the machine base, the power of the cam is provided by a stepping motor, the ejector pin is arranged at the top end of the machine base, the area of the tip of the ejector pin is smaller than the area of the crystal particle to be separated, the ejector pin is connected with the cam through a connecting rod, a spring seat is arranged inside the machine base, a thrust spring is arranged between the connecting rod and the spring seat, ejecting force is generated by the connecting rod through the thrust spring to push the ejector pin to move upwards, a cam groove is formed in the lateral side of the cam, a follow-up device is arranged inside the cam groove, and the lower end of the connecting rod is connected to the follow-up device in a rotary mode. According to the separating device of the crystal particle, due to the fact that a method combining force limiting and shape limiting and the MOS tube heating method are adopted, the speed of crystal particle separation is high and the efficiency of the crystal particle separation is high.

Description

Die detachment apparatus
Technical field
The present invention relates to the integrated circuit (IC) chip processing technology field, particularly a kind of die detachment apparatus.
Background technology
Crystal grain early is because its particle is little, and counterdie is thin, and is simple in structure at the separator of this class crystal grain.Along with popularizing of large scale integrated circuit, separating of the crystal grain of bulky grain and thick counterdie will rely on separator to finish.Bigger at chip area, the way of use spininess and increase ejection height in the prior art is at the thermoplastic way of the thicker employing of counterdie.Though it is thicker and have the separation of the bigger crystal grain of strong viscosity that the combination of these two kinds of methods preferably resolves film, also there are a lot of insecure factors in the while.
Because the ejecting mechanism of thimble requires speed higher, substantially all be the spacing cam mechanism of employing power (being difficult in processing and the motion process stuck easily because the spacing cam of type will reach this precision), connecting rod below the needle stand slides in a linear sliding sleeve (being generally ball sliding bush), cam blocks in backhaul (spring pushes up back) easily when ejection height increases, be easy to cause counterdie to be pulled open like this, vacuum is difficult to absorption, and influence is separated into power.Heater mostly adopt below the mode of blowing hot-air, non-uniform temperature is difficult to control, the stability of separation is difficult to ensure.
Summary of the invention
The objective of the invention is provides a kind of die detachment apparatus in order to solve the problems of the technologies described above, in the hope of realizing that with spacing the combining of power the quick of crystal grain separates by shape is spacing.
The technical scheme that the present invention takes is:
A kind of die detachment apparatus, comprise support, cam and thimble, described cam is arranged in the support, described cam provides power by stepping motor, described thimble is arranged on the top of described support, the needle point area of described thimble is less than the area of crystal grain to be separated, it is characterized in that, be connected by a connecting rod between described thimble and the described cam, a spring base is set in described support, a thrust spring is set between described connecting rod and described spring base, described connecting rod makes it produce a top power that upwards promotes thimble by described thrust spring, the side of described cam has cam path, in described cam path follower is set, and the lower end of described connecting rod is rotatably connected on described follower, when described follower is positioned at the distal end of cam path, described connecting rod ejects the top of support with described thimble, and when described follower was positioned at the proximal part of cam path, described connecting rod retracted described thimble on the top of support.
Further, be provided with a plurality of pores on described support top, described pore is connected to a pneumatic shuttle by gas circuit, and described pneumatic shuttle provides vacuum or malleation for described pore.
Further, described upper part of the frame is cylindricality, in the cylindrical lateral surface near the support top a plurality of metal-oxide-semiconductor heating is set.
Further, cylindricality inside near its top on described support arranges temperature sensor, described temperature sensor sends temperature information to control unit, described control unit is controlled the heat that adds of described metal-oxide-semiconductor according to the information of temperature sensor, makes the top of described support keep a stationary temperature.
Further, above the top of described support, the crystal grain suction nozzle is set.
Further, in the rotating shaft of described cam position transducer is set, described position transducer sends the positional information of thimble to control unit, and described control unit is controlled described crystal grain suction nozzle and draw described crystal grain when described thimble is positioned at the extreme higher position.
Further, described thimble is 2 to 4.
The invention has the beneficial effects as follows:
(1) relies on spring force that Cam Follower is pressed on the type limit cam inner ring and guarantee kinematic accuracy, backhaul is simultaneously returned by type limit cam outer ring card, here accurate positioning action is not played in type limit cam outer ring, gap between type limit cam groove and the Cam Follower can be amplified so, avoid the type limit cam defective of card easily itself, requirement to the cam machining accuracy simultaneously reduces greatly, is easy to realize;
(2) use the metal-oxide-semiconductor heating to adopt temperature control modules to control real time temperature simultaneously at the absorption sleeve pipe that contacts with the crystal grain counterdie;
(3) make suction nozzle accurately draw each crystal grain that is separated by position transducer.
Description of drawings
Accompanying drawing 1 is structural representation of the present invention;
Accompanying drawing 2 is the A-A cutaway view of accompanying drawing 1;
Accompanying drawing 3 is adsorbed in the structural representation on support top for grain films;
The structural representation that accompanying drawing 4 will be siphoned away by suction nozzle after being ejected for crystal grain.
Mark in the accompanying drawing is respectively:
1. support; 2. base;
3. footstock; 4. cam;
5. stepping motor; 6. top;
7. thimble; 8. connecting rod;
9. spring base; 10. thrust spring;
11. cam path; 12. follower;
13. pore; 14. MOS heating tube;
15. temperature sensor; 16. rotating shaft;
17. position transducer; 18. suction nozzle;
100. crystal grain; 101. crystal grain thick film.
Embodiment
Elaborate below in conjunction with the embodiment of accompanying drawing to die detachment apparatus of the present invention.
Referring to accompanying drawing 1,2, the support 1 of die detachment apparatus is divided into base 2 and footstock 3, cam 4 is installed in base 1, cam 4 provides rotational kinetic energy by stepping motor 5, footstock 3 is hollow cylindrical, on the top 6 of footstock 3 a plurality of thimbles 7 are set, the quantity of thimble 7 is 2 to 4 and is advisable, the area that a plurality of thimbles 7 surround is less than the area of single crystal grain 100 on the crystal grain thick film 101, thimble 7 is connected to a connecting rod 8, connecting rod 8 is by wearing downwards in the footstock 3 to the top of cam 4, in footstock 3, be positioned at the junction of base 2, a spring base 9 is set, on connecting rod 8, also be provided with corresponding spring deck, between spring base 9 and spring deck, thrust spring 10 is set, thrust spring 10 makes connecting rod 8 produce a top power that upwards promotes thimble 7, the side of described cam 4 has cam path 11, the outline with cam 4 of cam path 11 is corresponding, follower 12 is installed in cam path 11, the lower end of connecting rod 10 and follower 12 are rotatably connected, and when follower 12 was positioned at the distal end of cam path 11, connecting rod 10 ejected thimble 7 on the top 6 of footstock 3, when follower 12 was positioned at the proximal part of cam path 11, connecting rod 10 retracted thimble 7 on the top 6 of footstock 3.Separator also comprises control unit, and control unit is used for the each several part operate as normal of control separator.Position on the top 6 of footstock 3 arranges a plurality of pores 13, in footstock 3, form gas circuit, gas circuit is connected to a pneumatic shuttle, pneumatic shuttle provides vacuum or malleation for pore 13, make crystal grain thick film 101 be adsorbed on the top 6 or leave top 6, the parts that gas circuit can be used in the footstock 2 pass passage, connect extraneous position at passage seal realization sealing is set.Pneumatic shuttle is controlled the frequency that it provides vacuum or malleation by control unit.Side at footstock 3 arranges a plurality of metal-oxide-semiconductor heating 14, the heating of MOS heating tube 14 is controlled by control unit, MOS heating tube 14 is used for to footstock 2 heating, the glue fusing that makes the crystal grain thick film 101 on the top 6 cling crystal grain 100, in the inside of footstock 2 temperature sensor 15 is set, temperature sensor 15 sends temperature information to control unit, and control unit makes the top 6 of footstock 3 keep a stationary temperature according to the heat that adds of the information control MOS heating tube 14 of temperature sensor 15.In rotating shaft 16 upper position sensor 17 of cam 4, position transducer 17 sends cam 4 positional information in a swing circle to control unit, and the positional information of cam 14 can be converted into the positional information of thimble 7 here.The crystal grain suction nozzle 18 of control unit control separator top is drawn the crystal grain 100 on the crystal grain thick film 101 when thimble 7 is positioned at the extreme higher position.
Referring to accompanying drawing 3,4, the course of work of the present invention is as follows, after each parts installation, carry out initialization, initialization procedure comprises the preheating of MOS heating tube, the speed of cam 4 is regulated etc., crystal grain thick film 101 is positioned on the top 7 of footstock 3, crystal grain thick film 101 realizes that by a connecting gear stepping moves, control unit control pneumatic shuttle makes pore 13 produce negative pressure of vacuum, crystal grain thick film 101 is adsorbed, cam 4 rotation makes follower 12 be positioned at the distal end of cam path 11, and connecting rod 10 upwards ejects the top 6 of footstock 3 with thimble 7, because crystal grain thick film 101 is adsorbed, itself and crystal grain 100 bonding glue are heated fusing, thimble 7 ejects crystal grain 100 from crystal grain thick film 101, at this moment, suction nozzle 18 presses down the crystal grain 100 that will eject and siphons away.Control unit control pneumatic shuttle makes pore 13 produce malleation, the connecting gear of crystal grain thick film 101 moves a step-length with crystal grain thick film 101, make a next crystal grain 100 be positioned at the top of thimble 7, it is empty true that pneumatic shuttle produces pore 13, repeats the separation to crystal grain 100.
The present invention utilizes the method for the spacing and spacing way of combining of shape of power and metal-oxide-semiconductor heating, makes the separation of crystal grain realize high speed and high efficiency.
The above only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (7)

1. die detachment apparatus, comprise support, cam and thimble, described cam is arranged in the support, described cam provides power by stepping motor, described thimble is arranged on the top of described support, the needle point area of described thimble is less than the area of crystal grain to be separated, it is characterized in that: be connected by a connecting rod between described thimble and the described cam, a spring base is set in described support, a thrust spring is set between described connecting rod and described spring base, described connecting rod makes it produce a top power that upwards promotes thimble by described thrust spring, the side of described cam has cam path, in described cam path, follower is set, the lower end of described connecting rod is rotatably connected on described follower, and when described follower was positioned at the distal end of cam path, described connecting rod ejected described thimble on the top of support, when described follower was positioned at the proximal part of cam path, described connecting rod retracted described thimble on the top of support.
2. die detachment apparatus according to claim 1, it is characterized in that: be provided with a plurality of pores on described support top, described pore is connected to a pneumatic shuttle by gas circuit, and described pneumatic shuttle provides vacuum or malleation for described pore.
3. die detachment apparatus according to claim 1, it is characterized in that: described upper part of the frame is cylindricality, in the cylindrical lateral surface near the support top a plurality of metal-oxide-semiconductors heating is set.
4. die detachment apparatus according to claim 3, it is characterized in that: the cylindricality inside near its top on described support arranges temperature sensor, described temperature sensor sends temperature information to control unit, described control unit is controlled the heat that adds of described metal-oxide-semiconductor according to the information of temperature sensor, makes the top of described support keep a stationary temperature.
5. according to each described die detachment apparatus in the claim 1 to 4, it is characterized in that: above the top of described support, the crystal grain suction nozzle is set.
6. die detachment apparatus according to claim 5, it is characterized in that: the rotating shaft at described cam arranges position transducer, described position transducer sends the positional information of thimble to control unit, and described control unit is controlled described crystal grain suction nozzle and draw described crystal grain when described thimble is positioned at the extreme higher position.
7. according to each described die detachment apparatus in the claim 1 to 4, it is characterized in that: described thimble is 2 to 4.
CN201310183320.0A 2013-05-17 2013-05-17 Die detachment apparatus Active CN103268863B (en)

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Application Number Priority Date Filing Date Title
CN201310183320.0A CN103268863B (en) 2013-05-17 2013-05-17 Die detachment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310183320.0A CN103268863B (en) 2013-05-17 2013-05-17 Die detachment apparatus

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CN103268863B CN103268863B (en) 2015-11-25

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611077A (en) * 2017-09-21 2018-01-19 深圳市环基实业有限公司 A kind of IC package processing unit and processing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084032A (en) * 2001-09-12 2003-03-19 Matsushita Electric Ind Co Ltd Inspecting device for electric part
CN201449396U (en) * 2009-03-23 2010-05-05 常州新区爱立德电子有限公司 Thimble lifting platform adjustment device
CN203288566U (en) * 2013-05-17 2013-11-13 嘉兴景焱智能装备技术有限公司 Crystal grain separating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084032A (en) * 2001-09-12 2003-03-19 Matsushita Electric Ind Co Ltd Inspecting device for electric part
CN201449396U (en) * 2009-03-23 2010-05-05 常州新区爱立德电子有限公司 Thimble lifting platform adjustment device
CN203288566U (en) * 2013-05-17 2013-11-13 嘉兴景焱智能装备技术有限公司 Crystal grain separating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107611077A (en) * 2017-09-21 2018-01-19 深圳市环基实业有限公司 A kind of IC package processing unit and processing method
CN107611077B (en) * 2017-09-21 2020-02-21 深圳市环基实业有限公司 IC packaging processing device and processing method

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GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Grain separation device

Effective date of registration: 20230526

Granted publication date: 20151125

Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch

Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd.

Registration number: Y2023980041808

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Granted publication date: 20151125

Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch

Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd.

Registration number: Y2023980041808

PC01 Cancellation of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Grain separation device

Granted publication date: 20151125

Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch

Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd.

Registration number: Y2024980018023