CN103258101A - Method for determining characterization parameters of simulation circuit welding spot mechanical creep failure mechanism - Google Patents
Method for determining characterization parameters of simulation circuit welding spot mechanical creep failure mechanism Download PDFInfo
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- 238000003466 welding Methods 0.000 title abstract 6
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- 229910000679 solder Inorganic materials 0.000 claims description 69
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- 238000002347 injection Methods 0.000 claims description 8
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Abstract
A method for determining characterization parameters of a simulation circuit welding spot mechanical creep failure mechanism comprises the steps of selecting a simulation circuit, drawing a circuit diagram in EDA simulation software, using a welding spot mechanical creep failure mechanism degradation model for replacing a function process of the welding spot mechanical creep failure mechanism in the circuit, injecting the welding spot mechanical creep failure mechanism in the drawn circuit diagram in the EDA simulation software according to a fault injecting mode, setting up simulation environmental conditions in the EDA simulation software to carry out a circuit simulation experiment, recording output values of each measurement node at different moments, calculating change cumulative rates of the output values of each measurement node at different moments, comparing the change cumulative rates of the output values of each measurement node at different moments, finding out a node which changes most fast, and using parameters expressed by the node as the characterization parameters of the simulation circuit welding spot mechanical creep failure mechanism according to a selecting principle of the characterization parameters.
Description
Affiliated technical field
The characterization parameter that the present invention relates to mimic channel solder joint mechanical creep failure mechanism is determined method, belongs to systems engineering system reliability technical field.
Background technology
In recent years, along with microelectric technique, automatic control technology, fast development of computer technology, electronic devices and components and electronic product associated therewith have obtained using widely in commercial production, and these products almost spread all over each corner of production and sphere of life.Electromechanical Design also becomes the development trend of mechanical industry product design.Electronic and electrical equipment is the important component part in the electromechanical integration equipment, and oneself becomes the problem that the product design personnel must face the reliability design of electronic and electrical equipment and associated joint product.The fault of electronic product may cause economy, politics, military serious consequence, therefore must study the integrity problem of electronic product and troubleshooting issue as a special technology-oriented discipline.
In the electronic product, it is the one of the main reasons that causes electronic product reliability to reduce that the solder joint mechanical property lost efficacy, and mechanical creep then is a kind of important factor wherein.Solder joint mechanical creep failure mechanism may cause taking place in the mimic channel different failure modes, identical failure mode also may be to be caused by different failure mechanisms, whether simple research failure mode and the corresponding relation between the characterization parameter can accurately not judged fault and be caused by solder joint mechanical creep failure mechanism, thereby can not propose strong innovative approach.
At this situation, need exploration to the concrete approach of the characterization parameter of a definite mimic channel solder joint mechanical creep failure mechanism.Summing up domestic and international having now based on electric design automation (Electronic Design Automation, EDA) on the fault simulation basis, utilize the EDA simulation software to carry out circuit simulation, in conjunction with Failure Injection Technique, can explore a kind of characterization parameter of mimic channel solder joint mechanical creep failure mechanism and determine method.
Summary of the invention
The objective of the invention is: provide a kind of characterization parameter of mimic channel solder joint mechanical creep failure mechanism to determine method, can diagnose out the fault in the mimic channel whether to be caused by solder joint mechanical creep mechanism quickly and accurately.
At first introduce three definition.
Definition 1: fault is injected: artificial is applied to system with system's contingent fault under the real work situation, to study the influence that these faults cause work and the performance of system.
The definition 2: the failure mechanism degradation model: by the quantitative description of relationship in the failure mechanism mechanism Changing Pattern of certain specified quantitative, this tittle has reflected product physically or certain damage chemically or the accumulative process of consumption.
Definition 3: mimic channel: processing time and amplitude be the electronic circuit of continuous signal (continuous implication is to get infinite a plurality of numerical value in certain span) all.
Technical scheme of the present invention: in the EDA simulation software, draw out circuit diagram, replace the mechanism of solder joint mechanical creep failure mechanism in circuit with solder joint mechanical creep failure mechanism degradation model; Carry out fault at the circuit model ad-hoc location and inject, and simulated environment is set on request carries out the fault emulation experiment; Can survey node to circuit and detect, obtain fault data; Fault data is handled, extracted the characterization parameter of solder joint mechanical creep failure mechanism.
The present invention is that a kind of characterization parameter of mimic channel solder joint mechanical creep failure mechanism is determined method, and its step is as follows:
Wherein, the fault injection mode is in the step 3: (1) obtains suitable components and parts type, and selection standard is to utilize these components and parts can reflect the Changing Pattern of failure mechanism degradation model; (2) determine this failure mechanism degradation model parameter by consulting manual of standards; (3) according to the concrete deterioration law of obtaining of calculation of parameter; (4) add selected components and parts to break down in the circuit diagram position; (5) in the simulation document of setting up, the Changing Pattern of these components and parts is set at deterioration law in (3).
Wherein, the environmental baseline of emulation refers to input voltage, enlargement factor, environment temperature in the step 4.
Wherein, whether measured node refers to selectedly to exporting influential node by circuit analysis in the step 5, can decision circuitry break down by the variation of observing these nodes outputs.
Wherein, the selection principle of the characterization parameter of solder joint mechanical creep failure mechanism is in the step 7: the first, and selected characterization parameter will be convenient for measuring, be easy to obtain; The second, selected characterization parameter is wanted the comparatively generation of sensitive reflection solder joint mechanical creep failure mechanism, and is namely comparatively responsive to the solder joint mechanical creep failure mechanism that will characterize.
The present invention compared with prior art has following advantage:
The first, the present invention has provided the idiographic flow of the characterization parameter of definite mimic channel solder joint mechanical creep failure mechanism from the angle of experiment.
The second, the present invention combines Failure Injection Technique and circuit emulation method.
Description of drawings
Fig. 1 is fault injection mode process flow diagram
Fig. 2 is the method for the invention process flow diagram
The circuit diagram of Fig. 3 in the EDA simulation software, drawing
Fig. 4 is the circuit diagram of resistance after adding
Symbol description is as follows among Fig. 3,4:
L: lead
Q: triode
R: resistance
V: power supply
S: solder joint
K: resistance value unit
Vdc: magnitude of voltage unit
OUT: output terminal
RS: the back adds the resistance that replaces solder joint
Embodiment
The characterization parameter of mimic channel solder joint mechanical creep failure mechanism of the present invention determines that method sees shown in Figure 2ly, and the embodiment step of this method is as follows:
In the formula, Δ R is changes in resistance rate in the solder joint mechanical creep process; η is the growth rate of crackle in the solder joint mechanical creep process, the difference along with solder joint mechanical creep different phase; W and L be respectively solder joint with the electric current mutually perpendicular direction on wide and long; T is the time of test; Δ t is the time interval.
When the solder joint mechanical creep took place, solder joint resistance rule over time was:
R(t)=R
0（1+ΔR） (2)
Wherein, R (t) is the t actual resistance of resistance constantly; Δ R is changes in resistance rate in the solder joint mechanical creep process; R
0Be the initial resistance of solder joint, R
0Computing formula be:
Wherein, ρ is resistivity, and h is solder joint thickness, the meaning cotype (1) of W, L
Step 301 in the EDA simulation software, is chosen resistance as suitable components and parts, and selection standard is solder joint mechanical creep failure mechanism degradation model, as the formula (1), is the relational expression about resistance change rate;
Step 302 is consulted the IPC standard, obtains the parameter of solder joint mechanical creep failure mechanism degradation model;
Step 303 is according to the concrete deterioration law of calculation of parameter solder joint mechanical creep failure mechanism that obtains;
Step 304, joining resistance actual among the primary circuit figure is the position of solder joint, the position that the solder joint mechanical creep namely takes place;
Step 305, in the EDA simulation software, by the parameter scanning method, the changes in resistance rule that adding is set is the deterioration law that step 303 is obtained.Parameter scanning method concrete operations mode is: in the simulation document of setting up, select " parameter scanning " option, add the Changing Pattern of the parameter of needs setting to assigned address.
Be example with certain typical amplifying circuit, in the EDA simulation software, draw out its circuit diagram, as shown in Figure 3.By consulting the IPC-SM-782A standard, obtain L=1.65mm, W=0.57mm, h=0.15mm, η=1 * 10
-6M/s, Δ t=1s in the substitution formula (1), obtains
Suppose that the material that solder joint adopts is Sn-3.5Ag, check in its electricalresistivity=12.31u Ω cm, utilize formula (3) can obtain initial resistance R
0=19.633u Ω.
Obtain the concrete deterioration law of resistance according to formula (2), as the formula (4), wherein the unit of t is s, and the span of t is 0≤t≤547.286s,
Resistance is joined the circuit diagram that obtains behind the initial circuit figure as shown in Figure 4, the resistance of RS1-RS7 for adding wherein, circled represents the position of solder joint in the reality among Fig. 4.
In the EDA simulation software, by the parameter scanning method, the Changing Pattern of RS1-RS7 is set as the formula (5).
In this experiment, it is input voltage 2v that simulated environment is set, and enlargement factor-5, environment temperature are 27 ° of C.Begin to carry out fault simulation experiment afterwards, make resistance increase to 1982.933u Ω from 19.633u Ω, every increase 196.33u Ω carries out an emulation, can obtain the influence that generation and development thereof along with the solder joint mechanical creep cause external circuit thus.
When the solder joint mechanical creep takes place, can be to the V(OUT in this circuit), V(R13:2), I (R13), I (R14), V(R15:1), I(R15) node output impacts, and needs record output data in experimentation.
The selection principle of the characterization parameter of solder joint mechanical creep failure mechanism is, the first, and selected characterization parameter will be convenient for measuring, be easy to obtain; The second, selected characterization parameter is wanted the comparatively generation of sensitive reflection solder joint mechanical creep failure mechanism, and is namely comparatively responsive to the solder joint mechanical creep failure mechanism that will characterize.
In this experiment, calculate the accumulative total rate of change of each moment output valve of each measured node, the result is as shown in table 1.By data analysis as can be known, the node of accumulative total rate of change maximum is V(R13:2), when being the generation of solder joint mechanical creep, this node changes the most soon in time, the comparatively generation that reflects solder joint mechanical creep in this circuit of sensitivity, therefore according to the selection principle of the characterization parameter of solder joint mechanical creep failure mechanism, with V(R13:2) determine the characterization parameter of the solder joint mechanical creep failure mechanism in the circuit for this reason.
Each of each measured node of table 1 be the accumulative total rate of change of output valve constantly
| t/s | R/uΩ | V(OUT)/% | V(R13:2)/% | I(R13)/% | I(R14)/% | V(R15:1)/% | I(R15)/% |
| 0 | 19.633 | 0 | 0 | 0 | 0 | 0 | 0 |
| 547.186 | 215.963 | 1E-05 | 0.1143 | 1.17E-05 | 1.15E-05 | 1.33E-07 | 0.00856 |
| 547.236 | 412.293 | 2.9E-05 | 0.2517 | 2.32E-05 | 2.35E-05 | -6.54E-06 | 0.01716 |
| 547.253 | 608.263 | 3.8E-05 | 0.3891 | 3.47E-05 | 3.50E-05 | -6.54E-06 | 0.02533 |
| 547.261 | 804.953 | 5.7E-05 | 0.5210 | 4.67E-05 | 4.65E-05 | -1.25E-05 | 0.03393 |
| 547.266 | 1001.283 | 6.7E-05 | 0.6530 | 5.82E-05 | 5.80E-05 | -1.25E-05 | 0.04253 |
| 547.270 | 1197.613 | 8.6E-05 | 0.7904 | 6.97E-05 | 7.00E-05 | -1.92E-05 | 0.05070 |
| 547.272 | 1393.943 | 0.00011 | 0.9223 | 8.17E-05 | 9.30E-05 | -2.52E-05 | 0.05929 |
| 547.274 | 1590.273 | 0.00012 | 1.0597 | 0.00059 | 0.00010 | -2.52E-05 | 0.06746 |
| 547.275 | 1786.603 | 0.00013 | 1.1916 | 0.00010 | 0.00012 | -3.19E-05 | 0.07606 |
| 547.276 | 1982.933 | 0.00014 | 1.3235 | 0.00012 | 0.00013 | -3.19E-05 | 0.08466 |
Claims (5)
1. the characterization parameter of mimic channel solder joint mechanical creep failure mechanism is determined method, it is characterized in that: the concrete steps of this method are as follows:
Step 1, selected mimic channel is drawn out its circuit diagram in the EDA simulation software;
Step 2 replaces the mechanism of solder joint mechanical creep failure mechanism in circuit with solder joint mechanical creep failure mechanism degradation model;
Step 3 in the EDA simulation software, according to the fault injection mode, is injected into solder joint mechanical creep failure mechanism in the circuit diagram of drawing;
Step 4 arranges the environmental baseline of emulation in the EDA simulation software on request, carries out the circuit simulation experiment;
Step 5 after emulation is finished, records the different output valves constantly of each measured node;
Step 6, each that calculates each measured node be the accumulative total rate of change of output valve constantly;
Step 7, to each measured node each constantly the accumulative total rate of change of output valve compare, find out the fastest node of variation, selection principle according to solder joint mechanical creep failure mechanism characterization parameter, with the parameter of this node representative characterization parameter as mimic channel solder joint mechanical creep failure mechanism, finish determining of characterization parameter.
2. the characterization parameter of mimic channel solder joint mechanical creep failure mechanism according to claim 1 is determined method, it is characterized in that: in the fault injection mode described in the step 3 be: (1) obtains selected components and parts type, and selection standard is to utilize these components and parts can reflect the Changing Pattern of failure mechanism degradation model; (2) determine this failure mechanism degradation model parameter by consulting manual of standards; (3) according to the concrete deterioration law of obtaining of calculation of parameter; (4) add selected components and parts to break down in the circuit diagram position; (5) in the simulation document of setting up, the Changing Pattern of these components and parts is set at deterioration law in aforementioned (3).
3. the characterization parameter of mimic channel solder joint mechanical creep failure mechanism according to claim 1 is determined method, it is characterized in that: the environmental baseline in the emulation described in the step 4 refers to input voltage, enlargement factor and environment temperature.
4. the characterization parameter of mimic channel solder joint mechanical creep failure mechanism according to claim 1 is determined method, it is characterized in that: refer to selectedly to exporting influential node by circuit analysis in the measured node described in the step 5, can decision circuitry whether break down by the variation of observing these nodes outputs.
5. the characterization parameter of mimic channel solder joint mechanical creep failure mechanism according to claim 1 is determined method, it is characterized in that: the selection principle at the solder joint mechanical creep failure mechanism characterization parameter described in the step 7 is: the first, and selected characterization parameter will be convenient for measuring, be easy to obtain; The second, selected characterization parameter is wanted the generation of reflection solder joint mechanical creep failure mechanism that can be sensitive, and is namely comparatively responsive to the solder joint mechanical creep failure mechanism that will characterize.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105528943A (en) * | 2015-07-06 | 2016-04-27 | 中国电子科技集团公司第二十八研究所 | Design and implementation method of education and training system based on circuit simulation technology |
| CN108563741A (en) * | 2018-04-12 | 2018-09-21 | 中国兵器工业第五九研究所 | The environmental damage sensitive parameter screening technique of more performance parameter products |
| CN113434963A (en) * | 2021-07-22 | 2021-09-24 | 中国第一汽车股份有限公司 | Welding spot failure parameter determination method and device, electronic equipment and storage medium |
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| WO2008115323A1 (en) * | 2007-03-20 | 2008-09-25 | Exxonmobil Upstream Research Company | A framework to determine the capacity of a structure |
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| ZHAO GUANGYAN 等: "Reliability Prediction Method Based on Function and Fault Reasoning for", 《2010 THIRD INTERNATIONAL CONFERENCE ON COMMUNICATION THEORY, RELIABILITY, AND QUALITY OF SERVICE》, 31 December 2010 (2010-12-31) * |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105528943A (en) * | 2015-07-06 | 2016-04-27 | 中国电子科技集团公司第二十八研究所 | Design and implementation method of education and training system based on circuit simulation technology |
| CN108563741A (en) * | 2018-04-12 | 2018-09-21 | 中国兵器工业第五九研究所 | The environmental damage sensitive parameter screening technique of more performance parameter products |
| CN113434963A (en) * | 2021-07-22 | 2021-09-24 | 中国第一汽车股份有限公司 | Welding spot failure parameter determination method and device, electronic equipment and storage medium |
| CN113434963B (en) * | 2021-07-22 | 2022-08-09 | 中国第一汽车股份有限公司 | Welding spot failure parameter determination method and device, electronic equipment and storage medium |
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