CN103256518A - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN103256518A CN103256518A CN 201210034409 CN201210034409A CN103256518A CN 103256518 A CN103256518 A CN 103256518A CN 201210034409 CN201210034409 CN 201210034409 CN 201210034409 A CN201210034409 A CN 201210034409A CN 103256518 A CN103256518 A CN 103256518A
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- CN
- China
- Prior art keywords
- location division
- heat sink
- lgp
- backboard
- backlight module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a backlight module. A first heat radiating plate, a second heat radiating plate and a light guiding plate are sequentially placed above a back plate, and a light-emitting module is fixedly connected onto a side plate of the first heat radiating plate. A heat radiating plate positioning portion of the first heat radiating plate and a back plate positioning portion of the back plate are positioned mutually, and the light guiding plate positioning portion of the light guiding plate and the back plate positioning portion are positioned mutually. A fixing part is used for connecting a second through hole of the second heat radiating plate and a first through hole of the first heat radiating plate to enable the second heat radiating plate to be fixedly connected onto the first heat radiating plate. In addition, an abutting-against portion of the second heat radiating plate abuts against a positioning convex block of the light guiding plate to enable a light incidence face of the light guiding plate to be adjacently connected with the light-emitting module. When the light guiding plate expands with heat and contracts with cold, the first heat radiating plate, the second heat radiating plate and the light guiding plate synchronously displace to enable a gap not to exist between the light incidence face and the light-emitting module.
Description
Technical field
The present invention relates to a kind of backlight module, and particularly relate to a kind of incidence surface of LGP that makes in abutting connection with the backlight module of light emitting module.
Background technology
Existing LCD all needs to provide area source by backlight module, and backlight module can be divided into side again according to two kinds of formula backlight module and direct type backlight modules, and side is lower according to the cost of formula backlight module, so is widely used.Frame and backboard before side has generally comprised according to the formula backlight module, preceding frame and backboard are connected to each other to form accommodation space, and holding space for holding has blooming piece, LGP, reflector plate, light emitting module and heat sink.Blooming piece and reflector plate are disposed at top and the below of LGP respectively, and the side of LGP then includes incidence surface and the end face that joins.Light emitting module is fixed on the heat sink, and heat sink adopts metal system usually, is beneficial to the heat radiation of light emitting module.Heat sink is fixed on the backboard, and light emitting module is the side that is disposed at LGP with the direction in the face of incidence surface, therefore the light that produces of light emitting module is entered LGP, and the optical effect by LGP, blooming piece and reflector plate evenly mixes light again, to produce area source.
When the design backlight module, generally can leave the gap between the incidence surface of LGP and the light emitting module, this gap is for the space that provides LGP to expand with heat and contract with cold, and is urged to light emitting module when avoiding the LGP thermal expansion, light emitting module is damaged or produces displacement and influences running.But the existence in gap can allow light spill, thereby reduces luminous efficiency.
Summary of the invention
In view of this, purpose of the present invention makes the incidence surface of LGP in abutting connection with light emitting module, so that does not have the gap between incidence surface and the light emitting module proposing a kind of backlight module, but is urged to light emitting module simultaneously can avoid the LGP thermal expansion again the time.
For achieving the above object, the present invention proposes a kind of backlight module, and it includes: backboard, first heat sink, light emitting module, positioning component and LGP.The side of backboard includes the backboard location division.First heat sink includes heat sink location division, first location division and the side plate corresponding to the backboard location division.The heat sink location division is disposed at the side of first heat sink, and side plate is disposed at another side of first heat sink, and first location division is disposed at the corner of first heat sink.First heat sink is disposed at the backboard top, and the heat sink location division engages one another with the backboard location division.Light emitting module is fixed in side plate.Positioning component includes second location division and the support division corresponding to first location division, and support division is disposed at the side of positioning component, and second location division engages one another with first location division, and positioning component and first heat sink coincide.The side of LGP includes incidence surface and end face, and end face and incidence surface join, and end face includes corresponding to the LGP location division of backboard location division and locating convex block corresponding to support division.LGP is disposed at first heat sink top, and the LGP location division engages one another with the backboard location division, and support division supports locating convex block, and thus, incidence surface is in abutting connection with light emitting module.
In an embodiment of the present invention, backlight module also includes firmware, and firmware connects second location division and first location division, and positioning component is fixed in first heat sink.
In an embodiment of the present invention, positioning component is disposed between LGP and first heat sink.
In an embodiment of the present invention, first location division and second location division are through hole, and first location division is circular port, and second location division is that slotted eye, capsule shape hole, slot or other have the hole of elongate structure.
In an embodiment of the present invention, firmware is screw, and first location division includes the internal thread corresponding to described screw.Firmware by second location division and interlocking in first location division, firmware and the first heat sink clamping and stationary positioned assembly.
In an embodiment of the present invention, positioning component has the breach corresponding to side plate and luminescence component.
In an embodiment of the present invention, heat sink location division and LGP location division have respectively corresponding to one first of backboard location division and allow bit space and one second allow bit space.
In an embodiment of the present invention, the backboard location division is cylinder.Support division is the bent sheet of L font.
In an embodiment of the present invention, backlight module also includes reflector plate, plural blooming piece and preceding frame.Reflector plate is disposed at the LGP below, and blooming piece is disposed at the LGP top, and preceding frame and backboard are connected to each other to form accommodation space, and holding space for holding has blooming piece, LGP, reflector plate, first heat sink, positioning component and light emitting module.
A kind of backlight module proposed by the invention makes the incidence surface of LGP in abutting connection with light emitting module, so that does not have the gap between incidence surface and the light emitting module, and the light that can avoid light emitting module to produce spills from the gap, therefore can improve luminous efficiency.Simultaneously, first heat sink and positioning component only join with LGP, be not fixed in backboard, therefore when the LGP generation is expanded with heat and contract with cold, therefore but LGP, first heat sink and positioning component synchronous shift can be avoided LGP to be urged to light emitting module when thermal expansion and produce the situation in gap when cold the contraction.
For allowing purpose of the present invention, feature and advantage that these those skilled in the art are more readily understood, hereinafter lift a preferred embodiment, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 shows the explosive view of the backlight module of the preferred embodiment of the present invention.
Fig. 2 shows the cutaway view of the syndeton of first through hole of the preferred embodiment of the present invention and second through hole.
Fig. 3 shows the schematic diagram of the abutment structure of the incidence surface of the preferred embodiment of the present invention and light emitting module.
[primary clustering symbol description]
100: backlight module 110: backboard
111: 120: the first heat sinks in backboard location division
Through hole 122 in 121: the first: the heat sink location division
Positioning port 123 in 1221: the first: side plate
130: 140: the second heat sinks of light emitting module
Through hole 142 in 141: the second: support division
143: breach 150: firmware
160: reflector plate 170: LGP
171: incidence surface 172: end face
173: locating convex block 174: the LGP location division
1742: the second projections of 1741: the first projections
Positioning port 180 in 1743: the second: blooming piece
190: preceding frame
The specific embodiment
Please consult Fig. 1, Fig. 2 and Fig. 3 simultaneously, Fig. 1 shows the explosive view of the backlight module of one embodiment of the present invention, Fig. 2 shows the cutaway view of the syndeton of first through hole of one embodiment of the present invention and second through hole, and Fig. 3 shows the schematic diagram of the abutment structure of the incidence surface of one embodiment of the present invention and light emitting module.Backlight module 100 includes backboard 110, first heat sink 120, light emitting module 130, positioning component, firmware 150, reflector plate 160, LGP 170, plural blooming piece 180 and preceding frame 190.Preceding frame 190 is connected to each other to form accommodation space with backboard 110, and blooming piece 180, LGP 170, reflector plate 160, first heat sink 120, positioning component, light emitting module 130 are placed in this accommodation space with 150 in firmware.In the present embodiment, positioning component is second heat sink 140.
LGP 170 belows are fitted with reflector plate 160, and it is disposed at first heat sink, 120 tops, and accompany second heat sink 140 between LGP 170 and first heat sink 120, and 180 of blooming pieces are disposed at LGP 170 tops.The material of LGP 170 is polymethyl methacrylate, and its side includes incidence surface 171 and end face 172, and incidence surface is towards negative y direction, and end face is towards the x direction, and end face 172 joins with incidence surface 171.End face 172 includes corresponding to the LGP location division 174 of backboard location division 111 and locating convex block 173 corresponding to support division 142.LGP location division 174 includes between first projection 1741 that protrudes out from end face 172 and second projection, 1742, the first projections 1741 and second projection 1742 and is formed with second positioning port 1743.During assembling, second positioning port 1743 can be aimed at and pass through in backboard location division 111, second positioning port 1743 is located mutually with backboard location division 111 and is engaged one another, more specifically, second positioning port 1743 has corresponding to second of backboard location division 111 allows bit space, make LGP 170 be positioned backboard 110 tops, and allow that LGP 170 does limited displacement in the x axle.Support division 142 makes the incidence surface 171 of LGP 170 in abutting connection with light emitting module 130 in order to support locating convex block 173.
In the present embodiment, firmware 150 is screw, and first location division is that first through hole, 121, the second location divisions are second through hole 141.Firmware 150 in order to by and connect second through hole 141 and first through hole 121 makes it affixed mutually so that second heat sink 140 is fixed in first heat sink 120.First through hole 121 is circular port, and has the internal thread (not shown) corresponding to firmware 150 on its inner surface, and second through hole 141 is the capsule shape hole.During assembling, firmware 150 is from top to bottom earlier by second through hole 141, interlocking is in first through hole 121 again, the bottom interlocking of firmware 150 is in the time of first through hole 121, second heat sink 140 can be oppressed in the top of firmware 150, force second heat sink 140 to be close to first heat sink 120, be equivalent to firmware 150 and first heat sink, 120 clampings, second heat sink 140, thereby firmware 150, first heat sink 120 and second heat sink 140 are affixed mutually.Be noted that the opening section of second through hole 141 is capsule shape, its definable has major axis and minor axis, and this major axis is parallel with the y axle, and this minor axis is then parallel with the x axle, and the opening section of first through hole 121 is circular, and its diameter is equal to or slightly less than described minor axis.Therefore in assembling process and as yet not with before firmware 150 affixed first through holes 121 and second through hole 141, can be along the y axle and in the scope that does not exceed described major axis, relative position between y direction or limited change first through hole 121 of negative y direction and second through hole 141, in other words, relative position between second heat sink 140 and first heat sink 120 can be adjusted by aforesaid way, its detailed mode makes to keep no gap between the incidence surface 171 of LGP 170 and the light emitting module 130, after will be described in.In other embodiments, second through hole also can be slotted eye or slot, or other can reach the hole with elongate structure of identical purpose.In other embodiments, second heat sink is also configurable in the below of first heat sink, and the associated component under this configuration is in structural change, and those skilled in the art can utilize existing skill to change, and repeat no more in this.
From the above, the detailed assembling mode of LGP 170, first heat sink 120 and second heat sink 140 is: earlier first heat sink 120, second heat sink 140 are repeatedly put to backboard 110 tops in regular turn with LGP 170, and backboard location division 111 is in regular turn by first positioning port 1221 and second positioning port 1743.Then, first heat sink 120 is pushed away toward the y directions, up to making light emitting module 130 on the side plate 123 in abutting connection with the incidence surface 171 of LGP 170, at this moment, present gapless state between light emitting module 130 and the incidence surface 171.Then, second heat sink 140 is pushed away toward negative y direction, make the support division 142 of second heat sink 140 be held in the locating convex block 173 of LGP 170, then connect second through hole 141 and first through hole 121 with firmware 150, make LGP 170, first heat sink 120 and second heat sink 140 fix as one.Thus, incidence surface 171 will keep adjacency and gapless state with light emitting module 130.
It should be noted that first heat sink 120 is not connected with backboard 110 with second heat sink 140, therefore when LGP 170 produced thermal expansion, first heat sink 120 and 140 meetings of second heat sink are synchronous shift along with the expansion of LGP 170; When LGP 170 shrinks because of cooling, first heat sink 120 and second heat sink 140 also can be along with the contraction of LGP 170 synchronous shift, no matter LGP 170 expands or contraction, is all keeping stable syntople between incidence surface 171 and the light emitting module 130.
In sum, a kind of backlight module proposed by the invention makes the incidence surface of LGP in abutting connection with light emitting module, so that does not have the gap between incidence surface and the light emitting module, and the light that can avoid light emitting module to produce spills from the gap, therefore can improve luminous efficiency.Simultaneously, first heat sink and second heat sink are only affixed with LGP, and first positioning port of first heat sink only works in coordination to limit first heat sink in the displacement of x axle and y axle with the backboard location division, first heat sink and second heat sink are not fixed in backboard in fact, therefore when the LGP generation is expanded with heat and contract with cold, LGP, first heat sink and second heat sink can be along y axle synchronous shift, therefore can avoid LGP to be urged to light emitting module when thermal expansion and produce the situation in gap when cold the contraction.In addition, see through working in coordination of LGP location division, heat sink location division and backboard location division, also provide the space that LGP expands with heat and contract with cold in the x axle.
Though the present invention discloses as above with preferred embodiment; right its is not for restriction the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (10)
1. backlight module, it includes:
One backboard, the side of this backboard include a backboard location division;
One first heat sink, this first heat sink includes a heat sink location division corresponding to this backboard location division, one first location division and side plate, this heat sink location division is disposed at the side of this first heat sink, this side plate is disposed at another side of this first heat sink, this first location division is disposed at the corner of this first heat sink, this first heat sink is disposed at this backboard top, and this heat sink location division engages one another with this backboard location division;
One light emitting module is fixed in this side plate;
Certain hyte part, this positioning component includes second location division and a support division corresponding to this first location division, this support division is disposed at the side of this positioning component, and this second location division engages one another with this first location division, and this positioning component and this first heat sink coincide; And
One LGP, the side of this LGP includes an incidence surface and an end face, this end face and this incidence surface join, this end face includes LGP location division and the locating convex block corresponding to this support division corresponding to this backboard location division, this LGP is disposed at this first heat sink top, and this LGP location division engages one another with this backboard location division, and this support division supports this locating convex block, thus, this incidence surface is in abutting connection with this light emitting module.
2. backlight module as claimed in claim 1 also includes a firmware, and this firmware connects this second location division and this first location division, and this positioning component is fixed in this first heat sink.
3. backlight module as claimed in claim 2, wherein, this positioning component is disposed between this LGP and this first heat sink.
4. backlight module as claimed in claim 3, wherein, this first location division and this second location division are through hole, and this first location division is circular port, and this second location division is that slotted eye, capsule shape hole, slot or other have the hole of elongate structure.
5. backlight module as claimed in claim 4, wherein, this firmware is screw, and this first location division includes the internal thread corresponding to described screw, this firmware by this second location division and interlocking in this first location division, this firmware and this first heat sink clamping and fix this positioning component.
6. backlight module as claimed in claim 1, wherein, this positioning component has the breach corresponding to this side plate and this luminescence component.
7. backlight module as claimed in claim 1, wherein, this heat sink location division and this LGP location division have respectively corresponding to one first of this backboard location division allows bit space and one second allow bit space.
8. backlight module as claimed in claim 1, wherein, this backboard location division is cylinder.
9. backlight module as claimed in claim 1, wherein, this support division is the bent sheet of L font.
10. backlight module as claimed in claim 1, also include a reflector plate, plural blooming piece and a preceding frame, this reflector plate is disposed at this LGP below, those blooming pieces are disposed at this LGP top, frame and this backboard are connected to each other to form an accommodation space before being somebody's turn to do, and this holding space for holding has those blooming pieces, this LGP, this reflector plate, this first heat sink, this positioning component and this light emitting module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210034409 CN103256518A (en) | 2012-02-16 | 2012-02-16 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210034409 CN103256518A (en) | 2012-02-16 | 2012-02-16 | Backlight module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103256518A true CN103256518A (en) | 2013-08-21 |
Family
ID=48960623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210034409 Pending CN103256518A (en) | 2012-02-16 | 2012-02-16 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103256518A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104235700A (en) * | 2014-09-29 | 2014-12-24 | 南京中电熊猫液晶显示科技有限公司 | LED backlight module |
| WO2016082383A1 (en) * | 2014-11-26 | 2016-06-02 | 京东方科技集团股份有限公司 | Light guide plate positioning column, backlight module and display device |
| WO2018090899A1 (en) * | 2016-11-17 | 2018-05-24 | 京东方科技集团股份有限公司 | Backlight module and display module |
-
2012
- 2012-02-16 CN CN 201210034409 patent/CN103256518A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104235700A (en) * | 2014-09-29 | 2014-12-24 | 南京中电熊猫液晶显示科技有限公司 | LED backlight module |
| CN104235700B (en) * | 2014-09-29 | 2016-08-24 | 南京中电熊猫液晶显示科技有限公司 | A kind of LED-backlit module |
| WO2016082383A1 (en) * | 2014-11-26 | 2016-06-02 | 京东方科技集团股份有限公司 | Light guide plate positioning column, backlight module and display device |
| US10234622B2 (en) | 2014-11-26 | 2019-03-19 | Boe Technology Group Co., Ltd. | Light guide plate-positioning column, backlight module and display apparatus |
| WO2018090899A1 (en) * | 2016-11-17 | 2018-05-24 | 京东方科技集团股份有限公司 | Backlight module and display module |
| US10725233B2 (en) | 2016-11-17 | 2020-07-28 | Boe Technology Group Co., Ltd. | Backlight module and display module |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130821 |