CN103254463A - Inorganic filler capable of improving drilling performance of copper-clad plate - Google Patents
Inorganic filler capable of improving drilling performance of copper-clad plate Download PDFInfo
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- CN103254463A CN103254463A CN2013101696773A CN201310169677A CN103254463A CN 103254463 A CN103254463 A CN 103254463A CN 2013101696773 A CN2013101696773 A CN 2013101696773A CN 201310169677 A CN201310169677 A CN 201310169677A CN 103254463 A CN103254463 A CN 103254463A
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- copper
- parts
- clad plate
- drilling performance
- inorganic filler
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Abstract
The invention discloses an inorganic filler capable of improving the drilling performance of a copper-clad plate. The inorganic filler comprises the following raw materials in parts by weight: 95-105 parts of epoxy resin, 20-40 parts of phenolic resin hardener, 0.01-2.0 parts of a catalyst, 5-40 parts of sericite, and 0.01-2.0 parts of a coupling agent. The invention provides an inorganic filler capable of improving the drilling performance of a copper-clad plate, wherein sericite with a low Mohs hardness is added to improve the drilling performance of the copper-clad plate; and the material has the characteristics of being high in dimension stability, good in heat resistance, excellent in drilling performance and the like.
Description
Technical field
The present invention relates to a kind of mineral filler that improves copper-clad plate boring property.
Background technology
The work in-process manufacturing technology of relevant printed circuit board, baking formed prepreg or bonding sheet (Prepreg after system contained resin pickup with glasscloth, PP), again with made prepreg upper and lower surface in conjunction with Copper Foil or release film after high temperature hot pressing obtain copper-clad base plate or the insulcrete of cupric not, the opering characteristic of electric apparatus and the stable on heating lifting of product along with product, second-order transition temperature (Glass Transition Temperature, Tg) also requirement more and more higher (Republic of China's patent 413659) to institute's prepared material; Along with the execution of the RoHS of European Union decree, lead-free solder is replaced to be had lead solder to cause assembling temperature significantly to improve (improving the 30-40 degree), thereby the thermotolerance of substrate is required also significantly to improve, and adopts ordinary method (improving the Tg of material) can't satisfy actual requirement.So current trends are by the Dyhard RU 100 (Dicyandiamide of original polarity than the Da Yi suction with solidifying agent, DICY) change the resol (Phenol Resin) that contains the difficult suction of benzene ring structure into, and add a large amount of inorganic silicon micropowder fillers, the bad phenomenon of copper-clad plate material hardens inevitably can appear in this measure, cause printed circuit board manufacturer processing difficulties, and when the boring substrate, substrate layering, drill point fracture and the excessive bad phenomenon of equipment attrition take place easily.
Summary of the invention
In order to alleviate the deficiencies in the prior art and defective, the object of the present invention is to provide a kind of mineral filler that improves copper-clad plate boring property; The present invention has added the boring that the lower sericite of Mohs' hardness improves copper-clad plate, and this material has high dimensional stability, good thermotolerance and good characteristics such as boring performance.
The present invention adopts following technical scheme:
Improve the mineral filler of copper-clad plate boring property, the weight part of its constitutive material is: Resins, epoxy 95-105 part, resol stiffening agent 20-40 part, catalyzer 0.01-2.0 part, sericite 5-40 part and coupling agent 0.01-2.0 part.
Improve the mineral filler of copper-clad plate boring property, the weight part of its constitutive material is: 0.04 part of 100 parts of Resins, epoxy, 30 parts of resol stiffening agents, 0.04 part of catalyzer, 30 parts of sericites and coupling agent.
Described catalyzer is selected from 2E4MZ, coupling agent is selected from silane coupling agent.
Advantage of the present invention:
The invention provides a kind of mineral filler that improves copper-clad plate boring property, added the boring that the lower sericite of Mohs' hardness improves copper-clad plate, this material has high dimensional stability, good thermotolerance and good characteristics such as boring performance.
Description of drawings
Fig. 1: experimental group material Hole Wall Roughness slice map;
Fig. 2: control group Hole Wall Roughness slice map.
Embodiment
Embodiment 1:
With 100 parts of Resins, epoxy (YNBE3350A80/KEB-3165A70/KET4131A70/153-60T), 30 parts of phenolic curing agents, 60 parts of PM solvents, 0.06 part of 2E4MZ(imidazole type epoxy resin hardener), under room temperature, use mechanical stirrer to mix 1 hour, add 30 parts of 0.04 part of silane coupling agent and sericites again; Above-mentioned epoxy systems was stirred under room temperature 2 hours, manual with resin-coated on 7628 woven fiber glass, be prepreg behind the heated baking, prepreg is put Copper Foil up and down, through high temperature hot pressing be copper-clad base plate; Test board is that 8 prepregs are respectively put gained 1.6mm material after the hot pressing of 1oZ Copper Foil up and down.
Boring property testing condition is:
1, drilling machine: Hitachi; 2, use new drill point boring (helping energy); 3, bore the sheet number down: 2; 4, boring number: 3000 holes.
| The aperture | Feeding speed (IPM) | Withdrawing speed (IPM) | Rotating speed (rpm) |
| 0.3mm | 110 | 900 | 140K |
Table one: substrate performance test table:
The hole wall coarseness data as can be seen from table one, Fig. 1, Fig. 2: add the lower sericite of Mohs' hardness, can obviously improve the boring performance of substrate.
Claims (3)
1. a mineral filler that improves copper-clad plate boring property is characterized in that the weight part of its constitutive material is: Resins, epoxy 95-105 part, resol stiffening agent 20-40 part, catalyzer 0.01-2.0 part, sericite 5-40 part and coupling agent 0.01-2.0 part.
2. the mineral filler of raising copper-clad plate according to claim 1 boring property is characterized in that the weight part of its constitutive material is: 0.04 part of 100 parts of Resins, epoxy, 30 parts of resol stiffening agents, 0.04 part of catalyzer, 30 parts of sericites and coupling agent.
3. the mineral filler of raising copper-clad plate boring property according to claim 1, it is characterized in that: described catalyzer is selected from imidazole type epoxy resin hardener 2E4MZ, coupling agent is selected from silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101696773A CN103254463A (en) | 2013-05-09 | 2013-05-09 | Inorganic filler capable of improving drilling performance of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101696773A CN103254463A (en) | 2013-05-09 | 2013-05-09 | Inorganic filler capable of improving drilling performance of copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103254463A true CN103254463A (en) | 2013-08-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101696773A Pending CN103254463A (en) | 2013-05-09 | 2013-05-09 | Inorganic filler capable of improving drilling performance of copper-clad plate |
Country Status (1)
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| CN (1) | CN103254463A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101215405A (en) * | 2007-12-29 | 2008-07-09 | 东莞联茂电子科技有限公司 | Thermosetting resin composition |
| CN101412840A (en) * | 2008-11-24 | 2009-04-22 | 广东汕头超声电子股份有限公司覆铜板厂 | Epoxy resin glue for manufacturing copper clad laminate |
| CN101654543A (en) * | 2009-09-09 | 2010-02-24 | 腾辉电子（苏州）有限公司 | Epoxy resin composition |
| CN102002208A (en) * | 2009-09-03 | 2011-04-06 | 联茂(无锡)电子科技有限公司 | Epoxy resin composition and adhesive sheet and substrate made by same |
| CN102069615A (en) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | Fabrication method of copper-clad plate |
-
2013
- 2013-05-09 CN CN2013101696773A patent/CN103254463A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101215405A (en) * | 2007-12-29 | 2008-07-09 | 东莞联茂电子科技有限公司 | Thermosetting resin composition |
| CN101412840A (en) * | 2008-11-24 | 2009-04-22 | 广东汕头超声电子股份有限公司覆铜板厂 | Epoxy resin glue for manufacturing copper clad laminate |
| CN102002208A (en) * | 2009-09-03 | 2011-04-06 | 联茂(无锡)电子科技有限公司 | Epoxy resin composition and adhesive sheet and substrate made by same |
| CN101654543A (en) * | 2009-09-09 | 2010-02-24 | 腾辉电子（苏州）有限公司 | Epoxy resin composition |
| CN102069615A (en) * | 2010-11-11 | 2011-05-25 | 广东生益科技股份有限公司 | Fabrication method of copper-clad plate |
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Application publication date: 20130821 |