CN103243699B - A kind of cable surrounding soil thermal parameter measurement sensor - Google Patents
A kind of cable surrounding soil thermal parameter measurement sensor Download PDFInfo
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- CN103243699B CN103243699B CN201310190668.2A CN201310190668A CN103243699B CN 103243699 B CN103243699 B CN 103243699B CN 201310190668 A CN201310190668 A CN 201310190668A CN 103243699 B CN103243699 B CN 103243699B
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- 239000002689 soil Substances 0.000 title claims abstract description 31
- 238000005259 measurement Methods 0.000 title claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 11
- 101000631695 Homo sapiens Succinate dehydrogenase assembly factor 3, mitochondrial Proteins 0.000 claims description 13
- 102100028996 Succinate dehydrogenase assembly factor 3, mitochondrial Human genes 0.000 claims description 13
- 230000010355 oscillation Effects 0.000 claims description 10
- 230000005672 electromagnetic field Effects 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 3
- 210000003298 dental enamel Anatomy 0.000 claims description 3
- 238000004146 energy storage Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 230000003534 oscillatory effect Effects 0.000 claims description 3
- 230000009514 concussion Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 102220007331 rs111033633 Human genes 0.000 description 1
Abstract
The invention provides a kind of cable surrounding soil thermal parameter measurement sensor, mainly comprise dc source, high-power current-limiting resistance, semiconductor switch, diode, capacitance group, air core inductor group, copper ball shell and temperature pick up; The present invention has following beneficial effect: the sensor of a kind of cable surrounding soil thermal parameter measurement 1, in the present invention adopts novel main circuit topological structure, whole device reliable operation, and portability is strong, measures fast; 2, heat generating components copper ball shell of the present invention is a desirable isothermal level, makes measurement result more accurately and reliably; 3, the embodiment of the present invention rationally arranges opening and turn-off time ratio of MOSFET, makes the charge and discharge process of capacitance group continuous, produces continuous print concussion waveform, thus produces continuous print alternating magnetic field, copper ball shell is heated evenly at air core inductor group two ends.
Description
Technical field
The present invention relates to soil thermal parameter measuring technique and application thereof, particularly relate to a kind of portable sensor for power cable surrounding soil thermal parameter Real-Time Monitoring.
Background technology
In the last few years, a kind of technology utilizing thermoprobe method to measure soil thermal parameter obtained and applied more and more widely.By the temperature rise curve of measuring probe, the thermal parameter of soil just can be calculated by setting up simple Mathematical Modeling.
But also there is some technical problems in actual applications and wait to solve in current above-mentioned measuring method: 1) thermal probe surface cannot ensure it is a desirable isothermal level, the accuracy that impact is measured; 2) have ignored self thermal capacitance of thermal probe and the thermal contact resistance between thermal probe and soil in measuring process, cause the error of measurement result.3) thermal capacitance value of soil cannot be measured.Therefore, how designing and making a kind of portable, measure the measuring sensor of soil thermal parameter new fast, solve and measure based on thermoprobe method the realistic problem that soil thermal parameter faces at present, belong to one of important subject of current industry in fact.
Summary of the invention
Technical problem to be solved by this invention is, a kind of sensor of cable surrounding soil thermal parameter measurement is provided, have safe, portable, measure the feature such as quick and precisely, to overcome the deficiency that exists of technical elements and the difficulty in practice of measuring system in prior art.
Following technical scheme is adopted for solving the problems of the technologies described above, the invention provides a kind of cable surrounding soil thermal parameter measurement sensor, mainly comprise dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell and temperature pick up;
Described dc source DC11, for being whole thermal parameter measurement sensor power;
Described high-power current-limiting resistance R11, is connected with dc source DC11, for the electric current of limiting sensor charge circuit;
Described semiconductor switch K11, is connected with high-power current-limiting resistance R11, for the charge control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop;
Described diode D11, is connected with semiconductor switch K11, for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward;
Described capacitance group C11 one end is connected with diode D11, other end ground connection, is energy storage and the oscillating unit of whole device;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then the electromagnetic field producing alternation at its two ends;
It is outside that described copper ball shell is placed in air core inductor group L11, and generating heat due to eddy-current loss in the alternating electromagnetic field that air core inductor produces, is the heating module of whole sensor;
Described temperature pick up, is placed in copper ball shell inner surface, for measuring the temperature rise on copper ball shell surface;
Preferably, described capacitance group C11 comprises:
First electric capacity C21, its one end is connected with Power Diode Pumped, other end ground connection;
Second electric capacity C22, in parallel with electric capacity C21;
3rd electric capacity C23, in parallel with electric capacity C22;
4th electric capacity C24, in parallel with electric capacity C23;
5th electric capacity C25, in parallel with electric capacity C24;
6th electric capacity C26, in parallel with electric capacity C25;
Preferably, described air core inductor group L11 comprises:
First inductance L 21, its one end is connected with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
3rd inductance L 23, in parallel with inductance L 22;
4th inductance L 24, in parallel with inductance L 23;
5th inductance L 25, in parallel with inductance L 24;
6th inductance L 26, in parallel with inductance L 25;
Preferably, described semiconductor switch K11 structure is by direct-current switch power supply, MOSFET control panel, MOSFET drive plate and MOSFET module composition, the input of direct-current switch power supply is connected with 220V alternating current, described MOSFET model calling MOSFET drive plate, described MOSFET drive plate is connected with MOSFET control panel by optical fiber;
Preferably, the inductance in described air core inductor group L11 is wound on inductance framework by enamel covered wire, has lower internal resistance value, can ensure that the decay of damped oscillation waveform is slower;
Preferably, six inductance uniform vertical in described air core inductor group L11 are pasted onto the inner surface of copper ball shell, ensure that copper ball shell is heated evenly;
Preferably, the external diameter of described copper ball shell is 10cm, and wall thickness is 1mm, is that two hemispherical Shells are stitched together, and copper ball shell top has diameter to be the hole of 1cm, and the connecting line for wire and temperature pick up that copper ball shell inside is connected inductance draws copper ball shell;
Preferably, described dc source DC11 is rechargeable battery.
The present invention has following beneficial effect: the sensor of a kind of cable surrounding soil thermal parameter measurement 1, in the present invention adopts novel main circuit topological structure, whole device reliable operation, and portability is strong, measures fast; 2, heat generating components copper ball shell of the present invention is a desirable isothermal level, makes measurement result more accurately and reliably; 3, the embodiment of the present invention rationally arranges opening and turn-off time ratio of MOSFET, make the charge and discharge process of capacitance group C11 continuous, produce continuous print concussion waveform at air core inductor group L11 two ends, thus produce continuous print alternating magnetic field, copper ball shell is heated evenly.4, when the cable surrounding soil thermal parameter measurement sensor of the embodiment of the present invention is measured at the scene, the copper ball housing of sensor only need be imbedded in soil to be measured by operating personnel, the temperature value of continuous print record temperature pick up in certain time interval, drawing out the temperature rise curve of sensor, the thermal parameter of soil to be measured can be calculated by setting up comparatively accurate Mathematical Modeling.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below
Fig. 1 is the main circuit structure schematic diagram of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 2 is the electrical block diagram of the capacitance group of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 3 is the electrical block diagram of the air core inductor group of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 4 is the semiconductor switch composition block diagram of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 5 is the oscillogram of the capacitance group C11 both end voltage of cable surrounding soil thermal parameter measurement sensor of the present invention
In figure, 1, temperature pick up 2, copper ball shell 3, direct-current switch power supply 4, MOSFET drive plate 5, MOSFET control panel 6, MOSFET module
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, invention is described in further detail.
As shown in Figure 1, a sensor for cable surrounding soil thermal parameter measurement, mainly comprises dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell 2 and temperature pick up 1;
Described dc source DC11, for being whole thermal parameter measurement sensor power;
Described high-power current-limiting resistance R11, is connected with dc source DC11, for the electric current of limiting sensor charge circuit; Choose high-power current-limiting resistance R11=1 Ω, power is the high power wire wound resistor of more than 250W.
Described semiconductor switch K11, is connected with high-power current-limiting resistance R11, for the charge control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop; Preferred switching speed is less than 1 μ s, is withstand voltagely greater than 50V, and through-current capability is greater than the semiconductor switch of 50A.
Described diode D11, is connected with semiconductor switch K11, for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward; The diode of withstand voltage 50V, through-flow more than 50A can be adopted;
Described capacitance group C11 one end is connected with diode D11, other end ground connection, for energy storage and the oscillating unit of whole device, namely when semiconductor switch K11 closes, dc source DC11 is charged to capacitance group C11 by high-power current-limiting resistance R11, after K11 disconnects, capacitance group C11, by the air core inductor group L11 resonance in parallel with it, produces the wave of oscillation;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then the electromagnetic field producing alternation at its two ends.
It is outside that described copper ball shell 2 is placed in air core inductor group L11, and generating heat due to eddy-current loss in the alternating electromagnetic field that air core inductor produces, is the heating module of whole sensor;
Described temperature pick up 1, is placed in copper ball shell 2 inner surface, for measuring the temperature rise on copper ball shell 2 surface;
As shown in Figure 2, described capacitance group C11 is made up of low-loss metal polypropylene screen (MKP) Capacitance parallel connection of six 5uf, withstand voltage 50V:
First electric capacity C21, its one end is connected with Power Diode Pumped, other end ground connection;
Second electric capacity C22, in parallel with electric capacity C21;
3rd electric capacity C23, in parallel with electric capacity C22;
4th electric capacity C24, in parallel with electric capacity C23;
5th electric capacity C25, in parallel with electric capacity C24;
6th electric capacity C26, in parallel with electric capacity C25;
As shown in Figure 3, the air core inductor that described air core inductor group L11 is greater than 50A by six 3uH, through-current capability composes in parallel:
First inductance L 21, its one end is connected with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
3rd inductance L 23, in parallel with inductance L 22;
4th inductance L 24, in parallel with inductance L 23;
5th inductance L 25, in parallel with inductance L 24;
6th inductance L 26, in parallel with inductance L 25;
As shown in Figure 4, described semiconductor switch K11 structure is by direct-current switch power supply 3, MOSFET control panel 5, MOSFET drive plate 4 and MOSFET module 6 are formed, the input of direct-current switch power supply 3 is connected with 220V alternating current, described MOSFET module 6 connects MOSFET drive plate 4, and described MOSFET drive plate 4 is connected with MOSFET control panel 5 by optical fiber; The module that MOSFET module 6 selects the withstand voltage 50V of being greater than, operating current is greater than 50A; Direct-current switch power supply 3 power is 20w, and the dutycycle of the control signal (PWM modulation signal) of MOSFET control panel 5 is 0.089, and it opens with turn-off time ratio is 12us: 122us.
Preferably, the inductance in described air core inductor group L11 is wound on inductance framework by enamel covered wire, has lower internal resistance value, can ensure that the decay of damped oscillation waveform is slower.
Preferably, six inductance uniform vertical in described air core inductor group L11 are pasted onto the inner surface of copper ball shell 2, ensure that copper ball shell 2 is heated evenly.
Preferably, the external diameter of described copper ball shell 2 is 10cm, and wall thickness is 1mm, is that two hemispherical Shells are stitched together, and copper ball shell 2 top has diameter to be the hole of 1cm, and the connecting line for wire and temperature pick up 1 that copper ball shell 2 inside is connected inductance draws copper ball shell.
Preferably, described dc source DC11 is rechargeable battery, and rechargeable battery selection work voltage is the lead accumulator of the Large Copacity (as 14Ah) of 48V, and this rechargeable battery is that 4 12V Large Copacity rechargeable batteries are composed in series.
As shown in Figure 5, it is the oscillogram of capacitance group C11 both end voltage of the present invention, as can be seen from this figure, when the parameter by embodiment shown in Fig. 1 is chosen, by the control signal of MOSFET control panel embodiment illustrated in fig. 4 (corresponding to the dotted portion in Fig. 5, high level represents that MOSFET control panel is open-minded, low level represents that MOSFET control panel turns off) modulate after, make the charge and discharge process of capacitance group C11 continuous, thus produce continuous print concussion waveform (bold portion corresponding in Fig. 5).
Above disclosed is only preferred embodiment of the present invention; so can not limit interest field of the present invention with this; those skilled in the art utilize the technology contents of above-mentioned exposure to make a little simple modification, equivalent variations or modification, still belong within protection scope of the present invention.
Claims (7)
1. a cable surrounding soil thermal parameter measurement sensor, is characterized in that, comprises dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell and temperature pick up;
Described dc source DC11, for being whole thermal parameter measurement sensor power;
Described high-power current-limiting resistance R11, is connected with dc source DC11, for the electric current of limiting sensor charge circuit;
Described semiconductor switch K11, is connected with high-power current-limiting resistance R11, for the charge control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop;
Described diode D11, is connected with semiconductor switch K11, for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward;
Described capacitance group C11 one end is connected with diode D11, other end ground connection, is energy storage and the oscillating unit of whole device;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then the electromagnetic field producing alternation at its two ends;
It is outside that described copper ball shell is placed in air core inductor group L11, and generating heat due to eddy-current loss in the alternating electromagnetic field that air core inductor produces, is the heating module of whole sensor;
Described temperature pick up, is placed in copper ball shell inner surface, for measuring the temperature rise on copper ball shell surface;
Described semiconductor switch K11 structure is by direct-current switch power supply, MOSFET control panel, MOSFET drive plate and MOSFET module composition, the input of direct-current switch power supply is connected with 220V alternating current, described MOSFET model calling MOSFET drive plate, described MOSFET drive plate is connected with MOSFET control panel by optical fiber.
2. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, described capacitance group C11 comprises:
First electric capacity C21, its one end is connected with Power Diode Pumped, other end ground connection;
Second electric capacity C22, in parallel with electric capacity C21;
3rd electric capacity C23, in parallel with electric capacity C22;
4th electric capacity C24, in parallel with electric capacity C23;
5th electric capacity C25, in parallel with electric capacity C24;
6th electric capacity C26, in parallel with electric capacity C25.
3. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, described air core inductor group L11 comprises:
First inductance L 21, its one end is connected with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
3rd inductance L 23, in parallel with inductance L 22;
4th inductance L 24, in parallel with inductance L 23;
5th inductance L 25, in parallel with inductance L 24;
6th inductance L 26, in parallel with inductance L 25.
4. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, inductance in described air core inductor group L11 is wound on inductance framework by enamel covered wire, has lower internal resistance value, can ensure that the decay of damped oscillation waveform is slower.
5. cable surrounding soil thermal parameter measurement sensor according to claim 1, is characterized in that, six inductance uniform vertical in described air core inductor group L11 are pasted onto the inner surface of copper ball shell, ensures that copper ball shell is heated evenly.
6. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, the external diameter of described copper ball shell is 10cm, wall thickness is 1mm, be that two hemispherical Shells are stitched together, copper ball shell top has diameter to be the hole of 1cm, and the connecting line for wire and temperature pick up that copper ball shell inside is connected inductance draws copper ball shell.
7. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, described dc source DC11 is rechargeable battery.
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| CN201310190668.2A CN103243699B (en) | 2013-05-22 | 2013-05-22 | A kind of cable surrounding soil thermal parameter measurement sensor |
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| CN201310190668.2A CN103243699B (en) | 2013-05-22 | 2013-05-22 | A kind of cable surrounding soil thermal parameter measurement sensor |
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| CN103243699B true CN103243699B (en) | 2015-12-23 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4579461A (en) * | 1983-02-14 | 1986-04-01 | United States Steel Corporation | Dual sensor radiation pyrometer |
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| CN201508338U (en) * | 2009-10-23 | 2010-06-16 | 中国建筑科学研究院 | Soil thermal property parameter measuring device |
| CN202204605U (en) * | 2011-08-12 | 2012-04-25 | 北京农业智能装备技术研究中心 | Soil temperature sensing and transmitting device |
| CN202372211U (en) * | 2011-12-29 | 2012-08-08 | 哈尔滨商业大学 | Soil temperature and humidity measuring instrument |
| CN102854214A (en) * | 2012-08-31 | 2013-01-02 | 中国建筑科学研究院 | Soil thermophysical property parameter measuring device and measuring method |
-
2013
- 2013-05-22 CN CN201310190668.2A patent/CN103243699B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4579461A (en) * | 1983-02-14 | 1986-04-01 | United States Steel Corporation | Dual sensor radiation pyrometer |
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| CN201508338U (en) * | 2009-10-23 | 2010-06-16 | 中国建筑科学研究院 | Soil thermal property parameter measuring device |
| CN202204605U (en) * | 2011-08-12 | 2012-04-25 | 北京农业智能装备技术研究中心 | Soil temperature sensing and transmitting device |
| CN202372211U (en) * | 2011-12-29 | 2012-08-08 | 哈尔滨商业大学 | Soil temperature and humidity measuring instrument |
| CN102854214A (en) * | 2012-08-31 | 2013-01-02 | 中国建筑科学研究院 | Soil thermophysical property parameter measuring device and measuring method |
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