CN103233234B - Partial copper plating method for part - Google Patents

Partial copper plating method for part Download PDF

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Publication number
CN103233234B
CN103233234B CN201310145379.0A CN201310145379A CN103233234B CN 103233234 B CN103233234 B CN 103233234B CN 201310145379 A CN201310145379 A CN 201310145379A CN 103233234 B CN103233234 B CN 103233234B
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copper
deg
liquid
part
etching
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CN201310145379.0A
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Chinese (zh)
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CN103233234A (en
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王朝琳
姜春玉
肖红
李晖
万杰
戴晓亮
梅长春
宋斌
林宝山
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哈尔滨飞机工业集团有限责任公司
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Abstract

The invention belongs to electroplating technology and relates to the improvement of a partial copper plating method for a part. The method is characterized in that the copper electroplating protection comprises the following steps: carrying out pre-plating treatment; electroplating copper on the whole part; protecting the partially copper-plated region; removing the copper; and removing a polytetrafluoroethylene tape. The method provided by the invention has the following advantages: firstly, the phenomenon that partial nitridation/cyanide infiltration treated area is plated with copper is prevented, and simultaneously, a protective substance can be conveniently cleaned off so as to protect the local nitridation/cyanide infiltration treatment effect; and secondly, process flow is simplified, and two times of pre-plating treatment are regulated to one time of pre-plating treatment.

Description

A kind of parts locally copper electroplating method

Technical field

The invention belongs to electroplating technology, relate to the improvement to parts locally copper electroplating method.

Background technology

In the manufacturing processed of some part, need to parts locally nitriding/ooze cyanogen process to improve hardness and the wear resistance in this region.For preventing non-nitriding/ooze cyanogen region in the change of nitriding/ooze physicals in cyanogen process, adopt copper plate (thickness of coating >=50um) as anti-nitriding/ooze cyanogen protective layer.In local copper facing process; need to soak for a long time in copper plating solution; soak time 3h ~ 4h; in order to prevent selective nitriding/ooze cyanogen treatment zone to plate layers of copper; need to adopt plumbous adhesive tape bonding or adopt the method protection selective nitriding of coating chemical milling protective colloid/ooze cyanogen treatment zone, then carry out copper facing.Its shortcoming is: the first, protected effect is poor.According to plumbous adhesive tape bonding method protection selective nitriding/ooze cyanogen treatment zone; the poor sealing performance of plumbous adhesive tape, in long-time electroplating process, electroplate liquid easily infiltrates protected area; cause selective nitriding/ooze cyanogen treatment zone to plate layers of copper, affect nitriding/ooze cyanogen treatment effect.According to the method protection selective nitriding/ooze cyanogen treatment zone of coating chemical milling protective colloid, after plating, chemical milling protective colloid is difficult to remove, and has residual in selective nitriding/ooze cyanogen treatment zone, affects nitriding/ooze cyanogen treatment effect equally.The second, processing method is loaded down with trivial details.Need first to carry out in Solvent degreasing, electrochemical deoiling, electrochemical degreasing, burn into part before insulation dress is hung and etc. a series for the treatment of before plating, insulation dress just can be electroplated after needing again to carry out treatment before plating after hanging.

Summary of the invention

The object of the invention is: propose a kind ofly can prevent selective nitriding/ooze cyanogen treatment zone from plating layers of copper, be convenient to remove the parts locally copper electroplating method of protection simultaneously, to ensure the effect of selective nitriding/ooze cyanogen process.Two of object of the present invention is simplification of flowsheets.

Technical scheme of the present invention is: a kind of parts locally copper electroplating method, and in nitriding or ooze in cyanogen process and protect non-nitriding or ooze cyanogen position, it is characterized in that, the step of electro-coppering protection is as follows:

1, treatment before plating:

1.1, Solvent degreasing: adopt one of following method to carry out oil removing:

1.1.1, adopt trichloroethylene steam oil removing, part is put into trichloroethylene steam degreasing tank, trichloroethylene steam temperature is 87 DEG C ~ 91 DEG C, and the oil removing time is 1min ~ 5min;

1.1.2, adopt absorbent cotton to dip acetone or butanone solvent wiper element surface, remove the greasy dirt of piece surface;

1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 3min ~ 20min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 60g/l ~ 80g/l;

Sodium carbonate: 20g/l ~ 40g/l;

Sodium phosphate: 20g/l ~ 40g/l;

Water glass: 3g/l ~ 10g/l;

Solvent is deionized water;

The temperature of degreasing fluid: 70 DEG C ~ 90 DEG C;

1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 3min ~ 5min, anode oil removing 1min ~ 5min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 30g/l ~ 50g/l;

Sodium carbonate: 20g/l ~ 30g/l;

Sodium phosphate: 20g/l ~ 30g/l;

Water glass: 3g/l ~ 5g/l;

The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 40g/l ~ 60g/l;

Solvent is deionized water;

Plate material: mild steel plate or Nickeled Steel Plate;

Current density: 3A/dm 2~ 10A/dm 2;

The temperature of electrochemical degreasing liquid: 60 DEG C ~ 80 DEG C;

1.4, corrode:

1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is more than 50%, if the volume of fourth is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 10 DEG C ~ 40 DEG C; The deep-etching time: be not more than 10min;

1.4.2, weak corrosion: part is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, sulfuric acid or the concentration of weak corrosive fluid to be concentration be 100g/l ~ 150g/l are the hydrochloric acid of 100g/l ~ 150g/l, the temperature of weak corrosive fluid is 10 DEG C ~ 40 DEG C, and weak etching time is 0.5min ~ 2min;

1.5, neutralize: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 30g/l ~ 50g/l, the temperature of neutralizer is 10 DEG C ~ 40 DEG C, in and the time be 0.5min ~ 1min;

2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:

Cuprous cyanide: 35g/l ~ 70g/l;

Sodium cyanide: 7g/l ~ 15g/l;

Sodium hydroxide: 10g/l ~ 15g/l;

Seignette salt: 30g/l ~ 60g/l;

Sodium carbonate: < 60g/l;

Solvent is deionized water;

Anode material: fine copper copper coin;

Temperature of electroplating solution: 40 DEG C ~ 60 DEG C;

Current density: 1A/dm 2~ 4A/dm 2;

Thickness of coating: 50 μm ~ 80 μm;

3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;

4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1h ~ 1.5h, go the formula of copper liquid to be:

Chromic anhydride: 100g/l ~ 150g/l;

Sulfuric acid: 20g/l ~ 30g/l;

Solvent is deionized water;

Remove copper liquid temperature: 10 DEG C ~ 40 DEG C;

5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.

Advantage of the present invention is: the first, can prevent selective nitriding/ooze cyanogen treatment zone from plating layers of copper, being convenient to remove protection simultaneously, thus ensure that the effect of selective nitriding/ooze cyanogen process.The second, simplify technical process, original second time electroplating pretreatment procedure is optimized for a pretreatment procedure.Three, by the protection in non-copper facing region before plating; the protection in preventing local nitriding after being adjusted to overall plating/ooze cyanogen copper facing region; before adjustment, protecting materials soaks 3h ~ 4h in copper electroplating solution; after adjustment, protecting materials only need go to soak 1h ~ 1.5h in copper solutions, reduces protecting materials soak time in the solution.

Accompanying drawing explanation

Fig. 1 is that in embodiment 1, stop collar needs local plated copper structure schematic diagram, and a, b, c in figure tri-regions are the regions needing nitriding/ooze cyanogen process, and remaining part is the region needing copper facing to protect.

Fig. 2 is that embodiment 2 times stop collar back-up rings need the copper-plated design of part schematic diagram in local, and the several region of d, e, f, g, h in figure is the region needing nitriding/ooze cyanogen process, and rest part is the region needing copper facing to protect.

Fig. 3 is that embodiment 3 times stop collars need the copper-plated design of part schematic diagram in local, and the several region of i, j in figure is the region needing nitriding/ooze cyanogen process, and rest part is the region needing copper facing to protect.

Embodiment

Below the present invention is described in further details.The present invention is a kind of parts locally copper electroplating method, and in nitriding or ooze in cyanogen process and protect non-nitriding or ooze cyanogen position, it is characterized in that, the step of electro-coppering protection is as follows:

1, treatment before plating:

1.1, Solvent degreasing: adopt one of following method to carry out oil removing:

1.1.1, adopt trichloroethylene steam oil removing, part is put into trichloroethylene steam degreasing tank, trichloroethylene steam removes oil temperature 87 DEG C ~ 91 DEG C, oil removing time 1min ~ 3min;

1.1.2, adopt absorbent cotton to dip acetone or butanone solvent wiper element surface, remove the greasy dirt of piece surface;

1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 3min ~ 20min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 60g/l ~ 80g/l;

Sodium carbonate: 20g/l ~ 40g/l;

Sodium phosphate: 20g/l ~ 40g/l;

Water glass: 3g/l ~ 10g/l;

Solvent is deionized water;

The temperature of degreasing fluid: 70 DEG C ~ 90 DEG C;

1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 3min ~ 5min, anode oil removing 1min ~ 5min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 30g/l ~ 50g/l;

Sodium carbonate: 20g/l ~ 30g/l;

Sodium phosphate: 20g/l ~ 30g/l;

Water glass: 3g/l ~ 5g/l;

The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 40g/l ~ 60g/l;

Solvent is deionized water;

Plate material: mild steel plate or Nickeled Steel Plate;

Current density: 3g/l ~ 10g/l;

The temperature of electrochemical degreasing liquid: 60 DEG C ~ 80 DEG C;

1.4, corrode:

1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is more than 50%, if the volume of fourth is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 10 DEG C ~ 40 DEG C; The deep-etching time: be not more than 10min;

1.4.2, weak corrosion: part is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, sulfuric acid or the concentration of weak corrosive fluid to be concentration be 100g/l ~ 150g/l are the hydrochloric acid of 100g/l ~ 150g/l, the temperature of weak corrosive fluid is 10 DEG C ~ 40 DEG C, and weak etching time is 0.5min ~ 2min;

1.5, neutralize: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 30g/l ~ 50g/l, the temperature of neutralizer is 10 DEG C ~ 40 DEG C, in and the time be 0.5min ~ 1min;

2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:

Cuprous cyanide: 35g/l ~ 70g/l;

Sodium cyanide: 7g/l ~ 15g/l;

Sodium hydroxide: 10g/l ~ 15g/l;

Seignette salt: 30g/l ~ 60g/l;

Sodium carbonate: < 60g/l;

Solvent is deionized water;

Anode material: fine copper copper coin;

Temperature of electroplating solution: 40 DEG C ~ 60 DEG C;

Current density: 1A/dm 2~ 4A/dm 2;

Thickness of coating: 50 μm ~ 80 μm;

3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;

4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1h ~ 1.5h, go the formula of copper liquid to be:

Chromic anhydride: 100g/l ~ 150g/l;

Sulfuric acid: 20g/l ~ 30g/l;

Solvent is deionized water;

Remove copper liquid temperature: 10 DEG C ~ 40 DEG C;

5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.

Embodiment 1: on certain type machine, stop collar needs local copper facing, see tri-regions of a, b, the c in Fig. 1, they are the regions needing nitriding/ooze cyanogen process, and remaining part is the region needing copper facing to protect.

1, treatment before plating:

1.1, Solvent degreasing:

Adopt trichloroethylene steam oil removing, part is put into trichloroethylene steam degreasing tank, trichloroethylene steam temperature is 90 DEG C, and the oil removing time is 3min;

1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 4min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 65.4g/l;

Sodium carbonate: 32.2g/l;

Sodium phosphate: 29.5g/l;

Water glass: 5.6g/l;

Solvent is deionized water;

The total alkalinity of degreasing fluid is equivalent to NaOH concentration 45.2g/l;

The temperature of degreasing fluid: 80 DEG C;

1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 4min, anode oil removing 3min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 35.4g/l;

Sodium carbonate: 22.8g/l;

Sodium phosphate: 23.5g/l;

Water glass: 3.9g/l;

The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 43.8g/l;

Solvent is deionized water;

Plate material: mild steel plate;

Current density: 9A;

The temperature of electrochemical degreasing liquid: 70 DEG C;

1.4, corrode:

1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is more than 59%, if the volume of fourth is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 13 DEG C; The deep-etching time: 3min;

1.4.2, weak corrosion: the part through deep-etching is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, the hydrochloric acid of weak corrosive fluid to be concentration be 125g/l, the temperature of weak corrosive fluid is 13 DEG C, and weak etching time is 1min;

1.5, neutralize: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 42.6g/l, the temperature of neutralizer is 12 DEG C, in and the time be 0.6min;

2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:

Cuprous cyanide: 38.5g/l;

Sodium cyanide: 10.2g/l;

Sodium hydroxide: 12.5g/l;

Seignette salt: 35.6g/l;

Sodium carbonate: 20.4g/l;

Solvent is deionized water;

Anode material: fine copper copper coin;

Temperature of electroplating solution: 46 DEG C;

Electric current: 9A;

Thickness of coating: 62 μm;

3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;

4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1.2h, go the formula of copper liquid to be:

Chromic anhydride: 122g/l;

Sulfuric acid: 23.5g/l;

Solvent is deionized water;

Remove copper liquid temperature: 13 DEG C;

5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.

Embodiment 2: under certain type machine, stop collar back-up ring needs local copper facing, d, e, f, g, h five regions in ginseng Fig. 2 are the regions needing nitriding/ooze cyanogen process, and remaining part is the region needing copper facing to protect.

1, treatment before plating:

1.1, Solvent degreasing:

Adopt absorbent cotton to dip acetone or butanone solvent wiper element surface, remove the greasy dirt of piece surface;

1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 3min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 66.2g/l;

Sodium carbonate: 35.4g/l;

Sodium phosphate: 30.2g/l;

Water glass: 5.7g/l;

Solvent is deionized water;

The total alkalinity of degreasing fluid is equivalent to NaOH concentration 46.1g/l;

The temperature of degreasing fluid: 74 DEG C;

1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 4min, anode oil removing 1.5min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 38.2g/l;

Sodium carbonate: 25.4g/l;

Sodium phosphate: 26.3g/l;

Water glass: 3.6g/l;

The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 46.6g/l;

Solvent is deionized water;

Plate material: mild steel plate;

Electric current: 16A;

The temperature of electrochemical degreasing liquid: 72 DEG C;

1.4, corrode:

1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is 62%, if fourth volume is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 12 DEG C; The deep-etching time: 3min;

1.4.2, weak corrosion: part is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, the hydrochloric acid of weak corrosive fluid to be concentration be 125g/l, the temperature of weak corrosive fluid is 14 DEG C, and weak etching time is 1min;

1.5, neutralize: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 38.6g/l, the temperature of neutralizer is 12 DEG C, in and the time be 0.8min;

2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:

Cuprous cyanide: 55.2g/l;

Sodium cyanide: 12.2g/l;

Sodium hydroxide: 11.8g/l;

Seignette salt: 40.5g/l;

Sodium carbonate: 21.2g/l;

Solvent is deionized water;

Anode material: fine copper copper coin;

Temperature of electroplating solution: 54 DEG C;

Current density: 12A;

Thickness of coating: 58 μm;

3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;

4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1.2h, go the formula of copper liquid to be:

Chromic anhydride: 132g/l;

Sulfuric acid: 24.5g/l;

Solvent is deionized water;

Remove copper liquid temperature: 13 DEG C;

5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.

Embodiment 3: under certain type machine, stop collar needs local copper facing, be the region needing nitriding/ooze cyanogen process see i, j Two Areas in Fig. 3, remaining part is the region needing copper facing to protect.

1, treatment before plating:

1.1, Solvent degreasing:

Adopt trichloroethylene steam oil removing, part is put into trichloroethylene steam degreasing tank, trichloroethylene steam temperature is 89 DEG C, and the oil removing time is 3min;

1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 4min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 64.4g/l;

Sodium carbonate: 32.2g/l;

Sodium phosphate: 27.5g/l;

Water glass: 6.4g/l;

Solvent is deionized water;

The total alkalinity of degreasing fluid is equivalent to NaOH concentration 48.2g/l;

The temperature of degreasing fluid: 74 DEG C;

1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 4min, anode oil removing 1.5min, the formula of electrochemical deoiling liquid is:

Sodium hydroxide: 33.4g/l;

Sodium carbonate: 24.8g/l;

Sodium phosphate: 23.5g/l;

Water glass: 4.1g/l;

The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 45.8g/l;

Solvent is deionized water;

Plate material: Nickeled Steel Plate;

Current density: 28A;

The temperature of electrochemical degreasing liquid: 69 DEG C;

1.4, corrode:

1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is 60%, if the volume of fourth is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 12 DEG C; The deep-etching time: 2min;

1.4.2, weak corrosion: part is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, the hydrochloric acid of weak corrosive fluid to be concentration be 128g/l, the temperature of weak corrosive fluid is 14 DEG C, and weak etching time is 1.5min;

1.5, neutralize: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 41.2g/l, the temperature of neutralizer is 12 DEG C, in and the time be 0.8min;

2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:

Cuprous cyanide: 42.6g/l;

Sodium cyanide: 12.1g/l;

Sodium hydroxide: 12.4g/l;

Seignette salt: 45.6g/l;

Sodium carbonate: 17.2g/l;

Solvent is deionized water;

Anode material: fine copper copper coin;

Temperature of electroplating solution: 49 DEG C;

Current density: 16.8A;

Thickness of coating: 68 μm;

3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;

4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1.3h, go the formula of copper liquid to be:

Chromic anhydride: 131g/l;

Sulfuric acid: 25.5g/l;

Solvent is deionized water;

Remove copper liquid temperature: 12 DEG C;

5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.

Claims (1)

1. a parts locally copper electroplating method, in nitriding or ooze in cyanogen process and protect non-nitriding or ooze cyanogen position, it is characterized in that, the step of electro-coppering protection is as follows:
1.1, treatment before plating:
1.1.1, Solvent degreasing: adopt one of following method to carry out oil removing:
1.1.1.1, adopt trichloroethylene steam oil removing, part is put into trichloroethylene steam degreasing tank, trichloroethylene steam removes oil temperature 87 DEG C ~ 91 DEG C, oil removing time 1min ~ 3min;
1.1.1.2, adopt absorbent cotton to dip acetone or butanone solvent wiper element surface, remove the greasy dirt of piece surface;
1.1.2, electrochemical deoiling: part is put into the degreasing tank that electrochemical deoiling liquid is housed and soak 3min ~ 20min, the formula of electrochemical deoiling liquid is:
Sodium hydroxide: 60g/l ~ 80g/l;
Sodium carbonate: 20g/l ~ 40g/l;
Sodium phosphate: 20g/l ~ 40g/l;
Water glass: 3g/l ~ 10g/l;
Solvent is deionized water;
The temperature of degreasing fluid: 70 DEG C ~ 90 DEG C;
1.1.3, electrochemical degreasing: part is put into the degreasing tank that electrochemical degreasing liquid is housed and to be energized oil removing, negative electrode oil removing 3min ~ 5min, anode oil removing 1min ~ 5min, the formula of electrochemical deoiling liquid is:
Sodium hydroxide: 30g/l ~ 50g/l;
Sodium carbonate: 20g/l ~ 30g/l;
Sodium phosphate: 20g/l ~ 30g/l;
Water glass: 3g/l ~ 5g/l;
The total alkalinity of electrochemical degreasing liquid is equivalent to NaOH concentration 40g/l ~ 60g/l;
Solvent is deionized water;
Plate material: mild steel plate or Nickeled Steel Plate;
Current density: 3A/dm 2~ 10A/dm 2;
The temperature of electrochemical degreasing liquid: 60 DEG C ~ 80 DEG C;
1.1.4, corrosion:
1.1.4.1, deep-etching: part is put into the deep-etching groove that deep-etching liquid is housed and carry out deep-etching, the formula of deep-etching liquid is as follows: the volumetric concentration of hydrochloric acid is more than 50%, if the volume of fourth is 0.4% of hydrochloric acid volume; The temperature of deep-etching liquid: 10 DEG C ~ 40 DEG C; The deep-etching time: be not more than 10min;
1.1.4.2, weak corrosion: part is put into the weak etching tank that weak corrosive fluid is housed and carry out weak corrosion, sulfuric acid or the concentration of weak corrosive fluid to be concentration be 100g/l ~ 150g/l are the hydrochloric acid of 100g/l ~ 150g/l, the temperature of weak corrosive fluid is 10 DEG C ~ 40 DEG C, and weak etching time is 0.5min ~ 2min;
1.1.5, neutralization: part is put into the neutralizing well that neutralizer is housed and neutralize, the sodium carbonate of neutralizer to be concentration be 30g/l ~ 50g/l, the temperature of neutralizer is 10 DEG C ~ 40 DEG C, in and the time be 0.5min ~ 1min;
1.2, the overall electro-coppering of part: be placed in copper plating solution by the part after being tied and electroplate, plating solution formula is:
Cuprous cyanide: 35g/l ~ 70g/l;
Sodium cyanide: 7g/l ~ 15g/l;
Sodium hydroxide: 10g/l ~ 15g/l;
Seignette salt: 30g/l ~ 60g/l;
Sodium carbonate: < 60g/l;
Solvent is deionized water;
Anode material: fine copper copper coin;
Temperature of electroplating solution: 40 DEG C ~ 60 DEG C;
Current density: 1A/dm 2~ 4A/dm 2;
Thickness of coating: 50 μm of m ~ 80 μm m;
1.3, local copper facing locality protection: copper facing region, local is non-nitriding or oozes cyanogen region, need to protect, tetrafluoroethylene adhesive tape is adopted to be pasted by copper facing region overlay in local, when pasting tetrafluoroethylene adhesive tape, should ensure that in adhesive tape, bubble-free retains, after stickup, tape edge is compressed, itself and piece surface are fitted tightly;
1.4, remove copper: part is put into the copper groove that goes that copper liquid is housed and soak 1h ~ 1.5h, go the formula of copper liquid to be:
Chromic anhydride: 100g/l ~ 150g/l;
Sulfuric acid: 20g/l ~ 30g/l;
Solvent is deionized water;
Remove copper liquid temperature: 10 DEG C ~ 40 DEG C;
1.5, tetrafluoroethylene adhesive tape is removed: peeled off from copper facing region, piece surface local by tetrafluoroethylene adhesive tape.
CN201310145379.0A 2013-04-24 2013-04-24 Partial copper plating method for part CN103233234B (en)

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CN104005065A (en) * 2014-06-11 2014-08-27 沈阳飞机工业(集团)有限公司 Electrocoppering method for TC2 titanium alloy
CN104532316B (en) * 2014-12-11 2017-02-22 贵州红林机械有限公司 Anti-nitridation process for copper-tin composite plating
CN105177607A (en) * 2015-07-21 2015-12-23 安徽江威精密制造有限公司 Copper piece degreasing agent and preparation method thereof
CN105256350A (en) * 2015-10-14 2016-01-20 哈尔滨飞机工业集团有限责任公司 Electroplating pretreatment method for high alloy steel
CN105780028A (en) * 2016-01-13 2016-07-20 哈尔滨飞机工业集团有限责任公司 Method for removing flow marks and dark spots on surface of aluminum plate
CN105671606A (en) * 2016-02-25 2016-06-15 哈尔滨飞机工业集团有限责任公司 Insulation method for partial copper plating
CN108673064A (en) * 2018-05-29 2018-10-19 宁波江丰电子材料股份有限公司 The method of sputtering target material SB welding sandblasting rear protectings
CN109972179A (en) * 2018-12-11 2019-07-05 中国航发贵州红林航空动力控制科技有限公司 A kind of metal molybdenum chrome-faced process
CN109338421A (en) * 2018-12-12 2019-02-15 中国航发贵州红林航空动力控制科技有限公司 A kind of cyanide-free copper electroplating technique of high temperature resistant thermo-chemical treatment

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CN1508289A (en) * 2002-12-17 2004-06-30 余章军 Photo permeable character electroplated button preparing process
CN101220491A (en) * 2007-10-08 2008-07-16 四川长虹电器股份有限公司 Partially plating method for plastic parts

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