CN103231487A - Small desktop low-temperature low-pressure glue injection machine - Google Patents
Small desktop low-temperature low-pressure glue injection machine Download PDFInfo
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- CN103231487A CN103231487A CN2013101577647A CN201310157764A CN103231487A CN 103231487 A CN103231487 A CN 103231487A CN 2013101577647 A CN2013101577647 A CN 2013101577647A CN 201310157764 A CN201310157764 A CN 201310157764A CN 103231487 A CN103231487 A CN 103231487A
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Abstract
The invention discloses a small desktop low-temperature low-pressure glue injection machine. The small desktop low-temperature low-pressure glue injection machine comprises a worktable, a control box, a mold platform and glue melting equipment; the control box and the mold platform are arranged on the worktable; a mold clamping cylinder is arranged above the mold platform; an upper mold plate and a lower mold plate used for fixing a mold are arranged below the mold clamping cylinder; a protective cover is arranged on the periphery of the mold clamping cylinder; a transverse glue gun is arranged on one sides of the upper mold plate and the lower mold plate; the glue gun is arranged above a gun seat; an adjustment handwheel is arranged below the gun seat; and mouths of the glue gun face the directions of the upper mold plate and the lower mold plate. By the adoption of low-pressure glue injection, components are not damaged, the sealing performance is high and the product precision is high, so that the defective rate of products are greatly reduced; the total production is saved; a flue material for product package does not contain any solvent and is a non-toxic harmless one-component environmental material; and in addition, According to the machine, the development period is shortened and the production efficiency is greatly improved.
Description
Technical field
The present invention relates to encapsulation and the protection field of the electronic devices and components of precision, sensitivity, be specifically related to a kind of small desk low-temp low-pressure glue-injection machine.
Background technology
Aspect the encapsulation and protection of accurate, responsive electronic devices and components, sealing is the comparatively method in common to the encapsulation of these type of electronic devices and components and protection, but has very big deficiency in the existing sealing technology, and is too big as the pressure of injecting glue, damages components and parts; Sealing is relatively poor after the product sealing, makes shorten greatly the service life of product; The product quality that sealing is used does not pass a test, and what contain pollutes the environment etc. easily.In addition, current injecting glue equipment mostly has only vertical injecting glue, to the quite inconvenience of injecting glue of some product.
Summary of the invention
The object of the present invention is to provide the small desk low-temp low-pressure glue-injection machine of low, the harmless components and parts of a kind of injection pressure, good airproof performance, environmental protection.
Technical scheme of the present invention is, a kind of small desk low-temp low-pressure glue-injection machine, comprise workbench, control cabinet, mold platform and melten gel equipment, described control cabinet and described mold platform are arranged on the workbench, the top of described mold platform is provided with the matched moulds cylinder, described matched moulds cylinder below is provided with cope match-plate pattern and the lower bolster for fixed mould, be provided with guard shield around the described matched moulds cylinder, described cope match-plate pattern and lower bolster one side are provided with a horizontal glue rifle, described glue rifle is arranged at the gun platform top, described gun platform below is provided with an adjusting handle, and described glue muzzle is towards cope match-plate pattern and lower bolster direction.
In a preferred embodiment of the present invention, the mould-closing stroke between described cope match-plate pattern and the lower bolster is 150mm.
In a preferred embodiment of the present invention, described glue rifle ejection stroke is 50mm, and rifle mouth height is 100-180mm, and the horizontal sliding stroke of described glue rifle is 50mm.
Of the present invention is a kind of small desk low-temp low-pressure glue-injection machine, adopts low-pressure glue-injection, harmless components and parts, good airproof performance, product precision height make the defect rate of product reduce greatly, have saved total cost of production, the sizing material of product encapsulation usefulness does not contain any solvent, be nontoxic one-component environment-friendly materials, in addition, this equipment has shortened the construction cycle, promoted production efficiency significantly, simultaneously, owing to be horizontal injecting glue, the injecting glue that can increase product is selected.
Description of drawings
Fig. 1 is the structural representation of a preferred embodiment of the present invention;
Each mark is as follows in the accompanying drawing: 1, workbench, 2, control cabinet, 3, mold platform, 4, melten gel equipment, 5, the matched moulds cylinder, 6, cope match-plate pattern, 7, lower bolster, 8, guard shield, 9, the glue rifle, 10, gun platform, 11, adjusting handle.
The specific embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
Of the present invention is a kind of small desk low-temp low-pressure glue-injection machine, referring to shown in Figure 1, comprise workbench 1, control cabinet 2, mold platform 3 and melten gel equipment 4, described control cabinet 2 and described mold platform 3 are arranged on the workbench 1, described control cabinet 2 is provided with man-machine interface and power switch, the top of described mold platform 3 is provided with matched moulds cylinder 5, described matched moulds cylinder 5 belows are provided with cope match-plate pattern 6 and the lower bolster 7 for fixed mould, be provided with guard shield 8 around the described matched moulds cylinder 5, described cope match-plate pattern 6 and lower bolster 7 one sides are provided with a horizontal glue rifle 9, described glue rifle 9 is arranged at gun platform 10 tops, described gun platform 10 belows are provided with an adjusting handle 11,9 mouthfuls in described glue rifle is towards cope match-plate pattern 6 and lower bolster 7 directions, and described mold platform 3 one sides arrange double startup button and danger button.The clamping pressure of described matched moulds cylinder 5 is 0.4-0.8t, mould-closing stroke between described cope match-plate pattern 6 and the lower bolster 7 is 150mm, described glue rifle 9 ejection strokes are 50mm, rifle mouth height is 100-180mm and is adjustable, described glue rifle 9 horizontal sliding strokes are 50mm, and the accuracy of temperature control of described melten gel equipment 4 is ± 1 ℃.
The employed PUR of this product is mainly used in encapsulation and the protection of the electronic devices and components of precision, sensitivity, comprising: printed substrate (PCB), automobile electronics, mobile phone, battery, wire harness, water-proof connector, sensor, microswitch, inductor, antenna, strop etc.
The operation principle of this product is as follows:
1) sizing material is put into the melten gel unit, set the temperature of glue cylinder, sebific duct, glue rifle, open heater switch, glue cylinder, sebific duct, glue rifle begin heating.
2) mould is fixed on cope match-plate pattern and the lower bolster, when glue cylinder, sebific duct, glue rifle temperature reach design temperature and sizing material and have melted, set the injecting glue parameter, duty is chosen as production status, both hands press the button, and matched moulds, advance rifle, injecting glue, pressurize, cool off, move back rifle, die sinking, push rod; Repeat to enter working cycles next time then.Injecting glue time, dwell time, matched moulds, opening speed all can be regulated.
A kind of small desk low-temp low-pressure glue-injection machine of the present invention adopts low-pressure glue-injection, harmless components and parts, good airproof performance, product precision height make the defect rate of product reduce greatly, have saved total cost of production, the sizing material of product encapsulation usefulness does not contain any solvent, be nontoxic one-component environment-friendly materials, in addition, this equipment has shortened the construction cycle, promoted production efficiency significantly, simultaneously, owing to be horizontal injecting glue, the injecting glue that can increase product is selected.
The above only is the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can expect without creative work all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. small desk low-temp low-pressure glue-injection machine, it is characterized in that: comprise workbench, control cabinet, mold platform and melten gel equipment, described control cabinet and described mold platform are arranged on the workbench, the top of described mold platform is provided with the matched moulds cylinder, described matched moulds cylinder below is provided with cope match-plate pattern and the lower bolster for fixed mould, be provided with guard shield around the described matched moulds cylinder, described cope match-plate pattern and lower bolster one side are provided with a horizontal glue rifle, described glue rifle is arranged at the gun platform top, described gun platform below is provided with an adjusting handle, and described glue muzzle is towards cope match-plate pattern and lower bolster direction.
2. small desk low-temp low-pressure glue-injection machine according to claim 1, it is characterized in that: the mould-closing stroke between described cope match-plate pattern and the lower bolster is 150mm.
3. small desk low-temp low-pressure glue-injection machine according to claim 1, it is characterized in that: described glue rifle ejection stroke is 50mm, and rifle mouth height is 100-180mm, the horizontal sliding stroke of described glue rifle is 50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310157764.7A CN103231487B (en) | 2013-05-02 | 2013-05-02 | A kind of small desktop low-temperature low-pressure glue injection machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310157764.7A CN103231487B (en) | 2013-05-02 | 2013-05-02 | A kind of small desktop low-temperature low-pressure glue injection machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103231487A true CN103231487A (en) | 2013-08-07 |
| CN103231487B CN103231487B (en) | 2016-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310157764.7A Active CN103231487B (en) | 2013-05-02 | 2013-05-02 | A kind of small desktop low-temperature low-pressure glue injection machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291347A (en) * | 2015-09-08 | 2016-02-03 | 合肥邦立电子股份有限公司 | Packaging production process of reed switch |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080040485A (en) * | 2006-11-03 | 2008-05-08 | 두원공과대학산학협력단 | A low temperature and pressure injection molding machine using hot melt |
| CN101816997A (en) * | 2010-01-20 | 2010-09-01 | 刘振 | Low-pressure glue-injection machine |
| CN202241805U (en) * | 2011-08-31 | 2012-05-30 | 苏州海特姆德光伏科技有限公司 | Low-temperature glue injection machine |
| CN203246033U (en) * | 2013-05-02 | 2013-10-23 | 苏州海特姆德光伏科技有限公司 | Mini-type table-type low temperature low-pressure glue-injection machine |
-
2013
- 2013-05-02 CN CN201310157764.7A patent/CN103231487B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080040485A (en) * | 2006-11-03 | 2008-05-08 | 두원공과대학산학협력단 | A low temperature and pressure injection molding machine using hot melt |
| CN101816997A (en) * | 2010-01-20 | 2010-09-01 | 刘振 | Low-pressure glue-injection machine |
| CN202241805U (en) * | 2011-08-31 | 2012-05-30 | 苏州海特姆德光伏科技有限公司 | Low-temperature glue injection machine |
| CN203246033U (en) * | 2013-05-02 | 2013-10-23 | 苏州海特姆德光伏科技有限公司 | Mini-type table-type low temperature low-pressure glue-injection machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105291347A (en) * | 2015-09-08 | 2016-02-03 | 合肥邦立电子股份有限公司 | Packaging production process of reed switch |
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| CN103231487B (en) | 2016-01-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 1, 22, Guanghua Road, No. 215500, Xinzhuang Town, Jiangsu, Suzhou Applicant after: Changshu Konig Technologies Co., Ltd. Address before: 1, 22, Guanghua Road, No. 215500, Xinzhuang Town, Jiangsu, Suzhou Applicant before: Suzhou Hot-Melt-Molding Technology Co., Ltd. |
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| CB03 | Change of inventor or designer information |
Inventor after: Zhu Jianxiao Inventor before: Zhu Jianxiao Inventor before: Shen Yang |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: ZHU JIANXIAO SHEN YANG TO: ZHU JIANXIAO Free format text: CORRECT: APPLICANT; FROM: SUZHOU HOT-MELT-MOLDING TECHNOLOGY CO.,LTD. TO: CHANGSHU KONIG TECHNOLOGYCO., LTD. |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 1, 22, Guanghua Road, No. 215500, Xinzhuang Town, Jiangsu, Suzhou Patentee after: SUZHOU KONIG ELECTRONIC TECHNOLOGY CO., LTD. Address before: 1, 22, Guanghua Road, No. 215500, Xinzhuang Town, Jiangsu, Suzhou Patentee before: Changshu Konig Technologies Co., Ltd. |