CN103215001A - Glue for PET-G (Polyethylene Terephthalate Glycol) smart card and preparation method of glue - Google Patents
Glue for PET-G (Polyethylene Terephthalate Glycol) smart card and preparation method of glue Download PDFInfo
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- CN103215001A CN103215001A CN2013101176001A CN201310117600A CN103215001A CN 103215001 A CN103215001 A CN 103215001A CN 2013101176001 A CN2013101176001 A CN 2013101176001A CN 201310117600 A CN201310117600 A CN 201310117600A CN 103215001 A CN103215001 A CN 103215001A
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- tetrahydrofuran
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Abstract
The invention discloses glue for a PET-G (Polyethylene Terephthalate Glycol) smart card and a preparation method of the glue. By using the glue, a PET-G substrate can be better bonded with INLAY, so that the production cost is reduced, the product quality is improved, and the production in subsequent processes is favorably carried out. In such a way, the PET-G substrate can be better bonded with the INLAY, so that the production cost is reduced, the product quality is improved, and the production in subsequent processes is favorably carried out.
Description
Technical field
The present invention relates to adhesive field, particularly relate to glue of a kind of PET-G of being used for smart card and preparation method thereof.
Background technology
The abbreviation of the English Polyethylene terephthalate of PET() is poly terephthalic acid class plastics, mainly comprises polyethylene terephthalate PET and polybutylene terephthalate PBT.PET-G is amorphism PET, and price compares higher, is mainly used in the replacement common PET, is better than common PET on surface propertys such as printing, cementability, and processibility, transparency, intensity also are better than common PET.Have with the common PET coextru-lamination now, also very wide with scope separately.What the assembling of PET-G smart card was used in the prior art is synthetic glue, INLAY is in the same place with the PET-G substrate bonding, is that simple physics is bonding, is being subjected under external force or the high-temperature condition, INLAY and PET-G base material can break away from and come, thereby influence the use of PET-G smart card.Owing to be not specifically designed to the glue of PET-G smart card, in the prior art generally the base material according to card adopt different synthetic glues, to assembling make troubles and the price of synthetic glue higher.
Summary of the invention
At above-mentioned deficiency of the prior art, main purpose of the present invention provides glue of a kind of PET-G of being used for smart card and preparation method thereof, and this glue can make PET-G base material and INLAY better bonding, reduces production costs, improve the quality of products, help the production of subsequent handling.
For achieving the above object, the technical solution used in the present invention is: a kind of glue that is used for the PET-G smart card, and its each component comprises by weight: 0.6 ~ 1.5 part in PET-G powder; 10 ~ 20 parts of tetrahydrofuran (THF)s.
Preferably, each component is by weight: 1 part in PET-G powder; 15 parts of tetrahydrofuran (THF)s.
Preferably, each component is by weight: 1.5 parts in PET-G powder; 20 parts of tetrahydrofuran (THF)s.
The preparation method of the glue of the PET-G of being used for smart card of the present invention is as follows: at first tetrahydrofuran (THF) is put into container, calculate the amount of required PET-G powder according to the amount of tetrahydrofuran (THF), the PET-G powder is slowly added in the described container, stir.After the glue allotment, stir first week needing every day and do once, churning time is about 30 minutes.Placing 5-6 week then can use.
Parts by weight described in the present invention can calculate according to weight unit such as gram, kilograms, also can calculate according to other weighing modes.
Tetrahydrofuran (THF) ((CH described in the present invention
2)
4O), be a kind of important organic synthesis raw material and be the solvent of excellent property, be specially adapted to dissolve PVC, polyvinylidene chloride and butylaniline, be widely used as the solvent of topcoating, protective system, printing-ink, tape and film coating, and as reaction solvent.
The invention has the beneficial effects as follows: the present invention is used for the glue of PET-G smart card, and allotment is simple, and PET-G base material and INLAY are closely bonded, and reduces production costs, and improves the quality of products, and helps the production of subsequent handling.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
The embodiment of the invention one: a kind of glue that is used for the PET-G smart card, its each component are 0.6 part in PET-G powder by weight; 10 parts of tetrahydrofuran (THF)s.The preparation method of the glue described in the present embodiment is as follows: step 1,10 parts of tetrahydrofuran (THF)s are put into container, 0.6 part of PET-G powder is slowly added in the described container, stir, form glue; After step 2, the glue allotment, do continuous seven day every day once and stir, churning time 30min stirs and leaves standstill 5 all getting final product after seven days.The test pulling force data that can bear between PET-G after bonding and the INLAY: 65 ~ 70G.
Embodiment two, a kind of glue that is used for the PET-G smart card, its each component are 1.5 parts in PET-G powder by weight; 20 parts of tetrahydrofuran (THF)s.The preparation method of the glue described in the present embodiment is as follows: step: step 1,20 parts of tetrahydrofuran (THF)s are put into container, 1.5 parts of PET-G powder are slowly added in the described container, stir, form glue.After step 2, the glue allotment, do continuous seven day every day once and stir, churning time 60min stirs and leaves standstill 6 all getting final product after seven days.The test pulling force data that can bear between PET-G after bonding and the INLAY: 60 ~ 65G.
Embodiment three, a kind of glue that is used for the PET-G smart card, its each component are 1 part in PET-G powder by weight; 15 parts of tetrahydrofuran (THF)s.The test pulling force data that can bear between PET-G after bonding and the INLAY: 70 ~ 75G.
Embodiment four, a kind of glue that is used for the PET-G smart card, its each component is by weight: 1.2 parts in PET-G powder; 12 parts of tetrahydrofuran (THF)s.The test pulling force data that can bear between PET-G after bonding and the INLAY: 75 ~ 80G.
Embodiment five, a kind of glue that is used for the PET-G smart card, its each component is by weight: 1.4 parts in PET-G powder; 16 parts of tetrahydrofuran (THF)s.The test pulling force data that can bear between PET-G after bonding and the INLAY: 65 ~ 70G.
Embodiment six, a kind of glue that is used for the PET-G smart card, its each component is by weight: 1.3 parts in PET-G powder; 18 parts of tetrahydrofuran (THF)s.The test pulling force data that can bear between PET-G after bonding and the INLAY: 65 ~ 75G.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes description of the present invention to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (4)
1. a glue that is used for the PET-G smart card is characterized in that, its each component comprises by weight: 0.6 ~ 1.5 part in PET-G powder; 10 ~ 20 parts of tetrahydrofuran (THF)s.
2. the glue that is used for the PET-G smart card according to claim 1 is characterized in that, each component is by weight: 1 part in PET-G powder; 15 parts of tetrahydrofuran (THF)s.
3. the glue that is used for the PET-G smart card according to claim 1 is characterized in that, each component is by weight: 1.5 parts in PET-G powder; 20 parts of tetrahydrofuran (THF)s.
4. preparation method who is used for the glue of PET-G smart card, it is characterized in that, comprise the steps: step 1, tetrahydrofuran (THF) is put into container, calculate the amount of required PET-G powder according to the amount of tetrahydrofuran (THF), the PET-G powder is slowly added in the described container, stir, form glue; After the allotment of step 2, glue, do continuous seven day every day once and stir, churning time 30min-60min stirs and leaves standstill after seven days that 5-6 is all to get final product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013101176001A CN103215001A (en) | 2013-04-07 | 2013-04-07 | Glue for PET-G (Polyethylene Terephthalate Glycol) smart card and preparation method of glue |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN2013101176001A CN103215001A (en) | 2013-04-07 | 2013-04-07 | Glue for PET-G (Polyethylene Terephthalate Glycol) smart card and preparation method of glue |
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CN103215001A true CN103215001A (en) | 2013-07-24 |
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CN2013101176001A Pending CN103215001A (en) | 2013-04-07 | 2013-04-07 | Glue for PET-G (Polyethylene Terephthalate Glycol) smart card and preparation method of glue |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006272835A (en) * | 2005-03-30 | 2006-10-12 | Riken Technos Corp | Polyester based laminate, its manufacturing method, and thermal adhesive for laminate |
CN102057011A (en) * | 2008-06-10 | 2011-05-11 | 太阳控股株式会社 | Heat curable adhesive and resin laminated-type IC card |
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2013
- 2013-04-07 CN CN2013101176001A patent/CN103215001A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006272835A (en) * | 2005-03-30 | 2006-10-12 | Riken Technos Corp | Polyester based laminate, its manufacturing method, and thermal adhesive for laminate |
CN102057011A (en) * | 2008-06-10 | 2011-05-11 | 太阳控股株式会社 | Heat curable adhesive and resin laminated-type IC card |
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Application publication date: 20130724 |