CN103213203A - Groove processing tool and method for processing groove - Google Patents
Groove processing tool and method for processing groove Download PDFInfo
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- CN103213203A CN103213203A CN2013100256969A CN201310025696A CN103213203A CN 103213203 A CN103213203 A CN 103213203A CN 2013100256969 A CN2013100256969 A CN 2013100256969A CN 201310025696 A CN201310025696 A CN 201310025696A CN 103213203 A CN103213203 A CN 103213203A
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10D—STRINGED MUSICAL INSTRUMENTS; WIND MUSICAL INSTRUMENTS; ACCORDIONS OR CONCERTINAS; PERCUSSION MUSICAL INSTRUMENTS; AEOLIAN HARPS; SINGING-FLAME MUSICAL INSTRUMENTS; MUSICAL INSTRUMENTS NOT OTHERWISE PROVIDED FOR
- G10D7/00—General design of wind musical instruments
- G10D7/02—General design of wind musical instruments of the type wherein an air current is directed against a ramp edge
- G10D7/04—General design of wind musical instruments of the type wherein an air current is directed against a ramp edge with Helmholtz resonators, e.g. ocarinas
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10D—STRINGED MUSICAL INSTRUMENTS; WIND MUSICAL INSTRUMENTS; ACCORDIONS OR CONCERTINAS; PERCUSSION MUSICAL INSTRUMENTS; AEOLIAN HARPS; SINGING-FLAME MUSICAL INSTRUMENTS; MUSICAL INSTRUMENTS NOT OTHERWISE PROVIDED FOR
- G10D9/00—Details of, or accessories for, wind musical instruments
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The present invention relates to a groove processing tool which performs groove processing on a deposition-molded thin-film solar cell. Even when the thickness of the thin film being processed is large, the groove processing tool can linearly generate beautiful scribed lines with fixed line width. The groove processing tool is composed of the following components: a rod-shaped body and an edge front-end area 11 which is formed at the front end of the body. The edge front-end area 11 is composed of the following components: a rectangular bottom surface 12, a left-side surface 13 and a right-side surface 14 which project from the long-side direction side of the bottom surface 12 relative to the bottom surface 12 to a right angle and are parallel with each other, and an edge front-end part 16 which is formed on at least one side of the front surface side and the back surface side of the edge front-end area 11 along the width-direction side of the bottom surface 12. The edge front-end part 16 is provided with the following components: a first edge surface 18 which inclines from the end edge of the bottom surface 12 to oblique upper part, and an edge front-end which is composed of a second edge surface 19 which is crossed with the first edge surface 18 while an acute angle is formed between the second edge surface and the first edge surface.
Description
Technical field
The present invention is relevant for a kind of groove processing instrument, particularly relevant for groove processing instrument that is used in the groove processing when making chalcopyrite (chalcopyrite) compound solar cell or amorphous (amorphous) silicon solar cell equivalance form film solar cell and the groove processing method that uses this groove processing instrument.
At this, so-called chalcopyrite compound is except CIGS (Cu (In, Ga) Se
2) outside, also comprise CIGSS (Cu (and In, Ga) (Se, S)
2), CIS (CuInS
2) etc.
Background technology
In the thin film solar cells as light absorbing zone such as use chalcopyrite compound semiconductor, generally being connected in series on substrate is formed with the long-pending formation structure of a plurality of elementary cells (unit ce11).
Now the manufacture method that existing known chalcopyrite compound is amassed the form film solar cell describes.Fig. 6 (a), Fig. 6 (b) and Fig. 6 (c), the schematic diagram of the manufacturing step of expression CIGS thin film solar cell.At first, shown in Fig. 6 (a), on insulated substrate 1 by formations such as soda lime glass (SLG), after sputtering method is formed with the Mo electrode layer 2 of the lower electrode that becomes side of the positive electrode, thin film solar cell substrate to before the formation light absorbing zone is processed to form the separatory groove S of lower electrode (P1 step) by delineation.
Afterwards, shown in Fig. 6 (b), on Mo electrode layer 2, by formation such as the method for steaming, sputtering methods by compound semiconductor (CIGS) light absorbing zone 3 that film constituted, thereon, form buffering (buffer) layer 4 that is constituted by ZnS film etc. in order to heterozygous by CBD method (chemical solution deposition),, form insulating barrier 5 thereon by ZnO film constituted.And, with respect to the thin film solar cell substrate before the formation transparent electrode layer, from the separatory groove S of lower electrode toward transverse direction away from both positions of set a distance, be processed to form the groove M1 (P2 step) that arrives to contact usefulness between the electrode of Mo electrode layer 2 by delineation.
Then, shown in Fig. 6 (c), on insulating barrier 5, form the transparent electrode layer 6 that is constituted by the ZnO:Al film as upper electrode, solar cell substrate as possessing favourable each the necessary functional layer that generates electricity with opto-electronic conversion is processed to form the groove M2 (P3 step) that arrival is used to the electrode separation of the Mo electrode layer 2 of bottom by delineation.
In the step of the long-pending form film solar cell of above-mentioned manufacturing, the technology as carry out groove processing groove M1 and M2 by delineation is to use mechanical delineation method.
Mechanical delineation method, for example, as in patent documentation 1 and 2 announcements, blade front end by the groove processing instrument of metal needle (needle) that front end is become the front end tapered etc., bestow set pressure and press on substrate and mobile simultaneously, and the technology of the separatory groove of machined electrode.
As the mechanical type delineation method as in patent documentation 1 and 2 announcements, the shape of the blade front end of groove processing instrument is become needle-like for the front end taper, but strictly speaking, the part of crimping thin film solar cell is cut into approximate horizontal to become smooth mode with front end in order to make contact area become wide.That is, as shown in Figure 7, fore-end 71 is become the circular cone scalariform, and become bottom surface 72 smooth.With the groove processing instrument 7 of shape like this, push in order to the film of the groove that forms the thin film solar cell substrate, move along the delineation preset lines simultaneously, carry out groove processing whereby.
Use the situation of the groove processing instrument of circular cone scalariform at fore-end, exist near the film the groove to peel off brokenly large stretch ofly, even removed the part of unnecessary removal, have the performance of solar cell and the problem points that yield reduces.In addition, in case make the blade front end produce abrasion along with the use of groove processing instrument, fore-end is owing to be the circular cone scalariform, so the chi of blade front end footpath will become big, and its result is that the groove width that quilt is delineated little by little broadens.Therefore, can't continue for a long time to use identical blade front end, maybe can't grind and reuse.
At this, because the problem points so, the inventor is in the groove processing instrument that has before proposed shown in patent documentation 3.
Fig. 8 is illustrated in the stereogram of the groove processing instrument that above-mentioned patent documentation 3 disclosed.The groove processing instrument 8 that this forms groove by columned body 81, constitutes with the blade front end area 82 that is integrally formed in this fore-end, and with hard material manufacturings such as superhard alloy or sintering diamonds.Blade front end area 82, by rectangular bottom surface 83, the end limit of 83 short side direction erects rectangular front 84 and back 85 from the bottom surface, erect with the end limit of 83 long side direction and to meet at right angles and become 88,89 formations in left and right side of the face of being parallel to each other from the bottom surface.83 with front 84, back 85 and the bight that forms becomes blade front end 86,87 respectively by the bottom surface.
According to groove processing instrument 8 so, the left and right side of blade fore-end becomes parallel surface, so the size of blade left and right sides width can not change, even after the abrasion, the left and right sides width of blade can be kept the groove width of being delineated for fixing.
In addition, the front 84 of groove processing instrument or back 85 are oblique toward the travel direction inclination with respect to the surface of solar cell substrate, by the front 84 or back 85 with bottom surface 83 and the bight that forms, that is blade front end 86 or blade front end 87 contact with solar cell substrate with the line contact that is close to the some contact, peeling off of film can be carried out glidingly and have, and the advantage of the delineation line of linearity, beauty can be formed.
Patent documentation 1: the Japan Patent spy opens the 2002-094089 communique
Patent documentation 2: the Japan Patent spy opens the 2004-115356 communique
Patent documentation 3: international open W02010/098306 communique
In the long-pending form film solar cell of existing known general chalcopyrite compound, the thickness of the CIGS light absorbing zone 3 of Fig. 6 C, comprising ZnS film cushion 4 and ZnO insulating barrier 5 is about 2 μ m, the about 1 μ m of the thickness of the ZnO:Al transparent electrode layer 6 on its upper strata.At the long-pending form film solar cell of nearest chalcopyrite compound, carry out from the viewpoint that improves photoelectric transformation efficiency the self-criticism such as thickness optimization, the thickness of the photoelectric conversion layer of manufacturing or the thickness of transparent electrode layer are more known more thick.For example, the thickness of transparent electrode layer 6 is 2 μ m, or this above person also becomes many.When the about 1 μ m of the thickness of transparent electrode layer 6, use groove processing instrument shown in Figure 8 can carry out peeling off of trench portions without a doubt, but the thickness of transparent electrode layer 6 become 2 μ m or more than, then along with the thickness change in order to the trench portions peeled off is thick, even use the groove processing instrument of Fig. 8, the problem that also exists near the film of groove to peel off.
For example, in the P3 step shown in Fig. 6 (c), in case dissection scope enlarges when forming groove M2, then cause and adjacent grooves M1 between transparent electrode layer 6 peel off.For the anti-inappropriate situation as here, the distance of groove M1 and groove M2 is got length fully, promptly adding the man-hour dissection scope at groove M2 does not reach groove M1 and gets final product, but will reduce the zone (generating area) that can utilize generating substantially in this situation, and can't improve the photoelectric transformation efficiency of solar cell.
This shows that above-mentioned existing groove processing instrument obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.
Summary of the invention
The object of the present invention is to provide a kind of groove processing instrument, when it carries out groove processing to films such as electrode film such as long-pending form film solar cell or light absorbing zones, even the film in order to processing is thicker, also can form the delineation line of the beauty of fixed line width point-blank, and can make the groove width of patternization less, carry out the less groove processing of peeling off.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of groove processing instrument of the utility model, it is made of bar-shaped body and the blade front end area that is formed at the body front end; This blade front end area, erect the rectangular left surface that is parallel to each other and right flank by rectangular bottom surface, from the limit of bottom surface long side direction with respect to the bottom surface and along the limit of bottom width direction and the blade leading section that is formed at the side of either party at least of the front face side of blade front end area or back side constituted; This blade leading section is formed towards the 1st blade face of oblique upper inclination and with respect to acutangulate the 2nd blade face of the 1st blade hand-deliver fork by the ora terminalis in the bottom surface.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Preferable, aforesaid groove processing instrument, wherein the angle of the blade front end that forms by the 1st blade face and the 2nd blade face is 30～85 degree.
Preferable, aforesaid groove processing instrument, wherein the 1st blade face is 1～30 degree with respect to the angle of inclination of bottom surface.
By preferable, aforesaid groove processing instrument, wherein the width of the bottom surface of this blade front end area and blade leading section is 30～5000 μ m, the length of the 1st blade face is 5～40 μ m.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of groove processing method of the present invention, it may further comprise the steps: use groove processing instrument of the present invention; The 1st blade face of this groove processing instrument is contacted with the film surface of processing object, this groove processing instrument is moved along the surface of film.
By technique scheme, groove processing instrument of the present invention has following advantage and beneficial effect at least:
(1) according to groove processing instrument of the present invention, the blade leading section that is arranged at blade front end area front face side (or back side) is formed with the blade front end of acute angle, therefore can make the blade front end invade film glidingly, and, the 2nd blade face that is present in blade front end upper face side is the inclined-plane, can make the part peeled off skim over toward the top and leave away.Whereby,, also can not produce peeling off of interruption of delineation line or irregular film, and can form the beauty delineation line of fixed line width even thicker in order to the film of processing.
(2) the 1st blade face of blade front end, owing to being tilts to form from the past oblique upper of an ora terminalis of bottom surface, therefore when groove processing, the 1st blade face carries out face with the surface of solar cell and contacts, make the groove processing tool tilt and carry out, can suppress whereby the excessive intrusion of the blade front end of machined surface.That is, in case sharp keen blade front end is pressed on machined surface with the line contact, the adjustment that then puts on contact site pressure will be difficult, but as above-mentioned, making the 1st blade face and machined surface carry out face contacts, can suppress excessive intrusion whereby, and can easily cooperate film shape and carry out the inching press pressure.Therefore in addition, the 1st blade face is because its length is shorter, on one side can suppress to guarantee appropriate cutting ability on one side as the excessive intrusion as above-mentioned.
(3) left and right side of the blade front end area of groove processing instrument, erect with end limit and to meet at right angles and become the mode of almost parallel reciprocally and form from the bottom surface long side direction, even therefore blade front end abrasion, the size of the left and right sides width of blade front end also can not change.Whereby, even the abrasion of blade front end also can make the groove width of delineation be maintained identical.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1: the stereogram of representing groove processing execution of instrument example of the present invention.
Fig. 2: the enlarged side view that is illustrated in the blade leading section of groove processing instrument shown in Figure 1.
Fig. 3: the side view that is illustrated in groove processing instrument state when groove processing shown in Figure 1.
Fig. 4: the enlarged side view of the blade leading section of presentation graphs 3.
Fig. 5: the stereogram of representing another embodiment of groove processing instrument of the present invention.
Fig. 6 (a), Fig. 6 (b) and Fig. 6 (c): the schematic diagram of representing the manufacturing step of general CIGS thin film solar cell.
Fig. 7: expression has the stereogram of known groove processing execution of instrument example now.
Fig. 8: expression has the stereogram of another embodiment of known groove processing instrument now.
Fig. 9 (a), Fig. 9 (b) and Fig. 9 (c): the processing illustration formula of representing the groove processing instrument of 3 kinds.
[main element symbol description]
W: solar cell substrate A: groove processing instrument
10: body 11: the blade front end area
12: the bottom surface 13 of blade front end area: the left surface of blade front end area
14: the right flank 15 of blade front end area: the front of blade front end area
16: 18: the 1 blade faces of blade leading section
19: the 2 blade faces 20: blade front end
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the specific embodiment, structure, feature and the effect thereof of a kind of groove processing instrument that foundation the present invention is proposed, describe in detail as after.
See also Fig. 1 and Fig. 2, represent the embodiment of groove processing instrument of the present invention.Fig. 1 is the stereogram of observing from the top, and Fig. 2 is the side view that amplifies the blade leading section of groove processing instrument.This groove processing instrument A is constituted by processing all-in-one-piece blade front end area 11 such as discharge processing by the body 10 of the quadrangular prism shape of correspondence delineation device (diagram is outer) installation portion and at its leading section in fact.Blade front end area 11 is with hard material manufacturings such as superhard alloy or sintering diamonds.Blade front end area 11, be by the rectangular bottom surface 12 of slenderly extending, the limit of 12 long side directions erects and meets at right angles and become an a pair of left side that is parallel to each other from the bottom surface, right flank 13,14, along the bottom surface 12 widths the limit and be formed at blade front end area 11 front (towards the face of the moving direction of groove processing instrument) 15 sides blade leading section 16 and erect rectangular back 17 from the end edge of bottom surface and constitute.Blade leading section 16, as at length representing, be by near the 1st blade face 18 that the ora terminalis of bottom surface 12, tilts, intersect acutangulate the 2nd blade faces 19 and the blade front end 20 that forms by the 1st blade face 18 and the 2nd blade face 19 and forming with respect to the 1st blade face 18 towards oblique upper in Fig. 2.
The 12nd sword face 18 is with respect to the tilt angle alpha 1 of bottom surface 12, in the scope of 1～30 degree and be preferably about 10 degree.Making the big reason of tilt angle alpha 1 to 1 degree, is in order to make the 1st blade face 18 be different faces with bottom surface 12.Make the little reason of tilt angle alpha 1 to 30 degree, in case be in order to prevent that inclined angle alpha 1 is bigger than minimum angles 30 degree of aftermentioned angle [alpha] 2, then get over that bottom surface 12 and the 2nd blade face 19 are approaching more, and the easy folding that becomes is ruined away from blade leading section 16.
In addition, by the 1st blade face 18 and the 2nd blade face 19 and the angle [alpha] 2 of the blade front end 20 that forms is in the scopes of 30～85 degree, and be more preferred from and consider that intensity forms the angle of spending near 60 with the balance of cutting ability.
Further, the left and right sides width L1 of the bottom surface 12 of blade front end area 11 is preferably 30～80 μ m, but can cooperate desired delineation groove width and be 30～5000 μ m.The length L 2 of the 1st blade face 18 that links to each other with the ora terminalis of this bottom surface and form is preferably 5～40 μ m.In addition, the body 10 of groove processing instrument A is not limited to quadrangular prism, with cylindric or polygonal and form and also can.
The situation of using above-mentioned groove processing instrument A and processing, as shown in Figures 3 and 4, make the state of blade leading section 16 towards moving direction, and with respect to solar cell substrate W, the 1st blade face 18 of blade leading section 16 carries out the mode that face contacts with the surface of solar cell substrate W, groove processing instrument A is tilted, that is only be 10 degree, make groove processing instrument A tiltedly be installed on delineation device (diagram is outer) toward the moving direction inclination with the angle of inclination of the 1st blade face.Afterwards, groove processing instrument A is pushed toward the surface of solar cell substrate W, and relatively move with respect to solar cell substrate W simultaneously, be machined in previous described groove M1 or groove M2 whereby.
When this groove processing, for the live width of the groove width that preferably makes processing that is delineation line is maintained fixing, and the quality (photoelectric transformation efficiency etc.) of being scheduled in the design of goods can realize and the homogeneity of quality, is necessary to make the ratio of peeling off of film for fixing.
Above-mentioned groove processing instrument A of the present invention, owing to the blade front end 20 that is arranged at blade front end area 11 fronts forms with acute angle, therefore the 2nd blade face 19 that is present in blade front end 20 upper face sides becomes the inclined-plane, and can make released part as to skim over toward the top as shown in the arrow of Fig. 4 and to leave away.Whereby, even the groove processing of transparent electrode layer 62 μ m or above thickness (even than this groove processing for thin thickness) also can suppress to delineate the generation of peeling off of line interruption or irregular film, and can form the beauty delineation line of fixed line width point-blank.
In addition, because the 1st blade face 18 of blade leading section 16, the past oblique upper of an ora terminalis of 12 tilts and forms from the bottom surface, therefore when groove processing, the 1st blade face 18 carries out face with the surface of solar cell substrate W and contacts, and groove processing instrument A is tilted and carries out, and makes the 1st blade face 18 and machined surface carry out face whereby and contacts, the pressure that inching is easily pushed, and can prevent to apply excessive point-load.In addition, the 1st blade face 18 is because its length only is 5～40 μ m, and is shorter, therefore can apply the pressure of appropriateness and guarantees cutting ability.
In addition, the left and right side 13,14 of the blade front end area of groove processing instrument A, the ora terminalis of 12 long side directions erects and meets at right angles and become the mode that is parallel to each other from the bottom surface, even therefore blade front end 20 abrasion also can not make the size of blade front end 20 left and right sides width change.Whereby, even after abrasion of blade front end or the grinding, also can make the groove width of delineation be maintained identical.
The processing illustration formula of P3 step shown in Fig. 6 (c) of the groove processing instrument of Fig. 9 (a), Fig. 9 (b) and Fig. 9 (c) expression use 3 kinds, the machining state of the circular cone scalariform groove processing instrument of the front end taper that Fig. 9 (a) expression is shown in Figure 7 graphic, the machining state of the groove processing instrument that Fig. 9 (b) expression is shown in Figure 8 graphic, the machining state of Fig. 9 (c) expression groove processing instrument A of the present invention shown in Figure 1 graphic.In graphic, black partly is transparent electrode layer 6, and white band-like portions are M2 trench portions, and irregular spot shape partly is the part that transparent electrode layer 6 has been peeled off.
When measuring the released part Breadth Maximum of irregular spot shape, it is 206 μ m at Fig. 9 (a) that maximum is peeled off width, is 157 μ m at Fig. 9 (b), is 79 μ m at Fig. 9 (c), and groove processing instrument A according to the present invention can suppress to peel off.
In the present invention, the foregoing description has represented that blade leading section 16 is arranged at the situation of the front (or back) of blade front end area, even but also can at the front and back of blade front end area 11 two square one-tenth blade leading sections 16 as shown in Figure 5.Whereby, if side abrasion or damaged then can make the opposing party's blade front end use as new product by the installation direction that changes groove processing instrument A.
The present invention is applicable to the groove processing of substrate surface films such as thin film solar cell or organic EL panel.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (7)
1. groove processing instrument is characterized in that:
It is made of bar-shaped body and the blade front end area that is formed at the body front end;
The blade front end area, erect the rectangular left surface that is parallel to each other and right flank by rectangular bottom surface, from the limit of bottom surface long side direction with respect to the bottom surface and along the limit of bottom width direction and the blade leading section that is formed at the side of either party at least of the front face side of blade front end area or back side constituted;
This blade leading section is formed towards the 1st blade face of oblique upper inclination and with respect to acutangulate the 2nd blade face of the 1st blade hand-deliver fork by the ora terminalis in the bottom surface.
2. groove processing instrument as claimed in claim 1 is characterized in that wherein the angle of the blade front end that forms by the 1st blade face and the 2nd blade face is 30～85 degree.
3. groove processing instrument as claimed in claim 1 or 2 is characterized in that the 1st blade face wherein is 1～30 degree with respect to the angle of inclination of bottom surface.
4. groove processing instrument as claimed in claim 1 or 2 is characterized in that wherein the bottom surface of this blade front end area and the width of blade leading section are 30～5000 μ m, and the length of the 1st blade face is 5～40 μ m.
5. groove processing instrument as claimed in claim 3 is characterized in that wherein the bottom surface of this blade front end area and the width of blade leading section are 30～5000 μ m, and the length of the 1st blade face is 5～40 μ m.
6. groove processing method is characterized in that:
Each groove processing instrument in the use claim 1 to 3; And
The 1st blade face of this groove processing instrument is contacted with the film surface of processing object, this groove processing instrument is moved along the surface of film.
7. groove processing method is characterized in that:
Use the groove processing instrument of claim 4; And
The 1st blade face of this groove processing instrument is contacted with the film surface of processing object, this groove processing instrument is moved along the surface of film.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-007996 | 2012-01-18 | ||
| JP2012007996A JP2013146811A (en) | 2012-01-18 | 2012-01-18 | Groove machining tool and groove machining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103213203A true CN103213203A (en) | 2013-07-24 |
Family
ID=48811520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100256969A Pending CN103213203A (en) | 2012-01-18 | 2013-01-16 | Groove processing tool and method for processing groove |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013146811A (en) |
| KR (1) | KR101529966B1 (en) |
| CN (1) | CN103213203A (en) |
| TW (1) | TW201331138A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108453906A (en) * | 2018-03-29 | 2018-08-28 | 中钢集团新型材料（浙江）有限公司 | A kind of graphite material fracture toughness test grooving tool, equipment and grooving method |
| CN110394491A (en) * | 2019-07-22 | 2019-11-01 | 河南北方红阳机电有限公司 | A kind of coaxial double-point tool oblique cutting processing tool and processing method |
| CN112091298A (en) * | 2020-09-16 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | Straight groove machining tool and machining method |
| CN112620762A (en) * | 2020-12-18 | 2021-04-09 | 贵州华烽电器有限公司 | Shell keyway cutting process device |
| CN113698085A (en) * | 2021-07-05 | 2021-11-26 | 维达力实业（赤壁）有限公司 | Processing method of clearance groove and 3D substrate product |
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|---|---|---|---|---|
| TWI513671B (en) * | 2013-12-06 | 2015-12-21 | Ind Tech Res Inst | Cutting tool and glass cutting device using the same |
| JP7010621B2 (en) * | 2017-08-02 | 2022-01-26 | 住友化学株式会社 | Synthetic resin film, separator for power storage device and power storage device |
| CN117774040B (en) * | 2024-02-26 | 2024-05-14 | 山东山科蓝芯太阳能科技有限公司 | PVT photovoltaic photo-thermal plate cutting integrated equipment |
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- 2012-01-18 JP JP2012007996A patent/JP2013146811A/en active Pending
- 2012-12-03 TW TW101145242A patent/TW201331138A/en unknown
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- 2013-01-08 KR KR1020130002015A patent/KR101529966B1/en not_active IP Right Cessation
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| CN108453906A (en) * | 2018-03-29 | 2018-08-28 | 中钢集团新型材料（浙江）有限公司 | A kind of graphite material fracture toughness test grooving tool, equipment and grooving method |
| CN108453906B (en) * | 2018-03-29 | 2019-03-26 | 中钢集团新型材料（浙江）有限公司 | A kind of graphite material fracture toughness test grooving tool, equipment and grooving method |
| CN110394491A (en) * | 2019-07-22 | 2019-11-01 | 河南北方红阳机电有限公司 | A kind of coaxial double-point tool oblique cutting processing tool and processing method |
| CN110394491B (en) * | 2019-07-22 | 2024-08-02 | 河南北方红阳机电有限公司 | Coaxial double-edge cutter oblique insertion machining tool and machining method |
| CN112091298A (en) * | 2020-09-16 | 2020-12-18 | 中国航发贵州黎阳航空动力有限公司 | Straight groove machining tool and machining method |
| CN112620762A (en) * | 2020-12-18 | 2021-04-09 | 贵州华烽电器有限公司 | Shell keyway cutting process device |
| CN113698085A (en) * | 2021-07-05 | 2021-11-26 | 维达力实业（赤壁）有限公司 | Processing method of clearance groove and 3D substrate product |
| CN113698085B (en) * | 2021-07-05 | 2022-05-20 | 维达力实业（赤壁）有限公司 | Method for processing clearance groove and 3D substrate product |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130084990A (en) | 2013-07-26 |
| KR101529966B1 (en) | 2015-06-18 |
| JP2013146811A (en) | 2013-08-01 |
| TW201331138A (en) | 2013-08-01 |
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