CN103213203A - Groove processing tool and method for processing groove - Google Patents

Groove processing tool and method for processing groove Download PDF

Info

Publication number
CN103213203A
CN103213203A CN2013100256969A CN201310025696A CN103213203A CN 103213203 A CN103213203 A CN 103213203A CN 2013100256969 A CN2013100256969 A CN 2013100256969A CN 201310025696 A CN201310025696 A CN 201310025696A CN 103213203 A CN103213203 A CN 103213203A
Authority
CN
China
Prior art keywords
blade
groove
groove processing
edge
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100256969A
Other languages
Chinese (zh)
Inventor
山田充
曾山正信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN103213203A publication Critical patent/CN103213203A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photovoltaic Devices (AREA)
  • Milling, Broaching, Filing, Reaming, And Others (AREA)

Abstract

The present invention relates to a groove processing tool which performs groove processing on a deposition-molded thin-film solar cell. Even when the thickness of the thin film being processed is large, the groove processing tool can linearly generate beautiful scribed lines with fixed line width. The groove processing tool is composed of the following components: a rod-shaped body and an edge front-end area 11 which is formed at the front end of the body. The edge front-end area 11 is composed of the following components: a rectangular bottom surface 12, a left-side surface 13 and a right-side surface 14 which project from the long-side direction side of the bottom surface 12 relative to the bottom surface 12 to a right angle and are parallel with each other, and an edge front-end part 16 which is formed on at least one side of the front surface side and the back surface side of the edge front-end area 11 along the width-direction side of the bottom surface 12. The edge front-end part 16 is provided with the following components: a first edge surface 18 which inclines from the end edge of the bottom surface 12 to oblique upper part, and an edge front-end which is composed of a second edge surface 19 which is crossed with the first edge surface 18 while an acute angle is formed between the second edge surface and the first edge surface.

Description

沟槽加工工具及沟槽加工方法Groove machining tool and groove machining method

技术领域technical field

本发明有关于一种沟槽加工工具,特别是有关于使用于制造黄铜矿(chalcopyrite)化合物太阳电池或非晶(amorphous)硅太阳电池等积成型薄膜太阳电池时的沟槽加工的沟槽加工工具、以及使用该沟槽加工工具的沟槽加工方法。The present invention relates to a grooving tool, in particular to a grooving tool used for grooving in the manufacture of chalcopyrite compound solar cells or amorphous silicon solar cells. A machining tool, and a groove machining method using the groove machining tool.

在此,所谓的黄铜矿化合物,除了CIGS(Cu(In,Ga)Se2)之外,还包括CIGSS(Cu(In,Ga)(Se,S)2)、CIS(CuInS2)等。Here, the chalcopyrite compound includes CIGSS (Cu(In, Ga)(Se, S) 2 ), CIS (CuInS 2 ) and the like in addition to CIGS (Cu(In, Ga)Se 2 ).

背景技术Background technique

在使用黄铜矿化合物半导体等作为光吸收层的薄膜太阳电池中,一般在基板上串联连接形成有多个单位晶格(unit ce11)的积成型构造。In a thin-film solar cell using a chalcopyrite compound semiconductor or the like as a light-absorbing layer, generally, a plurality of unit cells (unit ce11) are connected in series on a substrate to form an integral structure.

现对现有习知的黄铜矿化合物积成型薄膜太阳电池的制造方法进行说明。图6(a)、图6(b)及图6(c),表示CIGS薄膜太阳电池的制造步骤的示意图。首先,如图6(a)所示,在由碱石灰玻璃(SLG)等构成的绝缘基板1上,借由溅镀法形成有成为正极侧的下部电极的Mo电极层2之后,对形成光吸收层前的薄膜太阳电池基板,借由刻划加工形成下部电极分离用的沟槽S(P1步骤)。A conventionally known method for producing a chalcopyrite compound-integrated thin-film solar cell will now be described. Fig. 6(a), Fig. 6(b) and Fig. 6(c) are schematic diagrams showing the manufacturing steps of CIGS thin film solar cells. First, as shown in FIG. 6(a), on an insulating substrate 1 made of soda-lime glass (SLG) or the like, a Mo electrode layer 2 serving as a lower electrode on the positive side is formed by sputtering, and then the light is formed. On the thin-film solar cell substrate before the absorbing layer, grooves S for separating the lower electrodes are formed by scribing (P1 step).

之后,如图6(b)所示,在Mo电极层2上,借由蒸着法、溅镀法等形成由化合物半导体(CIGS)薄膜所构成的光吸收层3,在其上,借由CBD法(化学溶液沉积法)形成用以异质接合的由ZnS薄膜等所构成的缓冲(buffer)层4,在其上,形成由ZnO薄膜所构成的绝缘层5。而且,相对于形成透明电极层前的薄膜太阳电池基板,在从下部电极分离用的沟槽S往横方向远离既定距离的位置,借由刻划加工形成到达至Mo电极层2的电极间接触用的沟槽M1(P2步骤)。Afterwards, as shown in FIG. 6(b), on the Mo electrode layer 2, a light-absorbing layer 3 made of a compound semiconductor (CIGS) film is formed by evaporation, sputtering, etc., and on it, by CBD A buffer (buffer) layer 4 made of a ZnS thin film or the like for heterojunction is formed by a method (chemical solution deposition method), and an insulating layer 5 made of a ZnO thin film is formed thereon. Furthermore, with respect to the thin-film solar cell substrate before the formation of the transparent electrode layer, at a position away from the groove S for separating the lower electrodes in the lateral direction by a predetermined distance, an inter-electrode contact reaching the Mo electrode layer 2 is formed by scribing. Use trench M1 (P2 step).

接着,如图6(c)所示,从绝缘层5之上形成由ZnO:Al薄膜所构成的作为上部电极的透明电极层6,作为具备有利用光电转换而发电必要的各机能层的太阳电池基板,借由刻划加工形成到达至下部的Mo电极层2的电极分离用的沟槽M2(P3步骤)。Next, as shown in FIG. 6(c), a transparent electrode layer 6 as an upper electrode made of a ZnO:Al thin film is formed from the insulating layer 5, as a solar system equipped with various functional layers necessary for generating electricity by photoelectric conversion. On the battery substrate, trenches M2 for electrode separation reaching the lower Mo electrode layer 2 are formed by scribing (P3 step).

在上述的制造积成型薄膜太阳电池的步骤中,作为借由刻划进行沟槽加工沟槽M1及M2的技术,是使用机械式的刻划法。In the above-mentioned steps of manufacturing an integral thin-film solar cell, a mechanical scribing method is used as a technique for grooving the grooves M1 and M2 by scribing.

机械式的刻划法,例如,如在专利文献1及2所揭示般,借由将前端成为前端尖细状的金属针(needle)等的沟槽加工工具的刀刃前端,施予既定的压力而按压于基板并同时移动,而加工电极分离用的沟槽的技术。In the mechanical scoring method, for example, as disclosed in Patent Documents 1 and 2, a predetermined pressure is applied to the front end of a groove processing tool such as a metal needle with a tapered front end. On the other hand, it presses against the substrate while moving it, and processes the grooves for electrode separation.

如于专利文献1及2所揭示般的机械式刻划法,将沟槽加工工具的刀刃前端的形状变成为前端尖细的针状,但严格来说,压接薄膜太阳电池的部分为了使接触面积变广而以成为平坦的方式将前端切成大致水平。亦即,如图7所示,将前端部分71成为圆锥梯状,且将底面72成为平坦。将如此形状的沟槽加工工具7,用以形成薄膜太阳电池基板的沟槽的薄膜按压,同时沿着刻划预定线移动,借此进行沟槽加工。In the mechanical scribing method disclosed in Patent Documents 1 and 2, the shape of the tip of the blade of the groove processing tool is changed into a needle shape with a tapered tip. Strictly speaking, the part where the thin-film solar cell is crimped is The tip is cut approximately horizontally so as to widen the contact area and become flat. That is, as shown in FIG. 7 , the tip portion 71 is made into a conical trapezoidal shape, and the bottom surface 72 is made flat. Grooving tool 7 having such a shape is pressed against the thin film for forming the groove of the thin-film solar cell substrate while moving along the planned scribing line, thereby performing groove processing.

在前端部分使用圆锥梯状的沟槽加工工具的情形,存在沟槽附近的薄膜不规则地大片地剥落,甚至去除了不必要去除的部分,存在太阳电池的性能及良率降低的问题点。此外,一旦随着沟槽加工工具的使用而使刀刃前端产生磨耗,前端部分由于是圆锥梯状,因此刀刃前端的尺径将变大,其结果为,被刻划的沟槽宽度逐渐地变宽。因此,无法长时间地持续使用相同的刀刃前端,或无法进行研磨而重复使用。When a conical trapezoidal groove processing tool is used at the front end, there is a problem that the thin film near the groove peels off in large pieces irregularly, and even unnecessary removal is removed, which has the problem of lowering the performance and yield of the solar cell. In addition, once the front end of the blade is worn with the use of the groove machining tool, the diameter of the front end of the blade will become larger because the front end part is conical and trapezoidal, and as a result, the width of the groove to be carved will gradually become larger. Width. Therefore, it is impossible to continue to use the same blade tip for a long time, or to grind it and reuse it.

在此,有鉴于如此般的问题点,本发明人于先前已提出如专利文献3所示的沟槽加工工具。Here, in view of such a problem, the present inventors have previously proposed a groove processing tool as shown in Patent Document 3.

图8表示在上述专利文献3所揭示的沟槽加工工具的立体图。该形成沟槽的沟槽加工工具8,由圆柱状的本体81,与一体地形成于该前端部分的刀刃前端区域82所构成,且以超硬合金或烧结钻石等硬质材料制造。刀刃前端区域82,由长方形的底面83、从底面83的短边方向的端边立起成直角的前面84及后面85,与从底面83的长边方向的端边立起成直角而成为相互平行面的左、右侧面88、89所构成。借由底面83与前面84、后面85而形成的角部分别成为刀刃前端86、87。FIG. 8 shows a perspective view of the groove machining tool disclosed in Patent Document 3 above. The groove forming tool 8 is composed of a cylindrical body 81 and a blade front region 82 integrally formed at the front end, and is made of hard materials such as cemented carbide or sintered diamond. Blade front end region 82, by rectangular bottom surface 83, the front face 84 that stands at right angles from the end edge of bottom surface 83 short-side direction and the rear face 85, with the end edge that stands upright from the long-side direction of bottom surface 83 and becomes mutually. The left and right sides 88, 89 of the parallel planes are formed. Corner portions formed by the bottom surface 83 , the front surface 84 , and the rear surface 85 become blade front ends 86 , 87 , respectively.

根据如此的沟槽加工工具8,刀刃前端部分的左右侧面成为平行面,因此刀刃左右宽度的尺寸不会产生变化,即使是磨耗之后,刀刃的左右宽度为固定,能够维持被刻划的沟槽宽度。According to such a groove machining tool 8, the left and right sides of the front end of the blade become parallel planes, so the dimension of the width of the blade does not change. width.

此外,沟槽加工工具的前面84或后面85相对于太阳电池基板的表面往进行方向侧倾斜,借由前面84或后面85与底面83而形成的角部,亦即刀刃前端86或刀刃前端87以近乎点接触的线接触与太阳电池基板接触,而具有能够滑顺地进行薄膜的剥离,且能够形成直线状、美丽的刻划线的优点。In addition, the front side 84 or the back side 85 of the groove machining tool is inclined toward the direction of progress relative to the surface of the solar cell substrate. Contact with the solar cell substrate by a line contact close to point contact has the advantage that the thin film can be peeled off smoothly and a linear and beautiful scribe line can be formed.

专利文献1:日本专利特开2002-094089号公报Patent Document 1: Japanese Patent Laid-Open No. 2002-094089

专利文献2:日本专利特开2004-115356号公报Patent Document 2: Japanese Patent Laid-Open No. 2004-115356

专利文献3:国际公开W02010/098306号公报Patent Document 3: International Publication No. W02010/098306

在现有习知的一般黄铜矿化合物积成型薄膜太阳电池中,图6C的CIGS光吸收层3的厚度,包含ZnS薄膜缓冲层4及ZnO绝缘层5为2μm左右,其上层的ZnO:Al透明电极层6的厚度约1μm。在最近的黄铜矿化合物积成型薄膜太阳电池,从提高光电转换效率的观点进行膜厚最适化等检讨中,制造的光电转换层的厚度或透明电极层的厚度较习知更为厚。例如,透明电极层6的厚度为2μm,或此以上者亦变多。在透明电极层6的厚度约1μm时,使用图8所示的沟槽加工工具能够毫无问题地进行沟槽部分的剥离,但透明电极层6的厚度成为2μm或以上,则随着用以剥离的沟槽部分的膜厚变更厚,即使使用图8的沟槽加工工具,亦存在沟槽附近薄膜剥离的问题。In the conventionally known general chalcopyrite compound-integrated thin-film solar cells, the thickness of the CIGS light-absorbing layer 3 in FIG. The thickness of the transparent electrode layer 6 is about 1 μm. In recent chalcopyrite compound-integrated thin-film solar cells, the thickness of the photoelectric conversion layer or the thickness of the transparent electrode layer is thicker than the conventional ones. For example, the thickness of the transparent electrode layer 6 is 2 μm or more. When the thickness of the transparent electrode layer 6 is about 1 μm, the groove part can be peeled off without any problem using the groove machining tool shown in FIG. The film thickness of the groove part becomes thicker, and even if the groove processing tool of FIG. 8 is used, there is a problem of peeling of the film near the groove.

例如,在图6(c)所示的P3步骤,一旦形成沟槽M2时剥离范围扩大,则造成与相邻的沟槽M1间的透明电极层6剥离。为了防止此般的不适当情形,将沟槽M1与沟槽M2的距离充分地取长,即在沟槽M2加工时剥离范围未达沟槽M1即可,但于此情形将减少可实质地利用发电的区域(发电用面积),且无法提高太阳电池的光电转换效率。For example, in step P3 shown in FIG. 6( c ), once the trench M2 is formed, the peeling range expands, causing the transparent electrode layer 6 between the adjacent trenches M1 to peel off. In order to prevent such an inappropriate situation, the distance between the groove M1 and the groove M2 is sufficiently long, that is, the peeling range does not reach the groove M1 when the groove M2 is processed, but in this case it will be reduced substantially. The area for power generation (the area for power generation) is utilized, and the photoelectric conversion efficiency of the solar cell cannot be improved.

由此可见,上述现有的沟槽加工工具在结构与使用上,显然仍存在有不便与缺陷,而亟待加以进一步改进。为了解决上述存在的问题,相关厂商莫不费尽心思来谋求解决之道,但长久以来一直未见适用的设计被发展完成,而一般产品又没有适切结构能够解决上述问题,此显然是相关业者急欲解决的问题。It can be seen that the above-mentioned existing groove processing tool obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. urgent problem to be solved.

发明内容Contents of the invention

本发明的目的在于提供一种沟槽加工工具,其对积成型薄膜太阳电池等电极膜或光吸收层等薄膜进行沟槽加工时,用以加工的薄膜即使较厚,亦能够直线地形成固定线宽的美丽的刻划线,且能够使图型化的沟槽宽度较小,进行较少剥离的沟槽加工。It is an object of the present invention to provide a grooving tool that can form a groove in a straight line even if the film used for processing is thick when grooving an electrode film such as an integral thin-film solar cell or a thin film such as a light-absorbing layer. Beautiful scribing lines with a wide line width, and can make the patterned groove width smaller, and perform groove processing with less peeling.

本发明的目的及解决其技术问题是采用以下技术方案来实现的。本实用新型一种沟槽加工工具,其由棒状的本体、以及形成于本体前端的刀刃前端区域所构成;该刀刃前端区域,由长方形的底面、从底面长边方向的边相对于底面立起成直角的相互平行的左侧面及右侧面、以及沿着底面宽度方向的边而形成于刀刃前端区域的前面侧或后面侧的至少任一方侧的刀刃前端部所构成;该刀刃前端部,由在底面的端缘朝向斜上方倾斜的第1刀刃面、以及相对于第1刀刃面交叉成锐角的第2刀刃面所形成。The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. The utility model relates to a groove processing tool, which is composed of a rod-shaped body and a front end area of a blade formed at the front end of the body; the front end area of the blade is formed by a rectangular bottom surface, and stands upright from the bottom surface in the direction of the long side of the bottom surface. The left side and the right side parallel to each other at right angles, and the blade front end formed on at least either side of the front side or rear side of the blade front end region along the side in the width direction of the bottom surface; the blade front end , formed by a first blade surface inclined obliquely upward at the end edge of the bottom surface, and a second blade surface intersecting at an acute angle with respect to the first blade surface.

本发明的目的及解决其技术问题还可采用以下技术措施进一步实现。The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

较佳的,前述的沟槽加工工具,其中借由该第1刀刃面与第2刀刃面而形成的刀刃前端的角度为30~85度。Preferably, in the aforementioned groove machining tool, the angle of the front end of the blade formed by the first blade surface and the second blade surface is 30-85 degrees.

较佳的,前述的沟槽加工工具,其中该第1刀刃面相对于底面的倾斜角度为1~30度。Preferably, in the aforementioned groove processing tool, the inclination angle of the first cutting edge surface relative to the bottom surface is 1-30 degrees.

借由较佳的,前述的沟槽加工工具,其中该刀刃前端区域的底面以及刀刃前端部的宽度为30~5000μm,第1刀刃面的长度为5~40μm。Preferably, in the aforementioned groove processing tool, the width of the bottom surface of the front end region of the blade and the front end of the blade is 30-5000 μm, and the length of the first blade surface is 5-40 μm.

本发明的目的及解决其技术问题还采用以下技术方案来实现的。本发明一种沟槽加工方法,其包括以下步骤:使用本发明沟槽加工工具;使该沟槽加工工具的第1刀刃面与加工对象的薄膜表面接触,使该沟槽加工工具沿着薄膜的表面移动。The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. A groove processing method of the present invention comprises the following steps: using the groove processing tool of the present invention; bringing the first blade surface of the groove processing tool into contact with the film surface of the processing object, and making the groove processing tool along the film surface movement.

借由上述技术方案,本发明沟槽加工工具至少具有下列优点及有益效果:With the above technical solution, the groove processing tool of the present invention has at least the following advantages and beneficial effects:

(一)根据本发明的沟槽加工工具,设置于刀刃前端区域前面侧(或后面侧)的刀刃前端部形成有锐角的刀刃前端,因此能够使刀刃前端滑顺地侵入薄膜,并且,存在于刀刃前端上面侧的第2刀刃面为斜面,能够使已剥离的部分往上方掠过而离去。借此,即使用以加工的薄膜较厚,亦不会产生刻划线中断或不规则薄膜的剥离,且能够形成固定线宽的美丽刻划线。(1) According to the grooving tool of the present invention, the front end portion of the blade provided on the front side (or rear side) of the front end region of the blade is formed with an acute-angled blade front end, so that the front end of the blade can smoothly penetrate into the film, and there is The second blade surface on the upper side of the blade front end is a bevel, and the peeled-off part can be swept upwards and left. Thereby, even if the film used for processing is thick, there will be no scribe line interruption or irregular film peeling, and beautiful scribe lines with a fixed line width can be formed.

(二)刀刃前端的第1刀刃面,由于是从底面的一端缘往斜上方倾斜而形成,因此在沟槽加工时,该第1刀刃面与太阳电池的表面进行面接触,使沟槽加工工具倾斜而进行,借此能够抑制对被加工面的刀刃前端过度的侵入。亦即,一旦将锐利的刀刃前端以线接触按压于被加工面,则施加于接触部位压力的调整将是困难的,但如上述般,使第1刀刃面与被加工面进行面接触,借此能够抑制过度的侵入,并且能够容易地配合薄膜形状而进行微调整按压压力。此外,第1刀刃面由于其长度较短,因此能够一边抑制如上述般的过度侵入,一边确保适度的切削性能。(2) The first blade surface at the front end of the blade is formed by inclining upward from one end edge of the bottom surface. Therefore, during groove processing, the first blade surface is in surface contact with the surface of the solar cell, making the groove processing The tool is tilted to suppress excessive intrusion of the tip of the cutting edge into the surface to be processed. That is, once the sharp blade front end is pressed on the processed surface with line contact, it will be difficult to adjust the pressure applied to the contact part, but as mentioned above, the first blade surface is surface-contacted with the processed surface, and by This suppresses excessive intrusion, and makes it easy to finely adjust the pressing pressure according to the shape of the film. In addition, since the length of the first blade surface is relatively short, moderate cutting performance can be secured while suppressing the above-mentioned excessive penetration.

(三)沟槽加工工具的刀刃前端区域的左右侧面,以从底面长边方向的端边立起成直角而成为相互地大致平行的方式而形成,因此刀刃前端即使磨耗,刀刃前端的左右宽度的尺寸亦不会产生变化。借此,即使刀刃前端磨耗,亦能够使刻划的沟槽宽度维持为相同。(3) The left and right side surfaces of the front end region of the groove processing tool are formed so as to stand at right angles from the end sides in the longitudinal direction of the bottom surface and become approximately parallel to each other. Therefore, even if the front end of the blade is worn, the left and right width of the front end of the blade size will not change. Thereby, even if the tip of the blade is worn, the width of the scribed groove can be maintained to be the same.

上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

附图说明Description of drawings

图1:表示本发明的沟槽加工工具实施例的立体图。Fig. 1: A perspective view showing an embodiment of a grooving tool of the present invention.

图2:表示在图1所示的沟槽加工工具的刀刃前端部的放大侧视图。Fig. 2: An enlarged side view showing the front end of the cutting edge of the grooving tool shown in Fig. 1 .

图3:表示在图1所示的沟槽加工工具在沟槽加工时状态的侧视图。Fig. 3: A side view showing the state of the groove machining tool shown in Fig. 1 during groove machining.

图4:表示图3的刀刃前端部的放大侧视图。Fig. 4: An enlarged side view showing the front end of the blade in Fig. 3 .

图5:表示本发明的沟槽加工工具的另一实施例的立体图。Fig. 5: A perspective view showing another embodiment of the grooving tool of the present invention.

图6(a)、图6(b)及图6(c):表示一般的CIGS薄膜太阳电池的制造步骤的示意图。Fig. 6(a), Fig. 6(b) and Fig. 6(c): schematic diagrams showing the manufacturing steps of a general CIGS thin film solar cell.

图7:表示现有习知的沟槽加工工具实施例的立体图。Fig. 7: A perspective view showing an embodiment of a conventional groove machining tool.

图8:表示现有习知的沟槽加工工具的另一实施例的立体图。Fig. 8: A perspective view showing another embodiment of a conventional groove machining tool.

图9(a)、图9(b)及图9(c):表示3种类的沟槽加工工具的加工例图式。Fig. 9(a), Fig. 9(b) and Fig. 9(c): Diagrams showing machining examples of three types of groove machining tools.

【主要元件符号说明】[Description of main component symbols]

W:太阳电池基板           A:沟槽加工工具W: Solar cell substrate A: Grooving tool

10:本体                  11:刀刃前端区域10: Body 11: Front end area of blade

12:刀刃前端区域的底面    13:刀刃前端区域的左侧面12: Bottom surface of the front end area of the blade 13: Left side of the front end area of the blade

14:刀刃前端区域的右侧面  15:刀刃前端区域的前面14: Right side of the front end area of the blade 15: Front of the front end area of the blade

16:刀刃前端部            18:第1刀刃面16: Front end of blade 18: 1st blade surface

19:第2刀刃面             20:刀刃前端19: Second blade side 20: Front end of the blade

具体实施方式Detailed ways

为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对依据本发明提出的一种沟槽加工工具的具体实施方式、结构、特征及其功效,详细说明如后。In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and features of a groove machining tool proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its effect is described in detail below.

请参阅图1及图2,表示本发明沟槽加工工具的实施例。图1是从上方观察的立体图,图2是放大沟槽加工工具的刀刃前端部的侧视图。该沟槽加工工具A实质上由对应刻划装置(图示外)安装部的四角柱状的本体10、以及在其前端部借由放电加工等加工成一体的刀刃前端区域11所构成。刀刃前端区域11,是以超硬合金或烧结钻石等硬质材料制造。刀刃前端区域11,是由细长地延伸的长方形的底面12、从底面12长边方向的边立起成直角而成为相互平行的一对左,右侧面13,14、沿着底面12宽度方向的边而形成于刀刃前端区域11的前面(朝向沟槽加工工具的移动方向的面)15侧的刀刃前端部16、以及从底面的后端缘立起成直角的后面17所构成。刀刃前端部16,如于图2详细地表示般,是由在底面12的端缘附近朝向斜上方倾斜的第1刀刃面18、相对于第1刀刃面18交叉成锐角的第2刀刃面19、以及借由该第1刀刃面18与第2刀刃面19而形成的刀刃前端20而形成。Please refer to FIG. 1 and FIG. 2 , which show an embodiment of the groove processing tool of the present invention. FIG. 1 is a perspective view seen from above, and FIG. 2 is an enlarged side view of the front end portion of the blade of the grooving tool. The grooving tool A is substantially composed of a quadrangular pillar-shaped body 10 corresponding to the mounting part of the scribing device (not shown), and a blade front end region 11 integrated at the front end by electrical discharge machining or the like. The blade front end region 11 is made of hard materials such as superhard alloy or sintered diamond. Blade front end area 11 is by elongately extending rectangular bottom surface 12, erects at right angles from the side of bottom surface 12 longitudinal direction and becomes a pair of left and right sides parallel to each other, right side 13,14, along bottom surface 12 widths The blade front end portion 16 formed on the front side (the surface facing the moving direction of the grooving tool) 15 side of the blade front end region 11 and the rear face 17 standing at right angles from the rear end edge of the bottom surface constitute. The blade front end portion 16, as shown in detail in FIG. , and the blade front end 20 formed by the first blade surface 18 and the second blade surface 19 is formed.

第12刃面18相对于底面12的倾斜角度α1,在1~30度的范围内且较佳为10度左右。使倾斜角度α1比1度大的理由,是为了使第1刀刃面18与底面12为不同的面。使倾斜角度α1比30度小的理由,是为了防止一旦倾斜角α1比后述角度α2的最小角度30度大,则越远离刀刃前端部16,底面12与第2刀刃面19越接近,且变得容易折毁。The inclination angle α1 of the twelfth blade surface 18 with respect to the bottom surface 12 is in the range of 1 to 30 degrees, preferably about 10 degrees. The reason for making the inclination angle α1 larger than 1 degree is to make the first blade surface 18 and the bottom surface 12 different surfaces. The reason that makes angle of inclination α1 smaller than 30 degrees is to prevent that once angle of inclination α1 is greater than 30 degrees of the minimum angle of angle α2 described later, then the farther away from the blade front end portion 16, the bottom surface 12 is closer to the second blade surface 19, and become easily broken.

此外,借由第1刀刃面18与第2刀刃面19而形成的刀刃前端20的角度α2,是30~85度的范围内,且更佳为考虑强度与切削性能的平衡而形成为接近60度的角度。In addition, the angle α2 of the blade front end 20 formed by the first blade surface 18 and the second blade surface 19 is in the range of 30 to 85 degrees, and is preferably formed to be close to 60 degrees in consideration of the balance between strength and cutting performance. degree angle.

进一步地,刀刃前端区域11的底面12的左右宽度L1,较佳为30~80μm,但可配合所要求的刻划沟槽宽度而为30~5000μm。与该底面的端缘相连而形成的第1刀刃面18的长度L2,较佳为5~40μm。另外,沟槽加工工具A的本体10并不限定于四角柱,以圆柱状或多角形而形成亦可。Furthermore, the left-right width L1 of the bottom surface 12 of the front end region 11 of the blade is preferably 30-80 μm, but it can be 30-5000 μm according to the required scribe groove width. The length L2 of the first blade surface 18 formed continuously with the edge of the bottom surface is preferably 5 to 40 μm. In addition, the main body 10 of the grooving tool A is not limited to a square column, and may be formed in a cylindrical shape or a polygonal shape.

使用上述的沟槽加工工具A而进行加工的情形,如图3及图4所示,使刀刃前端部16朝向移动方向的状态,且相对于太阳电池基板W,刀刃前端部16的第1刀刃面18与太阳电池基板W的表面进行面接触的方式,使沟槽加工工具A倾斜,亦即以第1刀刃面的倾斜角度仅为10度,使沟槽加工工具A往移动方向侧倾斜而安装于刻划装置(图示外)。之后,使沟槽加工工具A往太阳电池基板W的表面按压,并同时相对于太阳电池基板W而相对地移动,借此加工于先前所述的沟槽M1或沟槽M2。When processing using the above-mentioned groove processing tool A, as shown in FIG. 3 and FIG. The surface 18 is in surface contact with the surface of the solar cell substrate W, the groove processing tool A is inclined, that is, the inclination angle of the first blade surface is only 10 degrees, and the groove processing tool A is inclined to the moving direction side. Installed on the scoring device (not shown). Afterwards, the groove processing tool A is pressed against the surface of the solar cell substrate W, and at the same time relatively moved relative to the solar cell substrate W, thereby processing the aforementioned groove M1 or groove M2.

在该沟槽加工时,为了较佳地进行使加工的沟槽宽度亦即刻划线的线宽维持为固定,而制品的设计上预定的品质(光电转换效率等)可实现以及品质的均一性,有必要使薄膜的剥离比例为固定。In this groove processing, in order to maintain the processed groove width, that is, the line width of the scribe line, at a constant level, the quality (photoelectric conversion efficiency, etc.) predetermined in the design of the product can be realized and the uniformity of quality can be achieved. , it is necessary to make the stripping ratio of the film constant.

本发明的上述沟槽加工工具A,由于设置于刀刃前端区域11前面的刀刃前端20以锐角而形成,因此存在于刀刃前端20上面侧的第2刀刃面19成为斜面,而能够使已剥离部分如以图4的箭头所示般往上方掠过而离去。借此,透明电极层6即使是2μm或以上厚度的沟槽加工(即使是较此为薄的膜厚的沟槽加工),亦能够抑制刻划线中断或不规则薄膜的剥离发生,而可直线地形成固定线宽的美丽刻划线。In the above-mentioned grooving tool A of the present invention, since the blade front end 20 disposed on the front side of the blade front end region 11 is formed at an acute angle, the second blade surface 19 present on the upper side of the blade front end 20 becomes an inclined plane, and the peeled part can be made As shown by the arrow in FIG. 4, it flies upwards and leaves. Thereby, even if the transparent electrode layer 6 is grooved with a thickness of 2 μm or more (even if it is grooved with a thinner film thickness), it is possible to suppress the breakage of the scribe line or the peeling of the irregular film. Forms beautiful ruled lines with a fixed line width in a straight line.

此外,由于刀刃前端部16的第1刀刃面18,从底面12的一端缘往斜上方倾斜而形成,因此在沟槽加工时,该第1刀刃面18与太阳电池基板W的表面进行面接触,使沟槽加工工具A倾斜而进行,借此使第1刀刃面18与被加工面进行面接触,能够容易地微调整按压的压力,且能够防止施加过度的集中负载。此外,第1刀刃面18由于其长度仅为5~40μm,较短,因此能够施加适度的压力而确保切削性能。In addition, since the first blade surface 18 of the blade front end portion 16 is formed obliquely upward from one end edge of the bottom surface 12, the first blade surface 18 is in surface contact with the surface of the solar cell substrate W during grooving. The grooving tool A is tilted to bring the first blade surface 18 into surface contact with the surface to be processed, thereby making it possible to easily finely adjust the pressing pressure and prevent excessive concentrated load from being applied. In addition, since the first blade surface 18 has a short length of only 5 to 40 μm, it is possible to apply a moderate pressure and ensure cutting performance.

此外,沟槽加工工具A的刀刃前端区域的左、右侧面13,14,从底面12长边方向的端缘立起成直角而成为相互平行的方式,因此刀刃前端20即使磨耗,亦不会使刀刃前端20左右宽度的尺寸产生变化。借此,即使是刀刃前端磨耗或研磨之后,亦能够使刻划的沟槽宽度维持为相同。In addition, the left and right side surfaces 13, 14 of the cutting edge front end region of the grooving tool A are erected at right angles from the end edges in the longitudinal direction of the bottom surface 12 to be parallel to each other, so even if the cutting edge front end 20 is worn, it will not The size of the width of the front end 20 of the blade will change. Thereby, even after the front end of the blade is worn or polished, the width of the scribed groove can be maintained to be the same.

图9(a)、图9(b)及图9(c)表示使用3种类的沟槽加工工具的图6(c)所示P3步骤的加工例图式,图9(a)表示图7所示的前端尖细的圆锥梯状沟槽加工工具的加工状态的图式,图9(b)表示图8所示的沟槽加工工具的加工状态的图式,图9(c)表示图1所示本发明的沟槽加工工具A的加工状态的图式。在图式中,黑色部分是透明电极层6,白色带状部分是M2沟槽部分,不规则斑状部分是透明电极层6已剥离的部分。Fig. 9(a), Fig. 9(b) and Fig. 9(c) show the processing examples of the P3 step shown in Fig. 6(c) using three types of groove processing tools, and Fig. Figure 9 (b) shows a schematic diagram of the processing state of the conical trapezoidal groove processing tool shown in Figure 8, and Figure 9 (c) shows 1 is a diagram showing a machining state of the groove machining tool A of the present invention. In the drawing, the black part is the transparent electrode layer 6 , the white strip part is the M2 groove part, and the irregular patchy part is the part where the transparent electrode layer 6 has been peeled off.

测定不规则斑状的剥离部分最大宽度时,最大剥离宽度在图9(a)是206μm,在图9(b)是157μm,在图9(c)是79μm,且根据本发明的沟槽加工工具A能够抑制剥离。When measuring the maximum width of the peeling part of the irregular patch, the maximum peeling width is 206 μm in Fig. 9 (a), 157 μm in Fig. 9 (b), and 79 μm in Fig. 9 (c), and the groove processing tool according to the present invention A can suppress peeling.

在本发明中,上述实施例表示了刀刃前端部16设置于刀刃前端区域的前面(或后面)的情况,但如图5所示般即使在刀刃前端区域11的前后两方形成刀刃前端部16亦可。借此,若一方磨耗或破损,则能够借由改变沟槽加工工具A的安装方向而使另一方的刀刃前端作为新品而使用。In the present invention, the above-mentioned embodiment has shown the situation that the blade front end portion 16 is arranged on the front (or back) of the blade front end region, but as shown in FIG. also can. Thereby, if one is worn or damaged, the other blade tip can be used as a new product by changing the mounting direction of the grooving tool A.

本发明可适用于薄膜太阳电池或有机EL面板等基板表面薄膜的沟槽加工。The invention can be applied to groove processing of thin films on the surface of substrates such as thin film solar cells or organic EL panels.

以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all the content that does not depart from the technical solution of the present invention, according to the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments by the technical essence still belong to the scope of the technical solutions of the present invention.

Claims (7)

1.一种沟槽加工工具,其特征在于:1. A groove processing tool, characterized in that: 其由棒状的本体、以及形成于本体前端的刀刃前端区域所构成;It consists of a rod-shaped body and a blade front end area formed at the front end of the body; 刀刃前端区域,由长方形的底面、从底面长边方向的边相对于底面立起成直角的相互平行的左侧面及右侧面、以及沿着底面宽度方向的边而形成于刀刃前端区域的前面侧或后面侧的至少任一方侧的刀刃前端部所构成;The front end region of the blade is formed in the front end region of the blade by a rectangular bottom surface, a left side and a right side parallel to each other standing at right angles to the bottom surface from the sides in the long side direction of the bottom surface, and the sides along the width direction of the bottom surface. Consists of the blade front end on at least either side of the front side or the rear side; 该刀刃前端部,由在底面的端缘朝向斜上方倾斜的第1刀刃面、以及相对于第1刀刃面交叉成锐角的第2刀刃面所形成。The blade front end is formed by a first blade surface inclined obliquely upward at the end edge of the bottom surface, and a second blade surface intersecting the first blade surface at an acute angle. 2.如权利要求1所述的沟槽加工工具,其特征在于其中借由该第1刀刃面与第2刀刃面而形成的刀刃前端的角度为30~85度。2. The grooving tool according to claim 1, wherein the angle of the front end of the blade formed by the first blade surface and the second blade surface is 30-85 degrees. 3.如权利要求1或2所述的沟槽加工工具,其特征在于其中该第1刀刃面相对于底面的倾斜角度为1~30度。3. The grooving tool according to claim 1 or 2, wherein the inclination angle of the first blade surface relative to the bottom surface is 1-30 degrees. 4.如权利要求1或2所述的沟槽加工工具,其特征在于其中该刀刃前端区域的底面以及刀刃前端部的宽度为30~5000μm,第1刀刃面的长度为5~40μm。4. The grooving tool according to claim 1 or 2, wherein the width of the bottom surface of the front end region of the blade and the front end of the blade is 30-5000 μm, and the length of the first blade surface is 5-40 μm. 5.如权利要求3所述的沟槽加工工具,其特征在于其中该刀刃前端区域的底面以及刀刃前端部的宽度为30~5000μm,第1刀刃面的长度为5~40μm。5. The grooving tool according to claim 3, wherein the width of the bottom surface of the blade front end region and the blade front end is 30-5000 μm, and the length of the first blade surface is 5-40 μm. 6.一种沟槽加工方法,其特征在于:6. A groove processing method, characterized in that: 使用权利要求1至3中任一项的沟槽加工工具;以及using the grooving tool of any one of claims 1 to 3; and 使该沟槽加工工具的第1刀刃面与加工对象的薄膜表面接触,使该沟槽加工工具沿着薄膜的表面移动。The first blade face of the groove processing tool is brought into contact with the surface of the film to be processed, and the groove processing tool is moved along the surface of the film. 7.一种沟槽加工方法,其特征在于:7. A groove processing method, characterized in that: 使用权利要求4的沟槽加工工具;以及using the grooving tool of claim 4; and 使该沟槽加工工具的第1刀刃面与加工对象的薄膜表面接触,使该沟槽加工工具沿着薄膜的表面移动。The first blade face of the groove processing tool is brought into contact with the surface of the film to be processed, and the groove processing tool is moved along the surface of the film.
CN2013100256969A 2012-01-18 2013-01-16 Groove processing tool and method for processing groove Pending CN103213203A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012007996A JP2013146811A (en) 2012-01-18 2012-01-18 Groove machining tool and groove machining method
JP2012-007996 2012-01-18

Publications (1)

Publication Number Publication Date
CN103213203A true CN103213203A (en) 2013-07-24

Family

ID=48811520

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100256969A Pending CN103213203A (en) 2012-01-18 2013-01-16 Groove processing tool and method for processing groove

Country Status (4)

Country Link
JP (1) JP2013146811A (en)
KR (1) KR101529966B1 (en)
CN (1) CN103213203A (en)
TW (1) TW201331138A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108453906A (en) * 2018-03-29 2018-08-28 中钢集团新型材料(浙江)有限公司 A kind of graphite material fracture toughness test grooving tool, equipment and grooving method
CN110394491A (en) * 2019-07-22 2019-11-01 河南北方红阳机电有限公司 A kind of coaxial double-point tool oblique cutting processing tool and processing method
CN112091298A (en) * 2020-09-16 2020-12-18 中国航发贵州黎阳航空动力有限公司 Straight groove machining tool and machining method
CN112620762A (en) * 2020-12-18 2021-04-09 贵州华烽电器有限公司 Shell keyway cutting process device
CN113698085A (en) * 2021-07-05 2021-11-26 维达力实业(赤壁)有限公司 Processing method of clearance groove and 3D substrate product

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI513671B (en) * 2013-12-06 2015-12-21 Ind Tech Res Inst Cutting tool and glass cutting device using the same
JP7010621B2 (en) * 2017-08-02 2022-01-26 住友化学株式会社 Synthetic resin film, separator for power storage device and power storage device
JP7578997B2 (en) 2022-07-26 2024-11-07 三星ダイヤモンド工業株式会社 Groove machining tool and groove machining method
CN117774040B (en) * 2024-02-26 2024-05-14 山东山科蓝芯太阳能科技有限公司 PVT photovoltaic photo-thermal plate cutting integrated equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331413A (en) * 2001-05-02 2002-11-19 Pascal:Kk Fine cutting tool for correcting printed wiring board
WO2010098306A1 (en) * 2009-02-24 2010-09-02 三星ダイヤモンド工業株式会社 Slotting tool, and thin film solar cell slotting method and scribing device using same
CN102130217A (en) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 Grooving Tool for Thin Film Solar Cells
CN102832116A (en) * 2011-06-13 2012-12-19 聚日(苏州)科技有限公司 Thin film strip structure, solar cell and manufacturing method of thin film strip structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526010B1 (en) * 2002-10-17 2005-11-08 주식회사 광신기업 Tool for cutting name plate made of synthetic resin

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331413A (en) * 2001-05-02 2002-11-19 Pascal:Kk Fine cutting tool for correcting printed wiring board
WO2010098306A1 (en) * 2009-02-24 2010-09-02 三星ダイヤモンド工業株式会社 Slotting tool, and thin film solar cell slotting method and scribing device using same
CN102130217A (en) * 2010-01-08 2011-07-20 三星钻石工业股份有限公司 Grooving Tool for Thin Film Solar Cells
CN102832116A (en) * 2011-06-13 2012-12-19 聚日(苏州)科技有限公司 Thin film strip structure, solar cell and manufacturing method of thin film strip structure

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108453906A (en) * 2018-03-29 2018-08-28 中钢集团新型材料(浙江)有限公司 A kind of graphite material fracture toughness test grooving tool, equipment and grooving method
CN108453906B (en) * 2018-03-29 2019-03-26 中钢集团新型材料(浙江)有限公司 A kind of graphite material fracture toughness test grooving tool, equipment and grooving method
CN110394491A (en) * 2019-07-22 2019-11-01 河南北方红阳机电有限公司 A kind of coaxial double-point tool oblique cutting processing tool and processing method
CN110394491B (en) * 2019-07-22 2024-08-02 河南北方红阳机电有限公司 Coaxial double-edge cutter oblique insertion machining tool and machining method
CN112091298A (en) * 2020-09-16 2020-12-18 中国航发贵州黎阳航空动力有限公司 Straight groove machining tool and machining method
CN112620762A (en) * 2020-12-18 2021-04-09 贵州华烽电器有限公司 Shell keyway cutting process device
CN113698085A (en) * 2021-07-05 2021-11-26 维达力实业(赤壁)有限公司 Processing method of clearance groove and 3D substrate product
CN113698085B (en) * 2021-07-05 2022-05-20 维达力实业(赤壁)有限公司 Method for processing clearance groove and 3D substrate product

Also Published As

Publication number Publication date
JP2013146811A (en) 2013-08-01
KR20130084990A (en) 2013-07-26
TW201331138A (en) 2013-08-01
KR101529966B1 (en) 2015-06-18

Similar Documents

Publication Publication Date Title
CN103213203A (en) Groove processing tool and method for processing groove
CN102325621B (en) Groove processing instrument and use the groove processing method of thin film solar cell and the chalker of this groove processing instrument
TWI417260B (en) Set
CN113093445A (en) Electroactive device and method of manufacturing an electroactive device
TW201101525A (en) Method for manufacturing integrated thin-film solar cell
TWI472050B (en) Production of integrated thin film solar cells
CN104396015A (en) Laser-etched stacks of thin layers for photovoltaic cell connections
CN103367535B (en) Groove machining tool, method and the grooving apparatus of thin film solar cell
CN106328728B (en) A laser scribing method for copper indium gallium selenide thin film power generation glass
US12062733B2 (en) Substrate for solar cell, solar cell, and solar cell manufacturing method
JP2020107795A (en) Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same
JP2020107800A (en) Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same
JP2020107796A (en) Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same
JP2020107797A (en) Grooving tool, and thin film solar cell grooving method and grooving device using the same
JP2012089559A (en) Manufacturing method of nitride compound semiconductor element
JP2020107798A (en) Groove processing tool, and grooving method and grooving apparatus for thin film solar cell using the same
WO2011021615A1 (en) Solar cell module and method for manufacturing same
JP2012044226A (en) Solar cell module
JP2013071884A (en) Glass substrate, and method for producing the same
TW201340357A (en) Method for forming solar cell chip

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130724