CN103206625A - Lighting device and manufacturing method thereof - Google Patents
Lighting device and manufacturing method thereof Download PDFInfo
- Publication number
- CN103206625A CN103206625A CN2012100133095A CN201210013309A CN103206625A CN 103206625 A CN103206625 A CN 103206625A CN 2012100133095 A CN2012100133095 A CN 2012100133095A CN 201210013309 A CN201210013309 A CN 201210013309A CN 103206625 A CN103206625 A CN 103206625A
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- CN
- China
- Prior art keywords
- circuit board
- lighting device
- photo engine
- heat abstractor
- perisporium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a lighting device, comprising a radiator (1) made of thermal conductive plastic, and a light engine (2) in heat contact with the radiator (1), wherein the radiator (1) and the light engine (2) are integrated by a mold. The invention also relates to a manufacturing method of the lighting device.
Description
Technical field
The present invention relates to a kind of lighting device.In addition, the invention still further relates to a kind of manufacture method of lighting device of the above-mentioned type.
Background technology
Along with continuous advancement in technology, the LED lighting device more and more is subjected to people's favor, and this is because the luminous efficiency height of LED lighting device, and size is little, and is more energy-conservation and compare with traditional lighting device, and its life-span is longer.But LED lighting device led chip can produce heat when work, these heats must be derived from LED lighting device row in time and be gone, otherwise can cause harmful effect to electronic device at the heat that lighting device is assembled, for example weaken the luminous efficiency of LED lighting device and shorten its service life.Therefore, the designer tries every means to design various types of heat abstractors, leads these heats to arrange well.These heat abstractors are the separate part that is independent of the circuit board of LED lighting device equally.Under the situation that assembling finishes, in the time of on the installed surface that circuit board need be placed on heat abstractor, but between circuit board and installed surface, can there be the gap inevitably, this can cause harmful effect to heat radiation.Usually need between circuit board and installed surface, apply thermal interface material for this reason.But the thermal conductivity of thermal interface material is relatively low, and this heat dispersion to entire lighting device has caused negative influence.In addition, because therefore separate part separated from one another when circuit board and heat abstractor is fixed together at the other secure component of needs, this has increased cost and has strengthened manufacture difficulty.
Summary of the invention
For addressing the above problem, the present invention proposes a kind of lighting device, this lighting device has good performance of heat dissipation, and does not need other secure component, and it is with low cost, makes simple.In addition, the invention allows for a kind of manufacture method of lighting device of the above-mentioned type.
First purpose of the present invention realizes thus by a kind of lighting device, namely this lighting device comprise the heat abstractor made by heat-conducting plastic and with the photo engine of heat abstractor thermo-contact, wherein, heat abstractor and photo engine are integrally molded.In lighting device according to the present invention, because photo engine and heat abstractor are molded together, therefore, between photo engine and heat abstractor, there is not the gap, therefore need not to apply thermal interface material.This has reduced the thermal resistance the thermally conductive pathways from photo engine to heat abstractor significantly.Simultaneously, do not need the secure component that adds between the photo engine that is molded together and the heat abstractor, thereby reduced cost and manufacture difficulty.
Preferably, heat abstractor and photo engine are integrally molded by inlaying injection molding process.
Propose according to the present invention, heat abstractor comprises and substrate and the perisporium of photo engine thermo-contact that wherein perisporium and substrate limit at least one container cavity, and this substrate is isolated other electric assembly of photo engine and lighting device.Substrate arranged between other electric assembly of photo engine and lighting device, thereby between the two, formed good electric insulation.
Preferably, photo engine comprises circuit board and is arranged in led chip on first side of circuit board.
Being molded together with the first side second side surface opposite of substrate and circuit board proposed according to the present invention.When molded heat abstractor, substrate also together forms and is molded together with a side of circuit board, thereby forms closely, do not have direct heat contact intermittently between circuit board and substrate.
Preferably, the circumferential edge of perisporium covering board and cover first side.Thus, the part of perisporium forms and prevent the retainer that circuit board is deviate from from heat abstractor, thereby has further guaranteed circuit board and perisporium, the especially contact of the fixed-site between the substrate.
Preferably, board design becomes metal-core printed circuit board or ceramic printed-circuit board.Certainly, circuit board also can be designed to circuit board other types, that have good heat-conducting.
Preferably, heat-conducting plastic is to be the mixed plastic fraction of basic material with PP, ABS, PC, PA, LCP, PPS or PEEK.Certainly, heat-conducting plastic also can be other the material with high thermal conductivity.
Another object of the present invention realizes that by a kind of manufacture method of lighting device of the above-mentioned type this manufacture method may further comprise the steps: the photo engine that the led chip on first side that comprises circuit board and be arranged in circuit board a) is provided; B) photo engine is placed in the mould; C) be encapsulated in photo engine by heat-conducting plastic, to be molded into heat abstractor.
Preferably, in step c), utilize the embedding and injection molding moulding process to be molded into heat abstractor, wherein heat abstractor comprises and substrate and the perisporium of photo engine thermo-contact, and wherein, perisporium and substrate limit at least one container cavity.
Further preferably, in step c), circuit board be molded into substrate with the first side second side surface opposite, thereby between circuit board and substrate, form closely, do not have direct heat contact intermittently.
Preferably, in step c), make the circumferential edge of perisporium covering board and cover first side.Thus, the part of perisporium forms and prevent the retainer that circuit board is deviate from from heat abstractor, thereby has further guaranteed circuit board and perisporium, the especially contact of the fixed-site between the substrate.
Description of drawings
Accompanying drawing constitutes the part of this specification, is used for helping further to understand the present invention.These accompanying drawings illustrate embodiments of the invention, and are used for illustrating principle of the present invention with specification.Identical in the accompanying drawings parts are represented with identical label.Shown in the figure:
Fig. 1 is the sectional view according to lighting device of the present invention.
The specific embodiment
The unique accompanying drawing 1 of the present invention shows the sectional view according to lighting device of the present invention.As seen from the figure, lighting device according to the present invention comprise the heat abstractor 1 made by heat-conducting plastic and with the photo engine 2 of heat abstractor 1 thermo-contact, this heat abstractor 1 is by inlaying injection molding process and photo engine 2 is integrally molded.Further as seen, this heat abstractor 1 comprises and substrate 1b and the perisporium 1a of photo engine 2 thermo-contacts that wherein perisporium 1a and substrate 1b limit at least one container cavity from figure.In design of the present invention, perisporium 1a can have a plurality of for increasing area of dissipation and the radiating fin that improves concurrent condition.In addition, photo engine 2 comprises circuit board 2a and is arranged in led chip 2b on first side of circuit board 2a.Substrate 1b is with photo engine 2 other electric assembly with lighting device, and for example actuator electrical is isolated.In design of the present invention, circuit board 2a is designed to metal-core printed circuit board or ceramic printed-circuit board, and heat-conducting plastic is to be the mixed plastic fraction of basic material with PP, ABS, PC, PA, LCP, PPS or PEEK.
Further as seen, substrate 1b and circuit board 2a are molded together with the first side 2d second side surface opposite from figure, thereby have eliminated the gap that increases thermal resistance between circuit board 2a and substrate 1b.In addition, the circumferential edge 2b of perisporium 1a covering board 2a also covers first side, this has further increased the contact area between circuit board 2a and the perisporium 1a, improved heat dispersion, the part of perisporium 1a forms and prevent the retainer that circuit board 2a deviates from from heat abstractor simultaneously, thereby circuit board 2a and perisporium 1a have further been guaranteed, especially the contact of the fixed-site between the substrate 1b.
In the manufacture method according to lighting device of the present invention, the photo engine 2 of led chip 2b on first side that comprises circuit board 2a and be arranged in circuit board 2a at first is provided, then photo engine 2 is placed in the mould, and utilize the embedding and injection molding moulding process to be encapsulated in photo engine 2 by heat-conducting plastic, to be molded into heat abstractor 1, remove mould at last, form according to lighting device of the present invention.Wherein, the heat abstractor 1 that is molded into comprises substrate 1b and the perisporium 1a with photo engine 2 thermo-contacts, this perisporium 1a and substrate 1b limit at least one container cavity, wherein, this substrate 1b when forming namely with being molded together with the first side 2d second side surface opposite of circuit board 2a, may have the gap thereby eliminated between substrate 1b and the circuit board 2a.In addition, when forming perisporium 1a, make the circumferential edge 2c of perisporium 1a covering board 2a and part cover the first side 2d, thereby further guaranteed circuit board 2a and perisporium 1a, the especially contact of the fixed-site between the substrate 1b.
Be the preferred embodiments of the present invention only below, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All any modifications of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Reference number
1 heat abstractor
The 1a perisporium
The 1b substrate
2 photo engines
The 2a circuit board
The 2b led chip
The 2c circumferential edge
2d first side
Claims (12)
1. lighting device, comprise the heat abstractor (1) made by heat-conducting plastic and with the photo engine (2) of described heat abstractor (1) thermo-contact, it is characterized in that described heat abstractor (1) is integrally molded with described photo engine (2).
2. the described lighting device of claim 1 is characterized in that, described heat abstractor (1) is integrally molded by inlaying injection molding process with described photo engine (2).
3. lighting device according to claim 1, it is characterized in that, described heat abstractor (1) comprises substrate (1b) and the perisporium (1a) with described photo engine (2) thermo-contact, and wherein said perisporium (1a) limits at least one container cavity with described substrate (1b).
4. lighting device according to claim 3 is characterized in that, described photo engine (2) comprises circuit board (2a) and is arranged in led chip (2b) on first side of described circuit board (2a).
5. lighting device according to claim 3 is characterized in that, described substrate (1b) is molded together with described first side (2d) second side surface opposite with described circuit board (2a).
6. lighting device according to claim 3 is characterized in that, circumferential edge (2c) and part that described perisporium (1a) covers described circuit board (2a) cover described first side (2d).
7. lighting device according to claim 3 is characterized in that, described circuit board (2a) is designed to metal-core printed circuit board or ceramic printed-circuit board.
8. according to each described lighting device in the claim 1 to 7, it is characterized in that described heat-conducting plastic is to be the mixed plastic fraction of basic material with PP, ABS, PC, PA, LCP, PPS or PEEK material.
9. the manufacture method of a lighting device is characterized in that following steps:
A) provide the photo engine (2) of the led chip (2b) on first side that comprises circuit board (2a) and be arranged in described circuit board (2a);
B) described photo engine (2) is placed in the mould;
C) be encapsulated in described photo engine (2) by heat-conducting plastic, to be molded into heat abstractor (1).
10. manufacture method according to claim 9, it is characterized in that, in described step c), utilize the embedding and injection molding moulding process to be molded into described heat abstractor (1), wherein said heat abstractor (1) comprises substrate (1b) and the perisporium (1a) with described photo engine (2) thermo-contact, wherein, described perisporium (1a) limits at least one container cavity with described substrate (1b).
11. manufacture method according to claim 10 is characterized in that, in described step c), is molded into substrate (1b) at described circuit board (2a) with described first side (2d) second side surface opposite.
12. manufacture method according to claim 10 is characterized in that, in described step c), makes described perisporium (1a) cover the circumferential edge (2c) of described circuit board (2a) and covers described first side (2d).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100133095A CN103206625A (en) | 2012-01-16 | 2012-01-16 | Lighting device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100133095A CN103206625A (en) | 2012-01-16 | 2012-01-16 | Lighting device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103206625A true CN103206625A (en) | 2013-07-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100133095A Pending CN103206625A (en) | 2012-01-16 | 2012-01-16 | Lighting device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103206625A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329649A (en) * | 2013-07-22 | 2015-02-04 | 欧司朗有限公司 | Illuminating device |
| CN109307172A (en) * | 2017-07-26 | 2019-02-05 | 朗德万斯公司 | Lighting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145221Y (en) * | 2007-12-18 | 2008-11-05 | 陈炳武 | LED lamp |
| CN101363605A (en) * | 2008-09-05 | 2009-02-11 | 北京中庆微数字设备开发有限公司 | LED lamp and heat radiation structure thereof |
| WO2011005526A2 (en) * | 2009-06-24 | 2011-01-13 | Mahendra Dassanayake | Opto-thermal solution for multi-utility solid state lighting device using conic section geometries |
| CN102252297A (en) * | 2011-04-29 | 2011-11-23 | 上海威廉照明电气有限公司 | Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp |
| CN202065723U (en) * | 2010-12-10 | 2011-12-07 | 李文雄 | LED (light-emitting diode) lamp |
-
2012
- 2012-01-16 CN CN2012100133095A patent/CN103206625A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201145221Y (en) * | 2007-12-18 | 2008-11-05 | 陈炳武 | LED lamp |
| CN101363605A (en) * | 2008-09-05 | 2009-02-11 | 北京中庆微数字设备开发有限公司 | LED lamp and heat radiation structure thereof |
| WO2011005526A2 (en) * | 2009-06-24 | 2011-01-13 | Mahendra Dassanayake | Opto-thermal solution for multi-utility solid state lighting device using conic section geometries |
| CN202065723U (en) * | 2010-12-10 | 2011-12-07 | 李文雄 | LED (light-emitting diode) lamp |
| CN102252297A (en) * | 2011-04-29 | 2011-11-23 | 上海威廉照明电气有限公司 | Assembly of heating component and heat-dissipation structure and LED (light emitting diode) lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329649A (en) * | 2013-07-22 | 2015-02-04 | 欧司朗有限公司 | Illuminating device |
| CN109307172A (en) * | 2017-07-26 | 2019-02-05 | 朗德万斯公司 | Lighting device |
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| PB01 | Publication | ||
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Application publication date: 20130717 |