CN103192574A - Pressure-resistant corrugated board - Google Patents
Pressure-resistant corrugated board Download PDFInfo
- Publication number
- CN103192574A CN103192574A CN2013101500791A CN201310150079A CN103192574A CN 103192574 A CN103192574 A CN 103192574A CN 2013101500791 A CN2013101500791 A CN 2013101500791A CN 201310150079 A CN201310150079 A CN 201310150079A CN 103192574 A CN103192574 A CN 103192574A
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- China
- Prior art keywords
- corrugated board
- withstand voltage
- base stock
- facial tissue
- interlayer
- Prior art date
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Abstract
The invention discloses a pressure-resistant corrugated board which comprises surface paper, bottom paper, a sandwich layer, and transverse raised grains and longitudinal raised grains, which are arranged on the sandwich layer, wherein the transverse raised grains and the longitudinal raised grains are vertically arranged in a cross manner. Through the manner, the corrugated board for manufacturing a box body can be higher in pressure-resistant capacity by setting the structure of the sandwich layer, and simultaneously the manufacturing cost also can be reduced, and the pressure-resistant corrugated board is suitable for large-scale promotion.
Description
Technical field
The present invention relates to a kind of corrugated board, particularly relate to a kind of withstand voltage corrugated board.
Background technology
In life now, corrugated case is for packing, and the position is very important, so the material-corrugated board of corrugated case also is everybody positive improved material in the industrial production, but the withstand voltage degree of corrugated board in the life now awaits to improve.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of withstand voltage corrugated board, can utilize the architecture advances of interlayer in the middle of it to improve the withstand voltage degree of corrugated board.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of withstand voltage corrugated board is provided, comprise: facial tissue, base stock, interlayer, it is characterized in that, described interlayer is between facial tissue and base stock, described interlayer is provided with lateral wave Slippage and longitudinal wave Slippage, and described lateral wave Slippage and longitudinal wave Slippage are arranged in a crossed manner.
In a preferred embodiment of the present invention, described facial tissue and base stock material are corrugated paper.
In a preferred embodiment of the present invention, described lateral wave Slippage and the square crossing of longitudinal wave Slippage arrange.
In a preferred embodiment of the present invention, described thickness of interlayer is 0.5mm.
In a preferred embodiment of the present invention, described facial tissue is identical with base stock thickness.
In a preferred embodiment of the present invention, described facial tissue, base stock are identical with the sandwich shape size.
The invention has the beneficial effects as follows: the present invention can utilize the architecture advances of its middle interlayer, further improves the withstand voltage degree of corrugated board.
Description of drawings
Fig. 1 is the structural representation of withstand voltage corrugated board one preferred embodiment of the present invention.
The mark of each parts is as follows in the accompanying drawing: 1, facial tissue; 2, base stock; 3, interlayer; 301, lateral wave Slippage; 302, longitudinal wave Slippage.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
See also Fig. 1, the embodiment of the invention provides following technical scheme.
In one embodiment, a kind of withstand voltage corrugated board comprises: facial tissue 1, base stock 2, interlayer 3, and described interlayer 3 is between facial tissue 1 and base stock 2, described interlayer 3 is provided with lateral wave Slippage 301 and longitudinal wave Slippage 302, and described lateral wave Slippage 301 and longitudinal wave Slippage 302 are arranged in a crossed manner.
In an embodiment, preferably, described facial tissue 1 is corrugated paper with base stock 2 materials, adopts traditional corrugated paper, to guarantee the cost of cardboard.
Preferably, described lateral wave Slippage and the square crossing of longitudinal wave Slippage arrange, and make cardboard have stronger voltage endurance capability, instant packed and transportation.
During use, corrugated board made to be become corrugated case and replaces original withstand voltage degree strong common corrugated case inadequately.
By withstand voltage corrugated board of the present invention, not only can further improve the withstand voltage degree of corrugated board by utilizing the improvement rational in infrastructure of corrugated board intermediate course, and can under equal withstand voltage degree, effectively reduce cost, be fit to promote.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. withstand voltage corrugated board, comprise: facial tissue (1), base stock (2), interlayer (3), it is characterized in that, described interlayer is between facial tissue and base stock, described interlayer is provided with lateral wave Slippage (301) and longitudinal wave Slippage (302), and described lateral wave Slippage and longitudinal wave Slippage are arranged in a crossed manner.
2. withstand voltage corrugated board according to claim 1 is characterized in that, described facial tissue and base stock material are corrugated paper.
3. withstand voltage corrugated board according to claim 1 is characterized in that, described lateral wave Slippage and the square crossing of longitudinal wave Slippage arrange.
4. withstand voltage corrugated board according to claim 1 is characterized in that, described thickness of interlayer is 0.5mm.
5. withstand voltage corrugated board according to claim 1 is characterized in that, described facial tissue is identical with base stock thickness.
6. withstand voltage corrugated board according to claim 1 is characterized in that, described facial tissue, base stock are identical with the sandwich shape size.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101500791A CN103192574A (en) | 2013-04-27 | 2013-04-27 | Pressure-resistant corrugated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013101500791A CN103192574A (en) | 2013-04-27 | 2013-04-27 | Pressure-resistant corrugated board |
Publications (1)
Publication Number | Publication Date |
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CN103192574A true CN103192574A (en) | 2013-07-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2013101500791A Pending CN103192574A (en) | 2013-04-27 | 2013-04-27 | Pressure-resistant corrugated board |
Country Status (1)
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CN (1) | CN103192574A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2138027Y (en) * | 1992-09-16 | 1993-07-14 | 林锡良 | Enhanced structure for board of carton |
US5733403A (en) * | 1993-05-28 | 1998-03-31 | Aston Packaging Limited | Product packaging material and its manufacturing method |
CN202368023U (en) * | 2011-12-20 | 2012-08-08 | 天津市吉源元印刷制品有限公司 | Corrugated board |
-
2013
- 2013-04-27 CN CN2013101500791A patent/CN103192574A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2138027Y (en) * | 1992-09-16 | 1993-07-14 | 林锡良 | Enhanced structure for board of carton |
US5733403A (en) * | 1993-05-28 | 1998-03-31 | Aston Packaging Limited | Product packaging material and its manufacturing method |
CN202368023U (en) * | 2011-12-20 | 2012-08-08 | 天津市吉源元印刷制品有限公司 | Corrugated board |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
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C12 | Rejection of a patent application after its publication | ||
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Application publication date: 20130710 |