CN103171222B - High-viscosity composite film for flexible electronic packaging application, and its processing method - Google Patents
High-viscosity composite film for flexible electronic packaging application, and its processing method Download PDFInfo
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- CN103171222B CN103171222B CN201310072335.XA CN201310072335A CN103171222B CN 103171222 B CN103171222 B CN 103171222B CN 201310072335 A CN201310072335 A CN 201310072335A CN 103171222 B CN103171222 B CN 103171222B
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Abstract
The invention discloses a high-viscosity composite film for flexible electronic packaging application, and its processing method. The composite film comprises, from top to bottom, a polyester film base layer, a first adhesive layer, an auxiliary adhesive layer, a second adhesive layer and a heat seal layer. The method comprises the following steps: improving the surface tension of a polyester film by treating the polyester film as a base and adopting a plasma chemical modification process; coating a layer of a macromolecule solution under the modified polyester film; drying, and compounding with a first traffic flow delay technology fusion modified polyolefin resin to form the auxiliary adhesive layer; cooling, carrying out online trimming, coating a second layer of the macromolecule solution under the auxiliary adhesive layer, drying, compounding with a second traffic flow delay technology fusion modified ethylene-vinyl acetate copolymer resin, and carrying out ozone treatment of a melt in the compounding process; and cooling, carrying out composite film surface photo-grafting, carrying out online trimming, and carrying out rolling molding. The composite film has a good bonging effect, and is safe and environmentally-friendly.
Description
Technical field
The present invention relates to flexible electronic encapsulation, printing packaging field, be specifically related to a kind of flexible electronic package application class high viscosity composite membrane and processing method thereof.
Background technology
Flexible electronic technology is by the new electronic technology of organic or inorganic material electronics element manufacturing on flexibility, Drawability plastics or thin metal matrix plate, it, with the flexibility/ductility of uniqueness and efficient, low cost manufacturing process, has wide application prospect in fields such as information, the energy, medical treatment, national defence.
Flexible electronic encapsulation is a branch of flexible electronic technology, and it is that the one made for base material with polyimides or polyester film has height reliability, and excellent flexual technology, has the advantages that distribution density is high, lightweight, thickness is thin.Wherein paste the main technique that epiphragma is flexible electronic encapsulation.
Existing composite membrane encapsulating material comprises substrate, encapsulant, inter-level dielectric, protective layer etc.The material of being correlated with to be got out when using respectively, get corresponding size and processed by packaging technology.The quality of this technology depends on the own performance of the size alignment accuracy of interlayer, encapsulant adhesion strength, inter-level dielectric.The dimensional accuracy problem of interlayer is that each parts independently exists, and needs artificial or verification of machine, there is certain deviation; The adhesion strength of encapsulant and inter-level dielectric depend primarily on the selection of material and the technical finesse of material, and good technique can improve its caking property, electrical insulating property, toughness, intensity etc.Current most of Electronics Factory is adopt electric iron process pasting epiphragma technique, and technique is immature and security is not high.
Summary of the invention
It is good that technical problem to be solved by this invention is to provide a kind of bond effect, and electronic application class high viscosity composite membrane of safety and environmental protection and preparation method thereof.
A kind of electronic application class high viscosity composite membrane of the present invention, this composite membrane is respectively polyester film substrate layer, the first adhesive layer, adhesion promoter layer, the second adhesive layer and thermal synthesis layer from top to bottom.
The invention also discloses the processing method of this electronic application class high viscosity composite membrane, it comprises the following steps:
1) take polyester film as base material, using plasma chemic modified method improves the surface tension of polyester film; Plasma chemical modifying method adopts ionized gas to clash into polyester film surface by transmitter, self-energy is passed to polyester surface molecule by electronics wherein, ion, atom, molecule, with material surface interactions, produce surface reaction, realize surface modification;
2) be coated with one deck Polymer Solution under polyester film after modification, this Polymer Solution is using 1 part of polymine as key reaction body, and with 50 parts of methyl alcohol, 100 parts of water fully mix; Coating weight dry weight is 0.03-0.05 gram/m; Adhesion promoting layer is compounded to form mutually with the vistanex of the first car casting technology melt modification after dry; Casting technology adds polyolefin resin feedstock by extruder, and the fused films body being processed into cascade shape is coated on the technology on base material.
3) after after supercooling, online trimming, under adhesion promoting layer, be coated with second layer Polymer Solution, using 1 part of polymine as key reaction body, with 10 parts of methyl alcohol, 10 parts of water fully mix, coating weight dry weight 0.03-0.05 gram/square; With the ethylene-vinyl acetate copolymer phase compound of the second car casting technology melt modification after dry, in recombination process, ozone treatment is carried out to melt;
4) finally by cooling, composite film surface photo-grafting, after online trimming, rolling is shaping.
Above-mentioned steps 1) the corona intensity that adopts of plasma chemical modifying method is 15-20WD.
Beneficial effect of the present invention: the protective layer of packaging technology, encapsulating material and interlayer material are processed as one by the present invention, and dimensional accuracy significantly improves, and does not produce displacement in encapsulation process, good stability of the dimension.In quality, this product have chosen the vistanex of excellent combination property as binding material, and changes composite membrane interface configuration by process for treating surface, improves surface energy, makes binding material performance better.In addition, invention increases one deck adhesion promoting layer, by the effect of adhesion promoting layer, the adhesion strength of product is better.In packaging technology, the operation of this product simplification, does not produce the material of contaminated environment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention,
Detailed description of the invention
As shown in Figure 1, electronic application class high viscosity composite membrane of the present invention, is respectively polyester film substrate layer 1, first adhesive layer 2, adhesion promoter layer 3, second adhesive layer 4 and thermal synthesis layer 5 from top to bottom.
The processing method of this high viscosity composite membrane comprises the following steps:
1) take polyester film as base material, using plasma chemical modification technique improves the surface tension of polyester film;
2) be coated with one deck Polymer Solution as intermediate adhesive under polyester film after modification, after dry, be compounded to form adhesion promoting layer mutually with the vistanex of the first car casting technology melt modification;
3) after after supercooling, online trimming, another floor height molecular solution is coated with as intermediate adhesive under adhesion promoting layer, with the ethylene-vinyl acetate copolymer phase compound of the second car casting technology melt modification after dry, in recombination process, ozone treatment is carried out to melt;
4) finally by cooling, composite film surface photo-grafting, after online trimming, rolling is shaping.
To sum up, the present invention mainly solves following problems:
1, optimize the structure of encapsulating material, improve the dimensional accuracy of overall package.
2, select polyolefine material as binding material, there is the combination property that high strength, high tenacity, high electric insulation, high resistance to chemicals corrosion etc. are excellent.
3, the surface treatment at reinforcing material interface, and addition of one deck adhesion promoting layer, improve heat bonding performance.
Embody rule approach of the present invention is a lot, and the above is only the preferred embodiment of the present invention, should be understood that; for those skilled in the art; under the premise without departing from the principles of the invention, can also make some improvement, these improvement also should be considered as protection scope of the present invention.
Claims (3)
1. a flexible electronic package application class high viscosity composite membrane, it is characterized in that, this composite membrane is respectively polyester film substrate layer (1), the first adhesive layer (2), adhesion promoter layer (3), the second adhesive layer (4) and thermal synthesis layer (5) from top to bottom;
Wherein, described first adhesive layer (2) is using 1 part of polymine as key reaction body, and with 50 parts of methyl alcohol, 100 parts of water fully mix; Described second adhesive layer (4) is using 1 part of polymine as key reaction body, and with 10 parts of methyl alcohol, 10 parts of water fully mix.
2. a processing method for flexible electronic package application class high viscosity composite membrane, is characterized in that comprising the following steps:
1) take polyester film as base material, using plasma chemic modified method improves the surface tension of polyester film; 2) be coated with one deck Polymer Solution under polyester film after modification, this Polymer Solution is using 1 part of polymine as key reaction body, and with 50 parts of methyl alcohol, 100 parts of water fully mix; Coating weight dry weight is 0.03-0.05 gram/m; Adhesion promoting layer is compounded to form mutually with the vistanex of the first car casting technology melt modification after dry;
3) after after supercooling, online trimming, under adhesion promoting layer, be coated with second layer Polymer Solution, using 1 part of polymine as key reaction body, with 10 parts of methyl alcohol, 10 parts of water fully mix, coating weight dry weight 0.03-0.05 gram/square; With the ethene-acetate ethylene copolymer phase compound of the second car casting technology melt modification after dry, in recombination process, melt is carried out
Ozone treatment;
4) finally by cooling, composite film surface photo-grafting, after online trimming, rolling is shaping.
3., according to the processing method of the flexible electronic package application class high viscosity composite membrane described in claim 2, it is characterized in that the corona intensity that the plasma chemical modifying method of step 1) adopts is 15-20WD.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310072335.XA CN103171222B (en) | 2013-03-07 | 2013-03-07 | High-viscosity composite film for flexible electronic packaging application, and its processing method |
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| CN201310072335.XA CN103171222B (en) | 2013-03-07 | 2013-03-07 | High-viscosity composite film for flexible electronic packaging application, and its processing method |
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| CN103171222A CN103171222A (en) | 2013-06-26 |
| CN103171222B true CN103171222B (en) | 2015-06-17 |
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| CN106799830B (en) * | 2016-12-07 | 2019-02-01 | 上海交通大学 | A kind of polymer surfaces micro-structure thermal marking method of plasmaassisted |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287598A (en) * | 2005-10-12 | 2008-10-15 | 埃克森美孚石油公司 | Multi-layer films, methods of manufacture and articles made therefrom |
| CN102328779A (en) * | 2011-06-14 | 2012-01-25 | 刘继福 | High-barrier layer flexible packaging film for isolating contents of polymer lithium battery |
| CN102555370A (en) * | 2010-12-31 | 2012-07-11 | 苏州中来光伏新材股份有限公司 | Non-fluorinated high-weather-proof high-cohesiveness solar cell back membrane and processing technology |
| CN203110433U (en) * | 2013-03-07 | 2013-08-07 | 宜兴市王者塑封有限公司 | High-viscosity composite film applied to flexible electronic packaging |
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- 2013-03-07 CN CN201310072335.XA patent/CN103171222B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101287598A (en) * | 2005-10-12 | 2008-10-15 | 埃克森美孚石油公司 | Multi-layer films, methods of manufacture and articles made therefrom |
| CN102555370A (en) * | 2010-12-31 | 2012-07-11 | 苏州中来光伏新材股份有限公司 | Non-fluorinated high-weather-proof high-cohesiveness solar cell back membrane and processing technology |
| CN102328779A (en) * | 2011-06-14 | 2012-01-25 | 刘继福 | High-barrier layer flexible packaging film for isolating contents of polymer lithium battery |
| CN203110433U (en) * | 2013-03-07 | 2013-08-07 | 宜兴市王者塑封有限公司 | High-viscosity composite film applied to flexible electronic packaging |
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