CN103165526A - Manufacturing method of array substrate, display panel and manufacturing method of display panel - Google Patents
Manufacturing method of array substrate, display panel and manufacturing method of display panel Download PDFInfo
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- CN103165526A CN103165526A CN 201210052720 CN201210052720A CN103165526A CN 103165526 A CN103165526 A CN 103165526A CN 201210052720 CN201210052720 CN 201210052720 CN 201210052720 A CN201210052720 A CN 201210052720A CN 103165526 A CN103165526 A CN 103165526A
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Abstract
The invention relates to a manufacturing method of an array substrate, a display panel and a manufacturing method thereof. The manufacturing method of the array substrate comprises the following steps: providing a first light-transmitting substrate; forming a first conductive layer on the first light-transmitting substrate; forming a light shielding layer on the first light-transmitting substrate; patterning the first conductive layer and the light shielding layer using an energy beam to form a first conductive pattern and a light shielding pattern; forming a photoreaction material layer on the first transparent substrate to cover at least the first conductive pattern and the first transparent substrate; and exposing part of the photoreactive material layer by using the light shielding pattern as a mask, and patterning the photoreactive material layer to form a plurality of barrier structures.
Description
Technical field
The present invention relates to array base palte and technical field of display panel, particularly the manufacture method of array base palte, display floater and manufacture method thereof.
Background technology
In the development of display device, along with the progress of photoelectric technology and semiconductor fabrication, have that high image quality, space utilization efficient are good, the flat-panel screens (flat display panels) of low consumpting power, the advantageous characteristic such as radiationless becomes the main flow of consumption market gradually.In the middle of Display Technique now, because flexible display panel (flexible display panel) has lightness, resistance to impact, flexibility, wearable property and the advantage such as easy to carry, become at present a new generation's prediction Display Technique.Yet in present flexible display panel technique, how the major technique bottleneck is made in the pliability substrate accurately in each layer structure.
In the technique of flexible display panel; usually can be through multiple dried, wet technique or heating pressing technology; the pliability substrate of flexible display panel is easily expanded with heat and contract with cold in these techniques thereupon, is formed at the suprabasil pattern structure generation of pliability deformation and make.Thus, when the producer wanted to form another pattern structure on pattern structure in this deformation, the problem of contraposition skew just easily occured in these two pattern structures, and then made the fine ratio of product of flexible display panel descend.Hold above-mentionedly, how to improve because of pliability substrate one of the real problem that solves for developer institute utmost point wish of the problem that causes of expanding with heat and contract with cold in technique.
Summary of the invention
Embodiments of the invention propose a kind of manufacture method of array base palte, and it comprises the following steps.The first transparent substrates is provided.Form the first conductive layer on the first transparent substrates.Form light shield layer on the first transparent substrates.Utilize energy beam patterning the first conductive layer and light shield layer, to form the first conductive pattern and light-shielding pattern.Form the light reaction material layer on the first transparent substrates, to cover at least the first conductive pattern and the first transparent substrates.Make part light reaction material layer exposure take light-shielding pattern as mask, and patterning light reaction material layer and form a plurality of barrier structures.
Embodiments of the invention propose a kind of manufacture method of display floater, and it comprises the following steps.The first transparent substrates is provided.Form the first conductive layer on the first transparent substrates.Form light shield layer on the first transparent substrates.Utilize energy beam patterning the first conductive layer and light shield layer, to form the first conductive pattern and light-shielding pattern.Form the light reaction material layer on the first transparent substrates, to cover at least the first conductive pattern and the first transparent substrates.Make part light reaction material layer exposure take light-shielding pattern as mask, and patterning light reaction material layer and form a plurality of barrier structures.The second transparent substrates is provided.Make the second transparent substrates group stand on barrier structure.Make display medium insert in the accommodation space that is defined by the first transparent substrates and barrier structure.
Embodiments of the invention propose a kind of display floater, and it comprises the first transparent substrates, the second light-transparent substrate, the first conductive pattern, light-shielding pattern, the second conductive pattern and display medium.The second light-transparent substrate is with respect to the first transparent substrates.The first conductive pattern between the first transparent substrates and the second light-transparent substrate, and expose the part the first transparent substrates.Light-shielding pattern is connected with the first transparent substrates.Light-shielding pattern overlaps with the first conductive pattern in fact.Barrier structure connects the first transparent substrates and the second light-transparent substrate, and is positioned at the first transparent substrates by the first part that conductive pattern exposes to the open air.The second conductive pattern is between the first conductive pattern and the second light-transparent substrate.The first conductive pattern and the second conductive pattern are staggered.Display medium is arranged in by the first transparent substrates, the second light-transparent substrate and the formed accommodation space of barrier structure.
Description of drawings
Figure 1A to Fig. 1 F is the manufacturing process schematic diagram of the display floater of first embodiment of the invention.
Fig. 2 A to Fig. 2 E is the manufacturing process schematic diagram of the display floater of second embodiment of the invention.
Fig. 3 A to Fig. 3 B is the part manufacturing process schematic diagram of the display floater of third embodiment of the invention.
[main element symbol description]
100,100A, 100B: display floater
102: the first transparent substrates
102a: first surface
102b: second surface
104: the first conductive layers
104a: the first conductive pattern
106: light shield layer
106a: light-shielding pattern
108: the light reaction material layer
108a: barrier structure
110: display medium
112: the second transparent substrates
112a: the second light-transparent substrate
112b: the second conductive pattern
D1, D2: direction
K: the first transparent substrates is by the first part that conductive pattern exposes to the open air
L: energy beam
L: exposing light beam
R: accommodation space
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
The first embodiment
The manufacture method of display floater
Figure 1A to Fig. 1 F is the manufacturing process schematic diagram of the display floater of first embodiment of the invention.Please refer to Figure 1A, at first, provide the first transparent substrates 102.Then, form the first conductive layer 104 on the first transparent substrates 102.In detail, first transparent substrates 102 of the present embodiment has first surface 102a, and the first conductive layer 104 can be formed on first surface 102a.
First transparent substrates 102 of the present embodiment can be hard substrate or pliability (flexible) substrate.The material of hard substrate can be glass or quartz.The material of flexible base plate can be polyethylene terephthalate (polyethylene terephthalate, PET), PEN (polyethylene naphthalate, PEN), polyether sulfone, Poly-s 179 (polyethersulfone, PES), Merlon (polycarbonate, PC), pi (polyimide, PI), ring-type alkene nitrile polymer (cyclic olefin polymer, ARTON) or polyarylate resin (polyarylate resin, PAR).But the present invention is not limited with above-mentioned.
The demand of the visual reality of material of first conductive layer 104 of the present embodiment and selecting.For example, if producer's wish is made as the penetration display floater with the display floater of the present embodiment, the material of the first conductive layer 104 can be selected the printing opacity electric conducting material.If producer's wish is made as reflective display panel with the display floater of the present embodiment, the material of the first conductive layer 104 can be selected reflective electric conducting material.Described printing opacity electric conducting material comprises indium tin oxide (ITO), indium-zinc oxide (IZO), doped sno_2 antimony (ATO), aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, conducting polymer composite or nanoporous metal membrane.Described reflective electric conducting material comprises metal, metal oxide or metal oxynitride.Further say, metal material can be chromium (Cr) or aluminium (Al).Metal oxide materials can be chromium oxide or aluminium oxide.But the present invention is not limited with above-mentioned.
Please refer to Figure 1B, then, form light shield layer 106 on the first transparent substrates 102.In detail, can form light shield layer 106 on respect to the second surface 102b of first surface 102a.In the present embodiment, light shield layer 106 can utilize the mode of reflection, scattering or absorption to come shading.In other words, light shield layer 106 can be light-absorption layer or reflector layer.The light-absorption layer material can be black photoresist, coloured photoresist, black resin, colouring resin, ink, carbon dust or pi (polyimide, PI).The material of reflector layer can be metal, metal oxide or metal oxynitride, and wherein metal material comprises chromium or aluminium, and metal oxide materials comprises chromium oxide or aluminium oxide.
Please refer to Fig. 1 C, then, utilize energy beam L patterning the first conductive layer 104 and light shield layer 106, the patterning of above-mentioned the first conductive layer 104 and light shield layer 106 can carry out simultaneously, to form the first conductive pattern 104a and light-shielding pattern 106a.In detail, the energy beam L of the present embodiment can be laser, but the present invention is not as limit.Laser is ablation the first conductive layer 104 and light shield layer 106 simultaneously, to form the first conductive pattern 104a and light-shielding pattern 106a.It should be noted that, the energy beam L in Fig. 1 C sequentially passes light shield layer 106, the first transparent substrates 102 and the first conductive layer 104 by a side at light shield layer 106 places, and forms the first conductive pattern 104a and light-shielding pattern 106a.Yet, the invention is not restricted to this, in other embodiments, energy beam L also can sequentially pass the first conductive layer 104, the first transparent substrates 102 and light shield layer 106 by a side at the first conductive layer 104 places, and also can form the first conductive pattern 104a and light-shielding pattern 106a.
Please refer to Fig. 1 D, then, form light reaction material layer 108 on the first transparent substrates 102, to cover at least the first conductive pattern 104a and the first transparent substrates 102.In more detail, in the present embodiment, light reaction material layer 108 is to be formed on the first surface 102a of the first transparent substrates 102, and contacts with the first conductive pattern 104a and part the first transparent substrates 102.The light reaction material layer 108 of the present embodiment is for example negative photoetching glue layer.Yet, the invention is not restricted to this, in other embodiments, light reaction material layer 108 also can be the photosensitive hardening layer, is for example UV cured glue.But the present invention is not limited with above-mentioned.
Please refer to Fig. 1 D and Fig. 1 E, then, take light-shielding pattern 106a as mask, patterning light reaction material layer 108, and form a plurality of barrier structure 108a.In the present embodiment, exposing light beam I can sequentially pass light-shielding pattern 106a, the first transparent substrates 102 and the first conductive pattern 104a, and the light reaction material layer 108 of part is exposed.In the present embodiment, after Patternized technique, the part light reaction material layer 108 that is exposed can stay and form barrier structure 108a, and the light reaction material layer 108 of the another part that is not exposed can be removed.In detail, the light reaction material layer 108 of the present embodiment can be negative photoetching glue layer, commissure (cross-links) effect can occur in the part negative photoetching glue layer that is exposed, and makes it be difficult for being dissolved by the developing in developing process, and then is left formation barrier structure 108a.108 of the light reaction material layers of the another part that is not exposed on the other hand, can be dissolved by the developing in developing process and be removed.
Please refer to Fig. 1 F, then, make display medium 110 insert in the accommodation space R that is defined by the first transparent substrates 102 and barrier structure 108a.In the present embodiment, display medium 110 can be the display medium that electricity drives or heat drives.Take electrically driven (operated) display medium as example, display medium 110 can be liquid crystal.Described liquid crystal comprises nematic crystal (Nematic liquid crystal), host and guest's type liquid crystal (Guest-host liquid crystal), PDLC (Polymer Dispersed Liquid Crystal; PDLC), cholesterol liquid crystal (Cholesteric Liquid Crystal).Wherein, cholesterol liquid crystal can make it can reflect the different wave length line by adjusting its pitch (pitch), but and then makes the display floater display color picture of the present embodiment.Yet, the invention is not restricted to this, in other embodiments, display medium 110 also can be electrophoresis liquid, electroluminescence material or other suitable materials, wherein the electroluminescence material includes OLED (Organic Light Emitting Diode, OLED or macromolecule Organic Light Emitting Diode (Polymer Light Emitting Diode, PLED).
Referring again to Fig. 1 F, then, provide the second transparent substrates 112.Second transparent substrates 112 of the present embodiment comprises the second light-transparent substrate 112a and the second conductive pattern 112b.The second light-transparent substrate 112a of the present embodiment can be hard substrate or pliability (flexible) substrate.The material of hard substrate can be glass or quartz.The material of pliability substrate can be polyethylene terephthalate (polyethylene terephthalate, PET), PEN (polyethylene naphthalate, PEN), polyether sulfone, Poly-s 179 (polyethersulfone, PES), Merlon (polycarbonate, PC), pi (polyimide, PI), ring-type alkene nitrile polymer (cyclic olefin polymer, ARTON) or polyarylate resin (polyarylate resin, PAR).But the present invention is not limited with above-mentioned.The second conductive pattern 112b of the present embodiment can be transparent conductive patterns, and its material can be indium tin oxide (ITO), indium-zinc oxide (IZO), doped sno_2 antimony (ATO), aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, conducting polymer composite or nanoporous metal membrane.But the present invention is not limited with above-mentioned.
Referring again to Fig. 1 F, then, make 112 groups of the second transparent substrates stand on barrier structure 108a.In detail, the staggered mode group of the bearing of trend D2 that the second transparent substrates 112 can the second conductive pattern 112b and the bearing of trend D1 of the first conductive pattern 104a on the first transparent substrates 102 is stood on barrier structure 108a.Just tentatively completed the display floater 100 of the present embodiment in this.
In the present embodiment, the demand of the visual reality of producer optionally stays or removes the light-shielding pattern 106a on the second surface 102b of the first transparent substrates 102.For example, if display floater 100 is reflective display panel, the producer optionally stays light-shielding pattern 106a.When reflective display panel operated in dark attitude, light-shielding pattern 106a can absorb the light that enters reflective display panel, and then increased the contrast of reflective display panel.On the other hand, if display floater 100 is the penetration display floater, the producer can remove light-shielding pattern 106a, so that the light that backlight sends can pass through the viewing area of penetration display floater smoothly.
It is worth mentioning that, in the present embodiment, if light-shielding pattern 106a and the first conductive pattern 104a form simultaneously, can not produce the problem of contraposition skew between light-shielding pattern 106a and the first conductive pattern 104a.At this moment, because barrier structure 108a utilizes the light-shielding pattern 106a that forms simultaneously with the first conductive pattern 104a to form for mask, so the problem of contraposition skew also can not occur between barrier structure 108a and the first conductive pattern 104a (or light-shielding pattern 106a).Thus, the problem of the contraposition skew that in known techniques, each layer structure causes because substrate expands with heat and contract with cold just can be improved, and the yield of display floater 100 can obviously be improved.In addition, because utilizing light-shielding pattern 106a, barrier structure 108a forms for mask, therefore the manufacture method of the display floater of the present embodiment can be saved the expense of one mask at least, and then the manufacturing cost of reduction display floater 100.
The structure of display floater
Fig. 1 F is the generalized section of the display floater of first embodiment of the invention.Please refer to Fig. 1 F, the display floater 100 of the present embodiment comprises the first transparent substrates 102, the second light-transparent substrate 112a, the first conductive pattern 104a, light-shielding pattern 106a, a plurality of barrier structure 108a, the second conductive pattern 112b and display medium 110.
The second light-transparent substrate 112a of the present embodiment is with respect to the first transparent substrates 102.The first conductive pattern 104a is between the first transparent substrates 102 and the second light-transparent substrate 112a.The first conductive pattern 104a exposes the first transparent substrates 102 of part.The light-shielding pattern 106a of the present embodiment is connected with the first transparent substrates 102.In other words, the light-shielding pattern 106a of the present embodiment can be connected directly or indirectly with the first transparent substrates 102.For example, in the present embodiment, the first transparent substrates 102 has first surface 102a and second surface 102b, goes up and contacts with second surface 102b in second surface 102b and light-shielding pattern 106a is configurable.Wherein, first surface 102a can be between second surface 102b and the second light-transparent substrate 112a, and second surface 102b can be between light-shielding pattern 106a and first surface 102a.It should be noted that in the present embodiment, because light-shielding pattern 106a can form simultaneously with the first conductive pattern 104a, so light-shielding pattern 106a overlaps with the first conductive pattern 104a in fact.
The barrier structure 108a of the present embodiment connects the first transparent substrates 102 and the second light-transparent substrate 102.Barrier structure 108a is positioned at the first transparent substrates 102 and is exposed to the open air part K by the first conductive pattern 104a.It should be noted that because barrier structure 108a is formed take light-shielding pattern 106a as mask, so barrier structure 108a and light-shielding pattern 106a (or first conductive pattern 104a) trim in fact.
The second conductive pattern 112b of the present embodiment is between the first conductive pattern 104a and the second light-transparent substrate 112a.The first conductive pattern 104a and the second conductive pattern 112b are staggered.In detail, the first conductive pattern 104a can have bearing of trend D1, and the second conductive pattern 112b can have bearing of trend D2, and wherein bearing of trend D1 and bearing of trend D2 are staggered.In the present embodiment, bearing of trend D1 is vertical in fact with bearing of trend D2.The display medium 110 of the present embodiment is between the first transparent substrates 102 and the second light-transparent substrate 112a.Further say, display medium 110 can be arranged in formed a plurality of accommodation space R by the first transparent substrates 102, the second light-transparent substrate 112a and barrier structure 108a.
The second embodiment
The manufacture method of display floater
Fig. 2 A to Fig. 2 E is the manufacturing process schematic diagram of the display floater of second embodiment of the invention.Please refer to Fig. 2 A to Fig. 2 E, the manufacture method of the display floater of the manufacture method of the display floater of the present embodiment and the first embodiment is similar, and therefore identical element represents with identical label.The manufacture method of the display floater of the present embodiment is from the manufacture method difference of the display floater of the first embodiment: the position that light shield layer 106 forms is with different in the first embodiment.Below different place explains at this point, and both just no longer repeat something in common.
Please first with reference to Fig. 2 A, at first, first provide the first transparent substrates 102.The first transparent substrates 102 has relative first surface 102a and second surface 102b.Then, in upper first conductive layer 104 that forms of first surface 102a.Then, form light shield layer 106 on the first conductive layer 104.Yet, the invention is not restricted to this, in other embodiments, also can form light shield layer 106 prior to first surface 102a is upper, then form the first conductive layer 104 on light shield layer 106.
Please refer to Fig. 2 A and Fig. 2 B, then, utilize energy beam L patterning the first conductive layer 104 and light shield layer 106, the patterning of above-mentioned the first conductive layer 104 and light shield layer 106 can carry out simultaneously, to form the first conductive pattern 104a and light-shielding pattern 106a.In Fig. 2 B, energy beam L carries out patterning from the side near first surface 102a to the first conductive layer 104 and light shield layer 106.Yet, the invention is not restricted to this, in other embodiments, energy beam L also can carry out patterning to the first conductive layer 104 and light shield layer 106 from the side near second surface 102b.
Please refer to Fig. 2 C, then, form light reaction material layer 108 on the first transparent substrates 102.In the present embodiment, light reaction material layer 108 covers the first conductive pattern 104a, light-shielding pattern 106a and the first transparent substrates 102.
Please refer to Fig. 2 C and Fig. 2 D, then, take light-shielding pattern 106a as mask, patterning light reaction material layer 108, and form a plurality of barrier structure 108a.Please refer to Fig. 2 E, then, make display medium 110 insert in the accommodation space R that is defined by the first transparent substrates 102 and barrier structure 108a.Then, provide the second transparent substrates 112 that comprises the second light-transparent substrate 112a and the second conductive pattern 112b.Then, make 112 groups of the second transparent substrates stand on barrier structure 108a.Just completed the manufacturing process of the display floater 100A of the present embodiment in this.The manufacture method of the display floater 100A of the present embodiment has the similar function of manufacture method with the display floater 100 of the first embodiment, just no longer repeats in this.
The structure of display floater
Fig. 2 E is the generalized section of the display floater of second embodiment of the invention.Please refer to Fig. 2 E, the display floater 100A of the present embodiment and the display floater 100 of the first embodiment are similar, and therefore identical element represents with identical label.The display floater 100A of the present embodiment is from display floater 100 differences of the first embodiment: the position at light-shielding pattern 106a place is with different in the first embodiment.Below different place explains at this point, and both just no longer repeat something in common.
The light-shielding pattern 106a of the present embodiment also is connected with the first transparent substrates 102.In other words, the light-shielding pattern 106a of the present embodiment can be connected directly or indirectly with the first transparent substrates 102.For example, the light-shielding pattern 106a of the present embodiment can be connected with the first transparent substrates 102 by the first conductive pattern 104a.In other words, the light-shielding pattern 106a of the present embodiment can be between the first transparent substrates 102 and the second light-transparent substrate 112a.In more detail, light-shielding pattern 106a can be between the first conductive pattern 104a and the second light-transparent substrate 112a, and contact with the first conductive pattern 104a.Yet, the invention is not restricted to this, in other embodiments, the position of light-shielding pattern 106a and the first conductive pattern 104a can be exchanged.The display floater 100A of the present embodiment has the similar function of display floater 100 with the first embodiment, just no longer repeats in this.
The 3rd embodiment
The manufacture method of display floater
Fig. 3 A to Fig. 3 B is the part manufacturing process schematic diagram of the display floater of third embodiment of the invention.The manufacture method of the display floater of the manufacture method of the display floater of the present embodiment and the second embodiment is similar, and therefore identical element represents with identical label.The manufacture method difference of the display floater of the manufacture method of the display floater of the present embodiment and the second embodiment is: the manufacture method of the display floater of the present embodiment can further comprise the action of removing light-shielding pattern 106a.Below different place explains at this point, and both just no longer repeat something in common.
In the present embodiment, to completing barrier structure 108a, the manufacturing process of the display floater of the present embodiment all can be identical with the second embodiment.In other words, Fig. 2 A to Fig. 2 D is also the part manufacturing process of the display floater of the present embodiment.After completing barrier structure 108a (after namely completing the structure shown in Fig. 2 D), as shown in Figure 3A, in the present embodiment, can further light-shielding pattern 106a be removed.Please refer to Fig. 3 B, then, inserting display medium 110 to accommodation space R.Then, then with 112 groups of the second transparent substrates stand on barrier structure 108a.Just completed the manufacturing process of the display floater 100B of the present embodiment in this.The manufacture method of the display floater 100B of the present embodiment has the similar function of manufacture method with the display floater 100 of the first embodiment, just no longer repeats in this.
The structure of display floater
Fig. 3 B is the generalized section of the display floater of third embodiment of the invention.Please refer to Fig. 3 B, the display floater 100B of the present embodiment and the display floater 100A of the second embodiment are similar, and therefore identical element represents with identical label.The display floater 100A difference of the display floater 100B of the present embodiment and the second embodiment only is: the display floater 100B of the present embodiment does not comprise light-shielding pattern 106a.The display floater 100B of the present embodiment has the similar function of display floater 100A with the second embodiment, just no longer repeats in this.
In sum, in the manufacture method of the display floater of the embodiment of the present invention, the available energy bundle is light shield layer and the first conductive layer patterning simultaneously, so can not produce the problem that contraposition is offset between light-shielding pattern and the first conductive pattern.In addition, because barrier structure is to utilize the light-shielding pattern that forms simultaneously with the first conductive pattern to form for mask, so the problem of contraposition skew also can not occur between barrier structure and the first conductive pattern (or light-shielding pattern).Thus, the problem of the contraposition skew that in known techniques, each layer structure causes because substrate expands with heat and contract with cold just can be improved, and then improves the fine ratio of product of display floater.
In addition, in the manufacture method of the display floater of the embodiment of the present invention, because utilizing light-shielding pattern, barrier structure forms for mask, therefore the manufacture method of the display floater of the embodiment of the present invention can be saved the expense of one mask at least, and then the manufacturing cost of reduction display floater.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; be understood that; the above is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (60)
1. the manufacture method of an array base palte, is characterized in that, comprising:
The first transparent substrates is provided;
Form the first conductive layer on described the first transparent substrates;
Form light shield layer on described the first transparent substrates;
Utilize described the first conductive layer of energy beam patterning and described light shield layer, to form the first conductive pattern and light-shielding pattern;
Form the light reaction material layer on described the first transparent substrates, to cover at least described the first conductive pattern and described the first transparent substrates; And
Make the described light reaction material layer exposure of part take described light-shielding pattern as mask, and the described light reaction material layer of patterning, and form a plurality of barrier structures.
2. the manufacture method of array base palte as claimed in claim 1, it is characterized in that, described the first transparent substrates has relative first surface and second surface, in the step that forms described the first conductive layer on described the first transparent substrates be: form described the first conductive layer on the described first surface of described the first transparent substrates, and in the step that forms described light shield layer on described the first transparent substrates be: form described light shield layer on the described second surface of described the first transparent substrates.
3. the manufacture method of array base palte as claimed in claim 2, is characterized in that, more comprises: remove the described light shield layer on the described second surface that is positioned at described the first transparent substrates.
4. the manufacture method of array base palte as claimed in claim 1, it is characterized in that, described the first transparent substrates has relative first surface, comprises in the step that forms described the first conductive layer on described the first transparent substrates and the step that forms described light shield layer on described the first transparent substrates:
Form described the first conductive layer on the described first surface of described the first transparent substrates; And
Form described light shield layer on described the first conductive layer, wherein said the first conductive layer is between the described first surface and described light shield layer of described the first transparent substrates.
5. the manufacture method of array base palte as claimed in claim 4, is characterized in that, more comprises: remove the described light shield layer that is positioned on described the first conductive layer.
6. the manufacture method of array base palte as claimed in claim 1, it is characterized in that, described the first transparent substrates has relative first surface, comprises in the step that forms described the first conductive layer on described the first transparent substrates and the step that forms described light shield layer on described the first transparent substrates:
Form described light shield layer on the described first surface of described the first transparent substrates; And
Form described the first conductive layer on described light shield layer, wherein said light shield layer is between the described first surface and described the first conductive layer of described the first transparent substrates.
7. the manufacture method of array base palte as claimed in claim 1, is characterized in that, described the first conductive pattern overlaps with described light-shielding pattern.
8. the manufacture method of array base palte as claimed in claim 1, is characterized in that, described the first transparent substrates is flexible base plate or hard substrate.
9. the manufacture method of array base palte as claimed in claim 8, it is characterized in that, the material of described flexible base plate comprises: polyethylene terephthalate, PEN, polyether sulfone, Poly-s 179, Merlon, pi, ring-type alkene nitrile polymer or polyarylate resin.
10. the manufacture method of array base palte as claimed in claim 1, is characterized in that, described light reaction material layer comprises: negative photoetching glue layer or photosensitive hardening layer.
11. the manufacture method of array base palte as claimed in claim 1 is characterized in that, described light shield layer comprises: light-absorption layer or reflector layer.
12. the manufacture method of array base palte as claimed in claim 11 is characterized in that, described light-absorption layer material comprises: black photoresist, coloured photoresist, black resin, colouring resin, ink, carbon dust or pi (polyimide, PI).
13. the manufacture method of array base palte as claimed in claim 11 is characterized in that, the material of described reflector layer comprises: metal, metal oxide or metal oxynitride.
14. the manufacture method of array base palte as claimed in claim 13 is characterized in that, the material of described metal comprises: chromium or aluminium.
15. the manufacture method of array base palte as claimed in claim 13 is characterized in that, the material of described metal oxide comprises: chromium oxide or aluminium oxide.
16. the manufacture method of array base palte as claimed in claim 1 is characterized in that, described the first conductive layer is light transmission conductive layer.
17. the manufacture method of array base palte as claimed in claim 16, it is characterized in that, the material of described light transmission conductive layer comprises: indium tin oxide, indium-zinc oxide, doped sno_2 antimony, aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, conducting polymer composite or nanoporous metal membrane.
18. the manufacture method of array base palte as claimed in claim 1 is characterized in that, described energy beam comprises laser.
19. the manufacture method of array base palte as claimed in claim 1, it is characterized in that, after described light reaction material layer was patterned, the described light reaction material layer of the part that is exposed stayed and forms described a plurality of barrier structure, and the described light reaction material layer of the another part that is not exposed is removed.
20. the manufacture method of array base palte as claimed in claim 1, it is characterized in that, utilize described the first conductive layer of described energy beam patterning and described light shield layer, comprise with the step that forms described the first conductive pattern and described light-shielding pattern: utilize described energy beam described the first conductive layer of patterning and described light shield layer simultaneously, to form described the first conductive pattern and described light-shielding pattern.
21. the manufacture method of a display floater is characterized in that, comprising:
The first transparent substrates is provided;
Form the first conductive layer on described the first transparent substrates;
Form light shield layer on described the first transparent substrates;
Utilize described the first conductive layer of energy beam patterning and described light shield layer, to form the first conductive pattern and light-shielding pattern;
Form the light reaction material layer on described the first transparent substrates, to cover at least described the first conductive pattern and described the first transparent substrates;
Make the described light reaction material layer exposure of part take described light-shielding pattern as mask, and the described light reaction material layer of patterning, and form a plurality of barrier structures;
The second transparent substrates is provided;
Make described the second transparent substrates group stand on described a plurality of barrier structure; And
Make display medium insert in the accommodation space that is defined by described the first transparent substrates and described a plurality of barrier structure.
22. the manufacture method of display floater as claimed in claim 21, it is characterized in that, described the first transparent substrates has relative first surface and second surface, comprise in the step that forms described the first conductive layer on described the first transparent substrates: form described the first conductive layer on the described first surface of described the first transparent substrates, and comprise in the step that forms described light shield layer on described the first transparent substrates: form described light shield layer on the described second surface of described the first transparent substrates.
23. the manufacture method of display floater as claimed in claim 22 is characterized in that, more comprises: remove the described light shield layer on the described second surface that is positioned at described the first transparent substrates.
24. the manufacture method of display floater as claimed in claim 21, it is characterized in that, described the first transparent substrates has relative first surface, comprises in the step that forms described the first conductive layer on described the first transparent substrates and the step that forms described light shield layer on described the first transparent substrates:
Form described the first conductive layer on the described first surface of described the first transparent substrates; And
Form described light shield layer on described the first conductive layer, wherein said the first conductive layer is between the described first surface and described light shield layer of described the first transparent substrates.
25. the manufacture method of display floater as claimed in claim 24 is characterized in that, more comprises: remove the described light shield layer that is positioned on described the first conductive layer.
26. the manufacture method of display floater as claimed in claim 21, it is characterized in that, described the first transparent substrates has relative first surface, comprises in the step that forms described the first conductive layer on described the first transparent substrates and the step that forms described light shield layer on described the first transparent substrates:
Form described light shield layer on the described first surface of described the first transparent substrates; And
Form described the first conductive layer on described light shield layer, wherein said light shield layer is between the described first surface and described the first conductive layer of described the first transparent substrates.
27. the manufacture method of display floater as claimed in claim 21 is characterized in that, described the first conductive pattern overlaps with described light-shielding pattern.
28. the manufacture method of display floater as claimed in claim 21 is characterized in that, described the first transparent substrates is flexible base plate or hard substrate.
29. the manufacture method of display floater as claimed in claim 28, it is characterized in that, the material of described flexible base plate comprises: polyethylene terephthalate, PEN, polyether sulfone, Poly-s 179, Merlon, pi, ring-type alkene nitrile polymer or polyarylate resin.
30. the manufacture method of display floater as claimed in claim 21 is characterized in that, described light reaction material layer comprises: negative photoetching glue layer or photosensitive hardening layer.
31. the manufacture method of display floater as claimed in claim 21 is characterized in that, described light shield layer comprises: light-absorption layer or reflector layer.
32. the manufacture method of display floater as claimed in claim 31 is characterized in that, the material of described light-absorption layer comprises: black photoresist, coloured photoresist, black resin, colouring resin, ink, carbon dust or pi (polyimide, PI).
33. the manufacture method of display floater as claimed in claim 31 is characterized in that, the material of described reflector layer comprises: metal, metal oxide or metal oxynitride.
34. the manufacture method of display floater as claimed in claim 33 is characterized in that, the material of described metal comprises: chromium (Cr) or aluminium (A1).
35. the manufacture method of display floater as claimed in claim 33 is characterized in that, the material of described metal oxide comprises: chromium oxide or aluminium oxide.
36. the manufacture method of display floater as claimed in claim 21 is characterized in that, described the first conductive layer is light transmission conductive layer.
37. the manufacture method of display floater as claimed in claim 36, it is characterized in that, the material of described light transmission conductive layer comprises: indium tin oxide, indium-zinc oxide, doped sno_2 antimony, aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, conducting polymer composite or nanoporous metal membrane.
38. the manufacture method of display floater as claimed in claim 21 is characterized in that, described the second transparent substrates comprises the second light-transparent substrate and is disposed at the second conductive pattern on described the second light-transparent substrate.
39. the manufacture method of display floater as claimed in claim 38 is characterized in that, described the second conductive pattern and described the first conductive pattern are staggered.
40. the manufacture method of display floater as claimed in claim 21 is characterized in that, described display medium comprises: liquid crystal, electrophoresis liquid or electroluminescence material.
41. the manufacture method of display floater as claimed in claim 21 is characterized in that, described energy beam comprises laser.
42. the manufacture method of display floater as claimed in claim 21, it is characterized in that, after described light reaction material layer was patterned, the described light reaction material layer of the part that is exposed stayed and forms described a plurality of barrier structure, and the described light reaction material layer of the another part that is not exposed is removed.
43. the manufacture method of display floater as claimed in claim 21, it is characterized in that, utilize described the first conductive layer of described energy beam patterning and described light shield layer, comprise with the step that forms described the first conductive pattern and described light-shielding pattern: utilize described energy beam described the first conductive layer of patterning and described light shield layer simultaneously, to form described the first conductive pattern and described light-shielding pattern.
44. a display floater is characterized in that, comprising:
The first transparent substrates;
The second light-transparent substrate is with respect to described the first transparent substrates;
The first conductive pattern between described the first transparent substrates and described the second light-transparent substrate, and exposes the first transparent substrates partly;
Light-shielding pattern is connected with described the first transparent substrates, and wherein said light-shielding pattern overlaps with described the first conductive pattern;
A plurality of barrier structures connect described the first transparent substrates and described the second light-transparent substrate, and are positioned at described the first transparent substrates by described the first part that conductive pattern exposes to the open air;
The second conductive pattern, between described the first conductive pattern and described the second light-transparent substrate, wherein said the first conductive pattern and described the second conductive pattern are staggered;
Display medium is arranged in by described the first transparent substrates, described the second light-transparent substrate and the formed accommodation space of described a plurality of barrier structure.
45. display floater as claimed in claim 44 is characterized in that, described light-shielding pattern is between described the first transparent substrates and described the second light-transparent substrate.
46. display floater as claimed in claim 45 is characterized in that, described light-shielding pattern is between described the first conductive pattern and described the second light-transparent substrate.
47. display floater as claimed in claim 45 is characterized in that, described light-shielding pattern is between described the first conductive pattern and described the first transparent substrates.
48. display floater as claimed in claim 44, it is characterized in that, described the first transparent substrates has first surface and second surface, described first surface is between described second surface and described the second light-transparent substrate, and described second surface is between described light-shielding pattern and described first surface.
49. display floater as claimed in claim 44 is characterized in that, described the first transparent substrates is flexible base plate or hard substrate.
50. display floater as claimed in claim 44, it is characterized in that, the material of described flexible base plate comprises: polyethylene terephthalate, PEN, polyether sulfone, Poly-s 179, Merlon, pi, ring-type alkene nitrile polymer or polyarylate resin.
51. display floater as claimed in claim 44 is characterized in that, the material of described a plurality of barrier structures comprises: negative photoresist or photosensitive hardening material.
52. display floater as claimed in claim 44 is characterized in that, described light shield layer comprises: light-absorption layer or reflector layer.
53. display floater as claimed in claim 52 is characterized in that, the material of described light-absorption layer comprises: black photoresist, coloured photoresist, black resin, colouring resin, ink, carbon dust or pi (polyimide, PI).
54. display floater as claimed in claim 52 is characterized in that, the material of described reflector layer comprises: metal, metal oxide or metal oxynitride.
55. display floater as claimed in claim 54 is characterized in that, the material of described metal comprises: chromium (Cr) or aluminium (Al).
56. display floater as claimed in claim 54 is characterized in that, the material of described metal oxide comprises: chromium oxide or aluminium oxide.
57. display floater as claimed in claim 44 is characterized in that, described the first conductive layer is light transmission conductive layer.
58. display floater as claimed in claim 57 is characterized in that, the material of described light transmission conductive layer comprises: indium tin oxide, indium-zinc oxide, aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide, conducting polymer composite or nanoporous metal membrane.
59. display floater as claimed in claim 44 is characterized in that, described display medium comprises: liquid crystal, electrophoresis liquid or electroluminescence material.
60. display floater as claimed in claim 44 is characterized in that, described a plurality of barrier structures and described the first conductive pattern or described light-shielding pattern trim.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100146895A TW201327510A (en) | 2011-12-16 | 2011-12-16 | Manufacturing method of array substrate, display panel and manufacturing method thereof |
| TW100146895 | 2011-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103165526A true CN103165526A (en) | 2013-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210052720 Withdrawn CN103165526A (en) | 2011-12-16 | 2012-03-02 | Manufacturing method of array substrate, display panel and manufacturing method of display panel |
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| Country | Link |
|---|---|
| CN (1) | CN103165526A (en) |
| TW (1) | TW201327510A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105374933A (en) * | 2014-08-14 | 2016-03-02 | 三星电子株式会社 | Magnetic memory devices and methods of forming the same |
| CN107145869A (en) * | 2017-05-09 | 2017-09-08 | 上海箩箕技术有限公司 | Display module |
| CN107991730A (en) * | 2018-01-18 | 2018-05-04 | 深圳市华星光电技术有限公司 | Polaroid and preparation method thereof, display panel |
| CN109426397A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | The preparation method of touch-control structure, touch-control structure |
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| CN111077730A (en) * | 2019-12-13 | 2020-04-28 | Tcl华星光电技术有限公司 | Black photoresist, preparation method thereof, display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI557772B (en) | 2014-04-10 | 2016-11-11 | 友達光電股份有限公司 | Device substrate and fabricating method thereof |
| JP6259789B2 (en) * | 2015-05-28 | 2018-01-10 | 双葉電子工業株式会社 | Organic EL display module |
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2011
- 2011-12-16 TW TW100146895A patent/TW201327510A/en unknown
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2012
- 2012-03-02 CN CN 201210052720 patent/CN103165526A/en not_active Withdrawn
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374933A (en) * | 2014-08-14 | 2016-03-02 | 三星电子株式会社 | Magnetic memory devices and methods of forming the same |
| CN105374933B (en) * | 2014-08-14 | 2019-10-11 | 三星电子株式会社 | Magnetic memory device and forming method thereof |
| CN107145869A (en) * | 2017-05-09 | 2017-09-08 | 上海箩箕技术有限公司 | Display module |
| CN109426397A (en) * | 2017-08-22 | 2019-03-05 | 京东方科技集团股份有限公司 | The preparation method of touch-control structure, touch-control structure |
| CN109426397B (en) * | 2017-08-22 | 2020-08-04 | 京东方科技集团股份有限公司 | Preparation method of touch structure and touch structure |
| CN107991730A (en) * | 2018-01-18 | 2018-05-04 | 深圳市华星光电技术有限公司 | Polaroid and preparation method thereof, display panel |
| CN110706589A (en) * | 2018-07-09 | 2020-01-17 | 希映科技股份有限公司 | Electric driving element and method for manufacturing the same |
| CN111077730A (en) * | 2019-12-13 | 2020-04-28 | Tcl华星光电技术有限公司 | Black photoresist, preparation method thereof, display panel and display device |
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| TW201327510A (en) | 2013-07-01 |
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Application publication date: 20130619 |