CN103160882A - Cyanide-free copper plating process - Google Patents
Cyanide-free copper plating process Download PDFInfo
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- CN103160882A CN103160882A CN 201110423824 CN201110423824A CN103160882A CN 103160882 A CN103160882 A CN 103160882A CN 201110423824 CN201110423824 CN 201110423824 CN 201110423824 A CN201110423824 A CN 201110423824A CN 103160882 A CN103160882 A CN 103160882A
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- copper plating
- cyanide
- copper
- free
- plating process
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Abstract
The invention discloses a cyanide-free copper plating process. The cyanide-free copper plating process comprises the following steps: (1) oil removing under normal temperature, namely,processing with the use of a chemical method or sandblasting, (2) hot water scrubbing, namely, a metal piece is placed into the water with the temperature of 60-70 DEG C to wash, (3) cold water washing, (4) acid-washing, (5) cold water washing, (6) activation radioactivation, (7) pre copper plating, namely, etidronic acid is used for complexing copper ions in pre copper plating solution to avoid precipitation of the copper ions and improve bonding strength of a copper plating layer, the copper plating solution temperature is controlled between 40-60 DEG C, potential of hydrogen (PH) is 8-9, and electric current density is 0.5A/dm2, (8) cold water washing, (9) copper plating, and (10) winding and packaging. The cyanide-free copper plating process is reasonable and simple, the copper plating layer is high in bonding strength, cyanide-free pre copper plating is utilized, and the cyanide-free copper plating process is small in pollution and is suitable for a wide range of promotion and use.
Description
Technical field
The invention belongs to technical field of electrochemistry, be specifically related to a kind of cyanide-free copper electroplating technique.
Background technology
Copper facing at present is also in a large amount of cyanide copper plating techniques of using, cyanide copper plating technique to plate front oil removing, the degreasing requirement is lower, prussiate can activate Steel Wire Surface, thereby reaches good bonding strength, but there are severe toxicity and serious environmental pollution, belong to national cleaner production time limit and eliminate technique.
Summary of the invention
The object of the present invention is to provide a kind of technique reasonable, the copper plate bonding strength is high, and copper plating bath is stablized nontoxic cyanide-free copper electroplating technique.
Technical solution of the present invention is:
A kind of cyanide-free copper electroplating technique is characterized in that, comprises the steps, 1 normal temperature oil removing, namely use chemical process or the processing of sandblasting, 2 hot water wash are about to metalwork and put into temperature and clean at the water of 60-70 ° of C, 3 cold wash, 4 pickling, 5 cold wash, 6 activation, 7 pre-copper facing, adopt 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid with the cupric ion complexing in pre-copper plating solution, prevent that cupric ion from separating out, improve the bonding strength of copper plate, the copper plating solution temperature is controlled at 40-60 ° of C, pH value 8-9, current density 0.5A/dm2,8 cold wash, 9 copper facing, 10 reel packs.
Technique of the present invention is rationally simple, and the copper plate bonding strength is high, adopts the non-cyanide pre-plating copper staining little, is fit to large-scale popularization and uses.
Embodiment:
1 one kinds of cyanide-free copper electroplating techniques of embodiment, comprise the steps: 1 normal temperature oil removing, namely use chemical process or the processing of sandblasting, 2 hot water wash are about to metalwork and put into temperature and clean at the water of 60 ° of C, 3 cold wash, 4 pickling, 5 cold wash, 6 activation, 7 pre-copper facing, adopt 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid with the cupric ion complexing in pre-copper plating solution, prevent that cupric ion from separating out, improve the bonding strength of copper plate, the copper plating solution temperature is controlled at 50 ° of C, pH value 9, current density 0.5A/dm2,8 cold wash, 9 copper facing, 10 reel packs.
Claims (1)
1. cyanide-free copper electroplating technique, it is characterized in that, comprise the steps, (1) normal temperature oil removing, namely use chemical process or the processing of sandblasting, (2) hot water wash, being about to metalwork puts into temperature and cleans at the water of 60-70 ° of C, (3) cold wash, (4) pickling, (5) cold wash, (6) activation, (7) pre-copper facing, adopt 1-Hydroxy Ethylidene-1,1-Diphosphonic Acid with the cupric ion complexing in pre-copper plating solution, prevent that cupric ion from separating out, improve the bonding strength of copper plate, the copper plating solution temperature is controlled at 40-60 ° of C, pH value 8-9, current density 0.5A/dm2, (8) cold wash, (9) copper facing, (10) coiling packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423824 CN103160882A (en) | 2011-12-18 | 2011-12-18 | Cyanide-free copper plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423824 CN103160882A (en) | 2011-12-18 | 2011-12-18 | Cyanide-free copper plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103160882A true CN103160882A (en) | 2013-06-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110423824 Pending CN103160882A (en) | 2011-12-18 | 2011-12-18 | Cyanide-free copper plating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103160882A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015103786A1 (en) * | 2014-01-13 | 2015-07-16 | 孙松华 | Cyanide-free copper-preplating electroplating solution and preparation method therefor |
| CN105063732A (en) * | 2015-08-27 | 2015-11-18 | 天津佰金隆金属制品有限公司 | Device for cyanide-free copper plating |
-
2011
- 2011-12-18 CN CN 201110423824 patent/CN103160882A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015103786A1 (en) * | 2014-01-13 | 2015-07-16 | 孙松华 | Cyanide-free copper-preplating electroplating solution and preparation method therefor |
| CN105063732A (en) * | 2015-08-27 | 2015-11-18 | 天津佰金隆金属制品有限公司 | Device for cyanide-free copper plating |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130619 |