CN103152974A - Printed circuit board using metal circuit sheets and electronic packaging module of printed circuit board - Google Patents

Printed circuit board using metal circuit sheets and electronic packaging module of printed circuit board Download PDF

Info

Publication number
CN103152974A
CN103152974A CN2013100549461A CN201310054946A CN103152974A CN 103152974 A CN103152974 A CN 103152974A CN 2013100549461 A CN2013100549461 A CN 2013100549461A CN 201310054946 A CN201310054946 A CN 201310054946A CN 103152974 A CN103152974 A CN 103152974A
Authority
CN
China
Prior art keywords
those
circuit
electronic
metallic circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2013100549461A
Other languages
Chinese (zh)
Other versions
CN103152974B (en
Inventor
施春景
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JINXING PRECISION INDUSTRY Co Ltd
Original Assignee
JINXING PRECISION INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JINXING PRECISION INDUSTRY Co Ltd filed Critical JINXING PRECISION INDUSTRY Co Ltd
Priority to CN201310054946.1A priority Critical patent/CN103152974B/en
Publication of CN103152974A publication Critical patent/CN103152974A/en
Application granted granted Critical
Publication of CN103152974B publication Critical patent/CN103152974B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a printed circuit board using metal circuit sheets and an electronic packaging module of the printed circuit board. The printed circuit board comprises a plurality of metal circuit sheets which are in a geometrical shape, an electrical insulation packaging body and a plurality of electronic components, wherein the metal circuit sheets are coated by the electrical insulation packaging body to form the printed circuit board, and the metal circuit sheets are insulated, so that the condition that the current is conducted by the contact of the metal circuit sheets is avoided; the packaging body is provided with a plurality of openings, so that the metal circuit sheets is exposed to one plane; the electronic components are distributed on the openings and are electrically connected with the metal circuit sheets; and the electronic components are interconnected through the metal circuit sheets to form a circuit.

Description

A kind of electronic circuit board and Electronic Packaging module thereof of using the metallic circuit sheet
Technical field
The present invention is a kind of electronic circuit board, particularly a kind of electronic circuit board and Electronic Packaging module thereof of using the metallic circuit sheet.
Background technology
Printed circuit board (PCB) (Printed Circuit Board is called for short PCB) is according to circuit design, the electric wiring of connecting circuit part is depicted as wiring pattern, and then to design the modes such as specified machining, surface treatment, make electric conductor reappear the circuit board that consists of on insulator; In other words, printed circuit board (PCB) is the substrate of collocation before electronic component, its effect be with every electronic component with the formed electronic circuit of circuit board, the function of the every electronic components of performance, the purpose of processing to reach signal.
The mutual electric current that the major function of PCB is to provide every part connects, and the base of plank itself is that material heat insulation by insulation, also can't be crooked is made.The tiny line material that can see on the surface is Copper Foil, and originally Copper Foil covers on whole plank, and in manufacture process etched the disposing of part, the part that stays has just become webbed tiny circuit.These circuits are known as wire or claim wiring, and are used to provide the circuit connection of the upper part of PCB.
The PCB baseplate material still has aluminium base, iron substrate etc., and circuit is formed on substrate, most of back-steam car that is used for.But, automobile is in the situation that travel, engine bay temperature is understood the lasting condition of high temperature that remains on, thus, circuit board by the mode of printing manufacturing can damage because of the high temperature that the superincumbent passive component running of welding produces, especially easy high temperature melts down when the large electric current of long-time load, and damages other equipment on every side.
Summary of the invention
Problem for above-mentioned existence, the purpose of this invention is to provide a kind of electronic circuit board, it utilizes the metallic circuit sheet to form a current path, form a flat metal circuit board with packaging body coats metallic circuit sheet again, the upper electronic building brick formation one of welding at last is used in the high temperature resistant electromechanical assembly of transport carrier.
Main purpose of the present invention is to provide a kind of electronic circuit board that uses the metallic circuit sheet, comprises several metallic circuit sheets, and the metallic circuit sheet is the sheet metal with geometry, and each sheet metal provides the electric charge circulation; One packaging body, it is an electrical insulators, and clad metal circuit sheet forms an electronic circuit board, and isolating metal circuit sheet avoids contacting with each other On current, and packaging body has several openings makes the metallic circuit sheet be exposed to the first plane; And several electronic building bricks, it is laid in to form with the metallic circuit sheet on the opening on the first plane and is electrically connected, and electronic building brick is connected to each other by the metallic circuit sheet and forms a circuit.
In a preferred embodiment, the circuit of above-mentioned electronic circuit board is one can form the network of closed-loop path.
In a preferred embodiment, the metallic circuit sheet of above-mentioned electronic circuit board is conducting metal or electrical conductivity alloy.
In a preferred embodiment, the metallic circuit sheet of above-mentioned electronic circuit board has a power connector end and extends outside packaging body and expose the metal part, can be electrically connected an external power source or a printed circuit board (PCB).
In a preferred embodiment, the electronic building brick of above-mentioned electronic circuit board is passive component or driven unit.
In a preferred embodiment, the packaging body of above-mentioned electronic circuit board has several pairs opening makes the metallic circuit sheet be exposed to the first plane and the second plane, the metallic circuit sheet at two openings on the first plane is exposed in electronic building brick contact, and heat that electronic building brick produces is shed by two openings on the second plane.
Another object of the present invention is to provide a kind of electronic packaging of electronic circuit board, comprising: a digital circuit components that is formed by printed circuit board (PCB), and have an analog-digital converter and a digital analog converter; And a circuit board, use sheet metal as conductive path, be an artificial circuit component and have one first plane and one second plane, comprising: several metallic circuit sheets, metallic circuit sheet are the sheet metal with geometry, each sheet metal provides electric charge to circulate; One packaging body, it is an electrical insulators, and clad metal circuit sheet forms a flat metal circuit board, and isolating metal circuit sheet avoids contacting with each other On current, and packaging body has several openings makes the metallic circuit sheet be exposed to the first plane; And several electronic building bricks, it is laid in to form with the metallic circuit sheet on opening and is electrically connected, and electronic building brick is connected to each other by the metallic circuit sheet and forms a circuit.
In a preferred embodiment, the metallic circuit sheet of above-mentioned electronic packaging is conducting metal or electrical conductivity alloy.
In a preferred embodiment, the metallic circuit sheet of above-mentioned electronic packaging has a power connector end and extends outside packaging body and expose the metal part, can be electrically connected an external power source.
In a preferred embodiment, the electronic building brick of above-mentioned electronic packaging is passive component or driven unit.
In a preferred embodiment, the packaging body of above-mentioned electronic packaging has several pairs opening makes the metallic circuit sheet be exposed to the first plane and the second plane, the metallic circuit sheet at two openings on the first plane is exposed in electronic building brick contact, and heat that driven unit produces is shed by the another side of two openings.
A further object of the present invention is to provide a kind of Electronic Packaging module of metallic circuit sheet, comprise: several metallic circuit sheets, each metallic circuit sheet has geometry and the electric charge circulation is provided, several electronic building bricks are laid in to form on the metallic circuit sheet and are electrically connected, and electronic building brick is connected to each other by the metallic circuit sheet and forms an artificial circuit component; One printed circuit board (PCB) is a digital circuit components, and has an analog-digital converter and a digital analog converter; And a packaging body, be an electrical insulators, coat and isolating metal circuit sheet and printed circuit board (PCB) avoid contacting with each other On current, packaging body has several openings is exposed to outside packaging body the metallic circuit sheet.
In a preferred embodiment, the metallic circuit sheet of above-mentioned Electronic Packaging module is conducting metal or electrical conductivity alloy.
In a preferred embodiment, the sheet metal of above-mentioned Electronic Packaging module has a power connector end and extends outside packaging body and expose the metal part, can be electrically connected an external power source.
In a preferred embodiment, the electronic building brick of above-mentioned Electronic Packaging module is passive component or driven unit.
In a preferred embodiment, the electronic building brick of above-mentioned Electronic Packaging module is contacting metal circuit sheet in packaging body, and the heat that electronic building brick produces is shed by opening.
In a preferred embodiment, the metallic circuit sheet of above-mentioned Electronic Packaging module is arranged at the stacking-type that packaging body forms a level, with printed circuit board (PCB) at different layers.
In a preferred embodiment, the metallic circuit sheet of above-mentioned Electronic Packaging module ties up to and makes electronic building brick be laid in the upper artificial circuit component that forms of this layer in same layer.
Than the electronic installation that existing printed circuit board (PCB) forms, metallic circuit sheet of the present invention can reduce aisle resistance, reduce copper loss, and promotes the anti-magnitude of current, is fit to very much be applied in the electromechanical assembly of large electric current.In addition, the present invention separates power amplifier board (copper base) and control board, is about to large electric current and separates with little current circuit, avoids noise effect control board (little electric current) the signal output of power amplifier board (large electric current), prevents current interference.
The present invention is laid in passive component on the metallic circuit sheet increases area of dissipation, reduces the passive component accumulated heat, and heat radiation speed extends passive component useful life, promotes the integral module reliability.In addition, the present invention replaces the PCB circuit board with the copper base circuit, and recyclable recycling on material is to reach the environmental protection demand.
Description of drawings
Fig. 1 is the metallic circuit chip architecture schematic diagram of the present invention's one most preferred embodiment.
Fig. 2 is the package body structure schematic diagram of the present invention's one most preferred embodiment.
Fig. 3 is the electronic circuit board structure perspective view of the present invention's one most preferred embodiment.
Fig. 4 is electronic circuit board inner face and the electronic component structure schematic diagram of the present invention's one most preferred embodiment.
Fig. 5 is the electronic packaging structural representation of the electronic circuit board of the present invention's one most preferred embodiment.
Fig. 6 is the electronic packaging making step schematic diagram of the electronic circuit board of the present invention's one most preferred embodiment.
Fig. 7 is the Electronic Packaging modular structure schematic diagram of the metallic circuit sheet of the present invention's one most preferred embodiment.
[symbol description]
10,21 metallic circuit sheets
12,22 single radial cuts
13,23 pairs of openings
15,25,53 packaging bodies
20,51 metal circuit boards
24 power connector ends
26,27,28 electronic building bricks
30 electronic circuit boards
40,52 printed circuit board (PCB)s
S01 ~ S07 making step.
Embodiment
The invention will be further described below in conjunction with diagram and the embodiment of concrete operations.
See also and Figure 1 shows that the metallic circuit sheet 10 that uses in electronic circuit board of the present invention, the sheet metal of various different geometries is arranged, jointly consist of the guiding path of electric charge.Figure 2 shows that the packaging body 15 that uses in electronic circuit board of the present invention, the opening of single radial cut 12 and two 13 two kinds of different sizes of opening is arranged.
See also Fig. 3,4 are depicted as an embodiment of electronic circuit board of the present invention, and Fig. 3 is the structure perspective view of electronic circuit board, and Fig. 4 is inner face and the electronic component structure schematic diagram of electronic circuit board.The present embodiment uses sheet metal to form a current path, comprises several pieces metallic circuit sheets 21, packaging body 25 and several electronic building bricks 26,27,28.In this specific embodiment, metallic circuit sheet 21 is for having the sheet metal of plane geometric shape, and each sheet metal can make the electric charge circulation.The non-general traditional printed wire of metallic circuit sheet 21, but have conductive metal sheet or the electrical conductivity alloy sheet of width, therefore with general " line " road of " sheet " difference.Metallic circuit sheet 21 of the present invention can't be produced in the existing mode of making printed circuit board (PCB), must be shaped with the making one by one of the monomer mode of production, be combined into electronic circuit, can reduce aisle resistance, reduce copper loss, and promote the anti-magnitude of current, be fit to very much be applied in the electromechanical assembly of large electric current.
In addition, the whole clad metal circuit of packaging body 25 sheet 21 of one insulation electrical forms a flat metal circuit board 20, packaging body 25 isolating metal circuit sheets 21 avoid contacting with each other On current, and the formed circuit of all metallic circuit sheets 21 is fixed in metal circuit board 20, so can being laid on metal circuit board 20 surfaces some electronic building bricks 26,27,28 regular property.So packaging body 25 surfaces are provided with some single radial cuts 22 exposes metallic circuit sheet 21 in the plane, electronic building brick 26,27,28 just can weld together at single radial cut 22 places and metallic circuit sheet 21, forms the network of a closed-loop path.Metallic circuit sheet 21 is designed according to various different demands, has various different geometries, and when so being combined into an electronic circuit board 20, electronic circuit board 20 outward appearances can present circular or polygonal shape.
Moreover, packaging body 25 also has some two openings 23 makes the part of metallic circuit sheet 21 be exposed to inner face and the back side of this packaging body 25, open area ratio single radial cut 22 areas of two openings 23 are large, can make electronic building brick 26,27,28 contact at inner face the metallic circuit sheet 21 that exposes at two openings 23, its heat that produces is shed by the other one side (back side) of two openings 23, so the present invention can increase area of dissipation, reduce electronic building brick 26,27,28 accumulated heats, heat radiation speed. Electronic building brick 26,27,28 should comprise various passive components and driven unit.
In one embodiment, the network that forms a closed-loop path must receive external power source and just can operate, so some metallic circuit sheet has a power connector end 24, it is that to extend packaging body 25 by metallic circuit sheet 21 outer and expose metal and form, and can be electrically connected an external power source or a printed circuit board (PCB) (not shown).In one embodiment, the direct bending of metallic circuit sheet 21 can form power connector end 24, and assembling is quite convenient, can simplify processing procedure.
According to above-mentioned, metallic circuit sheet 21 is as power circuit (naked copper circuit), and its periphery is by the moulding of packaging body 25 (plastics) encapsulate, but the fixed power source circuit is avoided metallic circuit sheet 21 to be in contact with one another and causes short circuit.In one embodiment, the naked copper circuit can be made unified external form for different institutions, and the QC inspection process is unified, reduces the check erroneous judgement, reduces fraction defective.
See also electronic packaging one embodiment that Figure 5 shows that electronic circuit board of the present invention, particularly be used in the electromechanical assembly of transport carrier.One printed circuit board (PCB) 40 has at least one analog-digital converter and at least one digital analog converter (not shown) as a digital circuit components.Printed circuit board (PCB) 40 also has several control assemblies and several arithmetic units, under the driving of a frequency, and execution and the computing of control assembly control algorithm parts.
In addition, an electronic circuit board 30 uses several metallic circuit sheets as the electric charge guiding path, and these metallic circuit sheets are conductive metal sheet or the electrical conductivity alloy sheet with plane geometric shape.The electric packaging body of one insulator is separately arranged, coat these metallic circuit sheets and form a flat metal circuit board, and isolating metal circuit sheet avoids contacting with each other On current, packaging body has several openings makes part metals circuit sheet be exposed to the plane.Then some electronic building bricks are laid in to form with the metallic circuit sheet on opening and are electrically connected.Electronic building brick should be passive component or driven unit, and these assemblies are connected to each other by the metallic circuit sheet and form a circuit, make electronic circuit board 30 become an artificial circuit component.
According to above-mentioned, printed circuit board (PCB) 40 is fixed on metal circuit board 30 1 surfaces, and via several conductive pole (not shown) and metal circuit board 30 electrically connects, these conductive poles see through analog-digital converter, the digital analog converter on printed circuit board (PCB) 40, digital circuit components and artificial circuit component are connected to each other form a mixed-signal circuit.Metal circuit board 30 welds printed circuit board (PCB) 40 via conductive pole and is fixed in the inner face of metal circuit board 30.Printed circuit board (PCB) 40 also can be carried out by known draw-in groove or intermediate plate mode with the mode of metal circuit board 30 secure bond, and this kind fixed form is just without conducting function.
Moreover the metallic circuit sheet has a power connector end extend outside this packaging body and expose the metal part, can be electrically connected an external power source.Packaging body has several pairs opening is exposed on the plane metallic circuit sheet, and the metallic circuit sheet at two openings on plane is exposed in electronic building brick contact, and heat that these electronic building bricks produce is shed by the another side of two openings.
Seeing also Fig. 6 is that electronic packaging of the present invention is made flow process, and the metallic circuit sheet adopts copper base, forms at last a circuit and controller module, makes flow process and comprises:
The processing of derusting of deoiling of step S01, copper coin surface;
Step S02, copper coin electroplating surface use zinc-plated processing;
Step S03, drawing form the naked copper circuit unit;
Step S04, circuit arrangement combination, the naked copper circuit substrate;
Step S05, packaging body penetrate and coat, and plastics penetrate as packaging body and coat naked copper circuit substrate formation copper base circuit module;
Step S06, electronic building brick soldering become an artificial circuit component; And
Step S07, copper base circuit (artificial circuit component) become controller module in conjunction with control board circuit (digital circuit components).
According to above-mentioned, the electronic packaging of electronic circuit board of the present invention washes away with photographic exposure, etching, liquid medicine in the traditional PCB processing procedure to be compared, and without the problem of discharging heavily contaminated material, the present invention uses the processing procedure of stamped metal wiring board, meets environmental protection trend.In one embodiment, replace the PCB circuit board with the copper base circuit, (copper sheet and plastics) recyclable recycling on material is to reach the environmental protection demand.
See also Electronic Packaging module one embodiment that Figure 7 shows that metallic circuit sheet of the present invention, several metallic circuit sheets form metal circuit board 51, each metallic circuit sheet is that conducting metal or electrical conductivity alloy can make the electric charge circulation, metal circuit board 51 comprises that several passive components or driven unit are laid in formation electric connection on the metallic circuit sheet, are connected to each other by these metallic circuit sheets and form an artificial circuit component.The printed circuit board (PCB) 52 of one digital circuit components has at least one analog-digital converter and at least one digital analog converter.One packaging body 53 coats as electrical insulators and isolating metal wiring board 51 and printed circuit board (PCB) 52 avoid contacting with each other On current, and packaging body 53 has several openings makes the metallic circuit sheet partly expose packaging body 53.
According to above-mentioned, printed circuit board (PCB) 52 is fixed on metal circuit board 51 1 surfaces, and pass packaging body 53 inside and metallic circuit sheet or electronic building brick electrically connects via several conductive poles, conductive pole sees through analog-digital converter, digital analog converter, digital circuit components and artificial circuit component is connected to each other forms a mixed-signal circuit.
Packaging body separately has several openings to make the metallic circuit sheet be exposed to the outer (not shown) of packaging body 53, and electronic building brick has the metallic circuit sheet of opening in the interior contact of packaging body 53, and heat that electronic building brick produces is shed by the face that exposes of metallic circuit sheet.
In one embodiment, the metallic circuit sheet has a power connector end and extends outside packaging body and expose the metal part, can be electrically connected an external power source, so forms a complete electronic installation.The present embodiment is packaged into a module with digital circuit components and artificial circuit component, printed circuit board (PCB) 52 is isolated in different layers with metal circuit board 51, transmit signal with conductive pole between each layer, the metallic circuit sheet is arranged at the stacking-type that packaging body 53 forms a level, with printed circuit board (PCB) 52 at different layers, to simulate the GND signal and separate with digital GND signal, reduce the noise jamming of two kinds of circuit, promote the accuracy of start.
According to above-mentioned, the present invention separates metal circuit board 51 (power amplifier board-copper base) and printed circuit board (PCB) 52 (control board), be about to large electric current and separate with little current circuit, avoid noise effect printed circuit board (PCB) 52 (low current) the signal output of high electric current, prevent current interference.
Moreover, metal circuit board 51 substitute the PCB circuit board with copper base as circuit board, metal copper foil on the PCB circuit board (thickness is 0.03mm) changes to the copper sheet circuit (thickness is 1mm) of the present embodiment, can increase the current flowing area, be difficult for accumulated heat, and increase area of dissipation, therefore can bear the high temperature running, and power amplifier board (copper base) and control board are separately, improve the magnitude of voltage that the Electronic Packaging module can bear.
In another specific embodiment, the metallic circuit sheet is designed according to various different demands, has various different geometries, and when so being combined into an electronic circuit board, the electronic circuit board outward appearance can present circular or polygonal shape.Therefore, printed circuit board (PCB) also can match with the shape of electronic circuit board, makes Encapsulation Moulds organize structural integrity, and specification is consistent, promotes the stock control convenience.
In sum, the present invention uses the metallic circuit sheet as the use of the conducting electric charge of electronic circuit board, and sheet metal strengthens, and reduces aisle resistance, reduces copper loss, promotes the anti-magnitude of current.And passive component is laid on the metallic circuit sheet increases area of dissipation, reduces the passive component accumulated heat, and heat radiation speed extends passive part useful life, lifting integral module reliability.
Above specific embodiments of the invention are described in detail, but the present invention is not restricted to specific embodiment described above, it is just as example.To those skilled in the art, any equivalent modifications and alternative also all among category of the present invention.Therefore, not breaking away from impartial conversion and the modification of making under the spirit and scope of the present invention, all should contain within the scope of the invention.

Claims (18)

1. an electronic circuit board that uses the metallic circuit sheet, have one first plane and one second plane, comprising:
A plurality of metallic circuit sheets, those metallic circuit sheets are the sheet metal with geometry, each this sheet metal provides the electric charge circulation;
One packaging body, it is an electrical insulators, coats those metallic circuit sheets and forms an electronic circuit board, and isolate those metallic circuit sheets and avoid contacting with each other On current, this packaging body has plurality of openings makes those metallic circuit sheets be exposed to this first plane; And
A plurality of electronic building bricks, it is laid in to form with those metallic circuit sheets on those openings on this first plane and is electrically connected, and those electronic building bricks are connected to each other by those metallic circuit sheets and form a circuit.
2. the electronic circuit board of use metallic circuit sheet as claimed in claim 1, wherein, this circuit is one can form the network of closed-loop path.
3. the electronic circuit board of use metallic circuit sheet as claimed in claim 1, wherein, those metallic circuit sheets are conducting metal or electrical conductivity alloy.
4. the electronic circuit board of use metallic circuit sheet as claimed in claim 1, wherein, those metallic circuit sheets have a power connector end, and to extend this packaging body outer and expose the metal part, can be electrically connected an external power source or a printed circuit board (PCB).
5. the electronic circuit board of use metallic circuit sheet as claimed in claim 1, wherein, those electronic building bricks are passive component or driven unit.
6. the electronic circuit board of use metallic circuit sheet as described in claim 1 or 5, wherein, this packaging body has a plurality of pairs of openings makes those metallic circuit sheets be exposed to this first plane and this second plane, the metallic circuit sheet of those pairs opening on this first plane is exposed in those electronic building brick contacts, and the heat that those electronic building bricks produce is shed by those pairs opening on this second plane.
7. the electronic packaging of an electronic circuit board is used in the electromechanical assembly of transport carrier, comprising:
At least one digital circuit components that is formed by printed circuit board (PCB), and have at least one analog-digital converter and at least one digital analog converter; And
One circuit board is to use sheet metal as conductive path, is an artificial circuit component and has one first plane and one second plane, comprising:
A plurality of metallic circuit sheets, those metallic circuit sheets are the sheet metal with geometry, each this sheet metal provides the electric charge circulation;
One packaging body, it is an electrical insulators, coat those metallic circuit sheets and form a flat metal circuit board, and isolate those metallic circuit sheets and avoid contacting with each other On current, this packaging body has plurality of openings makes those metallic circuit sheets be exposed to this first plane; And
A plurality of electronic building bricks, it is laid in to form with those metallic circuit sheets on those openings and is electrically connected, and those electronic building bricks are connected to each other by those metallic circuit sheets and form a circuit;
Wherein, this printed circuit board (PCB) is fixed on this metal circuit board one surface, and via plural conductive post and those metallic circuit sheet electrically connects, those conductive poles see through this analog-digital converter, this digital analog converter, this digital circuit components and this artificial circuit component are connected to each other form a mixed-signal circuit.
8. the electronic packaging of electronic circuit board as claimed in claim 7, wherein, those metallic circuit sheets are conducting metal or electrical conductivity alloy.
9. the electronic packaging of electronic circuit board as claimed in claim 7, wherein, those metallic circuit sheets have a power connector end, and to extend this packaging body outer and expose the metal part, can be electrically connected an external power source.
10. the electronic packaging of electronic circuit board as claimed in claim 7, wherein, those electronic building bricks are passive component or driven unit.
11. the electronic packaging as claim 7 or 10 described electronic circuit boards, wherein, this packaging body has a plurality of pairs of openings makes those metallic circuit sheets be exposed to this first plane and this second plane, the metallic circuit sheet at those pairs opening on this first plane is exposed in the contact of those electronic building bricks, and heat that those driven units produce is shed by the another side of those pairs opening.
12. the Electronic Packaging module of a metallic circuit sheet is used in the electromechanical assembly of transport carrier, comprising:
A plurality of metallic circuit sheets, each this metallic circuit sheet has geometry and the electric charge circulation is provided, a plurality of electronic building bricks are laid in to form on those metallic circuit sheets and are electrically connected, and those electronic building bricks are connected to each other by those metallic circuit sheets and form an artificial circuit component;
At least one printed circuit board (PCB) is a digital circuit components, and has at least one analog-digital converter and at least one digital analog converter; And
One packaging body, it is an electrical insulators, coats and isolates those metallic circuit sheets and this printed circuit board (PCB) avoids contacting with each other On current, this packaging body has plurality of openings is exposed to outside this packaging body those metallic circuit sheets;
Wherein, this printed circuit board (PCB) passes this package interior and those metallic circuit sheets or electronic building brick electrically connect via the plural conductive post, those conductive poles see through this analog-digital converter, this digital analog converter, this digital circuit components and this artificial circuit component are connected to each other form a mixed-signal circuit.
13. the Electronic Packaging module of metallic circuit sheet as claimed in claim 12, wherein, those metallic circuit sheets are conducting metal or electrical conductivity alloy.
14. the Electronic Packaging module of metallic circuit sheet as claimed in claim 12, wherein, those sheet metals have a power connector end and extend outside this packaging body and expose the metal part, can be electrically connected an external power source.
15. the Electronic Packaging module of metallic circuit sheet as claimed in claim 12, wherein, those electronic building bricks are passive component or driven unit.
16. the Electronic Packaging module of metallic circuit sheet as claimed in claim 12, wherein, those electronic building bricks contact those metallic circuit sheets in this packaging body, and the heat that those electronic building bricks produce is shed by those openings.
17. the Electronic Packaging module of metallic circuit sheet as claimed in claim 12, wherein, those metallic circuit sheets are arranged at the stacking-type that this packaging body forms a level, with this printed circuit board (PCB) at different layers.
18. the Electronic Packaging module of metallic circuit sheet as described in claim 12 or 17, wherein, those metallic circuit sheets tie up to and make those electronic building bricks be laid in upper this artificial circuit component that forms of this layer in same layer.
CN201310054946.1A 2013-02-21 2013-02-21 A kind of electronic circuit board and Electronic Packaging module thereof using metallic circuit sheet Expired - Fee Related CN103152974B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310054946.1A CN103152974B (en) 2013-02-21 2013-02-21 A kind of electronic circuit board and Electronic Packaging module thereof using metallic circuit sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310054946.1A CN103152974B (en) 2013-02-21 2013-02-21 A kind of electronic circuit board and Electronic Packaging module thereof using metallic circuit sheet

Publications (2)

Publication Number Publication Date
CN103152974A true CN103152974A (en) 2013-06-12
CN103152974B CN103152974B (en) 2016-03-16

Family

ID=48550763

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310054946.1A Expired - Fee Related CN103152974B (en) 2013-02-21 2013-02-21 A kind of electronic circuit board and Electronic Packaging module thereof using metallic circuit sheet

Country Status (1)

Country Link
CN (1) CN103152974B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400774A (en) * 2013-08-06 2013-11-20 江苏长电科技股份有限公司 Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167887A (en) * 1989-11-28 1991-07-19 Toshiba Corp Metal printed wiring board device
US5432303A (en) * 1991-07-19 1995-07-11 Poly Circuits, Inc. Conductive adhesive for use in a circuit board
US6400044B1 (en) * 1998-11-24 2002-06-04 Continental Teves Ag & Co., Ohg Protective arrangement for electronic functional units and/or functional groups
TW200820860A (en) * 2006-10-25 2008-05-01 Inventec Corp Connection structure of electric signal
TWM380684U (en) * 2009-11-12 2010-05-11 zan-qi Chen Circuit board capable of loading large current
CN101926014A (en) * 2008-06-23 2010-12-22 Lg伊诺特有限公司 Semiconductor device package
US20110044009A1 (en) * 2004-04-14 2011-02-24 Denso Corporation Semiconductor device
CN102214647A (en) * 2010-04-12 2011-10-12 惠州科锐光电有限公司 Surface mount device thin package

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167887A (en) * 1989-11-28 1991-07-19 Toshiba Corp Metal printed wiring board device
US5432303A (en) * 1991-07-19 1995-07-11 Poly Circuits, Inc. Conductive adhesive for use in a circuit board
US6400044B1 (en) * 1998-11-24 2002-06-04 Continental Teves Ag & Co., Ohg Protective arrangement for electronic functional units and/or functional groups
US20110044009A1 (en) * 2004-04-14 2011-02-24 Denso Corporation Semiconductor device
TW200820860A (en) * 2006-10-25 2008-05-01 Inventec Corp Connection structure of electric signal
CN101926014A (en) * 2008-06-23 2010-12-22 Lg伊诺特有限公司 Semiconductor device package
TWM380684U (en) * 2009-11-12 2010-05-11 zan-qi Chen Circuit board capable of loading large current
CN102214647A (en) * 2010-04-12 2011-10-12 惠州科锐光电有限公司 Surface mount device thin package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103400774A (en) * 2013-08-06 2013-11-20 江苏长电科技股份有限公司 Packaging-prior-to-etching chip-normally-bonded bump type three-dimensional system-level metal circuit board and process method thereof
CN103400774B (en) * 2013-08-06 2016-01-20 江苏长电科技股份有限公司 First be honored as a queen and lose chip formal dress salient point three-dimensional systematic metal circuit board and process

Also Published As

Publication number Publication date
CN103152974B (en) 2016-03-16

Similar Documents

Publication Publication Date Title
CN101027948B (en) Electronics module and method for manufacturing the same
US8309244B2 (en) High-voltage battery comprising a connector unit, and connector unit for such a battery
CN100565735C (en) Solid electrolytic capacitor and transmission-line device and method for making thereof, composite electronic component
EP1225629A3 (en) Component built-in module and method of manufacturing the same
US20060003579A1 (en) Interconnects with direct metalization and conductive polymer
CN100459083C (en) Method for manufacturing substrate of embedded element
KR20130014122A (en) Electronic components embedded pcb and method for manufacturing thereof
CN105304584B (en) Interposer substrate and method of manufacturing the same
US10531569B2 (en) Printed circuit board and method of fabricating the same
CN103889168A (en) Bearing circuit board, manufacturing method of bearing circuit board and packaging structure
WO2011102134A1 (en) Component-embedded substrate
CN104284514A (en) Printed circuit board and method of manufacturing the same
CN105323948B (en) Interposer substrate and method of manufacturing the same
CN104756615A (en) Printed circuit board
CN101800216A (en) Electronic module with emi protection
CN103929895A (en) Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element
JPH10290059A (en) Wiring board
TWI472275B (en) An electric circuit board using metal plates and packaging module thereof
CN104427789B (en) Multilayer circuit board and preparation method thereof
EP1174951B1 (en) System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector
CN101316476A (en) Printed circuit board
CN103152974B (en) A kind of electronic circuit board and Electronic Packaging module thereof using metallic circuit sheet
CN104812226A (en) Cover plate structure and manufacturing method thereof
CN103503585A (en) Circuit carrier
US20150282297A1 (en) Printed Circuit Board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160316

Termination date: 20200221

CF01 Termination of patent right due to non-payment of annual fee