CN103143843B - Method for positioning mold line sample plate with positioning hole in repairing process - Google Patents
Method for positioning mold line sample plate with positioning hole in repairing process Download PDFInfo
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- CN103143843B CN103143843B CN201310088965.6A CN201310088965A CN103143843B CN 103143843 B CN103143843 B CN 103143843B CN 201310088965 A CN201310088965 A CN 201310088965A CN 103143843 B CN103143843 B CN 103143843B
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- sample plate
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- locating hole
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Abstract
The invention relates to a method for positioning a mold line sample plate with a positioning hole in a repairing process. The method comprises the steps that 1) the mold line sample plate is leveled; 2) a laser cutting program A is programmed; 3) a laser cutting program B is programmed; 4) the height of a laser head of a laser cutter is heightened, the laser cutter runs the laser cutting program A in an idling mode, when the laser head is positioned at a first positioning hole, the laser cutter is stopped, and a first positioning steel plate is put down and fixed; then the laser cutter runs in the idling mode continuously, when the laser head is positioned at a second positioning hole, the laser cutter is stopped, and a second positioning steel plate is put down and fixed; 5) the height of the laser head of the laser cutter is realigned; 6) and the laser cutter runs the laser cutting program B to machine the repaired part of the mold line sample plate. According to the method, the positioning holes in the mold line sample plate are utilized, the laser cutter can locate the accurate position of the mold line sample plate and carries out laser cutting on the repaired part, so that the machining accuracy is improved, and the working efficiency of sample plate repairing is also improved.
Description
Technical field
The present invention relates to a kind of with the localization method of locating hole sample plate in rework process, reprocess location for sample plate.
Background technology
Present stage, the sheet metal component of some band locating holes or pin hole and machine-made spares sample plate are reprocessed and are generally changed by workman is manual, increase when boring the higher pilot hole of multiple precision prescribed if run into, because manual machining accuracy is inadequate, usually need to scrap existing sample plate, coming of new of laying equal stress on is processed.If it is many to run into large scale lines, and more complicated sample plate, when establishing multiple viewport and increasing line bar newly, generally can not scrap easily, but reprocess really that some is hard, some regions are easy to when reprocessing produce distortion, and then cause the inaccurate of rework area.Above-mentioned situation can produce the unnecessary waste of material in actual production, and model can be made to produce deviation when reprocessing, precise decreasing, and meanwhile, production efficiency is also lower.So, machining accuracy be improved, digitlization will be realized and reprocess, but model how on laser cutting machine location be the problem that will solve now.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of with the localization method of locating hole sample plate in rework process, the method can utilize the locating hole in sample plate, make it on laser cutting machine, find accurate location, and carry out laser cutting to reprocessing position, not only increase the precision of processing, and the operating efficiency that raising model is reprocessed.
For overcoming the above problems, concrete technical scheme of the present invention is as follows: a kind of with the localization method of locating hole sample plate in rework process, it is characterized in that comprising the following steps:
1) mutual-mould line model is smoothed, and tests by polyester film, guarantee sample plate locating hole and outer rim accurate;
2) establishment only has the laser cutting program A of sample plate outer rim and locating hole, and ensures first to cut locating hole, rear cutting outer rim;
3) establishment only have sample plate outer rim and reprocess change position laser cutting program B, and ensure first cut reprocess change position, after cut outer rim;
4) heighten laser cutting machine laser head height, sky walks laser cutting machine program A, when laser head is at first place's locating hole, by stopping laser cutting machine, putting down Article 1 fixing steel plate and fixing; Then continue to allow laser cutting machine sky walk, when laser head is at second place's locating hole, by stopping laser cutting machine, putting down Article 2 fixing steel plate and fixing;
5) again aligning laser cutting machine laser head height, after cutting out two locating holes by laser cutting machine program A on two fixing steel plates, by stopping laser cutting machine, and making laser head return initial point;
6) model locating hole overlapped with fixing steel plate locating hole and fix, namely completing the location of sample plate on laser cutting machine, carrying out by laser cutting program B the processing that sample plate reprocesses position afterwards.
The localization method of this band locating hole sample plate in rework process adopts above-mentioned steps, utilizes the program of laser cutting to carry out accurate mutual-mould line model and positions, not only increase the positioning precision of sample plate, and improve sample plate reprocess efficiency.
Accompanying drawing explanation
Fig. 1 is the location structure schematic diagram of band locating hole sample plate.
Wherein, 1 be fixing steel plate, 2 be sample plate, 3 be pin, 4 be laser cutting machine workbench, 5 for laser head.
Detailed description of the invention
As shown in Figure 1, a kind of with the localization method of locating hole sample plate in rework process, comprise the following steps:
1) mutual-mould line model 2 is smoothed, and tests by polyester film, guarantee sample plate locating hole and outer rim accurate;
2) establishment only has the laser cutting program A of sample plate outer rim and locating hole, and ensures first to cut locating hole, rear cutting outer rim;
3) establishment only have sample plate outer rim and reprocess change position laser cutting program B, and ensure first cut reprocess change position, after cut outer rim;
4) heighten laser cutting machine laser head 5 height, sky walks laser cutting machine program A, when laser head is at first place's locating hole, by stopping laser cutting machine, putting down Article 1 fixing steel plate 1 and being fixed on laser cutting machine workbench 4; Then continue to allow laser cutting machine sky walk, when laser head is at second place's locating hole, by stopping laser cutting machine, putting down Article 2 fixing steel plate 1 and being fixed on laser cutting machine workbench 4;
5) again aligning laser cutting machine laser head height, after cutting out two locating holes by laser cutting machine program A on two fixing steel plates, by stopping laser cutting machine, and making laser head return initial point;
6) sample plate locating hole overlapped with fixing steel plate locating hole and use pin 3 to fix, namely completing the location of sample plate on laser cutting machine, carry out by laser cutting program B the processing that sample plate reprocesses position afterwards.
Claims (1)
1., with the localization method of locating hole sample plate in rework process, it is characterized in that comprising the following steps:
1) mutual-mould line model is smoothed, and tests by polyester film, guarantee sample plate locating hole and outer rim accurate;
2) establishment only has the laser cutting program A of sample plate outer rim and sample plate locating hole, and ensures first blanking punch line tempte locating hole, rear cutting outer rim;
3) establishment only have sample plate outer rim and reprocess change position laser cutting program B, and ensure first cut reprocess change position, rear cutting outer rim;
4) heighten laser cutting machine laser head height, sky walks laser cutting program A, when laser head is at first place's sample plate locating hole, by stopping laser cutting machine, putting down Article 1 fixing steel plate and fixing; Then continue to allow laser cutting machine sky walk, when laser head is at second place's sample plate locating hole, by stopping laser cutting machine, putting down Article 2 fixing steel plate and fixing;
5) again aligning laser cutting machine laser head height, after cutting out two fixing steel plate locating holes by laser cutting program A on two fixing steel plates, by stopping laser cutting machine, and making laser head return initial point;
6) sample plate locating hole overlapped with fixing steel plate locating hole and fix, namely completing the location of sample plate on laser cutting machine, carrying out by laser cutting program B the processing that sample plate reprocesses position afterwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310088965.6A CN103143843B (en) | 2013-03-20 | 2013-03-20 | Method for positioning mold line sample plate with positioning hole in repairing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310088965.6A CN103143843B (en) | 2013-03-20 | 2013-03-20 | Method for positioning mold line sample plate with positioning hole in repairing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103143843A CN103143843A (en) | 2013-06-12 |
| CN103143843B true CN103143843B (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310088965.6A Active CN103143843B (en) | 2013-03-20 | 2013-03-20 | Method for positioning mold line sample plate with positioning hole in repairing process |
Country Status (1)
| Country | Link |
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| CN (1) | CN103143843B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889672A (en) * | 2015-06-17 | 2015-09-09 | 沈阳飞机工业（集团）有限公司 | Numerical control part repair method |
| CN106926211A (en) * | 2017-04-27 | 2017-07-07 | 沈阳飞机工业（集团）有限公司 | A kind of model with measurement auricle |
| CN109648108B (en) * | 2019-01-16 | 2020-08-07 | 沈阳飞机工业（集团）有限公司 | Method for machining assembling hole of new sample plate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0252190A (en) * | 1988-08-13 | 1990-02-21 | Shimadzu Corp | Hole working method by laser beam |
| CN101001713B (en) * | 2004-06-25 | 2010-05-05 | 小松产机株式会社 | Composite thermal cutting device and composite thermal cutting method |
| CN202015918U (en) * | 2011-03-29 | 2011-10-26 | 三星高新电机（天津）有限公司 | Printed circuit board product arraying pallet |
| CN102284796B (en) * | 2011-06-07 | 2015-03-11 | 大族激光科技产业集团股份有限公司 | Method for processing window on covering film |
| CN102982200B (en) * | 2012-11-06 | 2015-08-12 | 西北工业大学 | A kind of aircraft sheet metal components process modeling method for designing |
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| CN103143843A (en) | 2013-06-12 |
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