CN103137140A - Light source chip, thermal urging magnetic head and manufacture method of light source chip - Google Patents
Light source chip, thermal urging magnetic head and manufacture method of light source chip Download PDFInfo
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- CN103137140A CN103137140A CN2011103778463A CN201110377846A CN103137140A CN 103137140 A CN103137140 A CN 103137140A CN 2011103778463 A CN2011103778463 A CN 2011103778463A CN 201110377846 A CN201110377846 A CN 201110377846A CN 103137140 A CN103137140 A CN 103137140A
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Abstract
The invention discloses a manufacture method of a light source chip of a thermal urging magnetic head. The manufacture method includes steps: (a) a light source strip with a surface coated film is provided; (b) a plurality of blind holes are formed at the preset position of the light source strip through etching, the blind holes are provided with tops hollowed on the surface coated film and bottoms hollowed on the light source strip, and the blind holes have a first maximum width at the tops; and (c) the light source strip is cut through a cutting machine along two adjacent blind holes, wherein the cutting machine is provided with a cutting part having a second maximum width smaller than the first maximum width of the blind holes, and therefore the independent light source chip can be cut down without contacting the side edges of the blind holes. The light source chip obtained in the manufacture method is provided with a smooth edge and a crackles surface, and the surface coated film formed on the light source chip cannot release easily.
Description
Technical field
The present invention relates to a kind of heat with light source module and promote magnetic head, relate in particular to and a kind ofly promote the manufacture method of the light source chip of magnetic head, the heat with this light source chip to promote the manufacture method of magnetic head, and promote magnetic head by light source chip and the heat that said method makes for heat.
Background technology
Hard disk drive is common information storing device.Fig. 1 a is the schematic diagram of a typical hard drive 100.It comprises a series of rotatable disk 101 that is installed on a Spindle Motor 102, and around driving the magnetic-head cantilever assembling (head stack assembly, HSA) 130 of arm axle 105 rotations in order to the data on accessing disk.This HSA 130 comprises at least one motor arm 104 and magnetic head fold piece combination (head gimbal assembly, HGA) typically, comprises that also a main shaft voice coil motor (not shown) is to be controlled at the motion of motor arm 104.
With reference to figure 1b, this HGA 150 comprises that the heat with magnetic head 103 promotes magnetic head 110, and is used for the cantilever part 190 that supporting hot promotes magnetic head 110.This cantilever part 190 comprises load beam 106, substrate 108, hinge element 107 and flexible element 109, and above element all is assembled together.Heeling-in one writing sensor and read transducer (not shown) are to read or data writing on the pole tip of magnetic head 103.When disc driver operated, Spindle Motor 102 made disk 101 High Rotation Speeds, and magnetic head 103 flies above disk 101 because of the air pressure that disk 101 rotations produce.This magnetic head 103 moves with radial direction on the surface of disk 101 under the control of voice coil motor.For different tracks, magnetic head 103 can be write into disk 101 from reading out data on magnetic disk surface or with data.
This kind heat promote magnetic head 110 the position of writing sensor or near heat energy is set on the position, laser diode for example.This kind heat energy provides energy to recording medium, thereby reduces the coercive force of medium so that write operation.Therefore, the heat of this kind with laser diode promotes magnetic head 110 to become liked by the consumer.
Usually, the heat with conventional laser diode chip for backlight unit promotes the manufacture method of magnetic head to comprise the following steps, as shown in Fig. 1 c:
Step (1001) provides a laser diode bar;
Step (1002) is coated anti-reflective film on this laser diode bar;
Step (1003) cuts into several independently laser diode chips by chalker with this laser diode; Particularly, utilize cutting knife or laser beam to form groove on laser diode, then be cut to a plurality of laser diode chips along this groove.
Step (1004) is bonded on a substrate pedestal this laser diode to form a laser diode module;
Step (1005) is connected on a magnetic head this laser diode module to form heat promotion magnetic head.
Yet, utilize laser diode module that said method makes in follow-up manufacturing procedure, as matting, press in operation or transfering process etc., have problems.For example, because cutting knife or laser beam are directly cut on laser diode bar, so the cut edge of laser diode chip is very coarse, thereby increases the possibility of anti-reflective film unsticking from the laser diode chip.More very, laser diode chip by the matting of brush or Ultrasonic Cleaning in, this anti-reflective film can come off.Again and, slight crack occurs in this laser diode chip on the surface because of pressurized in pressing operation.Therefore laser diode chip and heat promote that the performance of magnetic head is weakened, thereby do not meet manufacturer and consumer's requirement.
Therefore, demand the manufacture method that a kind of improved light source chip and heat promote magnetic head urgently, to obtain improved light source chip and the hot magnetic head that promotes, to overcome defects.
Summary of the invention
One of purpose of the present invention is to provide a kind of manufacture method that promotes the light source chip of magnetic head for heat, and the light source chip that obtains by the method has smooth edge, and the surface does not have slight crack, and surface coating formed thereon is incrust.
Another object of the present invention is to provide a kind of light source chip that promotes magnetic head for heat, it has smooth edge, and the surface does not have slight crack, and surface coating formed thereon is incrust, thereby improves the performance of light source chip.
A further object of the present invention is to provide a kind of heat to promote the manufacture method of magnetic head, obtain having the heat promotion magnetic head of improved light source module by the method, light source chip wherein has smooth edge, and the surface does not have slight crack, and surface coating formed thereon is incrust.
Another purpose of the present invention is to provide a kind of heat to promote magnetic head, and it has improved light source module, and light source chip wherein has smooth edge, the surface does not have slight crack, and surface coating formed thereon is incrust, thereby improves the performance of light source chip.
For achieving the above object, the invention provides a kind of manufacture method that promotes the light source chip of magnetic head for heat, comprise the following steps:
(a) provide a light source strip with surface coating;
(b) form some blind holes by etching on the precalculated position of described light source strip, described blind hole has at the top that hollows out on described surface coating and the bottom that hollows out on described light source strip, and described blind hole has the first breadth extreme at its top; And
(c) utilize a cutting machine along two adjacent described light source strips of blind hole cutting;
Wherein, described cutting machine has cutting parts, and described cutting part has the second breadth extreme, and described the second breadth extreme is less than the first breadth extreme of described blind hole, thereby the lateral edges that need not to contact described blind hole downcuts independently light source chip.
The invention provides a kind of light source chip that promotes magnetic head for heat, comprise top and the bottom that is connected with described top; Wherein, described top has to support the top surface of a surface coating, and described bottom has to connect the lower surface that heat promotes the substrate pedestal of magnetic head; Wherein, the width of described top and described surface coating is less than the width of described bottom.
The invention provides the manufacture method that a kind of heat promotes magnetic head, comprising: a magnetic head with air bearing face and opposite face relative with described air bearing face is provided; And connecting a light source module on the opposite face of described magnetic head, described light source module comprises a substrate pedestal and a light source chip that is connected on described substrate pedestal.
Wherein, forming described light source chip comprises the following steps:
(a) provide a light source strip with surface coating;
(b) form some blind holes by etching on the precalculated position of described light source strip, described blind hole has at the top that hollows out on described surface coating and the bottom that hollows out on described light source strip, and described blind hole has the first breadth extreme on its top; And
(c) utilize a cutting machine along two adjacent described light source strips of blind hole cutting;
Wherein, described cutting machine has cutting parts, and described cutting part has the second breadth extreme, and described the second breadth extreme is less than the first breadth extreme of described blind hole, thereby the lateral edges that need not to contact described blind hole downcuts independently light source chip.
Heat of the present invention promotes that magnetic head comprises: a magnetic head, described magnetic head have air bearing face and the opposite face relative with described air bearing face; And a light source module, described light source module is formed on the opposite face of described magnetic head, and described light source module comprises a substrate pedestal and is connected in a light source chip on described substrate pedestal.
Wherein, described light source chip comprises top and the bottom that is connected with described top; Described top has to support the top surface of a surface coating, and described bottom has to connect the lower surface that heat promotes the substrate pedestal of magnetic head; Wherein, the width of described top and described surface coating is less than the width of described bottom.
Compared with prior art, light source chip manufacture method of the present invention utilizes engraving method to form in advance some blind holes on light source strip, then utilizes cutting part to cut on two adjacent blind holes.The second breadth extreme that has due to this cutting part is less than the first breadth extreme of blind hole, therefore when the cutting light source chip, cutting part can not contact the lateral edges of blind hole, namely, lateral edges that can the surface in contact plated film, therefore, light source chip has level and smooth surface, and the surface can not produce slight crack.Again and, surface coating is also incrust.In particular, the light source chip that this manufacture method makes cleans or scrubs, presses or shift as high temperature in follow-up manufacturing procedure, still can keep high-performance.Therefore the performance of light source chip improves greatly, and then heat promotes the performance of magnetic head also to improve.
By following description also by reference to the accompanying drawings, it is more clear that the present invention will become, and these accompanying drawings are used for explaining embodiments of the invention.
Description of drawings
Fig. 1 a is the partial perspective view of traditional disc drive unit.
Fig. 1 b is the partial top view of traditional HGA.
Fig. 1 c is the process flow diagram that traditional heat promotes the manufacture method of magnetic head.
Fig. 2 is a stereographic map of disc drive unit of the present invention.
Fig. 3 is the top view of the HGA of disc drive unit shown in Figure 2.
Fig. 4 is the stereographic map that heat of the present invention promotes an embodiment of magnetic head.
Fig. 5 a is the stereographic map of an embodiment of the heat of the present invention light source chip that promotes magnetic head.
Fig. 5 b is the cut-open view of the light source chip shown in Fig. 5 a.
Fig. 5 c is the cut-open view of another embodiment of light source chip of the present invention.
Fig. 6 is the process flow diagram of the first embodiment of the manufacture method of light source chip of the present invention.
Fig. 7 a is the process flow diagram of the second embodiment of the manufacture method of light source chip of the present invention.
Fig. 7 b is a plurality of cut-open views according to the light source chip of the manufacturing step of Fig. 7 a.
Fig. 8 is a plurality of cut-open views of manufacturing step of another embodiment of light source chip of the present invention.
Embodiment
Set forth below with reference to the accompanying drawings the several different most preferred embodiments of the present invention, wherein in different figure, identical label represents identical parts.As mentioned above, essence of the present invention is that a kind of heat promotes the manufacture method of magnetic head and light source chip, obtain having heat promotion magnetic head and the improved light source chip of improved light source module by the method, light source chip wherein has the light source edge, the surface is flawless, and surface coating formed thereon is incrust, thereby improves the performance of light source chip and heat promotion magnetic head.
Fig. 2 is the stereographic map of an embodiment of disc drive unit of the present invention.This disc drive unit 300 comprises HGA 200, the actuating arm 304 that is connected with HGA 200, and a series of spinning disks 301, and the Spindle Motor 302 in order to drive disk 301, said elements all is installed in a housing 309.As shown in Figure 3, this HGA 200 comprises cantilever part 290 and is carried on the heat of one on this cantilever part 290 promotion magnetic head 230.This cantilever part 290 comprises load beam 216, substrate 218, hinge element 217 and the flexible element 215 that is assembled together.Particularly, this heat promotes magnetic head 230 to be supported by flexible element 215.
As shown in Figure 4, this heat promotes magnetic head 230 to comprise magnetic head 203 and is arranged at light source module 220 on magnetic head 203, promotes magnetic recording in order to heat energy.This heat promotes magnetic head 230 to comprise substrate pedestal 221 and the light source chip 222 that is installed on this substrate pedestal 221.In this embodiment, this light source module 220 is laser diode module, and light source chip 222 is laser diode chip.
Particularly, refer again to Fig. 4, this magnetic head 203 comprises front 204, trailing edge 205, and be formed between the two magnetic head body (scheming not label).This trailing edge 205 is provided with a plurality of connecting terminals 207, as 8, to be connected with the cantilever part 209 of HGA 200.And plant the pole tip (not shown) with read-write elements (not shown) in the embedding of the center of trailing edge 205, in order to realize read-write operation.This magnetic head body has towards the surface of disk (not shown), is referred to as " air bearing face (air bearing surface, ABS) " 241, and the opposite face 242 relative with this ABS 241.Specifically, this substrate pedestal 221 and light source chip 222 are arranged on this opposite face 242.Preferably, this substrate pedestal 221 and light source chip 222 are arranged on the trailing edge position of opposite face 242, thereby are convenient to be electrically connected to the magnetic head body.
Fig. 5 a is the stereographic map of an embodiment of light source chip 222 of the present invention.Fig. 5 b is the cut-open view of light source chip 222.As shown in Fig. 5 a, 5b, this light source chip 222 comprises top 251 and the bottom 252 of connection.Particularly, this top 251 has to support the top surface 2511 of a surface coating 253, and this bottom 252 has to connect the basal surface 2521 of substrate pedestal 221.As a preferred embodiment, this surface coating 253 is anti-reflective film.
As design of the present invention, the width on this top 251 is not more than the width of bottom 252.In the present embodiment, the xsect on top 251 is trapezoidal shape, and the rectangular shape of the xsect of bottom 252.Specifically, top 251 comprises rectangular portion and trapezoidal section.Alternatively, the xsect on this top 251 can be designed to rectangle, and the xsect of bottom 252 can be designed to rectangle equally, as shown in Fig. 5 c.
Preferably, this light source chip 222 also comprises the protection plated film 254 of the side surface that is coated on surface coating 253 and top 251, among the space between the top surface 2511 that prevents chemical material infiltration surface coating 253 and top 251.Preferably, this protection plated film 254 is diamond-film-like, but is not limited to this, and other suitable plated films also can.
Based on the structure of above-mentioned light source chip 222, surface coating 253 difficult drop-offs, and also the lateral edges on surface coating 253 and top 251 is level and smooth.Therefore, the performance of light source chip 222 improves, and then the heat with this light source chip promotes the performance of magnetic head 230 also to be improved.
Below the manufacture method of light source chip 222 is elaborated.In the present embodiment, this light source chip 222 is laser diode chip.
Fig. 6 is the process flow diagram of an embodiment of the manufacture method of light source chip 222 of the present invention, and it comprises the following steps at least:
Step (601) provides the light source strip 261 with surface coating 253;
Step (602) forms some blind holes 262 by etching on the precalculated position of light source strip 261, this blind hole 262 has the first breadth extreme at its top; And
Step (603) utilizes cutting machine to cut along adjacent 262 pairs of light source strips 261 of two blind holes, and this cutting machine has cutting part, and this cutting part has the second breadth extreme less than the first breadth extreme.
Particularly, this cutting machine comprises chalker, and this cutting part can be cutting knife or laser beam.
Fig. 7 a has showed a preferred embodiment of light source chip 222 manufacture methods, and its step comprises:
Step (701) provides the light source strip 261 with surface coating 253;
Step (702) is bonded in light source strip 261 on the carrier 271 with dry film 272;
Step (703) is coated resist layer 273 on the surface coating 253 of light source strip 261;
Step (704), exposing on resist layer 273 and developing forms a hole 274;
Step (705) is along hole 274 milling surface coatings 253 and light source strip 261, to form blind hole 275; Particularly, define the first breadth extreme W1 of this blind hole 275;
Step (706) removes carrier 271 from light source strip 261; And
Step (707) utilizes cutting machine to cut along adjacent 275 pairs of light source strips 261 of two blind holes, and this cutting machine has cutting knife 276, and the second breadth extreme W2 of this cutting knife 276 is less than the first breadth extreme W1 of blind hole 275.
Correspondingly, Fig. 7 b has showed the cut-open view of Fig. 7 a in the process of making light source chip 222.
In conjunction with Fig. 7 a and Fig. 7 b, dry film 272 use in step (702) are so that carrier 271 is easy to unsticking.Specifically, in step (704), this resist layer 273 is wet resist layer.Preferably, in execution in step (704) before, under the condition of 90 ℃, resist layer 273 is cured as good.In the present embodiment, this engraving method adopts dry etching, as reactive ion etching method.Preferably, the method also is included in step (705) afterwards, and step (706) plates protection plated film 254 before on the surface of resist layer 273, and this protection plated film 254 covers the edge of blind hole 275.
The xsect of the blind hole 275 that the hole 274 that forms in step (704) in the present embodiment, and step (705) form is all rectangular.The scope of the first breadth extreme W1 of blind hole 275 is 30 μ m～500 μ m, is for example 65 μ m at the present embodiment; The depth range that blind hole 275 extends to light source strip 271 is 0.1 μ m～30 μ m, as 2 μ m.And the second breadth extreme W2 of cutting knife 276 or laser beam is less than the first breadth extreme W1 of blind hole 275, and its scope is 10 μ m～480 μ m, for example 45 μ m.
Certainly, also have some manufacturing procedures after the cutting action of light source chip 222, such as matting, press operation etc., the descriptions thereof are omitted at this.
As another embodiment, Fig. 8 has showed the manufacture process of light source chip 222, slightly different shown in some aspect and Fig. 7 b.Wherein, Fig. 8 has omitted carrier.
Particularly, the xsect of the blind hole 275 ' of the present embodiment into a cone shape, it comprises wider top (scheming not label) and narrower bottom (figure indicates).Specifically, this top forms on surface coating 253, and the bottom extends on light source strip 261.Particularly, the width of the bottom of this blind hole 275 ' is less than the first breadth extreme W1.
Similar to the first embodiment, the second breadth extreme W2 of this cutting knife 276 is less than the first breadth extreme W1 of blind hole 275 ', makes in the process of cutting, and cutting knife 276 can not contact the lateral edges of blind hole 275 ', lateral edges that namely can surface in contact plated film 253.Therefore, this light source chip 222 has level and smooth edge, and the surface can not produce slight crack, then and, due to cutting knife 276 can surface in contact plated film 253 the edge, so this surface coating 253 can not break away from easily.Especially, the light source chip 222 that this manufacture method makes cleans or scrubs, presses or shift as high temperature in follow-up manufacturing procedure, still can keep high-performance.
Therefore, the light source chip performance of gained is improved.Based on this manufacture method, form the heat with this light source chip and promote that magnetic head is further comprising the steps of: (1) provides the magnetic head with ABS and opposite face relative with ABS; (2) will be connected to by the light source chip that said method makes on a substrate pedestal, to form light source module; (3) this light source module is connected on the opposite face of magnetic head.
Compared with prior art, light source chip manufacture method of the present invention utilizes engraving method to form in advance some blind holes on light source strip, then utilizes cutting knife or laser beam to cut on two adjacent blind holes.The the second breadth extreme W2 that has due to this cutting knife or laser beam is less than the first breadth extreme W1 of blind hole, therefore when the cutting light source chip, cutting part can not contact the lateral edges of blind hole, namely, lateral edges that can the surface in contact plated film, therefore, light source chip has level and smooth surface, and the surface can not produce slight crack.Again and, surface coating is also incrust.In particular, the light source chip that this manufacture method makes cleans or scrubs, presses or shift as high temperature in follow-up manufacturing procedure, still can keep high-performance.Therefore, the performance of light source chip improves greatly, and then heat promotes the performance of magnetic head also to improve.
Above disclosed is only preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the present patent application the scope of the claims still belongs to the scope that the present invention is contained.
Claims (42)
1. one kind is used for the manufacture method that heat promotes the light source chip of magnetic head, comprises the following steps:
(a) provide a light source strip with surface coating;
(b) form some blind holes by etching on the precalculated position of described light source strip, described blind hole has at the top that hollows out on described surface coating and the bottom that hollows out on described light source strip, and described blind hole has the first breadth extreme at its top; And
(c) utilize a cutting machine along two adjacent described light source strips of blind hole cutting;
It is characterized in that: described cutting machine has cutting parts, and described cutting part has the second breadth extreme, and described the second breadth extreme is less than the first breadth extreme of described blind hole, thereby the lateral edges that need not to contact described blind hole downcuts independently light source chip.
2. manufacture method as claimed in claim 1, it is characterized in that: described cutting machine comprises chalker.
3. manufacture method as claimed in claim 1, it is characterized in that: described cutting part comprises cutting knife or laser beam.
4. manufacture method as claimed in claim 1, is characterized in that: coat a protection plated film on the lateral edges in described blind hole before in step (c).
5. manufacture method as claimed in claim 1, it is characterized in that: (b) is further comprising the steps for described step:
(b1) described light source strip being bonded in one has on the carrier of dry film;
(b2) coat a resist layer on the surface coating of described light source strip;
(b3) expose on described resist layer and develop formation one hole;
(b4) along the described surface coating of described hole milling and described light source strip, to form described blind hole; And
(b5) remove described carrier from described light source strip.
6. manufacture method as claimed in claim 5 is characterized in that: in step (b4) afterwards, step (b5) is coated a protection plated film before on the surface of described resist layer, and described protection plated film covers the lateral edges of described blind hole.
7. manufacture method as claimed in claim 5 is characterized in that: described resist layer is wet resist layer.
8. manufacture method as claimed in claim 7, is characterized in that: also be included in step (b3) and cure before described wet resist layer.
9. manufacture method as claimed in claim 1, is characterized in that: form described blind hole on described light source strip by being dry-etched in.
10. manufacture method as claimed in claim 9, is characterized in that: form described blind hole by reactive ion etching on described light source strip.
11. manufacture method as claimed in claim 1 is characterized in that: the scope of the first breadth extreme of described blind hole is 30 μ m～500 μ m.
12. manufacture method as claimed in claim 1 is characterized in that: the scope of the second breadth extreme of the described cutting part of described cutting machine is 10 μ m～480 μ m.
13. manufacture method as claimed in claim 1 is characterized in that: the scope of the etch depth of described blind hole on described light source strip is 0.1 μ m～30 μ m.
14. manufacture method as claimed in claim 1 is characterized in that: the xsect of described blind hole is rectangular.
15. manufacture method as claimed in claim 1 is characterized in that: the width of the bottom of described blind hole is less than described the first breadth extreme.
16. one kind is used for the light source chip that heat promotes magnetic head, comprises top and the bottom that is connected with described top; It is characterized in that: described top has to support the top surface of a surface coating, and described bottom has to connect the lower surface that heat promotes the substrate pedestal of magnetic head; Wherein, the width of described top and described surface coating is less than the width of described bottom.
17. light source chip as claimed in claim 16 is characterized in that: a protection plated film is formed on the lateral edges and described top of described surface coating.
18. light source chip as claimed in claim 16 is characterized in that: described surface coating is anti-reflective film.
19. light source chip as claimed in claim 17 is characterized in that: described protection plated film is diamond like carbon.
20. light source chip as claimed in claim 16 is characterized in that: the xsect of described top and described bottom is rectangular.
21. light source chip as claimed in claim 16 is characterized in that: the xsect on described top is trapezoidal, and the xsect of described bottom is rectangular.
22. a heat promotes the manufacture method of magnetic head, comprising:
One magnetic head with air bearing face and opposite face relative with described air bearing face is provided; And
Connect a light source module on the opposite face of described magnetic head, described light source module comprises a substrate pedestal and a light source chip that is connected on described substrate pedestal;
It is characterized in that: form described light source chip and comprise the following steps:
(a) provide a light source strip with surface coating;
(b) form some blind holes by etching on the precalculated position of described light source strip, described blind hole has at the top that hollows out on described surface coating and the bottom that hollows out on described light source strip, and described blind hole has the first breadth extreme on its top; And
(c) utilize a cutting machine along two adjacent described light source strips of blind hole cutting;
Wherein, described cutting machine has cutting parts, and described cutting part has the second breadth extreme, and described the second breadth extreme is less than the first breadth extreme of described blind hole, thereby the lateral edges that need not to contact described blind hole downcuts independently light source chip.
23. manufacture method as claimed in claim 22 is characterized in that: described cutting machine comprises chalker.
24. manufacture method as claimed in claim 22 is characterized in that: described cutting part comprises cutting knife or laser beam.
25. manufacture method as claimed in claim 22 is characterized in that: coat a protection plated film on the lateral edges in described blind hole before in step (c).
26. manufacture method as claimed in claim 22 is characterized in that: (b) is further comprising the steps for described step:
(b1) described light source strip being bonded in one has on the carrier of dry film;
(b2) coat a resist layer on the surface coating of described light source strip;
(b3) expose on described resist layer and develop formation one hole;
(b4) along the described surface coating of described hole milling and described light source strip, to form described blind hole; And
(b5) remove described carrier from described light source strip.
27. manufacture method as claimed in claim 26 is characterized in that: in step (b4) afterwards, step (b5) is coated a protection plated film before on the surface of described resist layer, and described protection plated film covers the lateral edges of described blind hole.
28. manufacture method as claimed in claim 26 is characterized in that: described resist layer is wet resist layer.
29. manufacture method as claimed in claim 28 is characterized in that: also be included in step (b3) and cure before described wet resist layer.
30. manufacture method as claimed in claim 22 is characterized in that: form described blind hole on described light source strip by being dry-etched in.
31. manufacture method as claimed in claim 30 is characterized in that: form described blind hole on described light source strip by reactive ion etching.
32. manufacture method as claimed in claim 22 is characterized in that: the scope of the first breadth extreme of described blind hole is 30 μ m～500 μ m.
33. manufacture method as claimed in claim 22 is characterized in that: the scope of the second breadth extreme of the described cutting part of described cutting machine is 10 μ m～480 μ m.
34. manufacture method as claimed in claim 22 is characterized in that: the scope of the etch depth of described blind hole on described light source strip is 0.1 μ m～30 μ m.
35. manufacture method as claimed in claim 22 is characterized in that: the xsect of described blind hole is rectangular.
36. manufacture method as claimed in claim 22 is characterized in that: the width of the bottom of described blind hole is less than described the first breadth extreme.
37. a heat promotes magnetic head, comprising:
One magnetic head, described magnetic head have air bearing face and the opposite face relative with described air bearing face; And
One light source module, described light source module are formed on the opposite face of described magnetic head, and described light source module comprises a substrate pedestal and a light source chip that is connected on described substrate pedestal;
It is characterized in that: described light source chip comprises top and the bottom that is connected with described top; Described top has to support the top surface of a surface coating, and described bottom has to connect the lower surface that heat promotes the substrate pedestal of magnetic head; Wherein, the width of described top and described surface coating is less than the width of described bottom.
38. heat as claimed in claim 37 promotes magnetic head, it is characterized in that: a protection plated film is formed on the lateral edges and described top of described surface coating.
39. heat as claimed in claim 37 promotes magnetic head, it is characterized in that: described surface coating is anti-reflective film.
40. heat as claimed in claim 39 promotes magnetic head, it is characterized in that: described protection plated film is diamond like carbon.
41. heat as claimed in claim 37 promotes magnetic head, it is characterized in that: the xsect of described top and described bottom is rectangular.
42. heat as claimed in claim 37 promotes magnetic head, it is characterized in that: the xsect on described top is trapezoidal, and the xsect of described bottom is rectangular.
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| CN2011103778463A CN103137140A (en) | 2011-11-24 | 2011-11-24 | Light source chip, thermal urging magnetic head and manufacture method of light source chip |
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| CN2011103778463A CN103137140A (en) | 2011-11-24 | 2011-11-24 | Light source chip, thermal urging magnetic head and manufacture method of light source chip |
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| CN1947240A (en) * | 2004-04-27 | 2007-04-11 | S.O.I.Tec绝缘体上硅技术公司 | Method for making chips and associated support |
| JP2008010027A (en) * | 2006-06-27 | 2008-01-17 | Tdk Corp | Light source unit for heat assisted magnetic recording |
| JP2008010026A (en) * | 2006-06-27 | 2008-01-17 | Tdk Corp | Light source unit for heat assisted magnetic recording and manufacturing method of thin film magnetic head incorporating the same |
| US20110122735A1 (en) * | 2009-11-25 | 2011-05-26 | Hitachi, Ltd. | Thermally assisted magnetic head-slider and head-gimbal assembly |
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