CN103135819A - Conductive substrate with oxidation resistant metal layer - Google Patents
Conductive substrate with oxidation resistant metal layer Download PDFInfo
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- CN103135819A CN103135819A CN201110386500XA CN201110386500A CN103135819A CN 103135819 A CN103135819 A CN 103135819A CN 201110386500X A CN201110386500X A CN 201110386500XA CN 201110386500 A CN201110386500 A CN 201110386500A CN 103135819 A CN103135819 A CN 103135819A
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Abstract
A conductive substrate with an oxidation resistant metal layer comprises base materials, a transparent conductive layer formed on at least one surface of the base materials, and the metal layer formed on the surface of the transparent conductive layer. Particularly, the metal layer comprises a first metal membrane, a second metal membrane and a third metal membrane, wherein the first metal membrane, the second metal membrane and the third metal membrane are sequentially formed from the surface of the base materials, the first metal membrane and the third metal membrane are made of alloy with copper contained, and the second metal membrane is made of copper materials. According to the conductive substrate with the oxidation resistant metal layer, the metal layer in a sandwich combined structure is used, adherence of the metal layer and the transparent conductive layer is improved through the first metal membrane, oxidation of the second metal membrane due to contact with air is reduced through the third metal membrane, and meanwhile, the oxidation problem of the copper is solved and the adherence of the metal layer and the transparent conductive layer is improved.
Description
Technical field
The present invention relates to a kind of electrically-conductive backing plate for contact panel, particularly relate to a kind ofly for contact panel, and have the electrically-conductive backing plate of anti-oxidant metal layer.
Background technology
Utilize the touch man-machine interface, contact panel for example, replace traditional keyboard or the input mode of mouse, not only can save traditional input media occupied space, also can promote the convenience that the consumer uses those electronic installations, therefore, the touch interface is used in various 3C electronic product widely in recent years.
The touch technology that is usually used at present contact panel has condenser type, resistance-type, optical profile type, infrared-type and ultrasonic formula, is wherein used at the touch-control Related product the most widely in the electric resistance touch-control mode.consult Fig. 1, Fig. 1 is general structure of resistance type touch panel, has first substrate 11, second substrate 12, laminating layer 13 between this first substrate 11 and 12 its applyings of chien shih of this second substrate, and a plurality of this first substrates 11 that are positioned at, spaced points 15 in the enclosure space 14 that this second substrate 12 and this laminating layer 13 define jointly, wherein, this first substrate 11 has the plate body 111 that is made of clear glass, be formed at the first transparency conducting layer 112 that this plate body 111 surfaces are made of tin indium oxide (ITO), be formed at the first control electrode 113 on this first transparency conducting layer 112 and be formed at insulation course 114 on this first control electrode 113, this second substrate 12 has the second transparency conducting layer 121 that is made of tin indium oxide (ITO), be formed at the second control electrode 122 on this second transparency conducting layer 121 and be formed at insulation course 123 on this second control electrode 122.When the user touches arbitrary position of this second transparency conducting layer 121 with finger, the second transparency conducting layer 121 of this position can conduct and produce potential difference (PD) at correspondence position with these first substrate 11 formation, can calculate the coordinate position at touch point place this moment by the potential difference meter of this first control electrode 113, the second control electrode 122 sensings, and can be at the touch point display pattern of correspondence.
The first control electrode 113 of aforementioned this contact panel, the second control electrode 122, no matter be the wiring mode that adopts four lines, five lines or six lines, be mostly utilize screen printing mode that conductive silver paste is printed directly on this first transparency conducting layer 112, the second transparency conducting layer 121 and get at present; Yet this first control electrode 113, the second control electrode 122 that get with the screen printing mode printing easily have homogeneity and the not good shortcoming of collimation because of the impact of web plate, and can't meet the contact panel requirement of high gauge; In addition, the silver slurry also has the not good problem of adherence with this first transparency conducting layer 112, the second transparency conducting layer 121.Form the shortcoming of this first control electrode 113, the second control electrode 122 in serigraphy silver slurry mode in order to improve previous example, there is at present the dealer to utilize semiconductor copper manufacture process to replace the serigraphy processing procedure, plate respectively layer of metal copper layer prior to this first transparency conducting layer 112, the second transparency conducting layer 121 surfaces, then more respectively this metal copper layer of etching make its formation have this first control electrode 113, second control electrode 122 of predetermined pattern.Because copper wiring is general semiconductor industry processing procedure commonly used, therefore, its precision can obtain good control, make this first control electrode 113 or the second control electrode 122 that make with copper wiring more meet the requirement of high standard contact panel, and more be applicable to make the first control electrode 113 or second control electrode 122 of narrow line-spacing specification.
Yet, although the control electrode that forms with copper wiring can improve the shortcoming of starching the formation control electrode with serigraphy silver, but but easily because having the shortcoming of easy oxidation, copper itself makes easily in use oxidation of control electrode with the control electrode that metallic copper consists of, and cause contact panel life-span and the not good problem of stability, and copper and transparency conducting layer also have the not good shortcoming of adherence.
Summary of the invention
The object of the present invention is to provide a kind ofly for contact panel, and have the electrically-conductive backing plate of anti-oxidant metal layer.
The present invention has the electrically-conductive backing plate of anti-oxidant metal layer, comprises: base material, be formed at least one surperficial transparency conducting layer of this base material and be formed at the metal level of this layer at transparent layer; Wherein this metal level has the first metal film, the second metal film and the 3rd metal film that sequentially forms from this layer at transparent layer, wherein this first metal film is made of the copper-bearing alloy material, this second metal film is made of copper product, and the 3rd metal film is made of the copper-bearing alloy material.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein this first metal film and the 3rd metal film are selected from respectively cupronickel.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein the nickel content of this cupronickel is between 5～25wt%.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein this metal layer thickness is between 50～250nm.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein the sheet resistance of this metal level is between 0.1～0.6 Ω/cm
2Between.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein this transparency conducting layer is formed at respectively this substrate two surfaces respect to one another, and this metal level correspondence is formed on this transparency conducting layer.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, and wherein this substrate consists of with insulating material such as glass, polyester, polyimide or triacetate fibers.
The present invention should have the electrically-conductive backing plate of anti-oxidant metal layer, wherein the constituent material of this transparency conducting layer be selected from SnO, ZnO, ITO, F TO, ZNO, AZO, GZO or aforementioned in a combination.
The effect of invention
Beneficial effect of the present invention is: utilize the metal level with sandwich composite structure, increase the adherence of this metal level and this transparency conducting layer by this first metal film, and utilize the 3rd metal film to reduce the problem of this second metal film and air catalytic oxidation, solve simultaneously the problem of oxidation of copper and promote the adherence of this metal level and this transparency conducting layer.
Description of drawings
Fig. 1 is the combination schematic diagram of a kind of ' electric resistance touch-control panel ' in the past structure;
Fig. 2 is the schematic diagram of the preferred embodiment of the electrically-conductive backing plate of the present invention with anti-oxidant metal layer.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples.
The preferred embodiment that the present invention has an electrically-conductive backing plate of anti-oxidant metal layer is to be used to form as shown in Figure 1 that this first substrate 11 with first control electrode 113 explains for example.
This electrically-conductive backing plate with anti-oxidant metal layer comprises base material 2, transparency conducting layer 3 and metal level 4.
This base material 2 has surface 21, can be selected from the transparent insulation materials such as glass, polyester (PET), polyimide (PI) and triacetate fiber (TAC) consists of, because the constituent material of this base material 2 is that the art personnel are in common knowledge, and non-is emphasis of the present invention, therefore, no longer add to give unnecessary details.
This transparency conducting layer 3 is formed at this surface 21, be selected from transparent conductive oxide (transparent conductive oxide, TCO) material, for example: the tin oxide (FTO) of the indium oxide of tin dope (ITO), fluorine doping, the zinc paste (AZO) of aluminium doping or zinc paste (GZO), tin oxide (SnO), the zinc paste (ZnO) of gallium doping, or the transparent conductive material of aforementioned wherein combination consists of.
This metal level 4 is formed at this transparency conducting layer 3 surfaces, have the first metal film 41, the second metal film 42 and the 3rd metal film 43 that sequentially form from this transparency conducting layer 3 surfaces, wherein this first metal film 41 is selected from copper-bearing alloy, this second metal film 42 is selected from copper, and the 3rd metal film 43 is selected from copper-bearing alloy.Preferably, this first metal film 41, the 3rd metal film 43 are selected from cupronickel, and more preferably, in order not affect the requirement of monolithic conductive, the nickel content of this cupronickel is between 5～25wt%.
Be noted that, this electrically-conductive backing plate can be more further via etch process, this metal level 4 is etched into as shown in Figure 1 the first control electrode 113, then form insulation course 114 on this first control electrode 113 after, can be in order to make this first substrate 11 as shown in Figure 1.The relevant process parameter that forms this insulation course 114 due to the etching of this metal level 4 and deposition is that the art personnel are known, therefore no longer adds explanation.
Utilize resulting this control electrode 113 after these 4 etchings of metal level with three-decker, not only can have the precision of general copper wiring, and can solve the shortcoming of the easy oxidation of control electrode that consists of with copper, and can promote reliability and the serviceable life of the follow-up touch control component that makes.
In addition, what will illustrate is again, when the thickness of this metal level 4 during less than 50nm, the control electrode that utilizes this metal level 4 to form has the problem that impedance is performed poor, the thickness of working as this metal level 4 can cause the increase of processing procedure time and cost greater than 250nm, therefore, and preferably, the thickness of this metal level 4 is between 50～250nm, and the sheet resistance of this metal level 4 is between 0.1～0.6 Ω/cm
2Between.
it is worth mentioning that, this transparency conducting layer 3 also can be formed at respectively two relative surfaces of this base material 2, 4 correspondences of this metal level are formed on this transparency conducting layer 3, form the two-sided electrically-conductive backing plate that all has this metal level 4, so can obtain the two-sided substrate that all has control electrode through after follow-up etch process, and can be applicable to general capacitance type touch-control panel, not only can save two OCA glue and needed pet substrates of another sheet ITO to pasting, and the aforementioned two-sided metal level of this transparency conducting layer 34 that is formed at can make with the mode of single exposure required control electrode, can also further reduce the thickness of contact panel and effectively reduce costs.
by above explanation as can be known, the present invention utilizes cupronickel to consist of this first metal film 41 for material, increase the adherence of 3 of this first metal film 41 and this transparency conducting layers, and utilize the obstruct of the 3rd metal film 43 that is consisted of by cupronickel, reduce this and can prevent this second metal film 42 oxidations by the second metal film 42 that copper consists of with the extraneous chance that contacts, not only can solve simultaneously the not good problem of known silver-colored slurry and fine copper and the intermembranous adherence of electrically conducting transparent, also can reduce the problem of oxidation of fine copper, and can effectively promote fiduciary level and the life-span of utilizing the made touch control component of this electrically-conductive backing plate, therefore really can reach purpose of the present invention.
Claims (9)
1. electrically-conductive backing plate with anti-oxidant metal layer comprises: base material, be formed at least one surperficial transparency conducting layer of this base material and be formed at the metal level of this layer at transparent layer; It is characterized in that, this metal level has the first metal film, the second metal film and the 3rd metal film that sequentially forms from this layer at transparent layer, wherein this first metal film is made of the copper-bearing alloy material, this second metal film is made of copper product, and the 3rd metal film is made of the copper-bearing alloy material.
2. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 1, is characterized in that, this first metal film and the 3rd metal film are selected from respectively cupronickel.
3. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 2, is characterized in that, the nickel content of this cupronickel is between 5～25wt%.
4. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 1, is characterized in that, this metal layer thickness is between 50～250nm.
5. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 1, is characterized in that, the sheet resistance of this metal level is between 0.1～0.6 Ω/cm
2Between.
6. the described electrically-conductive backing plate with anti-oxidant metal layer of according to claim 1 to 5 any one, is characterized in that, this transparency conducting layer is formed at respectively this substrate two surfaces respect to one another, and this metal level correspondence is formed on this transparency conducting layer.
7. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 1, is characterized in that, this substrate consists of with insulating material.
8. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 7, is characterized in that, this insulating material is selected from glass, polyester, polyimide or triacetate fiber.
9. the electrically-conductive backing plate with anti-oxidant metal layer according to claim 1, is characterized in that, the constituent material of this transparency conducting layer be selected from SnO, ZnO, ITO, FTO, ZNO, AZO, GZO or aforementioned in a combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386500XA CN103135819A (en) | 2011-11-29 | 2011-11-29 | Conductive substrate with oxidation resistant metal layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386500XA CN103135819A (en) | 2011-11-29 | 2011-11-29 | Conductive substrate with oxidation resistant metal layer |
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| CN103135819A true CN103135819A (en) | 2013-06-05 |
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| CN201110386500XA Pending CN103135819A (en) | 2011-11-29 | 2011-11-29 | Conductive substrate with oxidation resistant metal layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617897A (en) * | 2013-09-29 | 2014-03-05 | 魏玲 | Novel three-layer silver / copper bimetallic composite electric contact material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020098681A1 (en) * | 1999-07-27 | 2002-07-25 | Chao-Kun Hu | Reduced electromigration and stressed induced migration of Cu wires by surface coating |
| CN1921729A (en) * | 2005-08-24 | 2007-02-28 | 铼宝科技股份有限公司 | Electrode substrate of two-dimensional display |
| CN101032007A (en) * | 2004-09-27 | 2007-09-05 | 株式会社爱发科 | Method for forming copper wiring |
| CN101261560A (en) * | 2008-04-17 | 2008-09-10 | 张树峰 | Touch screen electrode preparation method |
-
2011
- 2011-11-29 CN CN201110386500XA patent/CN103135819A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020098681A1 (en) * | 1999-07-27 | 2002-07-25 | Chao-Kun Hu | Reduced electromigration and stressed induced migration of Cu wires by surface coating |
| CN101032007A (en) * | 2004-09-27 | 2007-09-05 | 株式会社爱发科 | Method for forming copper wiring |
| CN1921729A (en) * | 2005-08-24 | 2007-02-28 | 铼宝科技股份有限公司 | Electrode substrate of two-dimensional display |
| CN101261560A (en) * | 2008-04-17 | 2008-09-10 | 张树峰 | Touch screen electrode preparation method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617897A (en) * | 2013-09-29 | 2014-03-05 | 魏玲 | Novel three-layer silver / copper bimetallic composite electric contact material |
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Application publication date: 20130605 |