CN103135356B - Reflection-type photoetching projection objective - Google Patents

Reflection-type photoetching projection objective Download PDF

Info

Publication number
CN103135356B
CN103135356B CN201110374750.1A CN201110374750A CN103135356B CN 103135356 B CN103135356 B CN 103135356B CN 201110374750 A CN201110374750 A CN 201110374750A CN 103135356 B CN103135356 B CN 103135356B
Authority
CN
China
Prior art keywords
spherical reflector
projection objective
reflector
focal power
spherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110374750.1A
Other languages
Chinese (zh)
Other versions
CN103135356A (en
Inventor
张品祥
黄玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micro Electronics Equipment Co Ltd
Original Assignee
Shanghai Micro Electronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Co Ltd filed Critical Shanghai Micro Electronics Equipment Co Ltd
Priority to CN201110374750.1A priority Critical patent/CN103135356B/en
Publication of CN103135356A publication Critical patent/CN103135356A/en
Application granted granted Critical
Publication of CN103135356B publication Critical patent/CN103135356B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Lenses (AREA)

Abstract

The invention provides a reflection-type photoetching projection objective, which orderly comprises, in a light propagation direction: a first planar reflector, a first spherical reflector with a positive focal power, a second spherical reflector with a negative focal power, a third spherical reflector with a positive focal power, and a second planar reflector; the light propagation direction orderly passes through the first planar reflector, the first spherical reflector with a positive focal power, the second spherical reflector with a negative focal power, the third spherical reflector with a positive focal power, and the second planar reflector. The reflection-type photoetching projection objective of the invention has the following advantages: the exposure field of view is large, which is 500 mm in a non-scanning direction; multi-wavelength exposure is adopted, which increases the exposure illumination, and improves the yield of the photoetching machine; a 3-face reflector pure reflection structure is adopted, which provides the objective with extremely high transmittance, obtains excellent image quality with the proviso that the focal power of each reflector is reasonably distributed, and ensures important premises such as objective manufacture, cost, weight, and the like.

Description

Reflective type photomask projection objective
Technical field
The present invention relates to technical field of manufacturing semiconductors, particularly, relate to a kind of reflective type photomask projection objective being applied to optical semiconductor engraving device.
Background technology
Jap.P. JP4182304 discloses a kind of photoetching projection objective lens of visual field of exposing completely, and as shown in Figure 1, adopts the version of classical ofner catoptron correction up aberration eyeglass.For traditional offner structure, its shortcoming is obviously easily shown in, the curvature of field and astigmatism are all difficult to correct, if add heavy caliber lenses which correct aberration can obtain good effect, but all can go wrong in manufacture feasibility and cost.Employ the glass mirror of four diameters more than 600mm in this embodiment.According to the data that this patent provides, this lithographic objective also exists following shortcoming:
1. exposure field is smaller, and non-scan direction is about 444mm;
2., in order to ensure aberration, use monochromatic light exposure, exposure efficiency is on the low side;
3. in order to improve aberration, employing 2 to 4 pieces of bigbore glass material eyeglasses, object lens manufacture difficulty is strengthened, cost increases, and weight is heavier.
Summary of the invention
In order to overcome defect of the prior art, the present invention proposes a kind of reflective type photomask projection objective, comprise successively along light transmition direction: the first plane mirror, there is the first spherical reflector of positive light coke, there is the second spherical reflector of negative power, there is the 3rd spherical reflector of positive light coke, the second plane mirror; Light transmition direction, successively through the first plane mirror, has the first spherical reflector of positive light coke, has the second spherical reflector of negative power, there is the 3rd spherical reflector of positive light coke, second spherical reflector, the 3rd spherical reflector, the second plane mirror.
More preferably, also comprise a diaphragm, be arranged on described 3rd spherical reflector.
Wherein, the relative optical axis of described first, second, and third spherical reflector is arranged axisymmetricly.
Wherein, described optical axis is the optical axis of the first spherical reflector.
More preferably, focal power Ф 1, the Ф 2 of described first, second, and third spherical reflector, Ф 3 meet following condition:
2*Ф1+2*Ф2+2*Ф3<1*e-6
-0.8<Ф1/Ф2<-0.4
-1.7<Ф2/Ф3<-1.2。
Wherein, projection objective has the non-scan direction visual field of 500mm, g(435.83nm) h(404.65nm) i(365.01nm) the broadband exposure wavelength of three wavelength.The true field of described photoetching projection objective lens is circular arc.
Reflective type photomask projection objective of the present invention has the following advantages:
1. to expose completely visual field, non-scan direction 500mm;
2. use multi-wavelength exposure, add exposure illumination, improve the productive rate of litho machine;
3. adopt 3 pure reflective structures of catoptron, make object lens have high transmitance, under the prerequisite of each catoptron focal power of reasonable distribution, obtain excellent picture element, ensure that the important prerequisites such as the manufacture of object lens, cost, weight simultaneously.
Accompanying drawing explanation
Can be further understood by following detailed Description Of The Invention and institute's accompanying drawings about the advantages and spirit of the present invention.
Fig. 1 is prior art projection objective optical structure chart;
Fig. 2 is projection objective lens optical system structural drawing of the present invention;
Fig. 3 is shape and the size of projection objective exposure field of the present invention;
Fig. 4 is the wave aberration value of projection objective exposure field each point of the present invention.
Embodiment
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
As shown in Figure 2, after mask plane 1 accepts illumination, the light through mask incides spherical reflector 3 to projection objective lens optical system structure of the present invention after plane mirror 2 reflects, and plane mirror 2 makes the chief ray of each object point with 90 degree of reflections.Recessed spherical reflector 3 has positive light coke, makes light thereon to reflect away by partial convergence.The light reflected from spherical reflector 3 enters into spherical reflector 4, and spherical reflector 4 has negative power, makes the light reflected can incide spherical reflector 5 with the form of dispersing.The light of each object point, after above-mentioned optical component, spherical reflector 5 forms pupil plane.Spherical reflector 5 has positive light coke, is reflected away by the incident ray dispersed with convergence form.From the reflected light that spherical reflector 5 reflects, again enter into spherical reflector 4.The divergent rays that the spherical reflector 4 with negative power reflects, after spherical reflector 3 reflects, incide on plane mirror 6 with the form assembled, plane mirror 6 makes the chief ray of each object point be reflected in image planes 7 with 90 degree and forms picture point.
In fact, objective lens arrangement provided by the invention is coaxial catoptric lens structure, and removing plane mirror 2 and plane mirror 6, spherical reflector 3, spherical reflector 4, spherical reflector 5 are all about optical axis 8 Rotational Symmetry.If along mask plane light transmition direction trace to image planes, this objective lens arrangement form has about the symmetrical feature of pupil plane (spherical reflector 5), and this is just for object lens provide without advantages such as the little distortion of coma.
The photoetching projection objective lens of this thrihedral reflector structure that the present invention proposes, its key point solving existing issue is, introduce a slice catoptron more, make light reflection number of times more twice than traditional offner structure, make the focal power of optical system distribute in essence and there is multiple possibility, the each catoptron focal power of reasonable distribution, makes each catoptron focal power weaken, and is easy to correct the curvature of field and astigmatism.
The focal power of spherical reflector 3 is Ф 1, and the focal power of spherical reflector 4 is Ф 2, and the focal power of spherical reflector 3 is Ф 5, should meet following condition between them, could obtain reasonable picture element:
2*Ф1+2*Ф2+2*Ф3<1*e-6
-0.8<Ф1/Ф2<-0.4
-1.7<Ф2/Ф3<-1.2
The distance L1 of mask plane 1 apart from catoptron 2 and the distance L2 sum of catoptron distance spherical reflector 3, i.e. object distance L, the picture element of the more large more favourable object lens of its numerical value, but spherical reflector 3 bore can be made to increase simultaneously.
Object lens of the present invention adopt broadband exposure, by g(435.83nm) h(404.65nm) i(365.01nm) broadband of line combination all can quote the pattern of good picture element.Object-side numerical aperture NA is 0.08.
Object lens true field of the present invention is circular arc, and as shown in Figure 3, non-scan direction field of view length 500mm, sagittal heights 134mm, the wide 4mm of arc, imaging enlargement ratio is positive 1 times.
The structured data of the present embodiment is as following table:
surface radius thickness glass semi-aperture
object infinity 884.31387    
1 infinity 800 mirror 546.2946
2 -1696.77 -555.508 mirror 432.6765
3 -1126.94 574.47152 mirror 192.5238
STO -1676.11 -574.4715 mirror 138.4456
5 -1126.94 555.50805 mirror 192.5675
6 -1696.77 -800 mirror 432.737
7 infinity -884.3139 mirror 373.0039
image infinity      
Wave aberration RMS value of the present invention as shown in Figure 4, is 0.0477 λ to the maximum, and λ gets h line wavelength (404.65nm).
Just preferred embodiment of the present invention described in this instructions, above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.

Claims (7)

1. a reflective type photomask projection objective, it is characterized in that comprising successively along light transmition direction: the first plane mirror, there is the first spherical reflector of positive light coke, there is the second spherical reflector of negative power, there is the 3rd spherical reflector of positive light coke, the second plane mirror; Light transmition direction, successively through the first plane mirror, has the first spherical reflector of positive light coke, has the second spherical reflector of negative power, there is the 3rd spherical reflector of positive light coke, second spherical reflector, the first spherical reflector, the second plane mirror.
2. reflective type photomask projection objective as claimed in claim 1, characterized by further comprising a diaphragm, is arranged on described 3rd spherical reflector.
3. reflective type photomask projection objective as claimed in claim 1, is characterized in that the relative optical axis of described first, second, and third spherical reflector is arranged axisymmetricly.
4. reflective type photomask projection objective as claimed in claim 3, is characterized in that described optical axis is the optical axis of the first spherical reflector.
5. reflective type photomask projection objective as claimed in claim 1, is characterized in that the focal power Ф 1 of described first, second, and third spherical reflector, Ф 2, Ф 3 meet following condition:
2*Ф1+2*Ф2+2*Ф3<1*e -6
-0.8<Ф1/Ф2<-0.4
-1.7<Ф2/Ф3<-1.2。
6. reflective type photomask projection objective as claimed in claim 1, it is characterized in that, projection objective has the non-scan direction visual field of 500mm, the broadband exposure wavelength of g line, h line, i line three wavelength, and wherein g line refers to that 435.83nm, h line refers to that 404.65nm, i line refers to 365.01nm.
7. reflective type photomask projection objective as claimed in claim 1, is characterized in that the true field of described photoetching projection objective lens is circular arc.
CN201110374750.1A 2011-11-23 2011-11-23 Reflection-type photoetching projection objective Active CN103135356B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110374750.1A CN103135356B (en) 2011-11-23 2011-11-23 Reflection-type photoetching projection objective

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110374750.1A CN103135356B (en) 2011-11-23 2011-11-23 Reflection-type photoetching projection objective

Publications (2)

Publication Number Publication Date
CN103135356A CN103135356A (en) 2013-06-05
CN103135356B true CN103135356B (en) 2015-04-15

Family

ID=48495389

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110374750.1A Active CN103135356B (en) 2011-11-23 2011-11-23 Reflection-type photoetching projection objective

Country Status (1)

Country Link
CN (1) CN103135356B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6635904B2 (en) * 2016-10-14 2020-01-29 キヤノン株式会社 Projection optical system, exposure apparatus and article manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170284A (en) * 1991-08-16 1992-12-08 Hughes Aircraft Company Wide field of view focal three-mirror anastigmat
CN1851526A (en) * 2006-06-02 2006-10-25 上海微电子装备有限公司 Projection objective lens optical system
CN101523294A (en) * 2006-08-14 2009-09-02 卡尔蔡司Smt股份公司 Catadioptric projection objective with pupil mirror. projection exposure apparatus and method
CN101794016A (en) * 2010-01-27 2010-08-04 中国科学院上海技术物理研究所 Multi-aperture multi-view-field long-focus one-barrier total reflection optical system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4182304B2 (en) * 1998-05-18 2008-11-19 株式会社ニコン Scanning projection exposure apparatus and projection optical system suitable for the exposure apparatus
US7130020B2 (en) * 2003-04-30 2006-10-31 Whitney Theodore R Roll printer with decomposed raster scan and X-Y distortion correction
JP2008170519A (en) * 2007-01-09 2008-07-24 Olympus Corp Catoptric system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5170284A (en) * 1991-08-16 1992-12-08 Hughes Aircraft Company Wide field of view focal three-mirror anastigmat
CN1851526A (en) * 2006-06-02 2006-10-25 上海微电子装备有限公司 Projection objective lens optical system
CN101523294A (en) * 2006-08-14 2009-09-02 卡尔蔡司Smt股份公司 Catadioptric projection objective with pupil mirror. projection exposure apparatus and method
CN101794016A (en) * 2010-01-27 2010-08-04 中国科学院上海技术物理研究所 Multi-aperture multi-view-field long-focus one-barrier total reflection optical system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
空间相机共轴三反红外光学系统设计;袁涛 等;《光电技术应用》;20110430;第26卷(第2期);第21-26页 *

Also Published As

Publication number Publication date
CN103135356A (en) 2013-06-05

Similar Documents

Publication Publication Date Title
US8363315B2 (en) Catadioptric projection objective with mirror group
JP2013065051A (en) Projection objective with incident pupil having negative background focus, and projection exposure device
TW201232091A (en) Projection objective lens system and microlithography system using the same
CN104199173B (en) Single-rate symmetrical projection exposure objective lens
TWI314673B (en) Imaging system, in particular for a microlithographic projection exposure apparatus
CN102566294A (en) Photoetching lamp optical system
CN103901593B (en) A kind of from axle without blocking extreme ultra-violet lithography object lens
CN103293863B (en) A kind of lithography illuminating system
CN103135356B (en) Reflection-type photoetching projection objective
JP2004198748A (en) Optical integrator, illumination optical system, exposure device, and exposure method
CN104950427B (en) Large-view-field high-numerical-aperture global surface photoetching machine projection objective
CN103105666B (en) Exposure projection objective lens
WO2015149427A1 (en) Catadioptric photolithographic illumination relay lens group
CN102540419B (en) Large-view-field projection lithography objective lens
CN102401980B (en) Projection objective lens with large exposure viewing field
CN103278913B (en) Aspheric photoetching coupling objective lens
CN103105664B (en) Photoetching projection objective lens
CN102279460B (en) Optical projection system
JP2009276769A (en) Imaging optical instrument and projection exposing device with the same
CN101221280B (en) Full reflection projection optical system
CN102955234B (en) Refraction and reflection projection objective with large view field
CN102608737A (en) Extreme-ultraviolet-projection photoetching objective lens
CN102981255B (en) A kind of Large visual angle projection objective
TWI682249B (en) Projection objective optical system and lithography machine
CN104777720A (en) Projection optical system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525

Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd

Address before: 201203 Shanghai Zhangjiang High Tech Park of Pudong New Area Zhang Road No. 1525

Patentee before: Shanghai Micro Electronics Equipment Co., Ltd.

CP01 Change in the name or title of a patent holder