CN103131132A - Hot solidification type component used for filling printed circuit board punched hole - Google Patents
Hot solidification type component used for filling printed circuit board punched hole Download PDFInfo
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- CN103131132A CN103131132A CN2011104026327A CN201110402632A CN103131132A CN 103131132 A CN103131132 A CN 103131132A CN 2011104026327 A CN2011104026327 A CN 2011104026327A CN 201110402632 A CN201110402632 A CN 201110402632A CN 103131132 A CN103131132 A CN 103131132A
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Abstract
The invention relates to a hot solidification type component used for filling a printed circuit board punched hole. The hot solidification type component used for filling the printed circuit board punched hole comprises a reactivity component, curing agents, reaction type rubber and inorganic particles. The reactivity component comprises at least one monomer or one oligomer of an epoxy group. The reaction type rubber comprises at least one functional group which can react with the reactivity component or the curing agents. The invention further provides method of filling the printed circuit board punched hole. The method of filling the printed circuit board punched hole includes the following steps: full filling the hot solidification type component used for filling the printed circuit board punched hole into the punched hole, and heating and solidifying the heat solidification type component in the punched hole. The hot solidification type component possesses good associative property and is capable of avoiding a cracking phenomenon after being solidified.
Description
Technical field
The present invention relates to a kind of thermohardening type constituent, particularly relate to a kind of thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation, and a kind of method of filling up the perforation of printed circuit board (PCB).
Background technology
Along with the progress of science and technology, tellite laminated also increasing must fill hole after via holes of substrate and turning circuit in technique, in order to follow-up circuit layout.
The technology of existing filling perforation, for example Japanese Patent Laid-Open discloses a kind of heat reactive resin to the flattening method of printed circuit board (PCB) No. 2001-015909, is after the hole on substrate is filled up with heat reactive resin, then makes by grinding and have an even surface.But this technique can increase the step of processing and the cost of grinding, and easily causes the distortion of circuit size.
In order to solve the problem of above-mentioned processing, Japanese Patent Laid-Open discloses a kind of filling perforation method that does not need surface grinding for No. 2001-111214, first scolder photoresistance (solder resist) to be filled up the hole of printed circuit board (PCB), clamp this printed circuit board (PCB) with two resin layers again, and this photoresistance is solidified.But, for the high-density circuit substrate, this method work in-process easily generates pressure dome, and material is difficult to fully and substrate driving fit (namely and the associativity between substrate not good), and pressure dome easy defective of generation thermal expansion projection in follow-up heating process.
In view of the shortcoming of aforementioned photoresistance, Japanese patent laid-open proposes a kind of not solvent-laden thermohardening type constituent No. 11-269355.This constituent is take difunctionality basic ring epoxy resins as host, the glass tansition temperature of this based epoxy resin is lower, can't form three-dimensional structure after curing, cause that associativity between the base material of constituent after curing and printed circuit board (PCB) is relatively poor, hardness can't allow the perforation driving fit not.Be used in the material of multilayer printed circuit board, except need possess high glass tansition temperature, more need to possess low-expansion coefficient, to avoid that crack performance occurs when the high temperature thermal cycling.
In addition, 201004994 of TaiWan, China patent TW disclose a kind of Porefilling heat curing resin combination, comprise difunctionality basic ring epoxy resins, trifunctional basic ring epoxy resins, solidifying agent and mineral filler, crack performance can not occur when thermal cycling.But the open case of this patent uses at least three functional groups' epoxy resin cure speed fast, shrink grading is large, is difficult for processing.
From the above, be used for the heat-curing resin constituent of perforation of filling printed circuit board (PCB) after being heating and curing, still can't take into account fully and the base material of printed circuit board (PCB) between associativity, mechanical properties and avoid the process requirements such as be full of cracks, therefore, industry still wishes to continue to promote the character of heat-curing resin constituent at present, to satisfy above-mentioned every demand.
This shows, above-mentioned existing thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, completed by development but have no for a long time applicable design always, and common product does not have appropriate structure to address the above problem, this is obviously the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of novel thermohardening type constituent that is used for filling up the printed circuit board (PCB) perforation, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
Demand in view of the heat-curing resin constituent of aforementioned perforation for the filling printed circuit board (PCB), the inventor attempts adding in addition response type rubber in the combination of reactive component, solidifying agent and inorganic powder, can produce reaction with this reactivity component or this solidifying agent by this response type rubber, and allow thermohardening type constituent of the present invention be satisfied aforesaid every demand.
The object of the invention is to, a kind of associativity possessing after curing between good and substrate is provided, and can avoid the thermohardening type constituent that is used for filling up the printed circuit board (PCB) perforation of crack performance.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation that the present invention proposes, comprise: reactive component comprises the monomer or the oligomer that contain at least one epoxy group(ing); Solidifying agent; Response type rubber, contain at least one can with this reactivity component or the aitiogenic functional group of this solidifying agent; And inorganic powder.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Preferably, aforesaid thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation, wherein this response type rubber is the functional groupization paracril.
Preferably, aforesaid thermohardening type constituent be used to filling up printed circuit board (PCB) perforation, wherein this functional groupization paracril is to be selected from nbr carboxyl terminal, end amido paracril, the product that reacts with the product of diamine based compound and nbr carboxyl terminal reaction, with bis-epoxy based compound and end amido butyronitrile liquid rubber or their combination.
Preferably, aforesaid thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation, wherein this monomer or oligomer that contains at least one epoxy group(ing) is to be selected from bisphenol A diglycidyl ether, bisphenol A diglycidyl ether oligomer, butylene diepoxy, butylene diepoxy oligomer, Diethylene Glycol diglycidylether or Diethylene Glycol diglycidylether oligomer.
Preferably, aforesaid thermohardening type constituent be used to filling up printed circuit board (PCB) perforation, wherein this solidifying agent is that to be selected from amine be that solidifying agent, acid anhydrides are that solidifying agent, imidazoles are that solidifying agent, Dicyanodiamide are that solidifying agent, melamine series solidifying agent, phenol are that solidifying agent, diamine are solidifying agent or their combination.
Preferably, aforesaid thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation, wherein calculate take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100wt%, the content range of this reactivity component is that the content range of 40～90wt%, this response type rubber is 0.03～30wt%, and the content range of this solidifying agent is 0.5～40wt%.
Preferably, aforesaid thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation wherein should also comprise coupler for the thermohardening type constituent of filling up the printed circuit board (PCB) perforation.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of method of filling up the perforation of printed circuit board (PCB) according to the present invention proposes comprises following steps: perforation as described in being filled in as the described thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation of any one in claim 1 to 7; And the thermohardening type constituent for filling up the printed circuit board (PCB) perforation in described perforation is heating and curing.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, the present invention has following advantages and beneficial effect at least for the thermohardening type constituent of filling up the printed circuit board (PCB) perforation: thermohardening type constituent of the present invention is by the interpolation of response type rubber, when follow-up being heating and curing, after this response type rubber and this reactivity component or the reaction of this solidifying agent, can allow formed cured body possess good nature, more can significantly promote the associativity of this cured body and substrate, and cured body there is no obvious crack performance, and can obviously improve the processing yield.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, for can clearer understanding technique means of the present invention, and can be implemented according to the content of specification sheets, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is a microscope section side-looking photo, and the profile status of the cured body in the specimen of embodiment 4 is described;
Fig. 2 is a microscope cross sectional photograph, and the profile status of the cured body in the specimen of embodiment 5 is described; And
Fig. 3 is that a microscope is overlooked photo, and the foaming situation of the cured body in the specimen of comparative example 2 is described.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples:
The present invention comprises reactive component, solidifying agent, response type rubber and inorganic powder for the thermohardening type constituent of filling up the printed circuit board (PCB) perforation.This reactivity component comprises monomer or the oligomer that contains at least one epoxy group(ing).
This reactivity component is the main component of this thermohardening type constituent, and it comprises monomer or the oligomer that contains at least one epoxy group(ing).For promoting processibility, preferably, this reactivity component is in a liquid state under 21-26 ℃.This monomer or oligomer that contains at least one epoxy group(ing) can be but be not limited to bisphenol A diglycidyl ether (bisphenol A diglycidyl ether; Referred to as BADGE), bisphenol A diglycidyl ether oligomer, butylene diepoxy (butadiene dioxide is referred to as BD), butylene diepoxy oligomer, Diethylene Glycol diglycidylether (diethylene glycol diglycidyl ether; Referred to as DEGDE) or Diethylene Glycol diglycidylether oligomer.In concrete example of the present invention, this reactivity component comprises the bisphenol A diglycidyl ether oligomer.
This response type rubber contain at least one can with this reactivity component or the aitiogenic functional group of this solidifying agent.Preferably, this response type rubber is the functional groupization paracril.More preferably, this functional groupization paracril is to be selected from nbr carboxyl terminal, end amido paracril, the product that reacts with the product of diamine based compound and nbr carboxyl terminal reaction, with bis-epoxy based compound and end amido paracril or their combination.This diamine based compound can be but be not limited to 4,4 '-two amido dicyclohexyl methyl hydrides (4,4 '-diaminodicyclohexyl methane; Referred to as DACM), hexanediamine (hexamethylenediamine; Referred to as HMD) and two-p-amido cyclohexyl-methane (bis-p-aminocyclohexyl methane; Referred to as PACM).This bis-epoxy based compound can be but is not limited to bisphenol A diglycidyl ether, butylene diepoxy and Diethylene Glycol diglycidylether.
When thermohardening type constituent of the present invention was heating and curing, this response type rubber compound can react and formation filling perforation cured body with this reactivity component or this solidifying agent, and the character of regulating this cured body.
This solidifying agent can use any solidifying agent that can react with this reactivity component (monomer or the oligomer that namely contain at least one epoxy group(ing)) or this response type rubber.Preferably, this solidifying agent is that to be selected from amine be that solidifying agent, acid anhydrides are that solidifying agent, imidazoles (imidazole) are that solidifying agent, Dicyanodiamide (dicyandiamide) are that solidifying agent, trimeric cyanamide (melamine) are that solidifying agent, phenol are that solidifying agent, diamine (hydrazine) are solidifying agent or their combination.For promoting the keeping quality of thermohardening type constituent of the present invention under 21～26 ℃, being preferably the use latent curing agent, is that solidifying agent, Dicyanodiamide are that solidifying agent, organic acid two hydrazines (acid dihydrazide) are that solidifying agent, lewis' acid-amine wrong fount are solidifying agent etc. such as the amine with microcapsule coated.
Preferably, calculate take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100wt%, the content range of this reactivity component is that the content range of 40～90wt%, this response type rubber is 0.03～30wt%, and the content range of this solidifying agent is 0.5～40wt%; With the problem of avoiding disperseing inequality or effect unclear.More preferably, calculate take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100wt%, the content range of this reactivity component is that the content range of 44～90wt%, this response type rubber is 1.5～27wt%, and the content range of this solidifying agent is 5～35wt%.
In thermohardening type constituent of the present invention, this inorganic powder can reduce the thermal expansivity of this thermohardening type constituent, to avoid that crack performance occurs in curing process.Preferably, this inorganic powder can be calcium carbonate, magnesiumcarbonate, aluminum oxide, aluminium hydroxide, magnesium hydroxide, titanium oxide, mica, aluminium carbonate, silicon carbide, Magnesium Silicate q-agent, pure aluminium silicate, silica, glass short fiber, aluminum borate, metal-powder or their combination.What need specify in addition is: when this inorganic powder was metal-powder, because it is conductive material, addition must be controlled, and had electroconductibility to avoid this thermohardening type constituent formed cured body after curing.Preferably, take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100 listed as parts by weight, the content range of this inorganic powder is 10～80 weight parts.More preferably, the content range of inorganic powder is 20～60 weight parts.
For making thermohardening type constituent easy handling processing of the present invention, preferably, the median size of this inorganic powder is 0.1～40 μ m.Clustering phenomena between inorganic powder easily occurs during less than 0.1 μ m in the median size of this inorganic powder, is difficult to make this thermohardening type constituent evenly to mix, and causes producing defective after processing; The median size of this inorganic powder is during greater than 40 μ m, and this thermohardening type constituent deposited phenomenon easily occurs and is difficult for processing.
Preferably, thermohardening type constituent of the present invention also comprises coupler, in order to the associativity between this thermohardening type constituent of further reinforcement and circuit card.Preferably, this coupler is to be selected from silicon-dioxide or gamma-methyl allyl acyloxypropyl trimethoxysilane (γ-methacryloyloxypropyl trimethoxy silane).More preferably, take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100 listed as parts by weight, the content range of this coupler is 0.01～5 weight part.More preferably, the content range of this coupler is 1.5～3.5 weight parts.
Preferably, this thermohardening type constituent also comprises additive, and this additive can be plasticizer, defoamer, stopping composition, tinting material, incombustible agent or their combination.This additive is applicable to regulate the processibility of thermohardening type constituent of the present invention, for example: adjust the viscosity of thermohardening type constituent, the generation that reduces bubble in curing process, the density that reduces cured body, enhancement identification, promote difficult fuel efficiency fruit etc.
The present invention fills up the method for the perforation of printed circuit board (PCB), comprises following steps: thermohardening type constituent as above is filled in described perforation, and the thermohardening type constituent in described perforation is heating and curing.
Preferably, the thermohardening type constituent in described perforation is once to be heating and curing under 50～150 ℃; Perhaps can adopt zone heating, for example carry out fs Procuring prior to 50～80 ℃, then carry out the subordinate phase curing reaction under high temperature (80～150 ℃).More preferably, being heating and curing is to adopt zone heating, can reduce stress and bubble that this thermohardening type constituent produces in solidification process, and can avoid the crack performance that causes because reacting fierceness.
The present invention will be described further with regard to following examples, but will be appreciated that, described embodiment is only for illustrating use, and should not be interpreted as restriction of the invention process.
＜chemical source 〉
1. response type rubber: use commercially available nbr carboxyl terminal (carboxyl terminated butadiene acrylonitrile rubber; Referred to as CTBN) with the product of diamine compound reaction, shown in the following synthesis example of its preparation process.Above-mentioned diamine compound is to use commercially available 4,4 '-two amido dicyclohexyl methyl hydrides.
2. reactive component: use bisphenol A diglycidyl ether oligomer (available from the Changchun chemical industry, model is BE188).
3. solidifying agent: use poly-(oxygen ethene) diamines (poly (oxyethylene) diamine) (available from fair moral solidifying agent company, model is YT25) or poly cyanamid imidazoles (melamine imidazole).
4. coupler: silicon-dioxide or gamma-methyl allyl acyloxypropyl trimethoxysilane (available from silica gel company of SHIN-ETSU HANTOTAI, model is KBM-503).
5. inorganic powder: use calcium carbonate microparticle or magnesiumcarbonate particulate, median size is less than 100 microns.
＜synthesis example 〉
[building-up reactions type rubber]
The synthesis step of response type rubber is as follows:
(1) 10g nbr carboxyl terminal and 20g 4,4 '-two amido dicyclohexyl methyl hydrides are dissolved in 60mL dimethylbenzene, to obtain mixed solution.
(2) this mixed solution under agitation is heated to 110 ℃, reacted 3 hours, to obtain response type rubber.
(3) after this response type rubber is cooling, confirm carboxyl absorption peak (3300cm with fourier-transform infrared photothermal spectroscopic analyzer (FT-IR)
-1Near the broad absorption of O H) disappearance, and amido linkage (3300cm
-1Near the elongated peak absorbing of N H) generation.
＜embodiment 1 〉
After fully mediating response type rubber and the 11g calcium carbonate microparticle of poly-(oxygen ethene) diamines of 45g bisphenol A diglycidyl ether oligomer, 5g, 5g synthesis example evenly, with acquisition thermohardening type constituent a1.
＜embodiment 2 〉
After fully mediating response type rubber and the 23.2g calcium carbonate microparticle of poly-(oxygen ethene) diamines of 30g bisphenol A diglycidyl ether oligomer, 18g, 10g synthesis example evenly, with acquisition thermohardening type constituent a2
＜embodiment 3 〉
After fully mediating response type rubber, 1g gamma-methyl allyl acyloxypropyl trimethoxysilane and the 11g magnesiumcarbonate particulate of 48g bisphenol A diglycidyl ether oligomer, poly-(oxygen ethene) diamines of 5g, 1g synthesis example evenly, to obtain thermohardening type constituent a3.
＜embodiment 4 〉
After fully mediating response type rubber, 2g silicon-dioxide and the 21g calcium carbonate microparticle of 40g bisphenol A diglycidyl ether oligomer, poly-(oxygen ethene) diamines of 15g, 5g synthesis example evenly, to obtain thermohardening type constituent a4.
＜test 〉
To the perforation filling thermohardening type constituent a4 of printed circuit board (PCB), then heated 1 hour under 120 ℃, so that should solidify by the interior thermohardening type constituent of perforation, with acquisition specimen A4.Then, specimen A4 is cut, with the section situation of formed cured body after observing thermohardening type constituent a4 and solidifying and take pictures, its result as shown in Figure 1, element numbers A4 is cured body, element numbers A0 is printed circuit board (PCB).
＜result 〉
In Fig. 1, can find to have good associativity between the rear formed cured body of thermohardening type constituent a4 curing and printed circuit board (PCB), and produce foaming or be full of cracks situation.
＜embodiment 5 〉
After fully mediating response type rubber, 2g silicon-dioxide and the 36g calcium carbonate microparticle of 40g bisphenol A diglycidyl ether oligomer, poly-(oxygen ethene) diamines of 20g, 8g synthesis example evenly, to obtain thermohardening type constituent a5.
＜test 〉
To the perforation filling thermohardening type constituent a5 of Mulitilayer circuit board, then heated 1 hour under 120 ℃, so that should solidify by the interior thermohardening type constituent of perforation, with acquisition specimen A5.Then, with specimen A5 transverse cross sectional with the square section driving fit situation of formed cured body after observing thermohardening type constituent a5 and solidifying and take pictures, its result as shown in Figure 2, element numbers A5 is cured body.
＜result 〉
In Fig. 2, can find to have good associativity between the rear formed cured body of thermohardening type constituent a5 curing and Mulitilayer circuit board, and produce foaming, the situation of peeling off or chap.
＜embodiment 6 〉
After fully mediating response type rubber, 2g gamma-methyl allyl acyloxypropyl trimethoxysilane and the 24.5g calcium carbonate microparticle of 30g bisphenol A diglycidyl ether oligomer, poly-(oxygen ethene) diamines of 20g, 18g synthesis example evenly, to obtain thermohardening type constituent a6.
＜comparative example 1 〉
After fully mediating 50g bisphenol A diglycidyl ether oligomer, poly-(oxygen ethene) diamines of 20g and 24.5g calcium carbonate microparticle evenly, to obtain thermohardening type constituent b1.
＜comparative example 2 〉
After fully mediating 50g bisphenol A diglycidyl ether oligomer, 22g poly cyanamid imidazoles and 24.5g calcium carbonate microparticle evenly, to obtain thermohardening type constituent b2.
＜test 〉
Filling thermohardening type constituent b2 in the aluminium dish, heated 1 hour under 120 ℃ again, so that the curing of the thermohardening type constituent in this aluminium dish, to obtain specimen B2, then observe thermohardening type constituent b2 and solidify the situation of rear formed cured body and take pictures, its result as shown in Figure 3.
＜result 〉
In Fig. 3, can find that the thermohardening type constituent of comparative example 2 solidifies a large amount of foaming of rear formed cured body generation situations.
＜efficacy test 〉
Respectively thermohardening type constituent a1～a6 and the b1～b2 of embodiment 1～6 and comparative example 1～2 are carried out following efficacy test:
＜crack performance test 〉
With the thermohardening type constituent a1～a6 of embodiment 1～6 and comparative example 1～2 and b1～b2 respectively filling in individual other aluminium dish, then heating under 120 ℃ so that the thermohardening type constituent in this aluminium dish solidifies, then, 0 ℃ of lower quenching.After repeating 120 ℃ of heating and 0 ℃ of quenching circulation three times, after observing the thermohardening type constituent and solidifying, the crack performance of formed cured body is also estimated.
＜substrate is in conjunction with property testing 〉
Coat respectively thermohardening type constituent a1～a6 and the b1～b2 of embodiment 1～6 and comparative example 1～2 on Copper Foil, heated 1 hour under 120 ℃ again, so that the thermohardening type constituent on this Copper Foil solidifies, then observe the thermohardening type constituent and solidify the then situation of rear formed cured body and Copper Foil and estimate.
＜zone heating test 〉
In the perforation of Mulitilayer circuit board, heating is 30 minutes under 60 ℃ with the thermohardening type constituent a1 filling of embodiment 1, then heating 30 minutes under 120 ℃, the crack performance of formed cured article and be all " ◎ " with the character such as substrate associativity.
One-tenth with above-described embodiment 1～6 and comparative example 1～2 is grouped into respectively, ratio and evaluation result arrange as following table 1.
Table 1
"--" expression is not added.
" ◎ " expression is excellent; " zero " expression is good; " △ " expression is not good; " * " expression is poor.
*Take the gross weight of this reactivity component, this reaction promoter and this response type rubber as 100 listed as parts by weight.
By above-mentioned test, the thermohardening type constituent of provable embodiment 1～6 (cured body after being heating and curing of a1～a6), all occur without the situation that foams or chap in appearance, and the interpolation by response type rubber and coupler makes the associativity between solidify material and substrate that obvious lifting all be arranged.And the constituent of comparative example 1 (b1) there is no interpolation response type rubber, its cured body after being heating and curing, and the crack performance evaluation is not good, and is not good with the associativity of substrate.And the cured body after being heating and curing in comparative example 2, the crack performance evaluation is not good, and is poor with the associativity of substrate, and obvious Bubble formation is arranged in appearance.
In sum, compare without the thermohardening type constituent that adds response type rubber with general, thermohardening type constituent of the present invention is after being heating and curing, and the crack performance of cured body obviously reduces.Pass through this response type rubber and this reactivity component or the reaction of this solidifying agent by above-mentioned provable thermohardening type constituent of the present invention, can regulate the character of this cured body, and can significantly promote this thermohardening type constituent after thermofixation with the associativity of substrate, obviously improve the processing yield.
the above, it is only preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (8)
1. one kind is used for filling up the thermohardening type constituent that printed circuit board (PCB) is bored a hole, and it is characterized in that comprising:
Reactive component comprises the monomer or the oligomer that contain at least one epoxy group(ing);
Solidifying agent;
Response type rubber, contain at least one can with this reactivity component or the aitiogenic functional group of this solidifying agent; And
Inorganic powder.
2. the thermohardening type constituent be used to filling up printed circuit board (PCB) perforation according to claim 1, it is characterized in that: this response type rubber is the functional groupization paracril.
3. the thermohardening type constituent be used to filling up printed circuit board (PCB) perforation according to claim 2 is characterized in that: this functional groupization paracril is to be selected from nbr carboxyl terminal, end amido paracril, the product that reacts with the product of diamine based compound and nbr carboxyl terminal reaction, with bis-epoxy based compound and end amido butyronitrile liquid rubber or their combination.
4. the thermohardening type constituent be used to filling up printed circuit board (PCB) perforation according to claim 1, it is characterized in that: this monomer or oligomer that contains at least one epoxy group(ing) is to be selected from bisphenol A diglycidyl ether, bisphenol A diglycidyl ether oligomer, butylene diepoxy, butylene diepoxy oligomer, Diethylene Glycol diglycidylether or Diethylene Glycol diglycidylether oligomer.
5. the thermohardening type constituent be used to filling up printed circuit board (PCB) perforation according to claim 1 is characterized in that: this solidifying agent is that to be selected from amine be that solidifying agent, acid anhydrides are that solidifying agent, imidazoles are that solidifying agent, Dicyanodiamide are that solidifying agent, melamine series solidifying agent, phenol are that solidifying agent, diamine are solidifying agent or their combination.
6. the thermohardening type constituent be used to filling up printed circuit board (PCB) perforation according to claim 1, it is characterized in that: calculate take the gross weight of this reactivity component, this solidifying agent and this response type rubber as 100wt%, the content range of this reactivity component is that the content range of 40～90wt%, this response type rubber is 0.03～30wt%, and the content range of this solidifying agent is 0.5～40wt%.
7. the thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation according to claim 1, is characterized in that: should also comprise coupler for the thermohardening type constituent of filling up the printed circuit board (PCB) perforation.
8. method of filling up the perforation of printed circuit board (PCB) is characterized in that comprising following steps:
Perforation as described in will the thermohardening type constituent be used to filling up the printed circuit board (PCB) perforation as described in any one in claim 1 to 7 being filled in; And
The thermohardening type constituent of being filled up the printed circuit board (PCB) perforation being used in described perforation is heating and curing.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN105802129A (en) * | 2014-12-31 | 2016-07-27 | 太阳油墨（苏州）有限公司 | Hole-filling thermocuring resin composition for printed circuit board, cured substance and printed circuit board |
| CN110809370A (en) * | 2019-11-08 | 2020-02-18 | 深圳市文德丰科技有限公司 | Resin hole plugging process technology treatment |
Citations (3)
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Cited By (4)
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| CN103709605A (en) * | 2013-12-30 | 2014-04-09 | 景旺电子科技(龙川)有限公司 | Epoxy resin composition, preparation method thereof and plugging aluminum plate |
| CN105802129A (en) * | 2014-12-31 | 2016-07-27 | 太阳油墨（苏州）有限公司 | Hole-filling thermocuring resin composition for printed circuit board, cured substance and printed circuit board |
| CN105802129B (en) * | 2014-12-31 | 2019-05-03 | 太阳油墨（苏州）有限公司 | Porefilling heat curing resin composition, solidfied material and the printed circuit board of printed circuit board |
| CN110809370A (en) * | 2019-11-08 | 2020-02-18 | 深圳市文德丰科技有限公司 | Resin hole plugging process technology treatment |
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