CN103131009A - Method for preparing polyamide imide wire enamel - Google Patents
Method for preparing polyamide imide wire enamel Download PDFInfo
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- CN103131009A CN103131009A CN 201110401719 CN201110401719A CN103131009A CN 103131009 A CN103131009 A CN 103131009A CN 201110401719 CN201110401719 CN 201110401719 CN 201110401719 A CN201110401719 A CN 201110401719A CN 103131009 A CN103131009 A CN 103131009A
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- wire enamel
- polyamide imide
- solvent
- preparing
- acid
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- Organic Insulating Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
The invention discloses a method for preparing polyamide imide wire enamel. The method for preparing the polyamide imide wire enamel can be realized through reaction copolymerization at the temperature of 50-140 DEG C. The method for preparing the polyamide imide wire enamel is characterized in that polyamide imide wire enamel comprises, by weight, 13-40 parts of aromatic polycarboxylic acid or acid of the aromatic polycarboxylic acid, 0.3-3 parts of catalyzer, 20-60 parts of mixed solvent, and 2.5-5 parts of polymerization inhibitor. According to the method for preparing the polyamide imide wire enamel, stability is good, good adhesiveness is achieved for copper conductors and a basic coating layer of general-used polyester or polyester imidogen, due to the fact that the viscosity of the polyamide imide wire enamel prepared with the method is lower than that of polyamide imide wire enamel prepared with a method using N-methyl pyrrolidone as solvent, and wire coating is convenient. Compared with an enamelled wire prepared by wire enamel with the N-methyl pyrrolidone as the solvent, an enamelled wire prepared by wire enamel prepared with the method is high in cut-through temperature.
Description
Technical field
The present invention relates to prepare novel method and the technique of polyamide-imide resin, for the preparation of highly filled, the wire enamel of high cut through temperature.
Background technology
Polyamide-imide enamelled wire varnishes is a kind of high comprehensive performance high temperature-resistant wire lacquer, is one of principal item of high temperature-resistant wire lacquer more than 200 grades in the world.It has not only kept thermotolerance high, can be in the performance of 200 ℃ of lower life-time service, and have good mechanical property, resistance to chemical corrosion and cold-resistant matchmaker's property, and binding property, pliability with conductor have been improved significantly, wear resistance also increases simultaneously, and the mechanical property of paint film obtains balance preferably.The polyamide-imide enamelled wire varnishes that provides on market is all in the solution of N-Methyl pyrrolidone, filled by hydrocarbon in some cases, and N-Methyl pyrrolidone is expensive solvent, and corresponding relatively poor to the additive that uses.The preparation technology of present polyamide-imide resin, generally below 120 ℃, the reaction times is longer for its polymeric reaction temperature, causes its production cycle longer, and labour productivity is not high.
Summary of the invention
For above deficiency, the object of the present invention is to provide a kind of method for preparing polyamide-imide enamelled wire varnishes, guaranteeing that resinogen has under the prerequisite that performance do not descend, and shortens polymerization reaction time, to reduce corresponding energy consumption, labour wage, improve plant factor, unit output.Simultaneously, also study under the prerequisite that guarantees the wire enamel performance, use other solvents to replace or partly replace the N-Methyl pyrrolidone solvent, to reduce product cost.
The present invention solves the problems of the technologies described above the technical scheme that adopts: a kind of method for preparing polyamide-imide enamelled wire varnishes,, form through the reaction copolymerization between 50～140 ℃, it is characterized in that:
Polyamide-imide enamelled wire varnishes comprises following component:
Wherein: isocyanates is tolylene diisocyanate, 2,4-diphenylmethanediisocyanate and 4,4 '-one or more of diphenylmethanediisocyanate, hexamethylene diisocyanate, polymeric polyisocyanate; Catalyzer is one or more of formic acid, acetic acid, zinc acetate, titanic acid ester, pyridine etc.; Mixed solvent is two or more mixed solvent of N-Methyl pyrrolidone, ethylene glycol ether acetate, dimethyl formamide, dimethylbenzene, solvent oil, gamma-butyrolactone; Stopper is one or more of phenylcarbinol, methyl alcohol, ethanol, isopropylcarbinol, phosphoric acid.
Its preparation method: by above-mentioned with aromatic multi-carboxy acid or its anhydrides, isocyanates, catalyzer, partially mixed solvent adds in reactor, a little heat or naturally be warming up to 50 ℃, the insulation for some time after slowly the intensification, so repeatedly, until after temperature rises to 120 ℃, the assize fat viscosity of taking a sample every half an hour, until after reaching required viscosity, be stopped heating, add stopper, after residual solvent, filter discharging.
In the control of technique, by controlling the controlling reaction temperature speed of reaction, cause that to prevent that polymerization is too fast molecular weight distribution is inhomogeneous, or reacted slowly and extend the production time.
The present invention, the polyamide-imide enamelled wire varnishes of preparation, good stability has good binding property to the subcoat of copper conductor and normally used polyester or polyester-imide base, and viscosity.
Claims (2)
1. method for preparing polyamide-imide enamelled wire varnishes,, form through the reaction copolymerization between 50～140 ℃, it is characterized in that:
Polyamide-imide enamelled wire varnishes comprises following component:
Wherein: isocyanates is tolylene diisocyanate, 2,4-diphenylmethanediisocyanate and 4,4 '-one or more of diphenylmethanediisocyanate, hexamethylene diisocyanate, polymeric polyisocyanate; Catalyzer is one or more of formic acid, acetic acid, zinc acetate, titanic acid ester, pyridine etc.; Mixed solvent is two or more mixed solvent of N-Methyl pyrrolidone, ethylene glycol ether acetate, dimethyl formamide, dimethylbenzene, solvent oil, gamma-butyrolactone; Stopper is one or more of phenylcarbinol, methyl alcohol, ethanol, isopropylcarbinol, phosphoric acid.
2. preparation method according to claim 1: it is characterized in that: by above-mentioned with aromatic multi-carboxy acid or its anhydrides, isocyanates, catalyzer, partially mixed solvent adds in reactor, a little heat or naturally be warming up to 50 ℃, the insulation for some time after slowly the intensification, so repeatedly, until after temperature rises to 120 ℃, the assize fat viscosity of taking a sample every half an hour, until after reaching required viscosity, be stopped heating, add stopper, after residual solvent, filter discharging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110401719 CN103131009A (en) | 2011-12-05 | 2011-12-05 | Method for preparing polyamide imide wire enamel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110401719 CN103131009A (en) | 2011-12-05 | 2011-12-05 | Method for preparing polyamide imide wire enamel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103131009A true CN103131009A (en) | 2013-06-05 |
Family
ID=48491500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110401719 Pending CN103131009A (en) | 2011-12-05 | 2011-12-05 | Method for preparing polyamide imide wire enamel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103131009A (en) |
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2011
- 2011-12-05 CN CN 201110401719 patent/CN103131009A/en active Pending
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130605 |