CN103124912A - Optical shielding device for separating optical paths - Google Patents
Optical shielding device for separating optical paths Download PDFInfo
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- CN103124912A CN103124912A CN2011800482672A CN201180048267A CN103124912A CN 103124912 A CN103124912 A CN 103124912A CN 2011800482672 A CN2011800482672 A CN 2011800482672A CN 201180048267 A CN201180048267 A CN 201180048267A CN 103124912 A CN103124912 A CN 103124912A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/06—Restricting the angle of incident light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
- G01S7/4813—Housing arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
- G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
- G01S17/06—Systems determining position data of a target
- G01S17/08—Systems determining position data of a target for measuring distance only
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/497—Means for monitoring or calibrating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Condensed Matter Physics & Semiconductors (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Measurement Of Optical Distance (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
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Abstract
The invention relates to a sensor unit (33) for detecting reference and measurement radiation (7, 5) for a distance measurement device. The sensor unit (33) has a sensor element (3) and an optical shielding device (1). The sensor element (3) has a first detection region (35) for detecting measurement radiation (5) and a second detection region (37) for detecting reference radiation (7). The optical shielding device (1) is positioned in relation to the sensor element (33) and fastened and optically separates the first and second detection regions (35, 37) from each other. The optical shielding device (1) further comprises a first recess (16) and a second recess (15) which are permeable to optical radiation of a first wavelength range.
Description
Prior art
In optical measuring apparatus, implementing reference measure for actual measurement may be important usually.This reference measure can be used for the alignment purpose of this measuring equipment.
In order to implement reference measure, such as the reference highway section that can be arranged on device interior.By DE 10 2,005 037 253 A1 such as the known distance measuring equipment that has with reference to the highway section.
Reference measure can be before the measurement of reality, side by side implement afterwards or with it.When measuring at the same time, measuring radiation can arrive the receiver of reference radiation, and reference radiation can arrive the receiver of measuring radiation.This crosstalking significantly reduced measuring accuracy.The receiver of reference radiation and measuring radiation is arranged closelyer mutually, and this crosstalking may be stronger.
Summary of the invention
Thereby need a kind of sensor unit and a kind of distance measuring equipment, it has realized the good optical isolation of tight adjacent optical path.
This task can be resolved by of the present invention theme described according to independent claims.Favourable embodiment of the present invention is described in the dependent claims.
The below discusses in detail according to the feature of the device of embodiment of the present invention, details and possible advantage.
According to a first aspect of the invention, introduced the sensor unit that is used for surveying reference radiation and measuring radiation that distance measuring equipment is used.This sensor unit has sensor element and optics shielding device.This sensor element has for the first search coverage of surveying measuring radiation with for the second search coverage of surveying reference radiation.This optics shielding device is located and fixes with reference to this sensor element, and the first and second mutual optical fractionation of search coverage.This optics shielding device also has the first depression and the second depression in addition, and described depression is transparent for the optical radiation of the first wavelength coverage.
This sensor element can be used as chip or chip package is implemented at this.Chip package is such as having semi-conductor chip, and it has framework or ceramic structure.In addition, chip package can also have the chip at the glass plate place.The receiver of the first and second search coverages or reference radiation and measuring radiation is mutually near arranging.Such as it is integrated in common encapsulation, or monolithic be integrated in a kind of material, such as on semiconductor material.
This optics shielding device (1) has two depressions, and described depression is transparent for the optical radiation of this first wavelength coverage.By this depression, measuring radiation and reference radiation can arrive in sensor for this reason and the sensor surface at the search coverage place that arranges.This first depression can be provided for this measuring radiation, and this second depression is provided for this reference radiation.Depression can be opening.Replacedly, depression also can have wave filter, and this wave filter optionally allows definite wavelength or wavelength coverage see through.This first depression can so be arranged on this optics shielding device and with reference to this sensor element, makes such as vertically being mapped on this first search coverage by this first optical radiation of caving in.This second depression can also so be arranged in addition, makes such as vertically being mapped on this second search coverage by this second optical radiation of caving in.
The optical radiation of the first wavelength coverage is such as being visible light, infrared light or ultraviolet light.This first wavelength coverage is such as the scope that can be this measuring radiation.This first wavelength coverage can comprise all wavelength or around the pact ± 100nm of the wavelength of determining, perhaps replacedly just corresponding to a wavelength.The semiconductor laser that has the wavelength of 635nm or 650nm such as employing.
This optics shielding device is such as the cover that is made of plastics that can constitute above this sensor element.By depression or opening in this optics shielding device, measuring radiation and reference radiation can be mapped on corresponding search coverage.This optics shielding device can protect this sensor element with such as the light that prevents side direction incident.This optics shielding device is such as coming the mutual optical fractionation of search coverage by partition (Steg) or lip spare in addition.
This sensor element can be fixed on such as circuit board in other words on the carrier element of printed circuit board (PCB).Can be arranged in the optics shielding device of this sensor element top such as being fixed on this carrier element equally.This fixing such as being undertaken by bonding or locking.This optics shielding device is with reference to the position of this sensor element and be fixed on this carrier element.This optics shielding device may be embodied as alignment sensor element and location in addition.
In other words, idea of the present invention based on be to carry out optical fractionation on sensor element between reference radiation and measuring radiation.If reference radiation receiver and measuring radiation receiver are integrated on silicon, this makes and is necessary that carrying out position height with minimum as far as possible crosstalking on short spacing separates accurately, and this may be even more important so.
The receiver of reference radiation and measuring radiation or search coverage are integrated on sensor element, help to save production cost.In addition, although between reference radiation detector and measuring radiation detector little interval, due to this optics shielding device, still can guarantee optical fractionation, and can improve measuring accuracy.
Sensor unit of the present invention especially can be used in encapsulation technology, and described encapsulation technology has little tolerance between the outside of the restraint location of chip (also referred to as " nude film (Die) ") and encapsulation.
This optics shielding device is such as at the sensor element order of magnitude that can be in aspect its size such as 2.5x2.5mm.This optics shielding device is such as using in optical measuring apparatus, especially in interval measurement equipment.
According to one embodiment of present invention, this optics shielding device has the first surface of contact, and this surface of contact is constructed for causing the aligning of this optics shielding device in the plane on the surface that is parallel to this sensor element.This first surface of contact can be used as the side stop surface and implements for this reason.Although the aligning of this optics shielding device can be with such as the fabrication tolerance of other elements of circuit board irrespectively and the small size of single member and realize accurate location.
According to another embodiment, this optics shielding device has the second surface of contact, and this surface of contact is constructed for causing that this optics shielding device is perpendicular to the aligning in the plane on the surface of this sensor element.This second surface of contact can be the face parallel with sensor element surface.Such as this second surface of contact is implemented at the lip spare of this optics shielding device or partition place between this first and second search coverage.Additionally or replacedly, other the second surface of contact can be set in the edge of optics shielding device.This second surface of contact can be positioned on this sensor element.
According to another embodiment, this optics shielding device has hard component and soft-component, and its optical radiation for the first wavelength coverage is not penetrable.Be arranged in the side towards sensor of this optics shielding device at this this soft-component, and be embodied as deformable.
Hard component and soft-component are such as being made by the different materials with different hardness and different densities.Hard component is such as the framework that can be used as dimensionally stable consists of, and it has the geometric configuration with this sensor element complementation, and can aim at this sensor element.Hard component can also have the deformability less than soft-component such as being embodied as in addition.
Soft-component such as can be used as soft para-curve moulding, such as lip spare or the partition made by rubber or elastic-like material are implemented.Soft-component can be arranged between the first and second search coverages, and separates by this way the optical path of reference radiation and measuring radiation.
Soft-component deformable under the power effect makes under the confined state of optics shielding device and sensor element and can closely be applied to the optics shielding device on sensor element surface.For this reason soft-component such as can undeformed state in the plane vertical with sensor element at the second surface of contact that exceeds hard component on the direction of sensor element.
Hard component and soft-component can mean that for the not penetrability of the optical radiation of the first wavelength coverage it causes optical attenuator.Lower than 0.1% of incident radiation, especially lower than 0.01%, and be preferably lower than 0.001% such as the transmission by hard component and soft-component.
Hard component can have the first and second surface of contact.The second surface of contact can surround this optics shielding device, and is embodied as the plane parallel with sensor element surface.Replacedly or additionally, this second surface of contact can be implemented at the soft-component place.
Soft-component can be guaranteed: although shape and fabrication tolerance, the optics shielding device still is positioned on sensor element surface to form fit, and makes simultaneously the power input in sensor element keep being restricted to defined yardstick, perhaps can be minimized.Maximum, force input can be in the situation that consider that above-mentioned tolerance regulates by Shore (Shore) hardness of soft-component.Because the smoothness of glass surface is passed on soft-component, so the diffuse scattering of the light that is reflected by chip surface is minimized.Such as guarantee as hard profiled member bearing accuracy and mechanical stability and preferable shape ordinatedly the hard component of alignment sensor element also help in addition the optical fractionation of sensor element surface.
This configuration of optics shielding device is particularly advantageous, because such as the fabrication tolerance that is brought by soft-component can be compensated.In addition, by the optics shielding device by surface of contact direct alignment sensor element directly, realize the high position precision of optics shielding device.According to the system of routine, must consider much higher tolerance, because at first must consider the fabrication tolerance of optical carriers.Also must consider to be used in addition the bearing accuracy of fastening optical carriers, such as the boring on circuit board.Must consider in addition electric printed conductor in the bearing accuracy on circuit board and sensor element the bearing accuracy on printed conductor.Corresponding, only must consider in the present invention the fabrication tolerance of optics shielding device, because it directly is arranged on sensor element.
According to another embodiment of the present invention, soft-component and hard component have at the first systemic material of wavelength coverage.This absorbing material is such as being inferior light black-materials.Hard component and software part can have identical absorbing material or different absorbing materials.Hard component and/or soft-component can be comprised of absorbing material fully in addition.Replacedly, hard component and/or soft-component can have absorption surface coating, and this surface coating has reduced scattering and the reflection of measuring radiation and reference radiation.
This optics shielding device can also have coating in addition, and this coating is to such as shielding at high MHz or high frequency or low frequency electromagnetic radiation in low GHz scope.Such as this coating can have conductive material, such as conducting metal.Can prevent thus emc issue (EMV), it is such as being caused by the high frequency that occurs in chip.Additionally, can also be at optics shielding device place arranging shielding plate for this reason.
According to another embodiment, soft-component has the first geometry, and it is implemented for the scattered radiation of deflection from sensor surface.Replacedly or additionally, this hard component has the second geometry, it is implemented for the scattered radiation of deflection from sensor surface.The first geometry and the second geometry may be embodied as identical or different.Scattered radiation at this such as the radiation that can represent not to be vertically to fall on sensor surface.In addition, scattered radiation can be the reference radiation of falling for surveying on the set detector surface of measuring radiation.In addition, scattered radiation can be the measuring radiation of falling for surveying on the set detector surface of reference radiation.This geometry is such as being ligh trap (" beam dump(beam dump) ").The first geometry and the second geometry are so implemented, and make the least possible scattered light fall on the probe field of sensor element surface.Light can so be reflected in this geometry for this reason, makes it again leave this optics shielding device.
In addition can also be on the surface of sensor element, especially apply coating on glass plate, it is for reducing the optical crosstalk between the first and second search coverages in sensor element.This especially can realize in the following manner, and namely this coating has the refractive index with the surperficial same order of this sensor element, and perhaps this coating is implemented as antireflecting coating.Such as in the sensor surface situation of being made by glass, have refractive index n=1.4 to 1.6, especially the coating of n=1.5 is favourable.This coating can be embodied as absorbefacient in the first wavelength coverage.Replacedly, the material of soft-component or hard component can have and the similar refractive index in the surface of sensor element.The surface of sensor element can be by structuring, so that optical crosstalk minimizes in addition.
According to another embodiment of the present invention, this soft-component is embodied as one together with this hard component.Such as these two parts can be used as moulding, especially implement as two parts mouldings (2K mould) that may be made of plastics.Replacedly, soft-component and hard component can be comprised of two parts, and these two parts are such as quilt is pegged graft, bonding or interlock.
According to another embodiment of the present invention, this sensor unit also has carrier element in addition, and wherein sensor element is fixed on this carrier element.The place also is furnished with tightening member in addition at this optics shielding device, and this tightening member is constructed for so matching with this carrier element, makes between the surface of this sensor element and this optics shielding device and forms being connected of form fit.
This carrier element at this such as implementing as circuit board or printed circuit board (PCB), at described circuit board or printed circuit board (PCB) place such as arranging chip.This tightening member is implemented such as can be used as grab.Such as this tightening member can be embodied as one together with this hard component.This tightening member can be in carrier element place's acting in conjunction together with interface components.The acting in conjunction of this tightening member and interface components can cause, the soft-component of optics shielding device is pressed to sensor element surface.This tightening member is flexible such as may be embodied as for this reason.
According to another embodiment of the present invention, this optics shielding device has interface element, and this interface element is constructed for being connected with this optics shielding device aiming at element.This interface element is such as guide portion and/or the fastening part that can comprise for this aiming element.This aims at element equally can be for separating of measuring radiation and reference radiation.Certainly, especially due to this sensor element than large-spacing, this aiming element can have higher fabrication tolerance.This aiming element is fastened to this interface element place such as coordinating by bonding, grafting or form fit or power.
According to one embodiment of present invention, this sensor unit has dispensing device, such as laser diode, to send measuring radiation and reference radiation.This dispensing device directly is arranged on this sensor element.Also namely, this dispensing device makes measuring radiation can leave this sensor unit between this sensor element and this optics shielding device, and can turn back to by the depression in the optics shielding device this sensor unit.Reference radiation can be stretched in this sensor unit along the reference highway section, and is mapped to the second search coverage of sensor element such as not leaving this optics shielding device ground.
According to a second aspect of the invention, described the distance measuring equipment that is used for determining distance, wherein this distance measuring equipment has above-mentioned shield assembly.
Description of drawings
From the following description of reference accompanying drawing to illustrative embodiments, other features and advantages of the present invention are obvious for the professional, and wherein still described illustrative embodiments should not be construed as restriction the present invention.
Fig. 1 shows the sectional side view according to the sensor unit of the embodiment of the present invention,
Fig. 2 shows the sectional side view according to the optics shielding device of the embodiment of the present invention,
Fig. 3 shows the sectional side view of the sensor unit with additional soft-component,
Fig. 4 shows the sectional side view that has absorber coatings and absorb the optics shielding device of geometry,
Fig. 5 shows the adjustment at the sensor element place on the z direction of optics shielding device with sectional side view,
Fig. 6 shows the adjustment at this sensor element place in the x-y plane of optics shielding device with sectional side view,
Fig. 7 shows the vertical view at the optics shielding device at circuit board place,
Fig. 8 shows the sectional side view of the sensor unit with interface element,
Fig. 9 shows the optics shielding device with the sectional side view of sensor unit and fixes by the machinery of grab,
Figure 10 shows the optics shielding device with the sectional side view of sensor unit and fixes by bonding machinery,
Figure 11 shows the possible configuration of sensor element,
Figure 12 shows the sectional side view of the sensor unit with the dispensing device that is arranged in the circuit board place,
Figure 13 shows the sectional side view with the sensor unit that is arranged in the dispensing device between sensor element and optics shielding device.
Embodiment
All figure are only according to device of the present invention or its schematically showing according to the ingredient of the embodiment of the present invention.Especially interval and magnitude relationship are not proportionally reproduced in the drawings.Corresponding element is equipped with identical Reference numeral in different figure.
Schematically illustrated the sectional side view of sensor unit 33 in Fig. 1.This sensor unit 33 has sensor element 3 and optics shielding device 1.This sensor element 3 be such as can be the chip of arranging on the carrier element 41 such as circuit board 41, it has for the first search coverage 35 of measuring radiation 5 and is used for the second search coverage 37 of reference radiation 7.This sensor element 3 can also be the chip package with glass plate 43 in addition, and wherein this glass plate covers this chip and especially covers search coverage 35,37.This sensor element 3 can differently be fastened on this circuit board 41 as shown in Figure 11.As shown in Figure 11 a, this sensor element 3 can have glass plate 43, and by solder joint 45(ball grid array (ball grid array)) and be soldered to (glass top chip (Chip-on-Glass)) on this circuit board 41.Figure 11 b show with Figure 11 a similarly, without the enforcement (nude film (bare die mit ball grid array) with ball grid array) of glass plate 43.In Figure 11 c, this sensor element 3 directly is arranged on this circuit board 41.Figure 11 d and e show the illustrated replaceable vertical view in Figure 11 c.This sensor element 3 can be fastened on this circuit board 41 by joint line 53.As shown in Figure 11 d, this optics shielding device 1 can be with " nude film ", also be that uncanned semi-conductor chip is combined.This optics shielding device 1 is not only directly aimed at this sensor element 3 vertically but also laterally, and it is fastening to use circuit board 41 to be used for.The limit that is used for aiming at of hard component 9 has the recess for joint line 43 shown in Figure 11 d and e in case of necessity.
Particularly advantageous is following encapsulation technology, and it seals hermetically chip and carries out mechanical protection (such as in glass top chip is implemented), and has little tolerance simultaneously between outside and chip position, as shown in Figure 11 a.Be also chip or chip package at the tolerance chain that is used in the conventional chip package situation of optics shielding device 1 of the present invention by fabrication tolerance, the sensor element 3(of optics shielding device 1) tolerance and in this encapsulation the tolerance of chip positioning form, wherein said sensor element typically encapsulates corresponding to the mould that is comprised of pottery or the low plastic cement of cost.
This optics shielding device 1 is preferably combined with sensor element 3, and wherein this sensor element utilizes method for packing to make on wafer scale.Should be obviously little than at modeling method the time in the moulding tolerance of this sensor element 3, and roughly corresponding to the tolerance of described nude film.
As shown in FIG. 1, this optics shielding device 1 has soft-component 11 and the frame-type hard component 9 of implementing such as soft lip spare.This soft-component 11 is located immediately on sensor element surface 3.By soft flexible material, it is airtight and separate to be used for reference radiation and measuring radiation 7,5 zone optically.As shown in FIG. 2, this be such as can realize in the following way, namely undeformed soft-component on the Z direction, also namely perpendicular to the outstanding sensor element surface of the surperficial parallel plane earth of sensor element 3 on supporting plane.Soft-component is such as the rubber lip spare that can be used as the para-curve moulding is realized, even make described soft-component in the situation that distortion also forms defined surface of contact.By this configuration of soft-component, can avoid described soft-component such as the undefined position that folds and occupy when a side is exerted pressure on this sensor element surface.In addition, hard component has the first surface of contact 13, and this first surface of contact is implemented as side backstop, and is used for optics shielding device 1 at the horizontal aligning at this sensor element 3 places.In addition, optics shielding device 1 has the second surface of contact 14, and this second surface of contact is used for optics shielding device 1 at the aligning perpendicular to the plane on the surface of sensor element 3.The part that this second surface of contact 14 can be used as soft-component 11 realizes and/or wherein realizes hard component 9.This optics shielding device 1 has for the first depression 16 of measuring radiation 5 and caves in 15 for second of reference radiation 7.
As shown in FIG. 3, can also arrange additional soft-component 11 ' at this optics shielding device 1 place.As shown in Fig. 3 a, these additional soft-components be such as can be arranged between this circuit board 41 and hard component 9, and cause the optics airtight lock with this circuit board 41.Replacedly, as shown in Fig. 3 b, the additional soft-component 11 ' between this hard component 9 and this sensor element 3 be such as can be arranged on glass plate 43, and realizes optics shielding in the side of sensor element.If this sensor element 3 and dispensing device 39, also be that light source is arranged on this circuit board 41 abreast, this device especially can prevent optical crosstalk so.Additionally, the aligning of this optics shielding device 1 on the z direction can be supported or cause to this soft-component 11 '.
As shown in Fig. 4 a, this optics shielding device 1 can be not only towards the side of sensor element has absorbing material 17 at the soft-component place but also at the hard component place.Additionally or alternatively, this optics shielding device 1 can have the first geometry 19 of soft-component 11 and/or the second geometry 21 of hard component 9, it causes scattered light 25, is absorbed in ligh trap such as the light that is reflected by sensor element surface 3, perhaps again leaves this optics shielding device 1.
This hard component 9 can have hard rigidity profiled member, and it guarantees positional precision and the mechanical stability of this optics shielding device 1.This hard component 9 directly form fit ground on X and Y-direction, also namely aim at sensor element 3 places or at the chip package place in the plane parallel with sensor element surface.Be illustrated in aligning in the XY plane with reference symbol 47 in Fig. 6.As shown in Fig. 6 a, this first surface of contact 13 may be embodied as the straight guide portion of hard component 9 for this reason.Replacedly, as in Fig. 6 b, described guide portion may be embodied as cuts sth. askew.Additionally, as shown in Fig. 6 c, the second surface of contact 14 can be supported described aligning.
Figure 5 illustrates perpendicular to the aligning on the Z direction of sensor element surface.As in Fig. 5 a with as shown in reference symbol 47, can realize described aligning at this sensor element surface place by the second surface of contact 14 of soft-component 11.Replacedly, as shown in Fig. 5 b, can aim at 47 with these circuit board 41 form fit ground realizations on the Z direction, perhaps as in Fig. 5 c, aim in sensor element surface place's realization by the second surface of contact 14 of hard component.
Figure 7 illustrates the vertical view of this optics shielding device 1.The surface of hard component 9 has first depression the 16 and second depression 15, and it is arranged in each side for measuring radiation and reference radiation 5,7 optical fractionation.Depression 15,16 can be open, transparent sealing or implement in optical filter 23 as shown in Figure 8.Be used for to form hard component and soft- component 9,11 respective material especially can have high absorption coefficient in the wavelength coverage by 23 transmissions of optics incident wave filter.In addition as shown in FIG. 8, this optics shielding device 1 can be connected with aiming element 31, and this aims at element equally for separating of reference radiation and measuring radiation 7,5.Interface element 29 can be set at the upside of optics shielding device 1, it is such as implementing as adapter for this reason, this interface element allow the tolerance with the required bearing accuracy of the soft-component 11 on chip connect, such as bonding or peg graft.
The machinery that optics shielding device 1 has been shown in Fig. 9 and 10 is fixed.As shown in Figure 10, this hard component 9 is such as being fastened with this carrier element 41 and this sensor element 3 by adhesive portion 51.This bonding agent 51 can with Fig. 3 A in soft-component 11 ' be that optics is not penetrable similarly, and prevent in the same way the incident of scattered light.
Figure 9 illustrates fixing by tightening member 27, wherein said tightening member is implemented as grab.Described tightening member is because its spring action can realize: optics shielding device 1 can be positioned on sensor element 3 with the snap-in force of optimizing, thereby and causes the form fit of sensor element surface and soft-component 11.Power to sensor surface represents with reference symbol 49.Due to the typical material intensity of plastic member and the typical sizes of tightening member 27, wherein said tightening member is implemented such as can be used as grab, adhesive portion, hot pressing section and ultra-sonic welded section, so at the element place of carries chips, also can be namely suitable such as carrying out fastening or fixing at circuit board 41 places.Directly at the aligning at sensor element 3 places, the high moulding tolerance of circuit board 41 does not shift by shield assembly 1.
The sensor unit 33 that not only has adhesive portion 51 but also have tightening member 27 has been shown in Figure 12 and 13.In Figure 12, the dispensing device 39 of implementing as laser diode is arranged in sensor unit 33 sides on circuit board 41.In Figure 13, light source 39 is integrated in sensor unit 33.Measuring radiation 5 can be passed this second depression 15 and leave this sensor unit 33, and passes the first depression 16 and arrive the first search coverage 35 of this sensor element 3.Reference radiation 7 can be stretched along the reference highway section 55 of sensor unit inside, its mode be this reference radiation such as by hard component 9 towards the side of this sensor element such as the second search coverage 37 that is deflected this sensor element 3 by reflection on.
Explanation is should not get rid of such as statements such as " having " element or the step that other can be set at last.Should be noted also that in addition " one " or " one " do not get rid of a plurality of.In addition, can at random mutually make up in conjunction with the described feature of different embodiments.Explanation is that the scope that reference symbol in the claims should not be construed as claim is restrictive in addition.
Claims (12)
1. be used for the sensor unit (33) that is used for surveying reference radiation and measuring radiation (7,5) of distance measuring equipment, this sensor unit (33) has sensor element (3);
This sensor unit (33) is characterised in that, described sensor unit also has optics shielding device (1) in addition;
Wherein this sensor element (3) has for the first search coverage (35) of surveying measuring radiation (5) with for the second search coverage (37) of surveying reference radiation (7);
Wherein this optics shielding device (1) is the mutual optical fractionation of the first and second search coverages (35,37);
Wherein this optics shielding device (1) is located and fixes with reference to this sensor element;
Wherein this optics shielding device (1) has the first depression (16) and the second depression (15), and its optical radiation for the first wavelength coverage is transparent.
2. sensor unit according to claim 1 (33),
Wherein this optics shielding device (1) has the first surface of contact (13), and it is constructed for causing the aligning of this optics shielding device (1) in the plane on the surface that is parallel to sensor element (3).
3. one of according to claim 1 with 2 described sensor units (33),
Wherein this optics shielding device (1) has the second surface of contact (14), and it is constructed for causing that this optics shielding device (1) is perpendicular to the aligning in the plane on the surface of sensor element (3).
4. described sensor unit of one of according to claim 1 to 3 (33),
Wherein this optics shielding device (1) has hard component (9) and soft-component (11);
Wherein hard component and soft-component (9,11) are not penetrable for the optical radiation of this first wavelength coverage;
Wherein this soft-component (11) is arranged in the side towards sensor of this optics shielding device (1), and is embodied as deformable.
5. sensor unit according to claim 4 (33),
Wherein this soft-component (11) is exceeding second surface of contact (14) of hard component (9) on the direction of sensor element (3) in the plane vertical with sensor element (3) under undeformed state.
6. described sensor unit of one of according to claim 4 to 5 (33),
Wherein this soft-component (11) has at the systemic material of this first wavelength coverage;
Wherein this hard component (9) has at the systemic material of this first wavelength coverage.
7. described sensor unit of one of according to claim 4 to 6 (33),
Wherein this soft-component (11) has the first geometry (19), and this first geometry is implemented for the scattered radiation (25) of deflection from sensor surface;
Wherein this hard component (9) has the second geometry (21), and this second geometry is implemented for the scattered radiation (25) of deflection from this sensor surface.
8. described sensor unit of one of according to claim 4 to 7 (33),
Wherein this soft-component (11) is embodied as one together with this hard component (9).
9. described sensor unit of one of according to claim 1 to 8 (33), also have carrier element (41) in addition;
Wherein this sensor element (3) is fixed on this carrier element (41) and locates;
Wherein locate also to arrange in addition tightening member (27) at this optics shielding device (1);
Wherein this tightening member (27) is constructed for matching with this carrier element (41), makes between the surface of this sensor element (3) and this optics shielding device (1) and forms being connected of form fit.
10. described sensor unit of one of according to claim 1 to 9 (33), also have interface element (29) in addition;
Wherein this interface element (29) is constructed for being connected with this optics shielding device (1) aiming at element (31).
11. described sensor unit of one of according to claim 1 to 10 (33) also has dispensing device (39) in addition to send measuring radiation (5) and reference radiation (7);
Wherein this dispensing device (39) is arranged in this sensor unit (33).
12. be used for determining the distance measuring equipment of distance, this distance measuring equipment has
Described sensor unit of one of according to claim 1 to 11 (33).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010041937A DE102010041937A1 (en) | 2010-10-04 | 2010-10-04 | Optical shielding device for separating optical paths |
| DE102010041937.0 | 2010-10-04 | ||
| PCT/EP2011/063620 WO2012045503A1 (en) | 2010-10-04 | 2011-08-08 | Optical shielding device for separating optical paths |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103124912A true CN103124912A (en) | 2013-05-29 |
| CN103124912B CN103124912B (en) | 2016-09-14 |
Family
ID=44509317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180048267.2A Active CN103124912B (en) | 2010-10-04 | 2011-08-08 | For separating the optics shielding device of optical path |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9368529B2 (en) |
| EP (1) | EP2625545B1 (en) |
| CN (1) | CN103124912B (en) |
| DE (1) | DE102010041937A1 (en) |
| RU (1) | RU2594949C2 (en) |
| WO (1) | WO2012045503A1 (en) |
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| CN106551683A (en) * | 2015-09-25 | 2017-04-05 | 飞比特公司 | Optical physiological parameter measurement equipment with intermeshing optical barrier feature |
| CN106575660A (en) * | 2014-07-25 | 2017-04-19 | 赫普塔冈微光有限公司 | Optoelectronic modules including an image sensor having regions optically separated from one another |
| CN107250835A (en) * | 2014-12-18 | 2017-10-13 | 法雷奥开关和传感器有限责任公司 | Laser scanner, for the deflection mirror devices of laser scanner, and the optical fractionation device for deflection mirror devices |
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| CN108344984A (en) * | 2017-01-25 | 2018-07-31 | 迈来芯科技有限公司 | Light detection and range-measurement system |
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| CN109188450A (en) * | 2017-09-08 | 2019-01-11 | 北醒（北京）光子科技有限公司 | A kind of optical distance measurement apparatus |
| CN110090359A (en) * | 2018-01-31 | 2019-08-06 | 博朗有限公司 | Skin or hair treatment apparatus and its manufacturing method |
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| FR3073120A1 (en) * | 2017-11-02 | 2019-05-03 | Stmicroelectronics (Grenoble 2) Sas | ENCAPSULATION HOOD FOR ELECTRONIC HOUSING |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2625545B1 (en) | 2018-06-20 |
| US9368529B2 (en) | 2016-06-14 |
| US20130265590A1 (en) | 2013-10-10 |
| DE102010041937A1 (en) | 2012-04-05 |
| RU2013119820A (en) | 2014-11-20 |
| EP2625545A1 (en) | 2013-08-14 |
| CN103124912B (en) | 2016-09-14 |
| WO2012045503A1 (en) | 2012-04-12 |
| RU2594949C2 (en) | 2016-08-20 |
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