CN103121268A - LED (light emitting diode) die - Google Patents
LED (light emitting diode) die Download PDFInfo
- Publication number
- CN103121268A CN103121268A CN 201310076937 CN201310076937A CN103121268A CN 103121268 A CN103121268 A CN 103121268A CN 201310076937 CN201310076937 CN 201310076937 CN 201310076937 A CN201310076937 A CN 201310076937A CN 103121268 A CN103121268 A CN 103121268A
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- CN
- China
- Prior art keywords
- nozzle
- led
- runner plate
- sealing
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses an LED (light emitting diode) die. The LED die comprises a runner plate of a hot runner and a nozzle, wherein an annular seal groove is formed at the joint of the top surface of the nozzle and the runner plate, and an annular seal ring is sleeved in the seal groove. According to the LED die provided by the invention, the annular seal ring for sealing is arranged at the joint of the runner plate and the nozzle, so that the sealing performance of the hot runner can be improved, adhesive leakage caused by poor sealing can be prevented, cold charge and encapsulation are difficult to occur, and the adhesive cannot flow into the hot runner to avoid damaging the hot runner.
Description
Technical field
The present invention relates to mould, be specifically related to a kind of LED die.
Background technology
In LED die design, the runner plate of existing hot flow path is directly used sealant sealing with the nozzle junction, and sealing effectiveness is not good, easily produces cold burden, encapsulate and glue position and goes to hot flow path the inside, the phenomenon of damage hot flow path.
Summary of the invention
Technical problem to be solved by this invention is the not good problem of sealing effectiveness between the runner plate of LED die and nozzle.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is to provide a kind of LED die, the runner plate and the nozzle that comprise hot flow path, the junction with runner plate on the end face of described nozzle has annular seal groove, and described seal groove inner sleeve has the sealing ring of an annular.
LED die provided by the invention is modified to the O-ring seal sealing in the junction of runner plate and nozzle, the sealing property of hot flow path has improved like this, can not cause floor drain glue because of poor sealing, is not easy to produce cold burden, encapsulate, the glue position can not gone to inside hot flow path yet, damages hot flow path.
Description of drawings
Fig. 1 is the runner plate of LED die provided by the invention and the structural representation of nozzle.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is made detailed explanation.
As shown in Figure 1, LED die provided by the invention comprises the runner plate 1 and nozzle 2 of hot flow path, has the seal groove 3 of annular on the end face of nozzle 2 with the junction of runner plate 1, and seal groove 3 inner sleeves have the sealing ring 4 of an annular.
LED die provided by the invention is modified to O-ring seal 4 sealings in the junction of runner plate 1 and nozzle 2, the sealing property of hot flow path has improved like this, can not cause floor drain glue because of poor sealing, is not easy to produce cold burden, encapsulate, the glue position can not gone to inside hot flow path yet, damages hot flow path.
The present invention is not limited to above-mentioned preferred forms, and anyone should learn the structural change of making under enlightenment of the present invention, and every have identical or close technical scheme with the present invention, within all falling into protection scope of the present invention.
Claims (1)
1.LED mould comprises runner plate and the nozzle of hot flow path, has the seal groove of annular on the end face of described nozzle with the junction of runner plate, it is characterized in that, described seal groove inner sleeve has the sealing ring of an annular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310076937 CN103121268A (en) | 2013-03-11 | 2013-03-11 | LED (light emitting diode) die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310076937 CN103121268A (en) | 2013-03-11 | 2013-03-11 | LED (light emitting diode) die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103121268A true CN103121268A (en) | 2013-05-29 |
Family
ID=48452503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310076937 Pending CN103121268A (en) | 2013-03-11 | 2013-03-11 | LED (light emitting diode) die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103121268A (en) |
-
2013
- 2013-03-11 CN CN 201310076937 patent/CN103121268A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130529 |