CN103121267A - LED (light emitting diode) die - Google Patents

LED (light emitting diode) die Download PDF

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Publication number
CN103121267A
CN103121267A CN 201310076699 CN201310076699A CN103121267A CN 103121267 A CN103121267 A CN 103121267A CN 201310076699 CN201310076699 CN 201310076699 CN 201310076699 A CN201310076699 A CN 201310076699A CN 103121267 A CN103121267 A CN 103121267A
Authority
CN
China
Prior art keywords
caster
flow path
led
cavity plate
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 201310076699
Other languages
Chinese (zh)
Inventor
亢建兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNMING HAOKUN MACHINERY CO Ltd
Original Assignee
KUNMING HAOKUN MACHINERY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNMING HAOKUN MACHINERY CO Ltd filed Critical KUNMING HAOKUN MACHINERY CO Ltd
Priority to CN 201310076699 priority Critical patent/CN103121267A/en
Publication of CN103121267A publication Critical patent/CN103121267A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an LED (light emitting diode) die. The LED die comprises a cavity plate and a hot runner panel, wherein the hot runner panel is positioned at the top end of the cavity plate; a vertically downward positioning pin is fixed at the bottom end of the hot runner panel; a positioning groove corresponding to the positioning pin is formed at the top end of the cavity plate; and the positioning pin is inserted into the positioning groove to realize combined positioning of the hot runner panel and the cavity plate. According to the LED die provided by the invention, the positioning pin is arranged between the hot runner panel and the cavity plate, so that positioning can be carried out effectively, dislocation caused by processing clearances can be prevented when the die is assembled, the nozzle can be assembled conveniently, and the production efficiency can be improved.

Description

LED die
Technical field
The present invention relates to mould, be specifically related to a kind of LED die.
Background technology
In the LED die design, do not position between existing hot flow path panel and caster, thereby cause often can misplacing in the dress mould, nozzle causes filling the mould difficulty often to not going up.
Summary of the invention
Technical problem to be solved by this invention is the problem that does not position between the hot flow path panel of LED die and caster.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is to provide a kind of LED die, comprise caster and hot flow path panel, described hot flow path panel is positioned at the top of caster, the bottom of described hot flow path panel is fixed with an alignment pin straight down, the top of described caster has the locating slot corresponding with described alignment pin, and described alignment pin inserts the combination location of realizing hot flow path panel and caster in described locating slot.
In above-mentioned LED die, described alignment pin is needle-like, and described locating slot is a circular hole.
Append alignment pin between the hot flow path panel of LED die provided by the invention and caster, thereby effectively position, can not cause dislocation because of machining gap during the dress mould, also convenient a lot of to nozzle, improved production efficiency.
Description of drawings
Fig. 1 is the structural representation of LED die provided by the invention.
The specific embodiment
Below in conjunction with accompanying drawing, the present invention is made detailed explanation.
As shown in Figure 1, LED die provided by the invention comprises caster 1 and hot flow path panel 2, hot flow path panel 2 is positioned at the top of caster 1, the bottom of hot flow path panel 2 is fixed with an alignment pin 3 straight down, the top of caster 1 has the locating slot corresponding with alignment pin 3, and alignment pin 3 inserts the combination location of realizing hot flow path panel 2 and caster 1 in locating slot.
In present embodiment, alignment pin 3 is needle-like, and locating slot is a circular hole.
Append alignment pin 3 between the hot flow path panel 2 of LED die provided by the invention and caster 1, thereby effectively position, can not cause dislocation because of machining gap during the dress mould, also convenient a lot of to nozzle, improved production efficiency.
The present invention is not limited to above-mentioned preferred forms, and anyone should learn the structural change of making under enlightenment of the present invention, and every have identical or close technical scheme with the present invention, within all falling into protection scope of the present invention.

Claims (2)

1.LED mould, comprise caster and hot flow path panel, described hot flow path panel is positioned at the top of caster, it is characterized in that, the bottom of described hot flow path panel is fixed with an alignment pin straight down, the top of described caster has the locating slot corresponding with described alignment pin, and described alignment pin inserts the combination location of realizing hot flow path panel and caster in described locating slot.
2. very according to LED die claimed in claim 1, it is characterized in that, described alignment pin is needle-like, and described locating slot is a circular hole.
CN 201310076699 2013-03-11 2013-03-11 LED (light emitting diode) die Pending CN103121267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201310076699 CN103121267A (en) 2013-03-11 2013-03-11 LED (light emitting diode) die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201310076699 CN103121267A (en) 2013-03-11 2013-03-11 LED (light emitting diode) die

Publications (1)

Publication Number Publication Date
CN103121267A true CN103121267A (en) 2013-05-29

Family

ID=48452502

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201310076699 Pending CN103121267A (en) 2013-03-11 2013-03-11 LED (light emitting diode) die

Country Status (1)

Country Link
CN (1) CN103121267A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358472A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Display mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103358472A (en) * 2013-08-03 2013-10-23 昆山市浩坤机械有限公司 Display mold

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130529