CN103105401A - Substrate detection device - Google Patents
Substrate detection device Download PDFInfo
- Publication number
- CN103105401A CN103105401A CN2011104615726A CN201110461572A CN103105401A CN 103105401 A CN103105401 A CN 103105401A CN 2011104615726 A CN2011104615726 A CN 2011104615726A CN 201110461572 A CN201110461572 A CN 201110461572A CN 103105401 A CN103105401 A CN 103105401A
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- camera
- substrate
- detection apparatus
- image information
- substrate detection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention discloses a substrate detection device, which is composed of a plurality of cameras of different focusing angles. The surface and the edge part of a substrate are shot by the cameras, and then the images of the substrate are combined for being analyzed. In this way, fractures, cracks or other damages to the surface and the edge part of the substrate can be accurately detected. Meanwhile, before the substrate is put into a craft chamber, the quality state of the substrate is confirmed in advance. Therefore, the substrate is prevented from breaking during the processing process.
Description
Technical field
The present invention relates to a kind of detection OLED (Organic Light Emitting Diode, organic LED) or LCD with substrate (below, claim " substrate ") the device of quality state, relate in particular to that the surface of critically being detected substrate by combinatory analysis by the image information of a plurality of camera with mutually different focusing angle and marginal portion occur such as the damage state based substrate detection apparatus such as breaking or broken.
Background technology
Thin-film transistor LCD device mainly by the lower basal plate that forms thin film transistor (TFT), form the upper substrate of colored filter and be infused in lower basal plate and upper substrate between liquid crystal consist of, the technique of making above-mentioned liquid crystal indicator can be divided into three parts, i.e. thin film transistor (TFT) (TET) technique, cell process, module process.
Described TET technique and semiconductor fabrication process are closely similar, be repeatedly carry out depositing operation (deposition) and photoetching process (Photolithography), etch process (Etching) and on substrate the alignment film transistor, the technique of making thus.
Described cell process is in the lower basal plate that is formed with TET and be formed with on the upper substrate of colored filter (Color filter) and form alignment film, carry out orientation so that liquid crystal molecule can fitly be arranged on alignment film, then spreading sept (spacer), printing and sealing material (Seal) bonds.After bonding, utilize capillarity, Liquid crystal pour in inside, is sealed inlet, complete thus the manufacturing process of liquid crystal indicator.
The step of the quality of the described module process product that to be final decision provide to the user, bonding Polarizer on the panel of completing, drive integrated circult (Driver-IC) is installed, then assemble printed circuit board (PCB) (Printed Circuit Board, PCB), final assembling back light unit (Backlight unit) and works are completed Liquid Crystal Module thus.
In addition, OLED is sedimentary organic material matter and the LED that makes in each unit between upper substrate and lower basal plate glass, this OLED has available low voltage drive, can manufacture the advantage of thin flat plate, and the visual angle is wide, the speed of response is fast, therefore is different from common LCD (Liquid Crystal Display, liquid crystal display), when aside observing, image quality can not change yet, can afterimage on picture.
And in small-sized picture, because OLED has the better image quality than LCD, and manufacturing process is simple, so OLED more has superiority on price competitiveness.
For this OLED, colored display mode comprises three looks (red, green, blueness) independent pixel mode, look mapping mode (CCM), colorized optical filtering mode, and be divided into low Molecule OLEDs and macromolecule OLED according to the luminescent material that is used on display, and be divided into passive matrix mode (passive matrix according to type of drive, passive-matrix) and active drive mode (active matrix, active matrix).
And OLED and LCD, PDP (Plasma Display Panel, plasma display panel) compare, not only simple in structure, thin thickness, but also have flexible character, be therefore the new life of soft display (Flexible display) market injection.
At this moment, equipment for the manufacture of above-mentioned LCD or OLED, by formations such as purge chamber, load fixed chamber (load lock chamber), conveying chamber and process chambers, before dropping into substrate to described process chamber, whether need to detect the surface of described substrate and marginal portion occurs such as the breakage such as breaking or broken, in order to carry out this detection, provide Lighting Division and camera (camera).
Yet, in the past, as shown in Figure 1, when being positioned on identical perpendicular line for detection of the focus direction of the camera 2 of the quality state of the surface of substrate 1 and marginal portion with part (or damaged portion) A that breaks that forms, have that occur can not be from the image information of being taken by camera 2 find the to break problem of error-detecting of part A on the surface of substrate 1 or edge.
namely, the surface of substrate 1 or marginal portion exist break or the state of the problem such as damaged under, as shown in Figure 2, if break or damaged portion A1 with camera 2 not on identical perpendicular line, and the angle of formation deflection, when the light source of irradiating illumination section 3, light source can reflect or scattering and to different from original direction of illumination other directions diffusions, therefore when breaking of being irradiated by light with camera or damaged portion A1, image information based on this shooting can present dark part (the B1 part of Fig. 2), but as shown in Figure 1, part A is positioned on identical perpendicular line with camera 2 if break, light is understood the described part A that breaks of transmission, therefore the part (the B part of Fig. 1) of the dark of breaking can not appear representing in the image information for the part of breaking, being judged as accordingly substrate 1 does not break, thereby can detect mistake.
Summary of the invention
The present invention proposes in order to solve above-mentioned existing issue, its purpose is to provide a kind of substrate detection apparatus, this substrate detection apparatus has a plurality of cameras combinatory analysis afterwards of mutually different focusing angle by the image information of a plurality of camera for surface and the marginal portion of substrate by formation.Accordingly, can critically detect on the surface of substrate and marginal portion such as breaking or broken etc. damage state based, before dropping into substrate to process chamber, the quality state of prior confirmation substrate can prevent that thus in technique, substrate occurs damaged accordingly.
Whether substrate detection apparatus of the present invention to achieve these goals comprises: take parts, Lighting Division and control module, exist in order to the surface of the substrate that detects input by the image information analysis and marginal portion and break or damaged.Wherein, described Lighting Division is arranged in upside or the downside of described substrate, described shooting parts comprise the first camera, the second camera with different layout angle, in order to surface and/or the rim part of taking respectively substrate according to the light source that provides from described Lighting Division from mutually different focus direction.
And described the first camera is arranged vertically (90 °) with respect to described substrate, and described the second camera is arranged vertically in the layout angle scope that is arranged in 45 °~135 ° centered by line (perpendicular line) by described the first camera 11.
And, more than onely keeping at a certain distance away and be arranged side by side with respect to vertically arranged described the first camera of described substrate, described the second camera is arranged side by side and consists of with the quantity corresponding with described the first camera.
And described the first camera, described the second camera are made of line scan camera or regional camera.
And whether described control module is equipped with to exist based on the surface of being detected substrate by the image information of described the first camera, described the second camera and/or marginal portion and breaks or damaged trace routine.The combination of described trace routine is by the image information of described the first camera with by the image information of described the second camera, image information according to described combination, relatively be positioned at the breaking and the brightness value of damaged portion and brightness value on every side thereof on substrate that be present on identical perpendicular line with described the first camera respectively, when difference appears in the brightness value of described comparison, be judged as to exist on described substrate and break or breakage.
As mentioned above, the present invention consists of substrate detection apparatus, and this substrate detection apparatus has a plurality of cameras combinatory analysis afterwards of mutually different focusing angle by the image information of a plurality of camera for surface and the marginal portion of substrate by formation.Can expect following effect accordingly, namely can critically detect on the surface of substrate and marginal portion such as breaking or broken etc. damage state based, before dropping into substrate to process chamber, the quality state of prior confirmation substrate can prevent that thus in technique, substrate occurs damaged simultaneously.
Description of drawings
Fig. 1 is positioned at the main composition figure of the existing substrate detection apparatus on identical perpendicular line for breaking of occuring or damaged portion and camera on the surface of substrate and/or marginal portion.
Fig. 2 is breaking of occuring or damaged portion and the camera main composition figure of the existing substrate detection apparatus on identical perpendicular line not on the surface of substrate and/or marginal portion.
Fig. 3 A and Fig. 3 B have first and second camera of mutually different focus direction for the upside setting that is illustrated in substrate as embodiments of the invention and the main composition figure of substrate detection apparatus of the state of Lighting Division are set at the downside of substrate.
Fig. 4 A and Fig. 4 B have first and second camera of mutually different focus direction for the downside setting that is illustrated in substrate as embodiments of the invention and the main composition figure of substrate detection apparatus of the state of Lighting Division are set at the upside of substrate.
Fig. 5 is for illustrating the main modular pie graph of substrate detection apparatus as embodiments of the invention.
Main symbol description: 10 for taking parts, and 11 is the first camera, and 12 is the second camera, and 20 is Lighting Division, and 30 is control module, and 100 is substrate.
Embodiment
Below, illustrate referring to the drawings embodiments of the invention.
Fig. 3 A and Fig. 3 B have first of mutually different focus direction for the upside setting that is illustrated in substrate as embodiments of the invention, two cameras and the main composition figure of substrate detection apparatus of the state of Lighting Division is set at the downside of substrate, Fig. 4 A and Fig. 4 B have first of mutually different focus direction for the downside setting that is illustrated in substrate as embodiments of the invention, two cameras and the main composition figure of substrate detection apparatus of the state of Lighting Division is set at the upside of substrate, Fig. 5 is for illustrating the main modular pie graph of substrate detection apparatus as embodiments of the invention.
with reference to accompanying drawing 3 to accompanying drawing 5, substrate detection apparatus comprises according to an embodiment of the invention: take parts 10, Lighting Division 20 and control module 30, whether exist in order to the surface of the substrate 100 that detects input by the image information analysis and marginal portion and break or damaged, wherein, described Lighting Division 20 is arranged in upside or the downside of described substrate 100, described shooting parts 10 comprise the first camera 11 with different layout angle, the second camera 12, in order to surface and/or the rim part of taking respectively substrate according to the light source that provides from described Lighting Division 20 from mutually different focus direction.
At this moment, described the first camera 11 is arranged vertically (90 °) with respect to described substrate 100, described the second camera 12 is arranged vertically in the layout angle scope that is arranged in 45 °~135 ° centered by line (perpendicular line) by described the first camera 11, and described the first camera 11, the second camera 12 is arranged in centered by described substrate 100 and the opposition side of described Lighting Division 20.
And, more than onely keep at a certain distance away and be arranged side by side with respect to vertically arranged described the first camera 11 of described substrate 100, described the second camera 12 is arranged side by side and consists of with the quantity corresponding with described the first camera 11, described the first camera 11, the second camera 12 are made of line scan camera or regional camera (area camela) accordingly, thereby when described substrate 100 carries out by substrate detection apparatus mobile, can take continuously whole surface and the marginal portion of described substrate 100.
In addition, whether described control module 30 is equipped with the surface of detecting substrate 100 based on the image information of being taken by described the first camera 11, the second camera 12 and/or marginal portion and exists and break or damaged trace routine.Described trace routine combination is by the image information of described the first camera 11 shootings and the image information of being taken by described the second camera 12, image information according to described combination, respectively relatively with the first camera 11 be positioned on identical perpendicular line be present on substrate 100 break and the brightness value of damaged portion with and on every side brightness value, when difference appears in the brightness value of described comparison, be judged as to exist on described 100 and break or breakage.
Namely, as shown in Figures 3 to 5, for substrate detection apparatus according to an embodiment of the invention, when dropping into substrate 100 to substrate detection apparatus, at first control module 30 starts Lighting Divisions 20 and takes included described the first camera 11, the second camera 12 of parts 10.
If complete above-mentioned action, as shown in accompanying drawing 3 and accompanying drawing 4, Lighting Division 20 below substrate 100 or above surface and marginal portion radiation source.
At this moment, the first camera 11 that is arranged vertically (90 °) with respect to described substrate 100 is kept vertically the focus direction towards surface and the edge of described substrate 100, take simultaneously surface and the marginal portion of described substrate 100, then its image information is sent to control module 30.
And, the focus direction towards surface and the marginal portion of described substrate 100 of being arranged vertically in the layout angle scope that the second camera 12 in the layout angle scope that is arranged in 45 °~135 ° centered by line (perpendicular line) maintains 45 °~135 ° by described the first camera 11, take simultaneously surface and the marginal portion of described substrate 100, then its image information is sent to control module 30.
if complete above-mentioned action, the combination of the trace routine of described control module 30 is by the image information of described the first camera 11 shootings and the image information of being taken by described the second camera 12, then according to the image information of described combination, when hypothesis is positioned at breaking and damaged portion (Fig. 3 A on identical perpendicular line in existence on substrate 100 with the first camera 11, 3B, 4A, the P part of 4B) time, respectively more described break and the brightness value of damaged portion with and on every side brightness value, then when difference appears in the brightness value of described comparison, can be judged as to exist on described substrate 100 and break or breakage.
Namely, if exist on described substrate 100 and be positioned at breaking or damaged portion P on identical perpendicular line with described the first camera 11, although described break or damaged portion P can't detect from the image information of being taken by described the first camera 11, but by be arranged in described the first camera 11 shapes at 45 °~image information that the second camera 12 in the layout angle scope of 135 ° is taken on, because the refraction of light source or scattering phenomenon cause breaking or the brightness of damaged portion dark (the Q part of Fig. 3 A, 3B, 4A, 4B).The trace routine of described control module 30 is based on the image information of being taken by described the second camera 12, more described break and the brightness value of damaged portion with and on every side brightness value, according to described comparative result, when difference appears in brightness value, can detect to exist on described substrate 100 and break or breakage.
Although in the above description, with reference to the technological thought of accompanying drawing narration substrate detection apparatus of the present invention, this is only to illustrate highly preferred embodiment of the present invention, is not that the present invention is limited.
Therefore; the invention is not restricted to above-mentioned specific preferred embodiment; in not breaking away from claims in the scope of claimed purport of the present invention; so long as the technician with general knowledge of the technical field of the invention; all can carry out various distortion and implement, and this change should be contained in the scope of claims record.
Claims (5)
1. a substrate detection apparatus, is characterized in that, this substrate detection apparatus comprises: take parts, Lighting Division and control module, whether exist in order to the surface of the substrate that detects input by the image information analysis and/or marginal portion and break or damaged, wherein,
Described Lighting Division is arranged in upside or the downside of described substrate,
Described shooting parts comprise the first camera, the second camera with different layout angle, in order to surface and/or the rim part of taking respectively substrate according to the light source that provides from described Lighting Division from mutually different focus direction.
2. substrate detection apparatus as claimed in claim 1, is characterized in that, described the first camera is arranged vertically with respect to described substrate,
Described the second camera is arranged in being arranged vertically in line tilts the layout angle scope of 45 ° towards both sides of relatively described the first camera.
3. substrate detection apparatus as claimed in claim 2, is characterized in that, more than onely keep at a certain distance away and be arranged side by side with respect to vertically arranged described the first camera of described substrate,
Described the second camera is arranged side by side and consists of with the quantity corresponding with described the first camera.
4. substrate detection apparatus as claimed in claim 3, is characterized in that, described the first camera, described the second camera are made of line scan camera or regional camera.
5. substrate detection apparatus as claimed in claim 3, it is characterized in that, the combination of described control module is by the image information of described the first camera with by the image information of described the second camera, image information according to combination, relatively be positioned at the breaking or the brightness value of damaged portion and brightness value on every side thereof on substrate that be present on identical perpendicular line with described the first camera respectively, when difference appears in brightness value relatively, be judged as to exist on described substrate and break or breakage.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020110117146A KR20130051796A (en) | 2011-11-10 | 2011-11-10 | Glass inspecting device |
KR10-2011-0117146 | 2011-11-10 |
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CN103105401A true CN103105401A (en) | 2013-05-15 |
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CN2011104615726A Pending CN103105401A (en) | 2011-11-10 | 2011-12-29 | Substrate detection device |
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CN (1) | CN103105401A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104609137A (en) * | 2015-01-04 | 2015-05-13 | 京东方科技集团股份有限公司 | Glass substrate conveying device |
CN104714315A (en) * | 2013-12-12 | 2015-06-17 | 珠海格力电器股份有限公司 | Fracturing strength test tool and method for liquid crystal rubber frame bonding |
CN104820299A (en) * | 2014-01-31 | 2015-08-05 | 有限会社共同设计企画 | Electronic part detection device |
CN106569352A (en) * | 2015-10-13 | 2017-04-19 | 北京兆维电子(集团)有限责任公司 | Device and method for acquiring testing image of liquid crystal screen |
CN107121433A (en) * | 2016-02-24 | 2017-09-01 | 株式会社迪思科 | Check device and laser processing device |
CN108609381A (en) * | 2018-03-29 | 2018-10-02 | 厦门特盈自动化科技股份有限公司 | A kind of Systems for optical inspection |
CN109900705A (en) * | 2019-03-18 | 2019-06-18 | 合肥京东方光电科技有限公司 | A kind of substrate detection apparatus and detection method |
CN110741244A (en) * | 2017-04-18 | 2020-01-31 | 康宁股份有限公司 | Substrate edge testing device, system and method |
CN112880600A (en) * | 2021-04-29 | 2021-06-01 | 深圳博升光电科技有限公司 | Imaging device and equipment for detecting glass |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102161160B1 (en) | 2013-10-31 | 2020-09-29 | 삼성전자주식회사 | Method of inspecting a surface of a substrate and apparatus for performing the same |
KR102374037B1 (en) * | 2018-06-29 | 2022-03-11 | 캐논 톡키 가부시키가이샤 | Subtrate inspection system, manufacturing system of electronic device, subtrate inspection method, and manufacturing method of electronic device |
WO2020121784A1 (en) * | 2018-12-11 | 2020-06-18 | 本田技研工業株式会社 | Workpiece inspection device and workpiece inspection method |
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CN1786698A (en) * | 2004-12-06 | 2006-06-14 | Hoya株式会社 | Apparatus and method of inspecting mura-defect and method of fabricating photomask |
KR20110008665A (en) * | 2009-07-21 | 2011-01-27 | 주식회사 넥스트아이 | A inspecting apparatus and inspecting method of lcd panel |
CN101988908A (en) * | 2009-07-31 | 2011-03-23 | 法国圣-戈班玻璃公司 | Method and system for distinguishing fault of substrate |
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2011
- 2011-11-10 KR KR1020110117146A patent/KR20130051796A/en not_active Application Discontinuation
- 2011-12-29 CN CN2011104615726A patent/CN103105401A/en active Pending
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CN1786698A (en) * | 2004-12-06 | 2006-06-14 | Hoya株式会社 | Apparatus and method of inspecting mura-defect and method of fabricating photomask |
KR20110008665A (en) * | 2009-07-21 | 2011-01-27 | 주식회사 넥스트아이 | A inspecting apparatus and inspecting method of lcd panel |
CN101988908A (en) * | 2009-07-31 | 2011-03-23 | 法国圣-戈班玻璃公司 | Method and system for distinguishing fault of substrate |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104714315A (en) * | 2013-12-12 | 2015-06-17 | 珠海格力电器股份有限公司 | Fracturing strength test tool and method for liquid crystal rubber frame bonding |
CN104714315B (en) * | 2013-12-12 | 2017-07-25 | 珠海格力电器股份有限公司 | The fracturing strengh test tool and method of liquid crystal glue frame bonding |
CN104820299A (en) * | 2014-01-31 | 2015-08-05 | 有限会社共同设计企画 | Electronic part detection device |
US9434553B2 (en) | 2015-01-04 | 2016-09-06 | Boe Technology Group Co., Ltd. | Glass substrate conveyer |
CN104609137A (en) * | 2015-01-04 | 2015-05-13 | 京东方科技集团股份有限公司 | Glass substrate conveying device |
CN106569352B (en) * | 2015-10-13 | 2024-01-26 | 北京兆维电子(集团)有限责任公司 | Device and method for acquiring detection image of liquid crystal display |
CN106569352A (en) * | 2015-10-13 | 2017-04-19 | 北京兆维电子(集团)有限责任公司 | Device and method for acquiring testing image of liquid crystal screen |
CN107121433A (en) * | 2016-02-24 | 2017-09-01 | 株式会社迪思科 | Check device and laser processing device |
CN110741244A (en) * | 2017-04-18 | 2020-01-31 | 康宁股份有限公司 | Substrate edge testing device, system and method |
CN110741244B (en) * | 2017-04-18 | 2022-12-13 | 康宁股份有限公司 | Substrate edge testing device, system and method |
US11639898B2 (en) | 2017-04-18 | 2023-05-02 | Corning Incorporated | Substrate edge test apparatus, system, and method |
CN108609381A (en) * | 2018-03-29 | 2018-10-02 | 厦门特盈自动化科技股份有限公司 | A kind of Systems for optical inspection |
CN109900705A (en) * | 2019-03-18 | 2019-06-18 | 合肥京东方光电科技有限公司 | A kind of substrate detection apparatus and detection method |
CN109900705B (en) * | 2019-03-18 | 2022-06-10 | 合肥京东方光电科技有限公司 | Substrate detection device and detection method |
CN112880600A (en) * | 2021-04-29 | 2021-06-01 | 深圳博升光电科技有限公司 | Imaging device and equipment for detecting glass |
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Application publication date: 20130515 |