CN103092295B - The heating means of electronic component and device and electronic installation - Google Patents
The heating means of electronic component and device and electronic installation Download PDFInfo
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- CN103092295B CN103092295B CN201110339947.1A CN201110339947A CN103092295B CN 103092295 B CN103092295 B CN 103092295B CN 201110339947 A CN201110339947 A CN 201110339947A CN 103092295 B CN103092295 B CN 103092295B
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Abstract
The present invention proposes a kind of heating means of electronic component and device and electronic installation.Well heater is configured in electronic component.Heating means comprise the following steps.According to work ratio, use the electrical energy drive well heater of power module.If the output voltage of power module is greater than the first critical value, then by work than being set as the first ratio.If the output voltage of power module is less than the second critical value, then by work than being set as the second ratio.If the output voltage of power module is between the first critical value and the second critical value, adjustment work ratio, makes the output voltage of power module and the difference of the second critical value, with work than proportional.Thus obtain a work ratio according to the output voltage of power module, and according to this work ratio, electronic component is heated, electronic component can being made being heated to normal running temperature simultaneously, also not damaging power module, such as, damaging battery.
Description
[technical field]
The invention relates to a kind of electronic installation, and the heating means of electronic component and heating arrangement under relating to a kind of low temperature environment especially.
[background technology]
General running gear, such as notebook computer, its normal range of operation is positioned under the normal temperature of 0 degree to 45 degree Celsius Celsius.Within this temperature range, the battery of running gear can normally output voltage be to running gear, and the electronic component of running gear inside, such as hard disk, also directly can operate under the normal temperature of this temperature range.
Such as, but when running gear is applied under rugged environment, in the low temperature environment of-30 degree Celsius, the element of running gear inside needs the action carrying out heating, and can make running gear normal operation.Now, if on hand without external power supply, then must heat up by the electronic component of the electric power of battery by running gear inside.Just, under low temperature, the usefulness of battery also cannot effectively provide, and heats with battery if rashly direct to running gear, then may cause damage to the battery of low temperature.Therefore, under the weather of above-mentioned low temperature, while to running gear heating, must consider again the infringement of low temperature battery, be a kind of awkward situation.
[summary of the invention]
The invention provides a kind of heating means of electronic component, by the method, when not damaging power module, efficiently electronic component can be heated.
The invention provides the heating arrangement of electronic component in a kind of low temperature environment, this heating arrangement when not damaging power module, can heat electronic component efficiently.
The invention provides a kind of electronic installation, it can heat the electronic component of its inside at low ambient temperatures, and does not damage power module.
The present invention proposes a kind of heating means of electronic component, and wherein primary heater is configured in electronic component, and heating means comprise the following steps.Primary heater is driven to use the electric energy of power module according to work than (dutyratio).If the output voltage of power module is greater than the first critical value, then by work than being set as the first ratio.If the output voltage of power module is less than the second critical value, then by work than being set as the second ratio, wherein the second critical value is less than the first critical value and is greater than zero, and the second ratio is less than the first ratio.If the output voltage of power module is between the first critical value and the second critical value, adjustment work ratio, makes the output voltage of power module and the difference of the second critical value, with work than proportional.
In one embodiment of this invention, the first above-mentioned ratio is the 100%, second ratio is 0%.
In one embodiment of this invention, in the step of above-mentioned adjustment work ratio, work is than between the first ratio and the second ratio.
In one embodiment of this invention, the step of above-mentioned adjustment work ratio comprises the following steps.By work than being set as (DH-DL) × [(V-VL)/(VH-VL)], wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, and V is the output voltage of power module, VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, the first above-mentioned ratio and DH are the 75%, second ratio be 0%, DL be the 10%, first critical value be the 8.1, second critical value is 7.1.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.Configuration secondary heater in the second electronic component, and according to work ratio, uses the electrical energy drive secondary heater of power module.Do not overlap during the activation of wherein primary heater with during the activation of secondary heater.
In one embodiment of this invention, the duration of work of above-mentioned work ratio all gives primary heater and secondary heater.
In one embodiment of this invention, when the temperature of the first above-mentioned electronic component reaches a normal running temperature, the duration of work of work ratio is all distributed to secondary heater.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.Configuration secondary heater in the second electronic component, and according to work ratio, uses the electrical energy drive secondary heater of power module.During being overlapped in the activation of secondary heater during the activation of wherein primary heater, and during the activation of primary heater with the activation of secondary heater during temporal summation be not more than work period of work ratio.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating means of electronic component, more comprise the following steps.The first step, detects the temperature of the first electronic component.Second step, when the temperature of the first electronic component reaches normal running temperature, stops driving primary heater.3rd step, when the temperature of the first electronic component reaches normal running temperature, starts the first electronic component.
In one embodiment of this invention, the first above-mentioned electronic component is Winchester disk drive.
In one embodiment of this invention, above-mentioned power module is battery module or exchanges breakout box.
The invention provides the heating arrangement of electronic component in a kind of low temperature environment, comprise primary heater, power module and controller.Primary heater is configured at the first electronic component, and power module provides the electric energy needed for primary heater, and controller is coupled to primary heater and power module.Its middle controller uses the electric energy of power module to heat the first electronic component according to a job than controlling primary heater, if the output voltage of power module is greater than the first critical value, then controller setting work ratio is the first ratio, if the output voltage of power module is less than the second critical value, then controller setting work ratio is the second ratio.Second critical value is less than the first critical value and is greater than zero, second ratio is less than the first ratio, if and the output voltage of this power module is between this first critical value and this second critical value, then this controller adjusts this work ratio, make the output voltage of this power module and the difference of this second critical value, with this work than proportional.
In one embodiment of this invention, the heating arrangement of electronic component in above-mentioned low temperature environment, wherein when the output voltage of power module is between the first critical value and the second critical value, controller adjustment work is than between the first ratio and the second ratio.
In one embodiment of this invention, above-mentioned controller by work than being set as (DH-DL) × [(V-VL)/(VH-VL)], wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, V is the output voltage of power module, VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, in above-mentioned low temperature environment, the heating arrangement of electronic component, more comprises temperature sensor, and it is configured at the first electronic component to detect the temperature of the first electronic component, and temperature sensor is coupled to controller.Wherein when the temperature of the first electronic component reaches normal running temperature, controller controls primary heater and stops heating.
The invention provides a kind of electronic installation and comprise the first electronic component, primary heater, power module and controller.Primary heater is configured at the first electronic component, power module provides the electric energy needed for electronic installation and primary heater, controller is coupled to primary heater and power module, and controller uses the electric energy of power module to heat the first electronic component according to work than controlling primary heater.If wherein the output voltage of power module is greater than the first critical value, then controller setting work ratio is the first ratio.If the output voltage of power module is less than the second critical value, then controller setting work ratio is the second ratio.Second critical value is less than the first critical value and is greater than zero, second ratio is less than the first ratio, if and the output voltage of power module is between the first critical value and the second critical value, then controller adjustment work ratio, make the output voltage of power module and the difference of the second critical value, with work than proportional.
In one embodiment of this invention, above-mentioned electronic installation, wherein when the output voltage of power module is between the first critical value and the second critical value, controller adjustment work is than between the first ratio and the second ratio.
In one embodiment of this invention, above-mentioned controller by work than being set as (DH-DL) × [(V-VL)/(VH-VL)], wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, V is the output voltage of power module, VH is the first critical value, and VL is the second critical value.
In one embodiment of this invention, above-mentioned electronic installation more comprises temperature sensor.Temperature sensor is configured at the first electronic component to detect the temperature of the first electronic component, and temperature sensor is coupled to controller.Wherein when the temperature of the first electronic component reaches normal running temperature, controller controls primary heater and stops heating.
Compared to prior art, the invention provides the heating means of electronic component in a kind of low temperature environment, it obtains a work ratio according to the output voltage of power module, and according to this work ratio, electronic component is heated, electronic component can be made to be heated to normal running temperature simultaneously, also do not damage power module, such as, damage battery.The invention provides the heating arrangement of electronic component in a kind of low temperature environment, it utilizes the heating means of above-mentioned electronic component, heats electronic component.The present invention also provides a kind of electronic installation, and it comprises above-mentioned heating arrangement, is suitable for being applied under low temperature environment.
[accompanying drawing explanation]
Fig. 1 illustrates the process flow diagram of the heating means of electronic component in the low temperature environment of one embodiment of the invention.
Fig. 2 illustrates the schematic diagram of the heating arrangement of electronic component in the low temperature environment of one embodiment of the invention.
Fig. 3 illustrates the oscillogram of the duration of work (dutycycle) of the work ratio of one embodiment of the invention.
Fig. 4 illustrates the output voltage of the power module of one embodiment of the invention and the graph of a relation of work ratio.
Fig. 5 illustrates the process flow diagram of the heating means in the low temperature environment of one embodiment of the invention with two electronic components.
Fig. 6 illustrates the oscillogram during the primary heater of one embodiment of the invention and the activation of secondary heater.
Fig. 7 illustrates the process flow diagram of the heating means in the low temperature environment of one embodiment of the invention with two electronic components.
Fig. 8 illustrates another oscillogram during the primary heater of one embodiment of the invention and the activation of secondary heater.
Fig. 9 illustrates the process flow diagram of Heating Electron element to operating temperature method of one embodiment of the invention.
Figure 10 illustrates the process flow diagram of heating two electronic components to operating temperature method of one embodiment of the invention.
Figure 11 illustrates the process flow diagram of the electronic installation heating means of one embodiment of the invention.
[embodiment]
Fig. 1 illustrates the process flow diagram of the heating means of electronic component in the low temperature environment of one embodiment of the invention.Fig. 2 is the function block schematic diagram being illustrated in a kind of electronic installation in low temperature environment according to one embodiment of the invention.This electronic installation comprises heating arrangement 500 and electronic component 550.In low temperature environment, heating arrangement 500 can heat in advance electronic component 550 in start process.After the temperature of electronic component 550 is promoted to admissible temperature, this electronic installation is completed in-cycle work smoothly.
Under low temperature situation, for operating electronic device startup shown in Fig. 2, the temperature of the electronic component 550 of electronic installation inside must be heated to normal running temperature in advance, user can this electronic installation of normal running.Such as, time under-30 degree environment Celsius to notebook computer start and operation, the temperature of notebook computer internal hard drive machine must be heated to 0 degree Celsius in advance, and user can this notebook computer of normal running.
In the present embodiment, heating arrangement 500 comprises controller 510 (being such as embedded controller), power module 520 and well heater 530.Well heater 530 is configured at electronic component 550 (such as Winchester disk drive).Controller 510 is coupled to well heater 530 and power module 520.The built-in power module of electronic installation 520 (such as battery module or exchange breakout box) provides the electric energy needed for well heater 530.Controller 510 determines/adjusts work ratio (dutyratio), and according to this work than the well heater 530 of drive arrangements in electronic component 550, use the electronic component 550 of the electric energy of power module 520 to electronic installation inside to heat with control heater 530.When power module 520 is battery modules, the output voltage of battery module when low temperature must limit to some extent.For example; under low temperature situation; the usefulness of battery module output voltage is lower; if now well heater 530 uses whole output electric energy of battery module to heat electronic component 550 in large quantities; then may cause damage to battery module; also or battery module in low temperature over-discharge can, and cause battery module self-protection and cannot power supply be provided.Such as, if in the environment of-40 degree Celsius, if well heater 530 uses the electric energy Heating Electron element 550 of battery module constantly with 100% work ratio, then may cause damage to battery module.
Please refer to Fig. 1 and Fig. 2, controller 510 can pass through the control chip of bus access power module 520, to know temperature and the output voltage values of power module 520.Such as, controller 510 can detect temperature and the output voltage values of power module 520 by System Management Bus (SM-Bus, SystemManagementBus).Controller 510 can dynamically determine work ratio according to the output voltage of power module 520, and according to work than controlling/driving well heater 530 (step S110).Well heater 530 heats electronic component 550 than the electric energy using power module 520 to provide according to this work.Owing to suffering damage in order to protection power source module 520 is unlikely, work has interdependent relation according to the output voltage of power module 520, so need the following step dynamic conditioning work ratio than needing.
Controller 510 carries out step S120 to judge whether the output voltage of power module 520 is greater than the first critical value.If the output voltage of power module 520 is greater than the first critical value, then controller 510 by work than being set as the first ratio (step S130).If the output voltage of power module 520 is not more than the first critical value, then controller 510 carries out step S140, to judge whether the output voltage of power module 520 is less than the second critical value.Wherein, described second critical value is less than the first critical value and is greater than zero.If the output voltage of power module 520 is less than the second critical value, then controller 510 by work than being set as the second ratio (step S150).Wherein, the second ratio is less than the first ratio.First ratio and the second ratio must determine it depending on actual product design requirement.Such as, described first ratio is 100%, and described second ratio is 0%.
Above-mentioned step S120 to step S150 is judging that the output voltage of power module 520 is whether in pre-set interval.If the output voltage of power module 520 is on pre-set interval, then work than being fixed to the first ratio.If the output voltage of power module 520 is under pre-set interval, then work than being fixed to the second ratio.If the output voltage of power module 520 is in pre-set interval, then controller 510 carries out step S160.Such as, if the output voltage of power module 520 is between the first critical value and the second critical value, then controller 510 is according to the output voltage dynamic conditioning work ratio of power module 520, make the output voltage of power module 520 and the difference of the second critical value, with work than proportional (step S160).That is, if the output voltage of power module 520 drops between two critical values, then utilize the output voltage of power module 520 to deduct the value of the second critical value, converse work ratio.Further, obtaining new work than afterwards, utilizing new work ratio to return step S110, utilizing new work than driving well heater 530.
For example, in step S160, controller 510 can adjust work ratio, makes described work than between the first ratio and the second ratio.Such as, by work than being set as (DH-DL) × [(V-VL)/(VH-VL)], wherein DH be less than 1 positive number, DL is the positive number being less than DH, V is the output voltage of power module 520, and VH is the first critical value, and VL is the second critical value.
For example, suppose that power module 520 is 8.1 volts in the output voltage of normal running temperature, therefore the first critical value VH in step S120 can be set to 8.1 volts (step S120).In another hypothesis power module 520, the low pressure self-protection point of battery controller is set as 6.6 volts.Mean, when the output voltage of power module 520 is lower than 6.6 volts, the infringement of power module 520 internal cell may be caused.Therefore, the second critical value VL in step S120 can be set to be greater than 6.6 volts and be less than any value of the first critical value VH (8.1 volts).Such as, conservatively the second critical value VL of step S140 can be set as 7.1 volts.Further, in order to not make power module 520 export than mode with 100% work, and cause electric quantity consumption too fast, so the first ratio in step S130 can be set as 75%, and the second ratio in step S150 is set to 0%.At the same time, can according to the design requirement of actual product the value of DH and DL in definition step S160, such as DH is 75% and DL is 10%.
Lift a concrete instance, please refer to Fig. 3, Fig. 3 illustrates the oscillogram of the duration of work (dutycycle) of the work ratio of one embodiment of the invention.If the output voltage of power module 520 is more than the first critical value (such as more than 8.1 volts), controller 510 drives the work of the control signal of well heater 530 than being then fixed as the first ratio (such as 75%, as shown in waveform D1).In the case, the fixing work ratio with 75% of controller 510 operates/drives well heater 530.If the output voltage of power module 520 is less than the second critical value (being such as less than 7.1 volts), then controller 510 drives the work of the control signal of well heater 530 ratio to be fixed as the second ratio (such as 10%, as shown in waveform D2).In the case, controller 510 is to fix the work of 10% than operation/driving well heater 530.If the output voltage of power module 520 is between the first critical value and the second critical value, such as, between 7.1 volts and 8.1 volts, then controller 510 drives the control signal of well heater 530 as shown in waveform D3.That is, controller 510 along with different output voltage values, can operate/drive well heater 530 with different work ratio.
In another embodiment, controller 510 also can in step S160 by work than being set as (DH-DL) × [(V-VL)/(VH-VL)]+DL.Work ratio is adjusted by this step S160, when the output voltage of power module 520 is between first and second critical value, can by obtained work than between the scope being limited in DL and DH.
Fig. 4 illustrates the graph of a relation of the output voltage of the power module 520 of one embodiment of the invention and the work ratio of well heater 530.Please refer to Fig. 4, in the present embodiment, first ratio of step S130 is second ratio of 75%, step S150 is 0%, the DH of step S160 is 75%, the DL of step S160 be 10%, step S120 the first critical value VH be 8.1, and the second critical value VL of step S140 is 7.1.Step S160, by above-mentioned work relational expression (DH-DL) × [(V-VL)/(VH-VL)]+DL than setting, can obtain the graph of a relation of the output voltage V as Fig. 4 and work ratio.As shown in Figure 4, when the output voltage V of power module 520 is greater than the first critical value (V > 8.1), the work ratio of well heater 530 is fixed as the first ratio 75%.When the output voltage V of power module 520 is less than the second critical value (V < 7.1), the work ratio of well heater 530 is fixed as the second ratio 0%.At the output voltage V of power module 520 between two critical values time (V=7.1 ~ 8.1), the output voltage V of power module 520 and the work of well heater 530 are than linear.
Subsidiary one carries, and in practical application, work can operate well heater 530 than the mode being incorporated into pulse wave width modulation (PWM, PulseWidthModulation) by controller 510.It should be noted that when low temperature, such as, when spending lower than Celsius-30, the output of power module 520 internal cell is comparatively close to the second critical value VL, then controller 510 can turn down the work ratio of well heater 530, with protection power source module 520.But can heat energy be discharged in the discharge process of power module 520 internal cell, make the temperature of battery itself gradually to increase.When power module 520 internal battery-temperature slowly rises, its discharging efficiency may be better and better, and namely the output voltage of power module 520 internal cell may raise gradually.In this process, if controller 510 is constantly detected the output voltage of power module 520 internal cell and is dynamically changed the work ratio of well heater 530 according to this, then can along with the trend of cell output voltage, by the work of well heater 530 than increasing together according to above-mentioned step.
In an embodiment of the present invention, in the device of if desired low-temperature operation, there is the first electronic component and the second electronic component, by following step, with primary heater and secondary heater, respectively to the first electronic component (such as the first hard disk) and the second electronic component (such as the second hard disk) heating.Fig. 5 illustrates the process flow diagram of the heating means in the low temperature environment of one embodiment of the invention with two electronic components.The present embodiment be analogized/be applied to implementation described in Fig. 1 to Fig. 4 can.Please refer to Fig. 5, primary heater is configured in the first electronic component, and secondary heater is configured in the second electronic component (step S210).Controller can obtain work ratio according to the method for embodiment described in Fig. 1 to Fig. 4.Controller drives primary heater and secondary heater respectively according to work ratio.Driven primary heater and secondary heater can use the electric energy of power module and heat the first electronic component and the second electronic component respectively.Wherein, (step S220) is not overlapped during the activation of primary heater with during the activation of secondary heater.
In the step S220 of above-described embodiment, owing to needing the first electronic component and the second electronic component to be by the time all heated to normal running temperature in electronic installation, such as 0 degree Celsius, just can normally start, therefore controller is in turn to two electronic component heating, can improve the effective utilization of well heater.Therefore, do not overlap during the activation of the primary heater of above-mentioned steps with during the activation of secondary heater.That is, when heating the first electronic component, then not to the second electronic component heating, vice versa.
As mentioned above, in order to overlap during not making the activation of primary heater with during the activation of secondary heater, then the mode all giving primary heater and secondary heater by the duration of work of the ratio that works is reached.Fig. 6 illustrates the oscillogram during the primary heater of one embodiment of the invention and the activation of secondary heater.Please refer to Fig. 6, waveform T1 for controller carry out flow process described in Fig. 1 after the work ratio that calculates, wherein this work ratio has duration of work 610.By the duration of work 610 of mean allocation waveform T1, controller can produce two control signal TA, TB respectively to primary heater and secondary heater, does not overlap mutually during making the activation of different heating device.Wherein, during the duration of work 611 of control signal TA is the activation of primary heater, and during the duration of work 612 of control signal TB is the activation of secondary heater.Above-mentioned duration of work 610 is for being more than or equal to duration of work 611 and duration of work 612 sum.
When the temperature of this first electronic component reaches normal running temperature, and when the temperature of this second electronic component not yet reaches normal running temperature, the duration of work 610 of this work ratio can all be distributed to this secondary heater by controller.That is, duration of work 611 is reduced to 0, and duration of work 612 is added to grow to equals duration of work 610.Otherwise when the temperature of this second electronic component reaches normal running temperature, and when the temperature of this first electronic component not yet reaches normal running temperature, the duration of work 610 of this work ratio can all be distributed to this primary heater by controller.That is, duration of work 612 is reduced to 0, and duration of work 611 is added to grow to equals duration of work 610.
Fig. 7 illustrates the process flow diagram of the heating means in the low temperature environment of another embodiment of the present invention with two electronic components.Please refer to Fig. 7, this embodiment can with reference to the related description of Fig. 5.With Fig. 5 unlike, in the step S220 of the present embodiment, during the activation of secondary heater can be overlapped in during the activation of primary heater, and during the activation of primary heater with the activation of secondary heater during temporal summation be not more than work period of work ratio.
Fig. 8 illustrates another oscillogram during the primary heater of another embodiment of the present invention and the activation of secondary heater.Please refer to Fig. 8, waveform T1 for controller carry out flow process described in Fig. 1 after the work ratio that calculates, wherein this work ratio has duration of work 610.Waveform TA is the control signal that primary heater exported to by controller, and wherein this control signal TA has duration of work (during activation) 613.Waveform TB is the control signal that secondary heater exported to by controller, and wherein this control signal TB has duration of work (during activation) 614.As shown in Figure 8, duration of work 613 is overlapped in duration of work 614, and duration of work 613 is not more than duration of work 610 with the summation of duration of work 614.That is, primary heater and secondary heater can be operated respectively to the first electronic component and the heating of the second electronic component simultaneously, but during the activation of primary heater with the activation of secondary heater during summation be not more than duration of work 610.
As mentioned above, if the electronic component that need heat is more than two, the duration of work of the work ratio of the output voltage of power module then can distribute its duration of work 610 to each well heater according to quantity, therefore the heatable number of electronic components of the present invention is not limited to above-mentioned.
Except work ratio, for some embodiments, the heating means of electronic component it should be noted that whether electronic component 550 arrives normal running temperature.Fig. 9 illustrates the process flow diagram of Heating Electron element to operating temperature method of one embodiment of the invention.In the present embodiment, heating arrangement 500 further comprises temperature sensor 540, as shown in Figure 2.Temperature sensor 540 is configured at electronic component 550.Temperature sensor 540 is coupled to controller 510 by bus.Such as, controller 510 is by the sensing value of System Management Bus reading temperature sensor 540.Please refer to Fig. 2 and Fig. 9, controller 510 can detect the temperature (step S310) of electronic component 550 (such as hard disk) by temperature sensor 540.When the temperature of electronic component 550 reaches normal running temperature, controller 510 stops driving well heater 530 (step S320), and starts electronic component 550 (S330).By above-mentioned three steps, then when cold-starting electronic component, can learn whether the electronic component of device inside has been in exercisable temperature, and when not damaging power module 520, reach the object of electronic component 550 being carried out to heating operation.When the temperature of electronic component 550 reaches normal running temperature, controller 510 control heater 530 stops Heating Electron element 550.
Further, Figure 10 illustrates the process flow diagram of heating two electronic components to operating temperature method of another embodiment of the present invention.Please refer to Figure 10, first, under low temperature, controller controls primary heater and secondary heater heats a period of time (step S410) the first electronic component and the second electronic component respectively.Next, whether the temperature detecting the first electronic component is greater than 3 degree (step S420) Celsius.If the temperature of the first electronic component is not greater than 3 degree Celsius, then get back to step S410, continue to heat a period of time to the first electronic component and the second electronic component.If the temperature of the first electronic component is greater than 3 degree Celsius, then stops heating first electronic component, and heated for second electronic component a period of time (step S430).
Then, whether the temperature detecting the second electronic component is greater than 3 degree (step S440) Celsius.If the temperature of the second electronic component is not greater than 3 degree Celsius, then get back to step S430, continue to heat a period of time to the second electronic component.If the temperature of the second electronic component is greater than 3 degree Celsius, then stop heating second electronic component (step S450).Further, the temperature in order to ensure the first electronic component also rests on exercisable temperature, and controller can carry out step S460, whether is less than 0 degree Celsius with the temperature detecting the first electronic component.If the temperature of the first electronic component is greater than 0 degree Celsius, then start the first electronic component and the second electronic component (step S490).If the temperature of the first electronic component is less than 0 degree Celsius, then heated for first electronic component a period of time (step S470).Then, after step S470, whether the temperature detecting the first electronic component is again greater than 3 degree (step S480) Celsius.If not, then get back to step S470 to continue to heat a period of time to the first electronic component.Otherwise, also enter step S490, complete startup first electronic component and the second electronic component.
By the heating means of above-described embodiment, then can guarantee all starting when being heated to operating temperature two electronic components.It should be noted that and above-mentioned judge whether that the enough ceiling temperatures of heating are 3 degree Celsius, and the lower limit temperature sentencing temperature whether deficiency is 0 degree Celsius.Heat to prevent one of them electronic component and after stopping heating, when waiting for the heating of another electronic component, stopped the electronic component temperature of heating to be at once down to below lower limit temperature again.Therefore, judging that the upper limit heated is increased to 3 degree Celsius higher than lower limit temperature, to provide a buffering range.But judge that the ceiling temperature that heat and lower limit temperature are determined by realistic situation, only the ceiling temperature that heated of judgement of the present invention and lower limit temperature are not limited to 3 degree and 0 degree Celsius Celsius.
General situation, in the system of device in action, such as notebook computer, flat computer etc., if the temperature of power module too low (such as-17 degree Celsius are following), then the efficiency of power module supply electric power is not enough to the well heater of driving hard disk.In any case now the power module of low temperature enough supplies electric power such as, to other system element, central processing unit (CPU, CentralProcessorUnit) etc.After the system elements such as central processing unit power on, these system elements can produce heat energy and heat whole electronic installation inside.Therefore, the present embodiment preheats utilizing these system elements.Carrying out in pre-warmed process, except these system elements provide heat energy, battery also can discharge heat energy because of electric discharge, and then promotes battery temperature, namely promotes the efficiency of power module supply electric power.If the temperature of power module is higher than temperature more than such as-17 degree Celsius, then the efficiency of power module supply electric power is enough to drive the well heater of hard disk usually, therefore can directly use the electric power of power module to heat hard disk (electronic component).It should be noted that above-mentioned-17 degree Celsius are only citing, actual temperature must decide depending on battery behavior.
Figure 11 illustrates the process flow diagram of the electronic installation heating means of further embodiment of this invention.Please refer to Figure 11, first user starts start (step S710), and now, controller checks that whether the temperature of battery (power module) is lower than-17 degree (step S720) Celsius.If judge, battery temperature is higher than-17 degree Celsius, then controller checks that whether hard disk temperature is lower than hard disk normal working temperature lower limit (step S723).In this step, usual hard disk normal working temperature lower limit is zero centigrade.If step S723 judges that hard disk temperature is lower than normal working temperature lower limit, then carry out step S725, to heat hard disk a period of time (such as heating several minutes), then then normal booting procedure (step S780) can be carried out.Such as, the normal booting procedure such as selftest (PowerOnSelfTest, POST) and load operation system (operatingsystem, OS) after starting shooting.In addition, if step S723 judges that hard disk temperature is higher than normal working temperature lower limit, then directly carry out the normal booting procedure of step S780.
In step S720, if judge, battery temperature is lower than-17 degree Celsius, then first preheat a period of time (such as three minutes) (step S730) to the element (such as central processing unit etc.) of system.In the present embodiment, step S730 can use heating means as described in Figure 1, and the method namely according to cell output voltage dynamic conditioning work ratio carrys out drive system element so that preheating system/battery.
Next, except continued power preheats to system element, battery (power module) also supplies electrical power to well heater to heat hard disk a period of time (step S740).Next step S750 is carried out, to judge the output voltage work ratio of battery temperature and dynamic conditioning power module.In the present embodiment, step S740 or step S750 can use heating means as described in Figure 1, method namely according to cell output voltage dynamic conditioning work ratio drives well heater to heat hard disk, and/or is that drive system element is so that preheating system/battery.
Moreover whether controller detecting hard disk temperature arrives a normal boot-strap temperature (step S760).If when the temperature of hard disk is not higher than normal boot-strap lowest temperature, then gets back to step S740 and proceed system and preheat and heat hard disk.Otherwise if hard disk temperature is higher than normal boot-strap lowest temperature, then preheat end to system, hard disk heating also terminates, and postpones a period of time (such as three seconds) (step S770), to prevent transient voltage too high.In this, then can start normal booting procedure (step S780).
In sum, the invention provides the heating means of electronic component in a kind of low temperature environment, it obtains a work ratio according to the output voltage of power module, and produce corresponding duration of work according to this work ratio, to be heated to normal running temperature to electronic component, electronic component can be operated under low temperature environment.Further, the duration of work of the ratio that more can share out the work, in most individual different electronic component, can improve the effective utilization of well heater.The invention provides the heating arrangement of electronic component in a kind of low temperature environment, it utilizes the heating means of electronic component, heats at least one electronic component.The present invention also provides a kind of electronic installation, and it comprises above-mentioned heating arrangement, is suitable for being applied under low temperature environment, and under specific low temperature, also can heat system element.
Claims (17)
1. the heating means of electronic component in low temperature environment, wherein a primary heater is configured in one first electronic component, it is characterized in that, these heating means comprise:
According to a job than the electric energy driving this primary heater to use a power module;
If the output voltage of this power module is greater than one first critical value, then this work ratio is set as one first ratio;
If the output voltage of this power module is less than one second critical value, then this work ratio is set as one second ratio, wherein this second critical value is less than this first critical value and is greater than zero, and this second ratio is less than this first ratio; And
If the output voltage of this power module is between this first critical value and this second critical value, adjust this work ratio, make the output voltage of this power module and the difference of this second critical value, with this work than proportional;
Wherein, the step of this work ratio of described adjustment comprises: be set as by this work ratio (DH-DL) × [(V-VL)/(VH-VL)], wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, V is the output voltage of this power module, VH is this first critical value, and VL is this second critical value.
2. the heating means of electronic component in low temperature environment as claimed in claim 1, it is characterized in that, this first ratio is 100%, and this second ratio is 0%.
3. the heating means of electronic component in low temperature environment as claimed in claim 1, it is characterized in that, in the step of this work ratio of described adjustment, this work is than between this first ratio and this second ratio.
4. the heating means of electronic component in low temperature environment as claimed in claim 1, it is characterized in that, this first ratio and DH are 75%, and this second ratio is 0%, DL is 10%, and this first critical value VH is 8.1, and this second critical value VL is 7.1.
5. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprise:
Configure a secondary heater in one second electronic component; And
According to this work ratio, this secondary heater is driven to use the electric energy of this power module;
Do not overlap during the activation of wherein this primary heater with during the activation of this secondary heater.
6. the heating means of electronic component in low temperature environment as claimed in claim 5, is characterized in that, the duration of work of this work ratio is all given this primary heater and this secondary heater.
7. the heating means of electronic component in low temperature environment as claimed in claim 5, is characterized in that, when the temperature of this first electronic component reaches a normal running temperature, the duration of work of this work ratio is all distributed to this secondary heater.
8. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprise:
Configure a secondary heater in one second electronic component; And
According to this work ratio, use this secondary heater of electrical energy drive of this power module;
During being overlapped in the activation of this secondary heater during the activation of wherein this primary heater, and during the activation of this primary heater with the activation of this secondary heater during temporal summation be not more than work period of this work ratio.
9. the heating means of electronic component in low temperature environment as claimed in claim 1, is characterized in that, also comprise:
Detect the temperature of this first electronic component;
When the temperature of this first electronic component reaches a normal running temperature, stop driving this primary heater; And
When the temperature of this first electronic component reaches this normal running temperature, start this first electronic component.
10. the heating means of electronic component in low temperature environment as claimed in claim 1, it is characterized in that, this first electronic component is Winchester disk drive.
In 11. low temperature environments as claimed in claim 1, the heating means of electronic component, is characterized in that, this power module is that a battery module or exchanges breakout box.
The heating arrangement of electronic component in 12. 1 kinds of low temperature environments, is characterized in that, comprising:
One primary heater, is configured at one first electronic component;
One power module, provides the electric energy needed for this primary heater; And
One controller, is coupled to this primary heater and this power module, and wherein this controller uses the electric energy of this power module to heat this first electronic component according to a job than controlling this primary heater; If the output voltage of this power module is greater than one first critical value, then this controller sets this work ratio is one first ratio; If the output voltage of this power module is less than one second critical value, then this controller sets this work ratio is one second ratio; This second critical value is less than this first critical value and is greater than zero; This second ratio is less than this first ratio; And if the output voltage of this power module is between this first critical value and this second critical value, then this controller adjusts this work ratio, makes the output voltage of this power module and the difference of this second critical value, with this work than proportional;
Wherein, this work ratio is set as (DH-DL) × [(V-VL)/(VH-VL)] by this controller, wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, V is the output voltage of this power module, VH is this first critical value, and VL is this second critical value.
The heating arrangement of electronic component in 13. low temperature environments as claimed in claim 12, it is characterized in that, when the output voltage of this power module is between this first critical value and this second critical value, this controller adjusts this work than between this first ratio and this second ratio.
The heating arrangement of electronic component in 14. low temperature environments as claimed in claim 12, is characterized in that, also comprise:
One temperature sensor, be configured at this first electronic component to detect the temperature of this first electronic component, this temperature sensor is coupled to this controller;
Wherein when the temperature of this first electronic component reaches a normal running temperature, this controller controls this primary heater and stops heating.
15. 1 kinds of electronic installations, is characterized in that, comprising:
One first electronic component;
One primary heater, is configured at one first electronic component;
One power module, provides this electronic installation and the electric energy needed for this primary heater; And
One controller, is coupled to this primary heater and this power module, and this controller uses the electric energy of this power module to heat this first electronic component according to a job than controlling this primary heater;
If wherein the output voltage of this power module is greater than one first critical value, then this controller sets this work ratio is one first ratio; If the output voltage of this power module is less than one second critical value, then this controller sets this work ratio is one second ratio; This second critical value is less than this first critical value and is greater than zero; This second ratio is less than this first ratio; And if the output voltage of this power module is between this first critical value and this second critical value, then this controller adjusts this work ratio, makes the output voltage of this power module and the difference of this second critical value, with this work than proportional;
Wherein, this work ratio is set as (DH-DL) × [(V-VL)/(VH-VL)] by this controller, wherein DH be less than or equal to 1 positive number, DL is the positive number being less than DH, V is the output voltage of this power module, VH is this first critical value, and VL is this second critical value.
16. electronic installations as claimed in claim 15, is characterized in that, when the output voltage of this power module is between this first critical value and this second critical value, this controller adjusts this work than between this first ratio and this second ratio.
17. electronic installations as claimed in claim 15, is characterized in that, also comprise:
One temperature sensor, be configured at this first electronic component to detect the temperature of this first electronic component, this temperature sensor is coupled to this controller;
Wherein when the temperature of this first electronic component reaches a normal running temperature, this controller controls this primary heater and stops heating.
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| CN201110339947.1A CN103092295B (en) | 2011-11-02 | 2011-11-02 | The heating means of electronic component and device and electronic installation |
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| CN201110339947.1A CN103092295B (en) | 2011-11-02 | 2011-11-02 | The heating means of electronic component and device and electronic installation |
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| US6928559B1 (en) * | 1997-06-27 | 2005-08-09 | Broadcom Corporation | Battery powered device with dynamic power and performance management |
| CN1886709A (en) * | 2003-11-26 | 2006-12-27 | 摩托罗拉公司 | Apparatus and method of computer component heating |
| CN2727963Y (en) * | 2004-08-30 | 2005-09-21 | 西安电子科技大学 | Thermoelectric and micro-channel circulating heat exchange system |
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