CN103071616A - Graded vibrating sieve for wafers - Google Patents

Graded vibrating sieve for wafers Download PDF

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Publication number
CN103071616A
CN103071616A CN2013100060031A CN201310006003A CN103071616A CN 103071616 A CN103071616 A CN 103071616A CN 2013100060031 A CN2013100060031 A CN 2013100060031A CN 201310006003 A CN201310006003 A CN 201310006003A CN 103071616 A CN103071616 A CN 103071616A
Authority
CN
China
Prior art keywords
sieve
blanking box
graded
wafers
vibrating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100060031A
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Chinese (zh)
Inventor
杨涛
袁林
杜广辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HENAN TAIHANG VIBRATING MACHINERY CO Ltd
Original Assignee
HENAN TAIHANG VIBRATING MACHINERY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HENAN TAIHANG VIBRATING MACHINERY CO Ltd filed Critical HENAN TAIHANG VIBRATING MACHINERY CO Ltd
Priority to CN2013100060031A priority Critical patent/CN103071616A/en
Publication of CN103071616A publication Critical patent/CN103071616A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a graded vibrating sieve for wafers. According to the graded vibrating sieve for the wafers, the bottom of a sieve frame is provided with a sealed type blanking box, vibration damping springs are symmetrically installed between the upper face of the blanking box and the bottom surface of the sieve frame, sieve pots are evenly distributed in the sieve frame, at least one blanking hopper is downwards installed in the blanking box corresponding to the sieve pots, one side of the front face of the blanking box is provided with a door which can be opened or closed, both sides of the sieve frame are symmetrically provided with a pair of synchronous vibrating motors, and a variable-frequency control box is connected between the two vibrating motors by using a conducting wire. Compared with the prior art, the graded vibrating sieve for the wafers has small labor strength, high working efficiency and good quality, and the requirement of mass production can be met.

Description

The wafer grading oscillating screen
Technical field:
The present invention relates to screening, particularly a kind of wafer grading oscillating screen that uses when being applicable to the photoelectricity industry to the wafer classification.
Background technology:
At present, the photoelectricity industry is to the classification of wafer, all be to use the hand sorting by artificial, not only separation velocity slow, yield poorly, also can't satisfy the needs of large-scale production.
Summary of the invention:
The purpose of this invention is to provide that a kind of hierarchical speed is fast, labour intensity is little, satisfy the wafer grading oscillating screen of large-scale production needs.
Technical scheme of the present invention is finished as follows, the wafer grading oscillating screen, it is characterized in that: it is to be provided with a closed blanking box in the bottom of a screen frame, on blanking box and between the screen frame bottom surface, be symmetrically installed with damping spring, in screen frame, be evenly equipped with the sieve pot, in blanking box corresponding to sieve pot, at least one material-falling hopper is installed downwards, but be provided with the door of a switch in the front of blanking box one side, bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor, is connected with a VFC case with wire between two vibrating motors.
The present invention compared with prior art has little, the high efficiency of labour intensity, and quality is good, can satisfy the needs of large-scale production.
Description of drawings:
Fig. 1 is structural representation of the present invention; Fig. 2 is plan structure schematic diagram of the present invention.
The specific embodiment:
Describe by reference to the accompanying drawings embodiment in detail, it includes a screen frame 2, be provided with a closed blanking box 8 in the screen frame bottom, be symmetrically installed with damping spring 6 on blanking box and between the screen frame bottom surface, in screen frame, be evenly equipped with the sieve pot 3 of conveniently assemble and disassemble, in blanking box corresponding to sieve pot to having 2-3 material-falling hopper 7, but be provided with the door 9 of a switch in the front of blanking box one side, can be conveniently with well-graded wafer recovery.Bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor 1, is connected with a VFC case 4 with wire 5 between two vibrating motors.How many VFC casees can regulate according to the upper material of sieve pot the rotating speed of vibrating motor, guarantees the gradation sizing efficient of wafer.

Claims (1)

1. wafer grading oscillating screen, it is characterized in that: it is to be provided with a closed blanking box in the bottom of a screen frame, on blanking box and between the screen frame bottom surface, be symmetrically installed with damping spring, in screen frame, be evenly equipped with the sieve pot, in blanking box corresponding to sieve pot, at least one material-falling hopper is installed downwards, but be provided with the door of a switch in the front of blanking box one side, bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor, is connected with a VFC case with wire between two vibrating motors.
CN2013100060031A 2012-10-24 2013-01-08 Graded vibrating sieve for wafers Pending CN103071616A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013100060031A CN103071616A (en) 2012-10-24 2013-01-08 Graded vibrating sieve for wafers

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201210407011 2012-10-24
CN201210407011.2 2012-10-24
CN2013100060031A CN103071616A (en) 2012-10-24 2013-01-08 Graded vibrating sieve for wafers

Publications (1)

Publication Number Publication Date
CN103071616A true CN103071616A (en) 2013-05-01

Family

ID=48148430

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100060031A Pending CN103071616A (en) 2012-10-24 2013-01-08 Graded vibrating sieve for wafers

Country Status (1)

Country Link
CN (1) CN103071616A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104242855A (en) * 2014-09-19 2014-12-24 湖北泰晶电子科技股份有限公司 Tool jig used for arranging produced tuning fork type resonator element wafers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025018A1 (en) * 2001-05-30 2003-02-06 William Mashburn Device and process for pulverizing solid materials
CN201249180Y (en) * 2008-08-06 2009-06-03 河南久大电子电器有限公司 Grain selecting machine
CN201978888U (en) * 2011-01-17 2011-09-21 江阴市江海光伏科技有限公司 Quartz wafer sand screening machine
CN202539059U (en) * 2012-03-12 2012-11-21 海城市方宏耐火材料有限公司 Anti-plugging frequency conversion type vibrating screen
CN203030508U (en) * 2012-10-24 2013-07-03 河南太行振动机械股份有限公司 Vibrating screen for wafer grading

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025018A1 (en) * 2001-05-30 2003-02-06 William Mashburn Device and process for pulverizing solid materials
CN201249180Y (en) * 2008-08-06 2009-06-03 河南久大电子电器有限公司 Grain selecting machine
CN201978888U (en) * 2011-01-17 2011-09-21 江阴市江海光伏科技有限公司 Quartz wafer sand screening machine
CN202539059U (en) * 2012-03-12 2012-11-21 海城市方宏耐火材料有限公司 Anti-plugging frequency conversion type vibrating screen
CN203030508U (en) * 2012-10-24 2013-07-03 河南太行振动机械股份有限公司 Vibrating screen for wafer grading

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104242855A (en) * 2014-09-19 2014-12-24 湖北泰晶电子科技股份有限公司 Tool jig used for arranging produced tuning fork type resonator element wafers

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130501