CN103071616A - Graded vibrating sieve for wafers - Google Patents
Graded vibrating sieve for wafers Download PDFInfo
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- CN103071616A CN103071616A CN2013100060031A CN201310006003A CN103071616A CN 103071616 A CN103071616 A CN 103071616A CN 2013100060031 A CN2013100060031 A CN 2013100060031A CN 201310006003 A CN201310006003 A CN 201310006003A CN 103071616 A CN103071616 A CN 103071616A
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- sieve
- blanking box
- graded
- wafers
- vibrating
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Abstract
The invention discloses a graded vibrating sieve for wafers. According to the graded vibrating sieve for the wafers, the bottom of a sieve frame is provided with a sealed type blanking box, vibration damping springs are symmetrically installed between the upper face of the blanking box and the bottom surface of the sieve frame, sieve pots are evenly distributed in the sieve frame, at least one blanking hopper is downwards installed in the blanking box corresponding to the sieve pots, one side of the front face of the blanking box is provided with a door which can be opened or closed, both sides of the sieve frame are symmetrically provided with a pair of synchronous vibrating motors, and a variable-frequency control box is connected between the two vibrating motors by using a conducting wire. Compared with the prior art, the graded vibrating sieve for the wafers has small labor strength, high working efficiency and good quality, and the requirement of mass production can be met.
Description
Technical field:
The present invention relates to screening, particularly a kind of wafer grading oscillating screen that uses when being applicable to the photoelectricity industry to the wafer classification.
Background technology:
At present, the photoelectricity industry is to the classification of wafer, all be to use the hand sorting by artificial, not only separation velocity slow, yield poorly, also can't satisfy the needs of large-scale production.
Summary of the invention:
The purpose of this invention is to provide that a kind of hierarchical speed is fast, labour intensity is little, satisfy the wafer grading oscillating screen of large-scale production needs.
Technical scheme of the present invention is finished as follows, the wafer grading oscillating screen, it is characterized in that: it is to be provided with a closed blanking box in the bottom of a screen frame, on blanking box and between the screen frame bottom surface, be symmetrically installed with damping spring, in screen frame, be evenly equipped with the sieve pot, in blanking box corresponding to sieve pot, at least one material-falling hopper is installed downwards, but be provided with the door of a switch in the front of blanking box one side, bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor, is connected with a VFC case with wire between two vibrating motors.
The present invention compared with prior art has little, the high efficiency of labour intensity, and quality is good, can satisfy the needs of large-scale production.
Description of drawings:
Fig. 1 is structural representation of the present invention; Fig. 2 is plan structure schematic diagram of the present invention.
The specific embodiment:
Describe by reference to the accompanying drawings embodiment in detail, it includes a screen frame 2, be provided with a closed blanking box 8 in the screen frame bottom, be symmetrically installed with damping spring 6 on blanking box and between the screen frame bottom surface, in screen frame, be evenly equipped with the sieve pot 3 of conveniently assemble and disassemble, in blanking box corresponding to sieve pot to having 2-3 material-falling hopper 7, but be provided with the door 9 of a switch in the front of blanking box one side, can be conveniently with well-graded wafer recovery.Bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor 1, is connected with a VFC case 4 with wire 5 between two vibrating motors.How many VFC casees can regulate according to the upper material of sieve pot the rotating speed of vibrating motor, guarantees the gradation sizing efficient of wafer.
Claims (1)
1. wafer grading oscillating screen, it is characterized in that: it is to be provided with a closed blanking box in the bottom of a screen frame, on blanking box and between the screen frame bottom surface, be symmetrically installed with damping spring, in screen frame, be evenly equipped with the sieve pot, in blanking box corresponding to sieve pot, at least one material-falling hopper is installed downwards, but be provided with the door of a switch in the front of blanking box one side, bilateral symmetry at screen frame is equipped with a pair of synchronous vibration motor, is connected with a VFC case with wire between two vibrating motors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013100060031A CN103071616A (en) | 2012-10-24 | 2013-01-08 | Graded vibrating sieve for wafers |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210407011 | 2012-10-24 | ||
CN201210407011.2 | 2012-10-24 | ||
CN2013100060031A CN103071616A (en) | 2012-10-24 | 2013-01-08 | Graded vibrating sieve for wafers |
Publications (1)
Publication Number | Publication Date |
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CN103071616A true CN103071616A (en) | 2013-05-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2013100060031A Pending CN103071616A (en) | 2012-10-24 | 2013-01-08 | Graded vibrating sieve for wafers |
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CN (1) | CN103071616A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104242855A (en) * | 2014-09-19 | 2014-12-24 | 湖北泰晶电子科技股份有限公司 | Tool jig used for arranging produced tuning fork type resonator element wafers |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030025018A1 (en) * | 2001-05-30 | 2003-02-06 | William Mashburn | Device and process for pulverizing solid materials |
CN201249180Y (en) * | 2008-08-06 | 2009-06-03 | 河南久大电子电器有限公司 | Grain selecting machine |
CN201978888U (en) * | 2011-01-17 | 2011-09-21 | 江阴市江海光伏科技有限公司 | Quartz wafer sand screening machine |
CN202539059U (en) * | 2012-03-12 | 2012-11-21 | 海城市方宏耐火材料有限公司 | Anti-plugging frequency conversion type vibrating screen |
CN203030508U (en) * | 2012-10-24 | 2013-07-03 | 河南太行振动机械股份有限公司 | Vibrating screen for wafer grading |
-
2013
- 2013-01-08 CN CN2013100060031A patent/CN103071616A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030025018A1 (en) * | 2001-05-30 | 2003-02-06 | William Mashburn | Device and process for pulverizing solid materials |
CN201249180Y (en) * | 2008-08-06 | 2009-06-03 | 河南久大电子电器有限公司 | Grain selecting machine |
CN201978888U (en) * | 2011-01-17 | 2011-09-21 | 江阴市江海光伏科技有限公司 | Quartz wafer sand screening machine |
CN202539059U (en) * | 2012-03-12 | 2012-11-21 | 海城市方宏耐火材料有限公司 | Anti-plugging frequency conversion type vibrating screen |
CN203030508U (en) * | 2012-10-24 | 2013-07-03 | 河南太行振动机械股份有限公司 | Vibrating screen for wafer grading |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104242855A (en) * | 2014-09-19 | 2014-12-24 | 湖北泰晶电子科技股份有限公司 | Tool jig used for arranging produced tuning fork type resonator element wafers |
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PB01 | Publication | ||
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130501 |