CN103051831A - Photographic device - Google Patents

Photographic device Download PDF

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Publication number
CN103051831A
CN103051831A CN2011103192264A CN201110319226A CN103051831A CN 103051831 A CN103051831 A CN 103051831A CN 2011103192264 A CN2011103192264 A CN 2011103192264A CN 201110319226 A CN201110319226 A CN 201110319226A CN 103051831 A CN103051831 A CN 103051831A
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CN
China
Prior art keywords
lens
clearance component
camera head
module
support unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2011103192264A
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Chinese (zh)
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CN103051831B (en
Inventor
侯志昆
柯庆鸿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Himax Technologies Ltd
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Himax Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Himax Technologies Ltd filed Critical Himax Technologies Ltd
Priority to CN201110319226.4A priority Critical patent/CN103051831B/en
Publication of CN103051831A publication Critical patent/CN103051831A/en
Application granted granted Critical
Publication of CN103051831B publication Critical patent/CN103051831B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention discloses a photographic device, comprising a lens module, an image sensor, a first gap element and a lug element, wherein the lens group comprises a lens unit and a support unit, and the support unit is connected to the lens unit; the image sensor is arranged corresponding to the lens unit so as to sense light from the lens unit; the first gap element is arranged between the support unit of the lens module and the image sensor so as to separate the lens module from the image sensor; and the lug element is arranged on the support unit and located between the first gap element and the lens unit so as to prevent the first gap element from contacting the lens unit.

Description

Camera head
[technical field]
The invention relates to a kind of video camera module, and particularly relevant for a kind of video camera module that can make at wafer stage.
[background technology]
Microcam is widely used in the middle of many electronic products, for example mobile phone and.In recent years, wafer scale camera module (WLCMs) has been used in the middle of this microcam, and wafer scale camera module has a wafer-level lens module and embeds wherein.The wafer-level lens module is to be stacked by a plurality of transparent wafer configurations to form, and the polymer camera lens system in the middle of the array forms with the method for repeated arrangement.Therefore, the wafer scale camera module just needs, and volume is little, lightweight, and cost is low, is convenient to large-scale production.
The separation material that the common employing of wafer scale camera module is comprised of gel separates each element in the middle of the wafer scale camera module.Yet, if the separation material that is comprised of gel melts and overflows, can cover the camera lens zone, these gels that overflow may obstruct the light, and cause image quality to descend.Therefore, need a kind of new wafer scale camera module, to promote image quality.
[summary of the invention]
Therefore, one of the present invention aspect is that a kind of camera module is being provided, and can prevent that wherein clearance component from overflowing and cover the pollution lens area.
According to one embodiment of the invention, camera head includes a lens module, an image sensor, one first clearance component, and a projection element.The lens module contains a lens unit and a support unit, and support unit is connected to lens unit; Image sensor arranges corresponding to lens unit, with the sensing light next by lens unit; The first clearance component is arranged between the support unit and image sensor of lens module, with partition lens module and image sensor.The projection element is arranged on the support unit and between the first clearance component and lens unit, touches lens unit to prevent the first clearance component.
Another aspect of the present invention is that another kind of camera module is being provided, and can prevent that also wherein clearance component from overflowing and cover the pollution lens area.
According to another embodiment of the present invention, camera head includes a lens module, an image sensor, at least one the first clearance component and a projection element.The lens module contains a lens unit and a support unit, and lens unit has arcuation surface and a flat surfaces, and wherein arcuation surface and flat surfaces are back-to-back; Support unit connects lens unit; Image sensor arranges corresponding to a flat surfaces of lens unit, the light that is come by lens unit with sensing; The first clearance component is arranged between the support unit and image sensor of lens module, with partition lens module and image sensor.The projection element is arranged on the support unit and between the first clearance component and lens unit, touches this lens unit to prevent the first clearance component.
The camera head of above embodiment utilizes projection element wherein to intercept the first clearance component and lens unit, can prevent that the diffusion of the first clearance component from coming and pollute other elements, does not make element in the middle of the camera head contaminated and keep image quality.
[description of drawings]
For above and other purpose of the present invention, feature, advantage and embodiment can be become apparent, appended graphic being described as follows:
Fig. 1 is the camera head profile that illustrates an embodiment of the present invention.
Fig. 2 is the camera head profile that illustrates another execution mode of the present invention.
100: camera head 101: the lens module
101a: lens unit 101b: support unit
103: 105: the first clearance components of image sensor
107: projection element 109: the photopolymerization resin layer
111: 113: the second clearance components of aperture module
115: thin layer 117: the projection element
200: camera head 201: the lens module
201a: lens unit 201b: support unit
202a: arcuation surface 202b: flat surfaces
203: 205: the first clearance components of image sensor
207: projection element 209: the photopolymerization resin layer
211: 213: the second clearance components of aperture module
215: thin layer 217: the projection element
[embodiment]
The camera module of following examples is to be applied on mobile phone or the notebook computer, and this camera module is to adopt the projection element to prevent the movement of clearance component and photopolymerization resin layer.Thus, clearance component and photopolymerization resin layer just can not touch lens unit, avoid stained lens unit, thereby can improve image quality.
Please refer to Fig. 1, it is the camera head profile that illustrates an embodiment of the present invention.Camera head 100 contains lens module 101, image sensor 103, the first clearance component 105 and projection element 107.Lens module 101 and image sensor 103 can be implemented on respectively on lens wafers or the sensing wafer.
Lens module 101 includes lens unit 101a and support unit 101b, and support unit 101b is connected to lens unit 101a.Lens unit 101a can contain convex lens or concavees lens and reflect from outside and light that come, light is compiled or bending is dispersed.Image sensor 103 is to arrange with respect to lens unit 101a, passes the light of lens unit 101a with sensing.By lens unit 101a, light can suitable angle be projected on the image sensor 103.
The first clearance component 105 is arranged between the support unit 101b and image sensor 103 of lens module 101, with partition lens module 101 and image sensor 103.The material of the first clearance component 105 can be glass, elastomeric material or other materials, as long as the first clearance component 105 can separate lens module 101 and image sensor 103.
Projection element 107 arranges and depends on the support unit 101b with projection element 117, and the material of projection element 107/117 is photopolymerization resin (light curing resin), namely ultraviolet glue (UV glue).Furthermore, projection element 107 is arranged between the first clearance component 105 and the lens unit 101a, prevents that the first clearance component 105 from touching lens unit 101a.In order to make image sensor 103 can sense the light of wide-angle, the height of projection element 107 need to be less than the height of the first clearance component 105.By the height of restriction projection element 107, projection element 107 just can not stop that needs are passed to the light of image sensor 103.
Camera head 100 more contains photopolymerization resin layer 109, and this photopolymerization resin layer 109 is attached to support unit 101b and first clearance component 105 of lens module 101, and the first clearance component 105 is adhered on the support unit 101b.For projection element 107 can normally must be acted on, the height of projection element 107 need to be greater than the height of photopolymerization resin layer 109.Thus, the end of projection element 107 will surpass the border of the first clearance component 105, therefore can stop to prevent that the first clearance component 105 is moved with photopolymerization resin layer 109.The first clearance component 105 just can not touch with photopolymerization resin layer 109 and pollute lens unit 101a, image quality thereby lifting.
Camera head 100 further contains aperture module 111, the second clearance component 113, and thin layer 115.111 controls of aperture module also receive the light that enters camera head 100, that is to say the quantity that 111 controls of aperture module enter camera head 100 light.The second clearance component 113 is arranged between support unit 101b and the aperture module 111, and this second clearance component 113 is that support unit 101b and aperture module 111 are separated.115 of thin layers are attached to aperture module 111, and thin layer 115 is that aperture module 111 is engaged to the second clearance component 113 that material is glass.
Please refer to Fig. 2, it is the camera head profile that illustrates another execution mode of the present invention.In the middle of the camera head 200 in the middle of this embodiment, except structure and the structure of lens unit 101a of lens unit 201a are different, its in structure be with Fig. 1 in the middle of camera head 100 be similar to.
Camera head 200 contains lens module 201, image sensor 203, the first clearance component 205 and projection element 207.Lens module 201 contains lens unit 201a and support unit 201b, and support unit 201b system connects lens unit 201a.
Lens unit 201a has arcuation surface 202a and a flat surfaces 202b, and wherein arcuation surface 202a and flat surfaces 202b are back-to-back.That is to say, if the light-entering surface of lens unit 201a is defined as destination end, and the light output surface of lens unit 201a is defined as sense terminals, and 202a system in arcuation surface is formed at the destination end of lens unit 201a so, and flat surfaces 202b then is formed at the sense terminals of lens unit 201a.Arcuation surface 202a can be convex lens, is used for adjusting the angle of incident light, can receive in order to image sensor 203.
Image sensor 203 arranges corresponding to the flat surfaces 202b of lens unit 201a, the light that is come by lens unit 201a with sensing.The first clearance component 205 is arranged between the support unit 201b and image sensor 203 of lens module 201, with partition lens module 201 and image sensor 203.Projection element 207 can namely U glue be made by photopolymerization resin layer (light curing resin), this projection element 207 is arranged at support unit 201b upward and between the first clearance component 205 and lens unit 201a, touches lens unit 201a to prevent the first clearance component 205.
In order to make image sensor 203 can sense the light of wide-angle, the height of projection element 207 need to be less than the height of the first clearance component 105.By the height of restriction projection element 207, projection element 207 just can not stop that needs are passed to the light of image sensor 203.
Camera head 200 more contains photopolymerization resin layer 209, and this photopolymerization resin layer 209 is attached to support unit 201b and first clearance component 205 of lens module 201, and the first clearance component 205 is adhered on the support unit 201b.For projection element 207 can normally must be acted on, the height of projection element 207 need to be greater than the height of photopolymerization resin layer 209.Thus, the end of projection element 207 will surpass the border of the first clearance component 205, therefore can stop to prevent that the first clearance component 205 is moved with photopolymerization resin layer 209.The first clearance component 205 just can not touch with photopolymerization resin layer 209 and pollute lens unit 201a, image quality thereby lifting.
Camera head 200 further contains aperture module 211, the second clearance component 213, and thin layer 215.211 controls of aperture module also receive the light that enters camera head 200, that is to say the quantity that 211 controls of aperture module enter camera head 200 light.The second clearance component 213 is arranged between support unit 201b and the aperture module 211, and this second clearance component 213 is that support unit 201b and aperture module 211 are separated.215 of thin layers are attached to aperture module 211, and thin layer 215 is that aperture module 211 is engaged to the second clearance component 213 that material is glass.
It is mobile that the projection element of above embodiment can prevent that clearance component and photopolymerization resin layer from producing, so lens unit just can avoid being touched by clearance component or photopolymerization resin layer and stained, the image quality of camera head thereby promoted.
Although the present invention discloses as above with execution mode; so it is not to limit the present invention; any persond having ordinary knowledge in the technical field of the present invention person; without departing from the spirit and scope of the present invention; when can doing various changes and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.

Claims (16)

1. camera head comprises:
One lens module comprises a lens unit and a support unit, and this support unit is connected to this lens unit;
One image sensor arranges corresponding to this lens unit, with the sensing light next by this lens unit;
At least one the first clearance component is arranged between this support unit and this image sensor of this lens module, to separate this lens module and this image sensor; And
One projection element is arranged on this support unit and between this first clearance component and this lens unit, touches this lens unit to prevent this first clearance component.
2. camera head as claimed in claim 1, wherein the height of this projection element is less than the height of this first clearance component.
3. camera head as claimed in claim 1 wherein also comprises a photopolymerization resin layer, is attached to this support unit and this first clearance component of this lens module, so that this first clearance component is adhered on this support unit.
4. camera head as claimed in claim 1, wherein the height of this projection element is greater than the height of this photopolymerization resin layer.
5. camera head as claimed in claim 1, wherein the material of this first clearance component is glass.
6. camera head as claimed in claim 1, wherein the material of this lens module and this projection element is photopolymerization resin.
7. camera head as claimed in claim 1 wherein also comprises:
One aperture module is to control and to receive the light that enters this camera head;
One second clearance component is arranged between this support unit and this aperture module, this second clearance component with this support unit and this aperture mould splits every; And
One thin layer is attached to this aperture module, and this thin layer is engaged to this second clearance component with this aperture module.
8. camera head as claimed in claim 1, wherein this lens module and this image sensor are arranged at respectively on a lens wafers and the sensing wafer.
9. camera head comprises:
One lens module comprises:
One lens unit has arcuation surface and a flat surfaces, and wherein this arcuation surface and this flat surfaces are back-to-back; And
One support unit connects this lens unit;
One image sensor arranges corresponding to a flat surfaces of this lens unit, the light that is come by this lens unit with sensing;
At least one the first clearance component is arranged between this support unit and this image sensor of this lens module, to separate this lens module and this image sensor; And
One projection element is arranged on this support unit and between this first clearance component and this lens unit, touches this lens unit to prevent this first clearance component.
10. camera head as claimed in claim 9, wherein the height of this projection element is less than the height of this first clearance component.
11. camera head as claimed in claim 10 wherein also comprises a photopolymerization resin layer, is attached to this support unit and this first clearance component of this lens module, so that this first clearance component is adhered on this support unit.
12. camera head as claimed in claim 11, wherein the height of this projection element is greater than the height of this photopolymerization resin layer.
13. camera head as claimed in claim 9, wherein the material of this first clearance component is glass.
14. camera head as claimed in claim 9, wherein the material of this lens module and this projection element is photopolymerization resin.
15. camera head as claimed in claim 9 wherein also comprises:
One aperture module is to control and to receive the light that enters this camera head;
One second clearance component is arranged between this support unit and this aperture module, this second clearance component with this support unit and this aperture mould splits every; And
One thin layer is attached to this aperture module, and this thin layer is engaged to this second clearance component with this aperture module.
16. camera head as claimed in claim 1, wherein this lens module and this image sensor are arranged at respectively on a lens wafers and the sensing wafer.
CN201110319226.4A 2011-10-14 2011-10-14 Camera head Expired - Fee Related CN103051831B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110319226.4A CN103051831B (en) 2011-10-14 2011-10-14 Camera head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110319226.4A CN103051831B (en) 2011-10-14 2011-10-14 Camera head

Publications (2)

Publication Number Publication Date
CN103051831A true CN103051831A (en) 2013-04-17
CN103051831B CN103051831B (en) 2016-05-04

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ID=48064323

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110319226.4A Expired - Fee Related CN103051831B (en) 2011-10-14 2011-10-14 Camera head

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040017501A1 (en) * 2002-04-24 2004-01-29 Jun Asaga Electronic device
US20060062559A1 (en) * 2004-09-22 2006-03-23 Fuji Photo Film Co., Ltd. Lens driving device, imaging device using the same, and small-sized electronics device using the same
US20060132644A1 (en) * 2004-02-20 2006-06-22 Dongkai Shangguan Wafer based camera module and method of manufacture
CN102005392A (en) * 2009-09-02 2011-04-06 奇景半导体股份有限公司 Wafer level module and its fabricating method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040017501A1 (en) * 2002-04-24 2004-01-29 Jun Asaga Electronic device
US20060132644A1 (en) * 2004-02-20 2006-06-22 Dongkai Shangguan Wafer based camera module and method of manufacture
US20060062559A1 (en) * 2004-09-22 2006-03-23 Fuji Photo Film Co., Ltd. Lens driving device, imaging device using the same, and small-sized electronics device using the same
CN102005392A (en) * 2009-09-02 2011-04-06 奇景半导体股份有限公司 Wafer level module and its fabricating method

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