CN103047558A - Light emitting diode (LED) fluorescent lamp - Google Patents

Light emitting diode (LED) fluorescent lamp Download PDF

Info

Publication number
CN103047558A
CN103047558A CN2012104810545A CN201210481054A CN103047558A CN 103047558 A CN103047558 A CN 103047558A CN 2012104810545 A CN2012104810545 A CN 2012104810545A CN 201210481054 A CN201210481054 A CN 201210481054A CN 103047558 A CN103047558 A CN 103047558A
Authority
CN
China
Prior art keywords
fluorescent lamp
led fluorescent
pedestal
substrate
lampshade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104810545A
Other languages
Chinese (zh)
Inventor
萧标颖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUZHOU GLORY GREEN LIGHTING SYSTEM Corp
Original Assignee
SUZHOU GLORY GREEN LIGHTING SYSTEM Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU GLORY GREEN LIGHTING SYSTEM Corp filed Critical SUZHOU GLORY GREEN LIGHTING SYSTEM Corp
Priority to CN2012104810545A priority Critical patent/CN103047558A/en
Priority to CN2013101209147A priority patent/CN103225755A/en
Publication of CN103047558A publication Critical patent/CN103047558A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention discloses a light emitting diode (LED) fluorescent lamp. The lamp comprises a lamp cover which is made of light- transmitting plastics, a base, a base plate which is located in the lamp cover and arranged on the base plate and an LED chip which is arranged on the base plate, wherein the lamp cover is provided with an opening slot of which an opening is arranged downwards, the lamp cover surrounds the base plate in a half mode, the upper side face of the base is located in the opening slot of the lamp cover, the lower side face of the base is located outside the opening slot of the lamp cover and is communicated with the outside, the lamp cover and the base are integrated, the base is made of a composite plastic, and the composite plastic comprises a plastic base and an inorganic filler which is dispersed in the plastic base in a nano-stage size. The lamp has the advantages that the lamp cover and the base are sealed completely, the water-proof property is good, the lamp can be used at the harsh environment and is made of the composite plastic, the radiating performance is good, and the heat can be discharged out of the lamp cover.

Description

The LED fluorescent lamp
Technical field
Related to a kind of LED fluorescent lamp among the present invention.
Background technology
LED (Light Emitting Diode) is a kind of solid-state semiconductor devices, and it can directly be converted into light to electricity.
LED fluorescent lamp of the prior art need to solve two technical barriers usually: 1, how to solve heat dissipation problem, only solving competence exertion LED high power, long service life under the bad precondition of heat radiation, reduce the advantages such as light decay; 2, how so that the LED fluorescent lamp can waterproof, the adverse circumstances such as only under the LED fluorescent lamp can the precondition of waterproof, it could use out of doors, moist, existing Aluminium Alloys in Common Use fluorescent tube can't reach waterproof effect in conjunction with the diffuser mode.
Generally, the LED fluorescent lamp comprises lamp housing, covers on lampshade, substrate, led chip on the lamp housing, for the purpose lamp housing that reaches heat radiation adopts aluminum or aluminum alloy system usually, substrate adopt aluminium and aluminium alloy plate or, copper and copper alloy, pottery, FR-4 etc. make.But the LED fluorescent tube cost that adopts aluminum alloy casing is higher, weight is larger, and on the other hand because aluminium alloy is conductive material, so aluminum alloy casing has potential safety hazard, may have the risk of electric shock.
In addition, LED fluorescent tube, the ZL2012200919722LED fluorescent tube made by composite plastic of ZL2012200919652 LED fluorescent tube, ZL2012200919135 adopted composite plastic significantly to promote the thermal diffusivity of fluorescent tube.But this kind material does not have water resistance, can not use in adverse circumstances.
Summary of the invention
The invention provides a kind of LED fluorescent lamp, it has good heat dispersion and water resistance simultaneously.
The invention discloses a kind of LED fluorescent lamp, it comprises the lampshade of being made by light-passing plastic, pedestal, be positioned at lampshade and be arranged on substrate on the pedestal, be arranged on the led chip on the substrate, described lampshade has an open slot that Open Side Down, the described substrate of described lampshade semi-surrounding, the upper side of described pedestal is positioned at the open slot of described lampshade, the open slot that the downside of described pedestal is positioned at lampshade communicates outward and with the external world, described lampshade and described pedestal integral type structure, described pedestal is made by composite plastic, and composite plastic comprises plastic substrate and the inorganic filler in plastic substrate with nanoscale or micron order size dispersion.
Preferably, described lampshade is made by PC.
Preferably, the integrated extrusion moulding of described lampshade and pedestal.
Preferably, the downside of described pedestal is formed with one or more jogs.
Preferably, described substrate and described pedestal are affixed to cover and put.
Preferably, described substrate is pegged graft and is arranged on the described pedestal.
Preferably, described substrate comprises connection layer, insulating barrier, metal level from top to bottom successively, and described led chip is arranged on the connection layer, and described metal level is arranged on the described pedestal.
Preferably, the metal level of described substrate is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more.
Preferably, described connection layer is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more.
Preferably, described substrate comprises connection layer, insulated non-metal layer from top to bottom successively, and described led chip is arranged on the connection layer, and described insulated non-metal layer is arranged on the described pedestal.
Preferably, described insulated non-metal layer is made by in FR-4, glass-fiber-plate, the pottery one or more.
Preferably, described substrate is made by the connection layer.
Preferably, described substrate is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more.
Preferably, the diameter of the inorganic filler of described composite plastic is 10 -10 ～10 -6 Rice.
Preferably, the coefficient of heat transfer of described composite plastic is greater than 300W/m 2 K, thermal conductivity factor is between 5-10W/mK.
Preferably, the plastic substrate of described composite plastic is one or more in polyamide-based, PET series, epoxy resin, polyimides system, the PPS system.
Preferably, the inorganic filler of described composite plastic is one or more in carbon element, oxide based, nitride based, the hydroxide system.
Preferably, be provided with high heat conduction packing material between described substrate and the described pedestal.
Preferably, described high heat conduction packing material comprises one or more in high thermal conductive silicon film, silicone rubber heating sheet, silicon rubber heating film, silicon rubber electric heating piece, silicon rubber oil drum heater, silica gel cloth, conductive graphite sheet, heat conduction casting glue, heat conduction phase-transition material, the silica gel products.
The present invention adopts above structure, has the following advantages:
1, hermetically sealed setting between lampshade and the pedestal has good fire resistance characteristic, can use under rugged environment;
2, adopt composite plastic, it has good heat dissipation characteristics, heat can be discharged lampshade;
3, be provided with between led chip for the metal that conducts heat, metal has good thermal conduction characteristic, and the heat that led chip can be sent conducts to substrate;
4, between pedestal and substrate, be provided with high heat conduction packing material, can further heat be conducted to pedestal from led chip.
Description of drawings
Accompanying drawing 1 is the structural representation of the first embodiment of the present invention.
Accompanying drawing 2 is the structural representation of the second embodiment of the present invention.
Accompanying drawing 3 is the structural representation of the third embodiment of the present invention.
Accompanying drawing 4 is the structural representation of the fourth embodiment of the present invention.
Accompanying drawing 5 is the structural representation of the fifth embodiment of the present invention.
In the accompanying drawing: 1, lampshade; 11, open slot; 2, pedestal; 21, bending part; 22, jog; 3, substrate; 31, connection layer; 32, insulating barrier; 33, metal level; 34, connection layer; 35, insulated non-metal layer; 4, led chip; 5, high heat conduction packing material.
The specific embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that protection domain of the present utility model is made more explicit defining.
As shown in Figure 1, the first embodiment of the present invention, it comprises lampshade 1, pedestal 2, substrate 3, led chip 4 a kind of LED fluorescent lamp.
Lampshade 1 has an open slot that Open Side Down 11.Lampshade 1 is made by light-passing plastic.When the led chip 4 that is positioned at lampshade 1 was luminous, light appeared the formation light source from lampshade 1.Concrete, lampshade 1 can be made by PC.PC is the amorphous polymer of almost colourless glassy state, has well optical.The PC high molecular weight resin has very high toughness, and the cantilever beam notched Izod impact strength is 600～900J/m, and the heat distortion temperature of not filling the trade mark is approximately 130 ° of C, can make this numerical value increase by 10 ℃ after glass fibre strengthens.The bending modulus of PC can reach more than the 2400MPa, and resin can be processed into large rigid articles.When being lower than 100 ℃, the creep rate under load is very low.PC has preferably hydrolytic resistance.
Lampshade 1 semi-surrounding substrate 3, the upper side of pedestal 2 is positioned at the open slot 11 of lampshade 1, and the open slot 11 that the downside of pedestal 2 is positioned at lampshade 1 communicates outward and with the external world.Lampshade 1 forms integrated structure with pedestal 2 by integrated extrusion molding, and the combination between them is tight, sealing is good.Therefore the fluorescent tube that is formed by lampshade 1 and pedestal 2 has good water resistance.Because composite plastic same be made of plastics the same as lampshade, thereby they can adopt the extrusion molding one-shot forming.
Pedestal 2 is made by composite plastic, and composite plastic is to be formed in plastic substrate with nanoscale or micron order size dispersion by inorganic filler.Compare with traditional composite, plastic substrate and inorganic filler are being received in the scope compoundly, and interfacial area is very large between two-phase, chemical bond between Presence of an interface, form excellent cohesion, can eliminate the mutually unmatched problem of organic/inorganic, form diverse characteristic and manifest.
Nanoscale or micron-sized material can produce quantum size effect; 1. small-size effect; 2. skin effect; 3. macro quanta tunnel effect; 4. coulomb stops up and quantum tunneling.
Surface energy by nano level material is large, easily reunion can reduce surface energy, eliminate surface charge, weaken surface polarity, with surface coverage modification, mechanochemical modification, theca externa modification, Topically active modification, high-energy surface modification, utilize the precipitation reaction surface modification.Therefore this composite plastic has the heat resistance raising; Thermal diffusivity significantly improves; Air-breathing property and hygroscopicity are lower; The advantages such as the size coefficient of expansion is lower.
The coefficient of heat transfer of composite plastic is greater than 300W/m 2 K, thermal conductivity factor is between 5-10W/mK.
The plastic substrate of composite plastic can be in polyamide-based (PA), PET series (PET), epoxy resin (Epoxy Resin), polyimides system (PI), the PPS system a kind of.
Polyamide is a kind of engineering plastics commonly used, wherein nylon 6(PA6) have excellent physics and chemistry performance, so that the water absorption rate of material is high, poor dimensional stability, wet strength and thermal deformation are stablized lowly, limited to a certain extent the use of polyamide.
This nanometer PET material of PETG combines rigidity, the heat resistance of inorganic material with toughness, the processability of PET.
Epoxy resin is as the main material of making copper-clad plate, has good combination property, epoxy resin through the nanometer technology modification, its structure is different from the epoxy composite material of common fillers fully, show extremely strong activity, huge specific surface is easy to and epoxy resin molecule generating keys and effect it, improved intermolecular distributary power and still some nano particle be distributed in the space of macromolecular chain, show very high flowability.
Polyimides (PI) is a kind of high heat-resisting organic material of at present practical application, and along with the increase of nanometer SiO2 content, polyimides can significantly promote its heat resistance along with the increase of nano-filled thing content.
Same, along with the increase of nano-filled thing content, can significantly promote its heat resistance among the PPS.
The inorganic filler of composite plastic is a kind of in carbon element, oxide based, nitride based, the hydroxide system.The diameter of inorganic filler is 10 -10 ～10 -6 Rice.
Therefore, the pedestal 2 of being made by composite plastic has good thermal diffusivity.
Substrate 3 is positioned at lampshade 1 and is arranged on the upper side of pedestal 2, and led chip 4 is arranged on the substrate 3, and the heat that sends at illumination condition led chip 4 conducts to pedestal 2 by substrate 3, outwards disperses by pedestal 2.Preferably, paste closely setting between substrate 3 and the pedestal 2, the conduction of heat is very fast like this, can as soon as possible heat be exhaled.At this moment, substrate 3 is used for connecting led chip 4 and is connected with circuit between the driving power.Substrate 3 can be by aluminium alloy, copper alloy, magnesium alloy, ceramic material, FR-4 etc.Because this pedestal 2 has good thermal diffusivity, so the heat energy that led chip 4 produces can be by pedestal 2 to external diffusion.
Preferably, between pedestal 2 and substrate 3, be filled with high heat conduction packing material 5.High heat conduction packing material 5 comprises one or more in high thermal conductive silicon film, silicone rubber heating sheet, silicon rubber heating film, silicon rubber electric heating piece, silicon rubber oil drum heater, silica gel cloth, conductive graphite sheet, heat conduction casting glue, heat conduction phase-transition material, the silica gel products.High heat conduction packing material 5 can reduce the slit between it, so that substrate 3 and pedestal 2 applyings is tightr, is conducive to the further conduction of heat.
As shown in Figure 2, the difference of the second embodiment of the present invention and the first embodiment is that substrate 3 grafting are arranged on the pedestal 2, is formed with the bending part 21 of bending inwardly on the pedestal 2, and substrate 3 is strip, and substrate 3 is pegged graft and is stuck on the pedestal 2.This kind connected mode is simple in structure, and assembling is simple, and the length allotment intercepting of fluorescent tube is simple and easy, convenient follow-up installation.
As shown in Figure 3, the difference of the third embodiment of the present invention and above-described embodiment is that the downside of pedestal 2 is formed with one or more jogs 22, and jog 22 can increase the contact area of pedestal 2 and air, further increases the heat dispersion of pedestal 2.
As shown in Figure 4, the difference of the fourth embodiment of the present invention and above-described embodiment is that substrate 3 comprises connection layer 31, insulating barrier 32, metal level 33 from top to bottom successively, described led chip 4 is arranged on the connection layer 31, and described metal level 33 is arranged on the described pedestal 2.Concrete, the connection layer is used for connecting led chip 4 and is connected with circuit between the driving power.Connection layer 31 can be made by aluminium alloy, copper alloy, magnesium alloy etc.Insulating barrier 32 is made by insulating materials.Metal level 33 is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more, and the heat that metal level 33 is used for led chip 4 is sent conducts to pedestal 2.This moment, insulating barrier 32 or metal level 33 can be used as the main part of substrate 3, as the agent structure of whole substrate 3.
Preferably, between pedestal 2 and metal level 33, be filled with high heat conduction packing material 5.High heat conduction packing material 5 comprises one or more in high thermal conductive silicon film, silicone rubber heating sheet, silicon rubber heating film, silicon rubber electric heating piece, silicon rubber oil drum heater, silica gel cloth, conductive graphite sheet, heat conduction casting glue, heat conduction phase-transition material, the silica gel products.High heat conduction packing material 5 can reduce the slit between it, so that metal level 33 and pedestal 2 applyings is tightr, is conducive to the further conduction of heat.
As shown in Figure 5, the difference of the fifth embodiment of the present invention and above-described embodiment is that substrate 3 comprises connection layer 34, insulated non-metal layer 35 from top to bottom successively, led chip 4 is arranged on the connection layer 34, and insulated non-metal layer 35 is arranged on the described pedestal 2.Connection layer 34 is used for connecting led chip 4 and is connected with circuit between the driving power.Connection layer 34 can be by aluminium alloy, copper alloy, magnesium alloy, ceramic material, FR-4 etc.Insulated non-metal layer 35 is made by in FR-4, glass-fiber-plate, the pottery one or more.At this moment, insulated non-metal layer 35 is the agent structure of whole substrate 3 as the main part of substrate 3.
Preferably, between pedestal 2 and insulated non-metal layer 35, be filled with high heat conduction packing material 5.High heat conduction packing material 5 comprises one or more in high thermal conductive silicon film, silicone rubber heating sheet, silicon rubber heating film, silicon rubber electric heating piece, silicon rubber oil drum heater, silica gel cloth, conductive graphite sheet, heat conduction casting glue, heat conduction phase-transition material, the silica gel products.High heat conduction packing material 5 can reduce the slit between it, so that insulated non-metal layer 35 and pedestal 2 applyings is tightr, is conducive to the further conduction of heat.
Above specific embodiment of the present invention is illustrated in conjunction with diagram, clearly on the basis of not leaving scope and spirit of the present invention, can much revise prior art and technique.In the technical field, the common knowledge of a GPRS just can in technology main idea scope of the present invention, be carried out diversified change under of the present invention.

Claims (18)

1. LED fluorescent lamp, it is characterized in that: it comprises by light-passing plastic makes lampshade, pedestal, be positioned at lampshade and be arranged on substrate on the pedestal, be arranged on the led chip on the substrate, described lampshade has an open slot that Open Side Down, the described substrate of described lampshade semi-surrounding, the upper side of described pedestal is positioned at the open slot of described lampshade, the open slot that the downside of described pedestal is positioned at lampshade communicates outward and with the external world, described lampshade and described pedestal integral type structure, described pedestal is made by composite plastic, and composite plastic comprises plastic substrate and the inorganic filler in plastic substrate with nanometer or micron order size dispersion.
2. LED fluorescent lamp according to claim 1, it is characterized in that: described lampshade is made by PC.
3. LED fluorescent lamp according to claim 1 is characterized in that: the integrated extrusion moulding of described lampshade and pedestal.
4. according to claim 1 LED fluorescent lamp, it is characterized in that: the downside of described pedestal is formed with one or more jogs.
5. LED fluorescent lamp according to claim 1 is characterized in that: described substrate pastes setting mutually closely with described pedestal.
6. according to claim 1 LED fluorescent lamp, it is characterized in that: described substrate is pegged graft and is arranged on the described pedestal.
7. according to claim 1 LED fluorescent lamp, it is characterized in that: described substrate comprises connection layer, insulating barrier, metal level from top to bottom successively, and described led chip is arranged on the connection layer, and described metal level is arranged on the described pedestal.
8. according to claim 7 LED fluorescent lamp is characterized in that: the metal level of described substrate is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more.
9. according to claim 7 LED fluorescent lamp is characterized in that: described connection layer is made by in aluminum or aluminum alloy, copper or copper alloy, the magnesium alloy one or more.
10. according to claim 1 LED fluorescent lamp, it is characterized in that: described substrate comprises connection layer, insulated non-metal layer from top to bottom successively, and described led chip is arranged on the connection layer, and described insulated non-metal layer is arranged on the described pedestal.
11. LED fluorescent lamp according to claim 10 is characterized in that: described insulated non-metal layer is made by in FR-4, glass-fiber-plate, the pottery one or more.
12. LED fluorescent lamp according to claim 1 is characterized in that: the diameter of the inorganic filler of described composite plastic is 10 -10～10 -6Rice.
13. LED fluorescent lamp according to claim 1 is characterized in that: the coefficient of heat transfer of described composite plastic is greater than 300W/m 2K.
14. LED fluorescent lamp according to claim 1 is characterized in that: the thermal conductivity factor of described composite plastic is between 5～10W/mK.
15. LED fluorescent lamp according to claim 1 is characterized in that: the plastic substrate of described composite plastic comprises one or more in polyamide-based, PET series, epoxy resin, polyimides system, the PPS system.
16. LED fluorescent lamp according to claim 1 is characterized in that: the inorganic filler of described composite plastic comprises one or more in carbon element, oxide based, nitride based, the hydroxide system.
17. LED fluorescent lamp according to claim 1 is characterized in that: be provided with high heat conduction packing material between described substrate and the described pedestal.
18. LED fluorescent lamp according to claim 17 is characterized in that: described high heat conduction packing material comprises one or more in high thermal conductive silicon film, silicone rubber heating sheet, silicon rubber heating film, silicon rubber electric heating piece, silicon rubber oil drum heater, silica gel cloth, conductive graphite sheet, heat conduction casting glue, heat conduction phase-transition material, the silica gel products.
CN2012104810545A 2012-11-23 2012-11-23 Light emitting diode (LED) fluorescent lamp Pending CN103047558A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2012104810545A CN103047558A (en) 2012-11-23 2012-11-23 Light emitting diode (LED) fluorescent lamp
CN2013101209147A CN103225755A (en) 2012-11-23 2013-04-09 Led lamp tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012104810545A CN103047558A (en) 2012-11-23 2012-11-23 Light emitting diode (LED) fluorescent lamp

Publications (1)

Publication Number Publication Date
CN103047558A true CN103047558A (en) 2013-04-17

Family

ID=48060311

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2012104810545A Pending CN103047558A (en) 2012-11-23 2012-11-23 Light emitting diode (LED) fluorescent lamp
CN2013101209147A Pending CN103225755A (en) 2012-11-23 2013-04-09 Led lamp tube

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2013101209147A Pending CN103225755A (en) 2012-11-23 2013-04-09 Led lamp tube

Country Status (1)

Country Link
CN (2) CN103047558A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103557506A (en) * 2013-10-31 2014-02-05 苏州东亚欣业节能照明有限公司 Radiating structure of LED (light-emitting diode) lamp
CN111271688A (en) * 2020-04-09 2020-06-12 何超喜 Lampshade and manufacturing method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103511888A (en) * 2013-09-25 2014-01-15 苏州东亚欣业节能照明有限公司 LED lamp tube
CN103557466B (en) * 2013-11-15 2015-07-01 重庆星河光电科技有限公司 LED (Light-Emitting Diode) fluorescent lamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1964084A (en) * 2005-11-11 2007-05-16 南茂科技股份有限公司 Packaging structure of LED
CN101775213A (en) * 2010-02-01 2010-07-14 黄晓峰 High thermal conducting composite material and preparation method thereof
CN202546353U (en) * 2012-03-13 2012-11-21 苏州东亚欣业节能照明有限公司 LED (light-emitting diode) fluorescent tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103557506A (en) * 2013-10-31 2014-02-05 苏州东亚欣业节能照明有限公司 Radiating structure of LED (light-emitting diode) lamp
CN111271688A (en) * 2020-04-09 2020-06-12 何超喜 Lampshade and manufacturing method thereof

Also Published As

Publication number Publication date
CN103225755A (en) 2013-07-31

Similar Documents

Publication Publication Date Title
CN105742252B (en) A kind of power module and its manufacturing method
CN103047558A (en) Light emitting diode (LED) fluorescent lamp
CN102412212A (en) Heat dissipation device for electronic/optolectronic assembly
CN102927482A (en) Integrated LED illuminating assembly
CN103104828A (en) Light emitting diode (LED) lamp wick and lighting device with LED as light source
CN201425284Y (en) Embedded radiator with a new structure and light emitting diode and light emitting diode light
CN107937838A (en) A kind of New LED ceramic heat emission material
CN209709021U (en) The LED encapsulation structure of nitride multilayer aluminum substrate
CN101872826B (en) Liquid metal heat radiation based high-power LED light source of threaded connection structure
CN203131533U (en) LED ball lamp
CN101761903A (en) Cooling structure for LED lamp
CN106634654A (en) Adhesive film with radiant heat dissipation function for LED (Light Emitting Diode) and preparation method of adhesive film
CN202901981U (en) Light-emitting diode (LED) bulb lamp
CN203500898U (en) LED tube
CN206349387U (en) LED lamp bead structure based on ceramet substrate
CN206864500U (en) It is a kind of based on heat-conducting plate and heat sink cooling LED packaged light source structure
CN202613104U (en) LED (light-emitting diode) fluorescent tube
CN202546353U (en) LED (light-emitting diode) fluorescent tube
CN202511051U (en) LED (light emitting diode) bulb lamp made from nanometer composite plastic
CN202546350U (en) LED fluorescent lamp tube made from nanometer compound plastics
CN204853237U (en) High -power LED car light heat abstractor
CN202546351U (en) LED (Light-Emitting Diode) lamp made of nanometer composite plastic
CN202546356U (en) Light emitting diode (LED) lamp made of nano composite plastic
CN203500867U (en) LED (light emitting diode) lamp tube
CN202546355U (en) Light emitting diode (LED) lamp made of nanocomposite plastic

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130417