CN103045142A - Epoxy wear-resisting ceramic wafer bonding glue and preparation method thereof - Google Patents
Epoxy wear-resisting ceramic wafer bonding glue and preparation method thereof Download PDFInfo
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- CN103045142A CN103045142A CN2011103243590A CN201110324359A CN103045142A CN 103045142 A CN103045142 A CN 103045142A CN 2011103243590 A CN2011103243590 A CN 2011103243590A CN 201110324359 A CN201110324359 A CN 201110324359A CN 103045142 A CN103045142 A CN 103045142A
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Abstract
The invention provides epoxy wear-resisting ceramic wafer bonding glue and a preparation method thereof. The component A of the bonding glue comprises 80-100 parts of mixed epoxy resin, 10-15 parts of flexibilizer, 5-10 parts of diluent, 120-140 parts of alumina powder, 5-12 parts of quartz powder, 5-12 parts of ground calcium carbonate, and 5-10 parts of fumed silica. The component B comprises 80-100 parts of epoxy hardener special for ceramic bonding, 4-10 parts of epoxy accelerant, 4-10 parts of silane coupling agent, 150-200 parts of alumina powder, 40-60 parts of quartz powder, 60-80 parts of ground calcium carbonate, and 10-20 parts of fumed silica. The ceramic wafer bonding glue is strong in bonding property, medium resistance and temperature resistance. The bonding glue in construction is strong in operability and excellent in thixotropy, and can be used to coat a vertical face and does not flow. The operation time is moderate, so that the bonding glue is appropriate for large area coating. After 24 hours of curing at room temperature, a workpiece can be operated. The bonding glue is mainly applied to bonding a ceramic wafer to devices such as a centrifugal machine and a wear-resisting pipeline which are subjected to strong scour or erosive wear of materials.
Description
Technical field
The invention belongs to technical field of macromolecules, be specifically related to a kind of epoxy wear resistant ceramic chip bonded adhesives and preparation method thereof.
Background technology
The wear-resistant ceramic adhesive technology is a kind of equipment wear Protection technology; mainly be the equipment that utilizes wear resistant ceramic chip to protect seriously washed away by material; prolong the work-ing life of these equipment; minimizing is to the maintenance of this kind equipment; thereby reach to reduce and change new installation; reduce the equipment operation maintenance expense, reduce the purpose that causes enterprise's production loss because of shutdown.Epoxyn is used widely at industrial circles such as machinery, electronics, electric power, metallurgy, Aeronautics and Astronautics with its excellent over-all properties.In self-vulcanizing; have superior heat resistance and mechanical property; can be a direction of epoxy adhesive research and development in long term operation under the hot environment always; in industrial application; especially during large-area construction; be subjected to working conditions and environmental limit; may carry out heating cure to epoxyn hardly; for example: thermal power plant's airduct; induced draft fans etc. belong to high abrading section; temperature during normal operation is all more than 80 ℃; in order to increase the service life, reduce frequency of maintenance, prevent disorderly closedown; mainly be at position easy to wear pasting wear resistant ceramic chip at present; so just require when bonding wear-resistant ceramic, the self-vulcanizing of tackiness agent energy can be used under hot environment.Adopt epoxy adhesive to carry out bondingly realizing that being connected between wear-resistant ceramic and the equipment metalwork is a kind of effective mode of connection, now extended to the industries such as electric power, metallurgy, mine, cement and also be widely used and approve.
Summary of the invention
The present invention proposes a kind of epoxy wear resistant ceramic chip bonded adhesives and preparation method thereof, as toughner epoxy wear resistant ceramic chip bonded adhesives is carried out toughening modifying by homemade CTBN modified epoxy, improve the sticking power to base material; Adopt low viscosity 8240 novolac epoxys to improve temperature tolerance and the resistance to medium of epoxy glue; Adding ceramic heat-resistant filler improves the temperature tolerance of epoxy glue and reduces material cost.
In order to realize purpose of the present invention, a kind of epoxy wear resistant ceramic chip bonded adhesives is proposed, described bonded adhesives comprises A component and B component, the weight ratio of described A, B two components is A:B=2:1, wherein,
The A component is comprised of the component of following weight part:
80～100 parts of blending epoxies, 10～15 parts of toughner, 5～10 parts of thinners, 120～140 parts of aluminum oxide powders, 5～12 parts of silica powders, 5～12 parts of water-ground limestones, 5～10 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
80～100 parts of the special-purpose epoxy hardeners of ceramic bonding, ring
4～10 parts of oxygen promotor, 4～10 parts of silane coupling agents, 150～200 parts of aluminum oxide powders, 40～60 parts of silica powders, 60～80 parts of water-ground limestones, 10～20 parts of gas-phase silicas.
Described blending epoxy is E-51 Resins, epoxy and 8240 low viscosity novolac epoxys, wherein the E-51 content of epoxy resin is that 40～60%, 8240 low viscosity novolac epoxy consumptions of blending epoxy gross weight are 40～60% of blending epoxy gross weight;
The special-purpose epoxy hardener of described ceramic bonding is the modified fat amine epoxy curing agent, and outward appearance is little yellow transparent thick liquid, viscosity 4500～8000cp of 25 ℃, amine value 180～220 mgKOH/g.
Viscosity 6000～7100cp that described 8240 low viscosity novolac epoxy average functionalities are 2～3,25 ℃, oxirane value is at 0.5～0.6mol ∕ 100g;
Described toughner is the Resins, epoxy of CTBN modification, and oxirane value is at 0.2～0.3mol ∕ 100g;
Described thinner is response type epoxies thinner, comprises a kind of in ethylene glycol bisthioglycolate Racemic glycidol, the butanediol diglycidyl ether;
Described curable epoxide promotor is DMP-30 curable epoxide promotor;
Described silane coupling agent is the KH-550 coupling agent.
The present invention also proposes a kind of method for preparing above-mentioned epoxy wear resistant ceramic chip bonded adhesives, and concrete steps are as follows:
Preparation A composition step is:
(1) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves;
(2) described E-51 Resins, epoxy, toughner are in advance at 60 ℃ of lower preheating 5h;
(3) in the normal temperature situation, add first at first in proportion E-51 Resins, epoxy, 8240 low viscosity novolac epoxys, toughner, thinner in Scattered Kettle, stir about 15min, keep vacuum tightness be-0.090～-0.095MPa;
(4) then add in proportion aluminum oxide powder, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(5) then add in proportion water-ground limestone, stir about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(6) then add first in proportion gas-phase silica, stir about 5min, keep vacuum tightness be-0.090～-0.095MPa;
(7) cleaning stirrer gear and still wall, discharging packing behind the about 5min of continuation stirring.
Preparation B composition step is:
(8) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves;
(9) in the normal temperature situation, adding at first in proportion the special-purpose epoxy hardener of ceramic bonding, epoxy promotor, silane coupling agent and in Scattered Kettle, stirs about 10min, maintenance vacuum tightness is-0.090～-0.095MPa;
(10) then add first aluminum oxide powder in proportion, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(11) then add in proportion water-ground limestone and stir about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(12) then add first in proportion gas-phase silica, stir about 8min, keep vacuum tightness be-0.090～-0.095MPa;
(13) cleaning stirrer gear and still wall, discharging packing behind the about 5min of continuation stirring.
The invention provides the wear resistant ceramic chip bonded adhesives and have very strong cementability and medium-resistance, aspect temperature tolerance, also improve a lot simultaneously; Very strong operability is arranged aspect construction, and thixotropy is good, can smear facade and not trickle; Operating time is moderate, and applicable to big area coating, workpiece can put into operation behind the self-vulcanizing 24h, is mainly used in whizzer, abrasion-proof pipe etc. and strongly washed away by material or the bonding wear resistant ceramic chip of equipment of erosive wear.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, technical scheme of the present invention is further described.
Embodiment 1
The A component is comprised of the component of following weight part:
40 parts of E-51 Resins, epoxy, 40 parts of 8240 low viscosity epoxy resins, 10 parts of toughner, 5 parts of thinners, 120 parts of aluminum oxide powders, 5 parts of silica powders, 5 parts of water-ground limestones, 5 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
80 parts of the special-purpose epoxy hardeners of ceramic bonding, 4 parts of epoxy promotor, 4 parts of silane coupling agents, 120 parts of aluminum oxide powders, 50 parts of silica powders, 60 parts of water-ground limestones, 10 parts of gas-phase silicas.
Embodiment 2
The A component is comprised of the component of following weight part:
60 parts of E-51 Resins, epoxy, 40 parts of 8240 low viscosity epoxy resins, 15 parts of toughner, 10 parts of thinners, 140 parts of aluminum oxide powders, 12 parts of silica powders, 12 parts of water-ground limestones, 10 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
100 parts of the special-purpose epoxy hardeners of ceramic bonding, 10 parts of epoxy promotor, 10 parts of silane coupling agents, 200 parts of aluminum oxide powders, 60 parts of silica powders, 100 parts of water-ground limestones, 20 parts of gas-phase silicas.
Embodiment 3
The A component is comprised of the component of following weight part:
40 parts of E-51 Resins, epoxy, 60 parts of 8240 low viscosity epoxy resins, 8 parts of toughner, 8 parts of thinners, 130 parts of aluminum oxide powders, 8 parts of silica powders, 6 parts of water-ground limestones, 7 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
90 parts of the special-purpose epoxy hardeners of ceramic bonding, 8 parts of epoxy promotor, 6 parts of silane coupling agents, 180 parts of aluminum oxide powders, 50 parts of silica powders, 75 parts of water-ground limestones, 12 parts of gas-phase silicas.
Embodiment 4
The A component is comprised of the component of following weight part:
50 parts of E-51 Resins, epoxy, 50 parts of 8240 low viscosity epoxy resins, 8 parts of toughner, 8 parts of thinners, 120 parts of aluminum oxide powders, 8 parts of silica powders, 6 parts of water-ground limestones, 5 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
80 parts of the special-purpose epoxy hardeners of ceramic bonding, 10 parts of epoxy promotor, 5 parts of silane coupling agents, 180 parts of aluminum oxide powders, 50 parts of silica powders, 80 parts of water-ground limestones, 15 parts of gas-phase silicas.
Embodiment 5
The A component is comprised of the component of following weight part:
48 parts of E-51 Resins, epoxy, 32 parts of 8240 low viscosity epoxy resins, 15 parts of toughner, 10 parts of thinners, 140 parts of aluminum oxide powders, 12 parts of silica powders, 12 parts of water-ground limestones, 10 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
80 parts of the special-purpose epoxy hardeners of ceramic bonding, 5 parts of epoxy promotor, 5 parts of silane coupling agents, 120 parts of aluminum oxide powders, 50 parts of silica powders, 60 parts of water-ground limestones, 10 parts of gas-phase silicas.
Embodiment 6
The A component is comprised of the component of following weight part:
32 parts of E-51 Resins, epoxy, 48 parts of 8240 low viscosity epoxy resins, 8 parts of toughner, 8 parts of thinners, 130 parts of aluminum oxide powders, 8 parts of silica powders, 6 parts of water-ground limestones, 7 parts of gas-phase silicas.
The B component is comprised of the component of following weight part:
80 parts of the special-purpose epoxy hardeners of ceramic bonding, 4 parts of epoxy promotor, 4 parts of silane coupling agents, 120 parts of aluminum oxide powders, 50 parts of silica powders, 60 parts of water-ground limestones, 10 parts of gas-phase silicas.
Concrete production technique all makes according to following technique in above-described embodiment:
Preparation A composition step is: (1) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves; (2) described E-51 Resins, epoxy, toughner are in advance at 60 ℃ of lower preheating 5h; (3) in the normal temperature situation, add first at first in proportion E-51 Resins, epoxy, 8240 low viscosity novolac epoxys, toughner, thinner in Scattered Kettle, stir about 15min, keep vacuum tightness be-0.090～-0.095MPa; (4) then add in proportion aluminum oxide powder, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa; (5) then add in proportion water-ground limestone, stir about 10min, keep vacuum tightness be-0.090～-0.095MPa; (6) then add first in proportion gas-phase silica, stir about 5min, keep vacuum tightness be-0.090～-0.095MPa; (7) cleaning stirrer gear and still wall, the name of an article, lot number, date manufactured, weight are indicated in discharging packing behind the about 5min of continuation stirring.
Preparation B composition step is: (1) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves; (2) in the normal temperature situation, adding at first in proportion the special-purpose epoxy hardener of ceramic bonding, epoxy promotor, silane coupling agent and in Scattered Kettle, stirs about 10min, maintenance vacuum tightness is-0.090～-0.095MPa; (3) then add first aluminum oxide powder in proportion, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa; (4) then add in proportion water-ground limestone and stir about 10min, keep vacuum tightness be-0.090～-0.095MPa; (5) then add first in proportion gas-phase silica, stir about 8min, keep vacuum tightness be-0.090～-0.095MPa; (6) cleaning stirrer gear and still wall, the name of an article, lot number, date manufactured, weight are indicated in discharging packing behind the about 5min of continuation stirring.
In above-described embodiment, aluminum oxide powder 240 orders, silica powder 400 orders, water-ground limestone 2500 orders mix two kinds of components of A, B in actual use according to weight ratio A:B=2:1, can use behind the mixed about 5～10min of glue.There is very strong operability the construction aspect, and thixotropy is good, can smear facade and not trickle; Operating time is moderate, and applicable to large face coating, coated workpiece can put into operation behind the self-vulcanizing 24h.
It is as shown in the table to test its performance with the wear resistant ceramic chip bonded adhesives of embodiment 1～6:
﹡ shearing resistance/MPa(carbon steel coupon-ceramic plate): with reference to the testing method of GB/T7124-86.
﹡ thixotropy (heap high) experiment: on carbon steel sheet, according to mass ratio A, the mixed glue 150g of B=2:1 proportioning, mixed after evenly, glue is piled similar cone shape, and highly approximately 50mm is then vertical carbon steel sheet, so that glue piles horizontal direction, observe Jiao Dui and whether tilt, move.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect have been carried out further detailed description; institute is understood that; the above only is specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. an epoxy wear resistant ceramic chip bonded adhesives is characterized in that, described bonded adhesives comprises A component and B component, and the weight ratio of described A, B two components is A:B=2:1, wherein,
The A component is comprised of the component of following weight part:
80～100 parts of blending epoxies, 10～15 parts of toughner, 5～10 parts of thinners, 120～140 parts of aluminum oxide powders, 5～12 parts of silica powders, 5～12 parts of water-ground limestones, 5～10 parts of gas-phase silicas;
The B component is comprised of the component of following weight part:
80～100 parts of the special-purpose epoxy hardeners of ceramic bonding, 4～10 parts of epoxy promotor, 4～10 parts of silane coupling agents, 150～200 parts of aluminum oxide powders, 40～60 parts of silica powders, 60～80 parts of water-ground limestones, 10～20 parts of gas-phase silicas.
2. epoxy wear resistant ceramic chip bonded adhesives according to claim 1, it is characterized in that, described blending epoxy is E-51 Resins, epoxy and 8240 low viscosity novolac epoxys, wherein the E-51 content of epoxy resin is that 40～60%, 8240 low viscosity novolac epoxy consumptions of blending epoxy gross weight are 40～60% of blending epoxy gross weight.
3. epoxy wear resistant ceramic chip bonded adhesives according to claim 1, it is characterized in that the special-purpose epoxy hardener of described ceramic bonding is the modified fat amine epoxy curing agent, outward appearance is little yellow transparent thick liquid, viscosity 4500～8000cp of 25 ℃, amine value 180～220 mgKOH/g.
4. described epoxy wear resistant ceramic chip bonded adhesives is characterized in that according to claim 1-3, viscosity 6000～7100cp that described 8240 low viscosity novolac epoxy average functionalities are 2～3,25 ℃, and oxirane value is at 0.5～0.6mol ∕ 100g;
Described toughner is the Resins, epoxy of CTBN modification, and oxirane value is at 0.2～0.3mol ∕ 100g;
Described thinner is response type epoxies thinner, comprises a kind of in ethylene glycol bisthioglycolate Racemic glycidol, the butanediol diglycidyl ether;
Described curable epoxide promotor is DMP-30 curable epoxide promotor;
Described silane coupling agent is the KH-550 coupling agent.
5. preparation is characterized in that such as the method for the epoxy wear resistant ceramic chip bonded adhesives of claim 1-4 concrete steps are as follows:
Preparation A composition step is:
(1) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves;
(2) described E-51 Resins, epoxy, toughner are in advance at 60 ℃ of lower preheating 5h;
(3) in the normal temperature situation, add first at first in proportion E-51 Resins, epoxy, 8240 low viscosity novolac epoxys, toughner, thinner in Scattered Kettle, stir about 15min, keep vacuum tightness be-0.090～-0.095MPa;
(4) then add in proportion aluminum oxide powder, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(5) then add in proportion water-ground limestone, stir about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(6) then add first in proportion gas-phase silica, stir about 5min, keep vacuum tightness be-0.090～-0.095MPa;
(7) cleaning stirrer gear and still wall, discharging packing behind the about 5min of continuation stirring.
6. preparation B composition step is:
(8) with described aluminum oxide powder, silica powder, water-ground limestone, gas-phase silica in advance first on drying machine in 120 ℃ of dryings 2 hours, then be chilled to room temperature, wherein aluminum oxide powder, silica powder are crossed 60 mesh sieves;
(9) in the normal temperature situation, adding at first in proportion the special-purpose epoxy hardener of ceramic bonding, epoxy promotor, silane coupling agent and in Scattered Kettle, stirs about 10min, maintenance vacuum tightness is-0.090～-0.095MPa;
(10) then add first aluminum oxide powder in proportion, silica powder stirs about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(11) then add in proportion water-ground limestone and stir about 10min, keep vacuum tightness be-0.090～-0.095MPa;
(12) then add first in proportion gas-phase silica, stir about 8min, keep vacuum tightness be-0.090～-0.095MPa;
(13) cleaning stirrer gear and still wall, discharging packing behind the about 5min of continuation stirring.
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| CN103497722A (en) * | 2013-10-10 | 2014-01-08 | 南宁珀源化工有限公司 | Adhesive for adhering silicon rods |
| CN103537382A (en) * | 2013-09-25 | 2014-01-29 | 安徽省绿巨人环境技术有限公司 | Spiral replaceable ceramic discharging outlet structure of horizontal screw centrifuge |
| CN104293262A (en) * | 2014-09-17 | 2015-01-21 | 明光市锐创电气有限公司 | Adhesive for splicing porcelain cover of air conditioning transformer |
| CN104327675A (en) * | 2014-11-20 | 2015-02-04 | 北京天山新材料技术有限公司 | High-temperature-resistant and wear-resistant epoxy adhesive coating and preparation method thereof |
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