CN103042370A - Heat dissipation frame manufacturing method and products thereof - Google Patents
Heat dissipation frame manufacturing method and products thereof Download PDFInfo
- Publication number
- CN103042370A CN103042370A CN2011103169499A CN201110316949A CN103042370A CN 103042370 A CN103042370 A CN 103042370A CN 2011103169499 A CN2011103169499 A CN 2011103169499A CN 201110316949 A CN201110316949 A CN 201110316949A CN 103042370 A CN103042370 A CN 103042370A
- Authority
- CN
- China
- Prior art keywords
- fin
- punching
- bending
- type
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat dissipation frame manufacturing method and products thereof. The heat dissipation frame manufacturing method comprises the following steps: firstly extruding an aluminum product into a cooling fin prototype; after measuring the cooling fin prototype according to needed dimensions, carrying out a local punching shear on a position to bend of the cooling fin prototype to form a plurality of punching shear gaps; bending the cooling fin prototype at the position of the punching shear gaps and forming a plurality of bending angles in a mutual butt joint mode; and fixedly jointing the butt joint positions of the punching shear gaps and the head and tail butt joint positions of the bended cooling fin to form a frame. Therefore, an extruding type cooling fin formed through a punching shear and bending can effectively reduce the procedures and save materials and reduce the cost of work hours and reach the aims of improving the heat conduction performance and lowering the manufacturing cost.
Description
Technical field
The present invention relates to a kind of heat-dissipating frame manufacture method and goods thereof, be specifically related to a kind of radiator structure that is applied to liquid crystal display backlight module.
Background technology
The multiple advantages such as that liquid crystal display has is slim, light weight, low radiation and low power consumption, make it within the short several years, just replace traditional crt display fully and become main product on the information market, but because display panels (LCD panel) itself does not have luminous function, therefore need to be in display panels rear configuration backlight module in order to provide display panels needed light source.
And traditional backlight module uses CCFL (CCFL), and it has mercurous shortcoming, and does not have an advantage compared to light emitting diode (LED) in reaction speed, monochromaticjty, volume and power consumption; Therefore, along with liquid crystal display continues towards large scale and lightening development trend, also so that light emitting diode replaces the main backlight that CCFL becomes liquid crystal display of new generation gradually.
Yet, although light emitting diode has that volume is little, brightness is high and the advantage such as low power consumption, but, the heat energy that produces in the process of electric energy conversion luminous energy can affect the problems such as its luminous efficacy and then generation colour cast, so, how by heat dissipation technology to avoid high temperature for the impact in production reliability and life-span, be the problem that many dealers institute wish solves.
See also shown in Figure 1, it is the backlight module heat abstractor 1 of a liquid crystal display, it comprises a plurality of light-emitting diode (LED) modules 11, a plurality of fin 12 and a metal backing 13, described light-emitting diode (LED) module 11 is individually fixed on the fin 12, again fin 12 is fixed on the metal backing 13, and then the heat energy that produces when making light-emitting diode (LED) module 11 work can conduct to metal backing 13 by fin 12, and further discharge outside the liquid crystal display, very not convenient during its assembling, and described fin 12 is the contact conduction with metal backing 13, and its heat conduction efficiency is limited; Moreover the fin 12 of this type radiator structure and metal backing 13 must be offered respectively mould up to specification for the liquid crystal display of different size, and it can cause manufacturing cost to increase, and necessity of improvement is arranged in fact.
Summary of the invention
The object of the present invention is to provide a kind of heat-dissipating frame manufacture method and goods thereof, in order to overcome the existing shortcoming that the backlight module heat radiation structure heat conduction efficiency is limited and cost of manufacture is higher.
In order to reach described purpose, heat-dissipating frame manufacture method of the present invention the steps include: aluminium is extruded into just type of fin; After the measurement of required size specification, carry out local punching at the long limit of the first type of fin wish bending part and form a plurality of punching breach, the first type of fin is formed a plurality of bendings angle in the bending of punching breach and mutual the docking, the first type initial and end joint of the fin after punching breach joint and the bending is engaged fix formation one framework again.
Further, the fixing mode of described joint can adopt stamping riveting method or chimeric method, wherein, the stamping riveting method is that the first type initial and end joint of the fin after described punching breach joint and bending has dug respectively a plurality of perforation, and by the number riveting sheet, it is provided with the flange of the described perforation of a plurality of correspondences, makes it be riveting in described perforation with impact style, and then formation one framework of combining closely.
Further, chimeric method then is that the local punching of described punching breach is mutually corresponding dovetail seat and dovetail groove, and in the just initial and end end punching of type of fin dovetail seat and dovetail groove are arranged simultaneously, more corresponding dovetail seat and dovetail groove are docked respectively chimeric rear formation one framework.
Heat-dissipating frame goods of the present invention include a framework and a plurality of riveting sheet, described framework is to be formed by the just type bending of fin that aluminium extrudes, described framework has a plurality of bendings angle, inboard, described bending angle has respectively a punching breach, and described punching breach joint and described fin just type initial and end joint have dug respectively a plurality of perforation; Described riveting sheet is provided with the flange of the described perforation of a plurality of correspondences, and its punch riveting is combined closely it and is integral in described perforation.
In sum, the present invention has following advantages:
1. the heat-dissipating frame according to the moulding of manufacture method of the present invention institute is formed in one, and can save procedure of processing and expending of reducing work hours, and can effectively overcome the shortcoming that affects thermal energy conduction usefulness after the backboard of existing backlight module and fin engage.
2. heat-dissipating frame of the present invention is to squeeze the machine-shaping of type mode, it has the not limited advantage of length, be applicable to the backlight module of all size, as long as measure rear in appropriate location punching breach according to the demand dimensions, can stamping riveting or chimeric moulding after bending, owing to no longer need to offer one by one mould according to different size, so can significantly reduce manufacturing cost, have splendid industrial applicability.
Description of drawings
Fig. 1 is the schematic perspective view of existing backlight module heat abstractor;
Fig. 2 is the flow chart of heat-dissipating frame manufacture method of the present invention;
Fig. 3 is the just crowded kenel sample schematic diagram of type of fin of the present invention;
Fig. 4-1 is the punching schematic diagram of first embodiment of the invention;
Fig. 4-2 is the local enlarged diagram of Fig. 4-1;
Fig. 5 is the joint schematic diagram of first embodiment of the invention;
Fig. 6 is that Fig. 5 is in the cross-sectional schematic of A-A position;
Fig. 7 is the goods schematic diagram of first embodiment of the invention;
Fig. 8 is the bending schematic diagram of second embodiment of the invention;
Fig. 9 is the joint schematic diagram of second embodiment of the invention;
Figure 10 is the goods schematic diagram of second embodiment of the invention.
The specific embodiment
Relevant detailed description of the present invention and technology contents now just cooperate graphic being described as follows:
See also shown in Figure 2ly, the invention provides a kind of heat-dissipating frame manufacture method, it comprises the following step:
A. squeeze type step 2: aluminium is extruded into just type of fin.
B. punching step 3: after measuring according to the required size specification, fin just the long limit wish bending part of type carry out local punching and form a plurality of punching breach.
C. bending step 4: with fin just type the bending of punching breach and mutually docking form a plurality of bendings angle.
D. engagement step 5: the first type initial and end joint of the fin after punching breach joint and the bending is engaged the fixing framework that forms, and the fixing mode of described joint can adopt stamping riveting method or chimeric method.
See also Fig. 3 to shown in Figure 6, be the first embodiment of the present invention, at first aluminium is extruded into just type 6 of fin, its crowded type length can be according to the actual demand adjustment, after then measuring according to the required size specification, carry out local punching in the long limit of the first type 6 of described fin wish bending part and form a plurality of punching breach 61, fin after described punching breach 61 joints and bending is type 6 head just, the tail joint has dug respectively a plurality of perforation 62, again the first type 6 of fin is formed a plurality of bendings angle 63 in 61 bendings of punching breach and mutual docking, and by a plurality of riveting sheets 7, it is provided with the flange 71 of the described perforation 62 of a plurality of correspondences, make it be riveting in described perforation 62 with impact style, and then formation one framework 8 of combining closely.
See also shown in Figure 7, heat-dissipating frame goods of the present invention include a framework 8 and a plurality of riveting sheet 7, described framework 8 is to be formed by just type 6 bendings of fin that aluminium extrudes, described framework 8 has a plurality of bendings angle 63,63 inboards, described bending angle have respectively a punching breach 61, and described punching breach 61 joints and described fin just type 6 initial and end joints have dug respectively a plurality of perforation 62; Described riveting sheet 7 is provided with the flange 71 of the described perforation 62 of a plurality of correspondences, and its punch riveting is combined closely it and is integral in described perforation 62.
See also Fig. 8 to shown in Figure 10, be the second embodiment of the present invention, at first aluminium is extruded into just type 6a of fin, then want bending part at the first type 6a of described fin and carry out a plurality of punching breach of local punching 61a, described punching breach 61a is provided with dovetail seat 611 and the dovetail groove 612 of mutual correspondence, and can be simultaneously in the head of the first type 6a of fin, the tail end punching has dovetail seat 611 and dovetail groove 612, the first type 6a of fin in punching breach 61a bending and after docking forms a plurality of bendings angle 63a mutually, is docked respectively chimeric formation one framework 8a with corresponding dovetail seat 611 and dovetail groove 612 again.
In sum, heat-dissipating frame manufacture method provided by the invention and goods thereof can be got rid of the drawback of traditional product and method completely.
Claims (5)
1. a heat-dissipating frame manufacture method is characterized in that, comprises the following step:
A. squeeze the type step: aluminium is extruded into just type of fin;
B. punching step: after measuring according to the required size specification, fin just the long limit wish bending part of type carry out local punching and form a plurality of punching breach;
C. bending step: with fin just type the bending of punching breach and mutually docking form a plurality of bendings angle;
D. engagement step: with the fin after punching breach joint and the bending just type initial and end joint engage the fixing framework that forms.
2. a kind of heat-dissipating frame manufacture method as claimed in claim 1 is characterized in that, the fixing mode of described joint adopts stamping riveting method or chimeric method.
3. a kind of heat-dissipating frame manufacture method as claimed in claim 2, it is characterized in that, described stamping riveting method is that the first type initial and end joint of the fin after described punching breach joint and bending has dug respectively a plurality of perforation, and by a plurality of riveting sheets, it is provided with the flange of the described perforation of a plurality of correspondences, make it be riveting in described perforation with impact style, and then formation one framework of combining closely.
4. a kind of heat-dissipating frame manufacture method as claimed in claim 2, it is characterized in that, described chimeric method is dovetail seat and the dovetail groove that is provided with mutual correspondence at described punching breach, and can in the just initial and end end punching of type of fin dovetail seat and dovetail groove be arranged simultaneously, more corresponding dovetail seat and dovetail groove are docked respectively chimeric formation one framework.
5. heat-dissipating frame goods, it is characterized in that, include a framework and a plurality of riveting sheet, described framework is to be formed by the just type bending of fin that aluminium extrudes, described framework has a plurality of bendings angle, inboard, described bending angle has respectively a punching breach, and described punching breach joint and described fin just type initial and end joint have dug respectively a plurality of perforation; Described riveting sheet is provided with the flange of the described perforation of a plurality of correspondences, and its punch riveting is combined closely it and is integral in described perforation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011103169499A CN103042370A (en) | 2011-10-13 | 2011-10-13 | Heat dissipation frame manufacturing method and products thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011103169499A CN103042370A (en) | 2011-10-13 | 2011-10-13 | Heat dissipation frame manufacturing method and products thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103042370A true CN103042370A (en) | 2013-04-17 |
Family
ID=48055354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011103169499A Pending CN103042370A (en) | 2011-10-13 | 2011-10-13 | Heat dissipation frame manufacturing method and products thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103042370A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175683A (en) * | 2013-05-23 | 2014-12-03 | 昆山市嘉美兴业电子材料有限公司 | Closed electronic material processing method |
CN104801976A (en) * | 2014-05-16 | 2015-07-29 | 中集集团集装箱控股有限公司 | Container short bottom beam stamping production line |
CN106847104A (en) * | 2016-11-24 | 2017-06-13 | 浙江宝丽彩光电科技有限公司 | Lamp box, framework metal plate, frame structure and frame manufacture method |
WO2017113671A1 (en) * | 2015-12-30 | 2017-07-06 | 乐视控股(北京)有限公司 | Front bezel for display device, method for manufacturing same, and display device |
CN107238959A (en) * | 2017-07-10 | 2017-10-10 | 深圳市华星光电技术有限公司 | The framework and its manufacture method of a kind of liquid crystal display |
CN111299972A (en) * | 2020-03-11 | 2020-06-19 | 珠海东荣金属制品有限公司 | Split type lock cover and machining method of lock cover frame thereof |
CN115673146A (en) * | 2022-11-18 | 2023-02-03 | 江苏蔚联精密科技有限公司 | Double-station stamping device for radiating fins |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1639373A (en) * | 2002-03-01 | 2005-07-13 | 昭和电工株式会社 | Process for producing Al-Mg-Si alloy plate, Al-Mg-Si alloy plate and Al-Mg-Si alloy material |
CN101308272A (en) * | 2007-05-14 | 2008-11-19 | 奇美电子股份有限公司 | Backlight module frame and its assembling method |
CN101691976A (en) * | 2009-09-30 | 2010-04-07 | 重庆大学 | Aluminum alloy snakelike flow channel evaporation plate and processing molding method thereof |
CN101691978A (en) * | 2009-09-30 | 2010-04-07 | 重庆大学 | Aluminum honeycomb type evaporation plate and processing molding method thereof |
-
2011
- 2011-10-13 CN CN2011103169499A patent/CN103042370A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1639373A (en) * | 2002-03-01 | 2005-07-13 | 昭和电工株式会社 | Process for producing Al-Mg-Si alloy plate, Al-Mg-Si alloy plate and Al-Mg-Si alloy material |
CN101308272A (en) * | 2007-05-14 | 2008-11-19 | 奇美电子股份有限公司 | Backlight module frame and its assembling method |
CN101691976A (en) * | 2009-09-30 | 2010-04-07 | 重庆大学 | Aluminum alloy snakelike flow channel evaporation plate and processing molding method thereof |
CN101691978A (en) * | 2009-09-30 | 2010-04-07 | 重庆大学 | Aluminum honeycomb type evaporation plate and processing molding method thereof |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175683A (en) * | 2013-05-23 | 2014-12-03 | 昆山市嘉美兴业电子材料有限公司 | Closed electronic material processing method |
CN104801976A (en) * | 2014-05-16 | 2015-07-29 | 中集集团集装箱控股有限公司 | Container short bottom beam stamping production line |
WO2017113671A1 (en) * | 2015-12-30 | 2017-07-06 | 乐视控股(北京)有限公司 | Front bezel for display device, method for manufacturing same, and display device |
CN106847104A (en) * | 2016-11-24 | 2017-06-13 | 浙江宝丽彩光电科技有限公司 | Lamp box, framework metal plate, frame structure and frame manufacture method |
CN107238959A (en) * | 2017-07-10 | 2017-10-10 | 深圳市华星光电技术有限公司 | The framework and its manufacture method of a kind of liquid crystal display |
CN111299972A (en) * | 2020-03-11 | 2020-06-19 | 珠海东荣金属制品有限公司 | Split type lock cover and machining method of lock cover frame thereof |
CN111299972B (en) * | 2020-03-11 | 2021-07-20 | 珠海东荣金属制品有限公司 | Split type lock cover and machining method of lock cover frame thereof |
CN115673146A (en) * | 2022-11-18 | 2023-02-03 | 江苏蔚联精密科技有限公司 | Double-station stamping device for radiating fins |
CN115673146B (en) * | 2022-11-18 | 2023-10-20 | 江苏蔚联精密科技有限公司 | Double-station stamping device for radiating fin |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103042370A (en) | Heat dissipation frame manufacturing method and products thereof | |
CN102200259A (en) | Combined-type backing plate for backlight module | |
US20120320302A1 (en) | Lcd back plate and a manufacturing method thereof | |
CN101943351A (en) | Liquid crystal display device and side-light backlight module thereof | |
CN102654258B (en) | Light-emitting diode backlight module | |
CN202281138U (en) | Back plate, backlight mold set and display device | |
CN201944701U (en) | A back light model and a LCD device containing the model | |
CN202884674U (en) | Liquid crystal mould group backlight component | |
CN103629589B (en) | Reflective sheet locating structure, backlight module and display equipment | |
CN102765066B (en) | Light bar attaching gauge and corresponding light bar attaching method | |
CN206671727U (en) | A kind of direct-light-type backlight and liquid crystal display die set | |
CN102003662A (en) | Edge type backlight module capable of strengthening local cooling | |
CN208334837U (en) | A kind of curved surface bar shaped LCD screen backlight mould group | |
CN103874391B (en) | Radiator and its preparation method | |
CN102721022B (en) | Heat radiator and manufacture method of heat radiator | |
CN102748662B (en) | Backlight module and light guide plate structure thereof | |
CN205124216U (en) | Edge of a knife formula radiator unit | |
CN107023779A (en) | Integral extrusion forming ultra-thin LED flat panel lamp and manufacture craft | |
CN103472609B (en) | Liquid crystal display | |
CN104235662A (en) | Light strip, backlight source and display device | |
TWI422923B (en) | Complex back plate for backlight module | |
CN107152611B (en) | Manufacturing method of LED lamp tube | |
TW201313357A (en) | Manufacturing method of heat dissipation frame and its product | |
CN201351837Y (en) | Side-light type backlight module | |
CN103792712A (en) | Cooling structure of liquid crystal display module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130417 |