CN103042361A

CN103042361A - Processing technique of light emitting diode (LED) lamp

Info

Publication number: CN103042361A
Application number: CN2012104465507A
Authority: CN
Inventors: 杜国新
Original assignee: SHANDONG JUNFENG ELECTRONIC CO Ltd
Current assignee: SHANDONG JUNFENG ELECTRONIC CO Ltd
Priority date: 2012-11-10
Filing date: 2012-11-10
Publication date: 2013-04-17

Abstract

The invention discloses a processing technique of a light emitting diode (LED) lamp and relates to the technical field of illumination device processing. When a drive circuit of the technique is processed, an Integrated Circuit Tester (ICT) testing process is added, and a pressure withstanding and insulating testing process is added to a lamp assembly process. The processing technique comprises steps of processing the drive circuit, processing a lamp plate patch, and assembling and processing the lamp. The ICT testing process and the pressure withstanding and insulating testing process are added, raw materials are saved, the maintenance is convenient, the frequency of the phenomena of leakage and breakdown of a product is reduced, and the safety coefficient is guaranteed.

Description

LED lamp processing technology

Technical field

The present invention relates to a kind of lighting apparatus processing technique field.

Background technology

Along with people are more and more higher to the requirement of environmental protection illumination, the LED illuminating lamp tube with plurality of advantages such as low energy consumption, high light efficiency, long service life replaces traditional fluorescent tube gradually, begins to be widely used in the daily life.The energising preliminary survey of drive circuit manufacturing procedure is unreasonable in the existing LED lamp production technology, do not have the ICT test step, and the light fixture assembling adds does not have the voltage-withstand test operation in the operation, electric leakage and punch-through appear in product easily, cause security incident, waste of raw materials, maintenance difficult.

Summary of the invention

The purpose of this invention is to provide a kind of LED lamp processing technology, unreasonable to solve the energising preliminary survey that has drive circuit manufacturing procedure in the LED lamp production technology now, there is not the ICT test step, there is not the voltage-withstand test operation in the light fixture assembling manufacturing procedure, electric leakage and punch-through appear in product easily, cause security incident, waste of raw materials, the problems such as maintenance difficult.

The technical solution adopted for the present invention to solve the technical problems is that the drive circuit of this technique adds and increases the ICT test step man-hour, increases withstand voltage and Insulation test operation in the light fixture assembling processing, concrete processing technology step:

A drive circuit processing: from the warehouse, get and enter the drive circuit job shop behind the material that the drive circuit machining needs and carry out the wiring board printed solder paste; Paster processing; Reflow soldering; Repair welding checks; After the element trimming preformed with the fixing filter inductance of 702 silica gel; Then all the other plug-in elements are mended dress; Through carrying out the ICT test after the cutting, ICT test-based examination electrochemical capacitor, rectifying component have that solderless is anti-, have or not short circuit and electrical characteristic between the component's feet, parameter correction, the design parameter that the ICT test reaches is the standard value of components and parts, change and debug before switching on again when not meeting standard, unnecessary first device occurs when avoiding switching on burn out and waste; The laggard units fine position of ICT test passes; Semi-finished product enter the working area.

The processing of B lamp plate paster: the semi-finished product of drive circuit processing are extracted into lamp plate paster job shop and carry out LED PCB seal solder(ing) paste from the working area; Paster processing, LED must be same colour temperature and lot number, can not mix subsides; Reflow soldering; Repair welding checks; The check of energising stepping detects colour temperature and light intensity uniformity, puts according to colour temperature, the light intensity classification of LED, must not load in mixture, and finishes the processing of lamp plate paster, changes subsequent processing over to.

The assembling processing of C light fixture: utilize frock to scrape thermal grease, lamp plate is for a long time in the exposure air, in case heat-conducting cream condenses; The aluminium section bar lamp plate aluminium groove of packing into, the downward compacting PCB that exerts oneself is beneficial to PCB and better dispels the heat; Connecting PCB board; The dress drive circuit; The energising qualified rear dress lampshade of preliminary survey and lamp holder; Carry out withstand voltage test, with reference to UL standard 1200V/2 second/5mA high pressure survey, insulaion resistance 〉=2000 megohms; The burn-in test testing time is 0.5-1.5 hour; The light splitting repetition measurement, the discrete type characteristics according to the LED colour temperature are divided into 3 classes with fluorescent tube according to colour temperature difference, and colour temperature is that 3500k-4500k is warm in vain, 5000k-6500k is just white, 7000k-9000k is cold white; Clean appearance, the rear packing of labelling change finished bin over to.

Adopt good effect of the present invention to be: saved raw material after increasing ICT test step, withstand voltage and Insulation test operation, easy to maintenance, reduced the frequency that electric leakage and punch-through appear in product, guaranteed safety coefficient.

Description of drawings

The present invention is further described below in conjunction with drawings and Examples:

Fig. 1 is process chart of the present invention;

1 wiring board printed solder paste among the figure, the processing of 2 pasters, 3 reflow solderings, 4 visual examinations, 5 repair weldings, 6 element trimming preformed, 7 plug-in elements are mended dress, 8 cuttings, test before 9 energisings, 10 repair, 11 adjust position of components, 12 put in storage stand-by, 13 LED PCB print solder(ing) paste, 14 repair welding inspections, 15 energising stepping inspections, 16 lamp plates are scraped thermal grease, 17 dress aluminium section bars, 18 connection PCB, 19 dress drive circuits, 20 energising preliminary surveys, 21 dress lampshades, lamp holder, 22 voltage-withstand tests, 23 burn-in tests, 24 light splitting/repetition measurement, 25 clean appearances, 26 packings, 27 cleanings, label, 28 get material/material working area, workshop, 29 finished bin, 30 enter the warehouse, 31 return goods, 32 materials are to be checked, 33 material incoming inspections.

The specific embodiment

As shown in the figure: the drive circuit of this technique adds increases the ICT test step man-hour, increases withstand voltage and Insulation test operation in the light fixture assembling processing, concrete processing technology step:

A drive circuit processing: from the warehouse, get and enter the drive circuit job shop behind the material that the drive circuit machining needs and carry out wiring board printed solder paste 1; Paster processing 2; Reflow soldering 3; Repair welding 5 checks; Element trimming preformed 6 rear usefulness 702 silica gel are filter inductance fixedly; Then all the other plug-in elements are mended and are filled 7; Through carrying out ICT test 9 after the cutting 8, ICT test-based examination electrochemical capacitor, rectifying component have that solderless is anti-, have or not short circuit and electrical characteristic between the component's feet, parameter correction, the design parameter of ICT test is the standard value of components and parts, change and debug before switching on again when not meeting standard, unnecessary first device occurs when avoiding switching on burn out and waste; The laggard units fine position 11 of ICT test passes; Semi-finished product enter the working area.

B lamp plate paster processing: the semi-finished product of drive circuit processing 29 are extracted into lamp plate paster job shop and carry out LED PCB seal solder(ing) paste 13 from the working area; Paster processing 2, LED must be same colour temperature and lot number, can not mix subsides; Reflow soldering 3; Repair welding checks 14; Energising stepping check 15 detects colour temperature and light intensity uniformity, puts according to colour temperature, the light intensity classification of LED, must not load in mixture, and finishes the processing of lamp plate paster, changes subsequent processing over to.

The assembling processing of C light fixture: utilize frock to scrape thermal grease 16, lamp plate is for a long time in the exposure air, in case heat-conducting cream condenses; The aluminium section bar 17 lamp plates aluminium groove of packing into, the downward compacting PCB that exerts oneself is beneficial to PCB and better dispels the heat; Connecting PCB board 18; Dress drive circuit 19; Energising preliminary survey 20 qualified rear dress lampshade and lamp holders 21; Carry out withstand voltage test 22, with reference to UL standard 1200V/2 second/5mA high pressure survey, insulaion resistance 〉=2000 megohms; 23 testing times of burn-in test are 1.1 hours; Light splitting/repetition measurement 24, the discrete type characteristics according to the LED colour temperature are divided into 3 classes with fluorescent tube according to colour temperature difference, and colour temperature is that 3500k-4500k is warm in vain, 5000k-6500k is just white, 7000k-9000k is cold white; Clean appearance 25, the 27 rear packings 26 of labelling change finished bin 29 over to.

Claims

1. LED lamp processing technology, it is characterized in that: the drive circuit of this technique adds increases the ICT test step man-hour, increases withstand voltage and Insulation test operation in the light fixture assembling processing, concrete processing technology step:

A drive circuit processing: from the warehouse, get and enter the drive circuit job shop behind the material that the drive circuit machining needs and carry out the wiring board printed solder paste; Paster processing; Reflow soldering; Repair welding checks; After the element trimming preformed with the fixing filter inductance of 702 silica gel; Then all the other plug-in elements are mended dress; Through carrying out the ICT test after the pedicure, ICT test-based examination electrochemical capacitor, rectifying component have that solderless is anti-, have or not short circuit and electrical characteristic between the component's feet, parameter correction, the design parameter that the ICT test reaches is the standard value of components and parts, change and debug before switching on again when not meeting standard, unnecessary first device occurs when avoiding switching on burn out and waste; The laggard units fine position of ICT test passes; Semi-finished product enter the working area;

The processing of B lamp plate paster: the semi-finished product of drive circuit processing are extracted into lamp plate paster job shop and carry out LED PCB seal solder(ing) paste from the working area; Paster processing, LED must be same colour temperature and lot number, can not mix subsides; Reflow soldering; Repair welding checks; The check of energising stepping detects colour temperature and light intensity uniformity, puts according to colour temperature, the light intensity classification of LED, must not load in mixture, and finishes the processing of lamp plate paster, changes subsequent processing over to;