CN103033127A - Base plate pre-alignment pose measuring method - Google Patents
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Abstract
A base plate pre-alignment pose measuring method comprises conducting difference on input images and removing negative peripheral points to obtain difference images; conducting difference image binaryzation and projecting and adopting non-maximum value restraining to confirm possible positions of base plate edges on two sides of the base plate in the images; searching the difference images in the vicinity and using a difference extreme point to serve as a candidate point of the base plate edges; rejecting noise in the candidate point of the base plate edges to obtain base plate edge points on two sides according to straightness characters of the base plate edges; judging whether the base plate edge points meet requirements for luminance consistency or not, on yes judgment, entering the sixth step, and on no judgment, skipping to the possible position of a next base plate edge in the images and returning to a step three; using two vertical sides of the base plate, calculating positions of the base plate after fitting a linear equation parameter of two sides of the base plate according to the base plate edge points, and calculating poses of the base plate after singly fitting a linear equation parameter of one side of the base plate.
Description
Technical field
The present invention relates to the position measurement field, particularly a kind of substrate prealignment pose measurement.
Background technology
In the information age, display is one of important means that realizes man-machine interaction.Particularly nowadays various handheld devices are flourish, people are not only increasing to the demand of display, resolution (number of pixels in the unit sizes) requirement to display is also more and more higher, and display color fidelity, power consumption are had higher requirement.In order to satisfy the growing demand of people, production technology must ceaselessly improve in production firm.Alignment precision is one of important indicator that affects technique.
Often there is deviation in the position behind the substrate upper plate, in order to satisfy the alignment precision requirement, need to carry out prealignment one time to it, so just must measure its position and attitude with certain means, can use the position of nominal center in worktable coordinate system of substrate to be its location, in the name of the angle of main shaft and worktable coordinate system y axle is as attitude.Because only need satisfy the alignment precision requirement, so the measured value of pose is only had the repdocutbility requirement, less demanding to accuracy, it can be ignored.
A kind of scheme of vision measurement substrate pose is proposed: above a certain fixed position of mechanical arm, place two CCD(charge coupled cells among the patent US6847730) imageing sensor, these two CCD gather by the edge image of optical lens to glass substrate, adopt edge detection operator to detect substrate edges, utilize marginal point to simulate respectively the straight-line equation on two limits of substrate, calculate the intersection point of two straight lines, thereby calculate the pose of substrate.
Edge extracting is one of content the most basic during image is processed, and still " edge extracting " word often refers to the point of finding out the brightness value sudden change in the image, and these algorithms mainly comprise sobel, prewitt, canny etc.Because the impact of different and various chaff interferences and the noise of interior of articles material, structure, illumination condition, the point that extracts via these algorithms may not all be the point of wanting.Under various environment, the correct profile that extracts object remains of computer vision field and does not separate a difficult problem.
Patent US6847730 need to simulate respectively two limits, and reproducibility is lower.
Summary of the invention
The technical problem to be solved in the present invention is that twice fitting and the edge extracting method thereof of substrate edges causes the precision of substrate pose measurement on the low side.
In order to solve the problems of the technologies described above, the present invention proposes a kind of substrate prealignment pose measuring method, comprising:
Step 1, imageing sensor are surveyed described substrate and are obtained input picture, and described input picture is carried out difference and gets rid of marginal edge point, obtain difference image;
Step 3 is searched for described difference image near the possible position of described substrate edges in image, with the difference extreme point as the substrate edges candidate point;
Step 5 judges whether described substrate edges point satisfies the requirement of brightness uniformity, if satisfy then enter step 6, if do not satisfy, then jumps to the possible position of next substrate edges in image, returns step 3;
Step 6, utilize the substrate both sides vertical, go out the straight-line equation parameter on substrate both sides by least square fitting and calculate the position of described substrate according to described substrate edges point, simulate separately described substrate wherein on one side the straight-line equation parameter and calculate the attitude of described substrate.
Further, the threshold value of the binaryzation of difference image described in the step 2 presets.
Preferably, spend as a comparison with bright spot in the image and the difference of the brightness value of dim spot, if contrast is greater than setting value, then establishing default value is threshold value, if contrast is less than or equal to setting value, then be about three times and marginal point the darkest general automatic selected threshold of characteristics in image of picture traverse according to the number of marginal point in the image.
Preferably, calculate the gradient direction of described substrate edges candidate point in the step 4, and the intermediate value of compute gradient direction, gradient direction is departed from the candidate point rejecting that described intermediate value surpasses the intermediate value threshold value.
Preferably, the fitting formula of the straight-line equation parameter on substrate both sides is in the step 6
Wherein, (xi, yi) is the substrate edges point of described first side, (xj, yj) be the substrate edges point of described Second Edge, k1 is the slope of described first side place straight line, and b1, b2 are respectively the intercept of described first side, described Second Edge place straight line.
Preferably, in the step 6 substrate wherein on one side the fitting formula of straight-line equation parameter be
Wherein, (xi, yi) is the substrate edges point of described first side, and k1 is the slope of described first side place straight line, and b1 is the intercept of described first side place straight line.
Preferably, comprise that also the image coordinate with described substrate edges point is converted to physical coordinates before the step 6.
Preferably, in the step 1 described input picture being carried out difference is to carry out convolution algorithm by vertical difference operator.
Preferably, described non-maximal value suppress for described difference image binaryzation and the extreme value after carrying out projection as the possible position of described substrate edges in image.Wherein said possible position can be any position in the image.
The invention has the advantages that the Boundary extracting algorithm in the measuring method has comprised effective mechanism, got rid of interior of articles and outside point, can under the lighting condition of wider range, work, thus have fast, robust, accurately characteristics, and reproducibility be high.
Description of drawings
Can be by following detailed Description Of The Invention and appended graphic being further understood about the advantages and spirit of the present invention.
Fig. 1 is the process flow diagram of substrate prealignment pose measuring method of the present invention;
Fig. 2 is the input picture of substrate;
Fig. 3 is the image after Fig. 2 gets rid of negative marginal point;
Fig. 4 is the lighting system synoptic diagram that prospect light adds bias light;
Fig. 5 is the synoptic diagram of substrate and image sensor field of view;
Fig. 6 is near the brightness uniformity synoptic diagram marginal point.
Embodiment
Describe specific embodiments of the invention in detail below in conjunction with accompanying drawing.
Use CCD or other imageing sensors to obtain the image of measured base plate, with reference to shown in Figure 2, carry out convolution algorithm by vertical difference operator, establish the result images that obtains edge by name.On edge figure, most of area grayscale value is 0(or very little).Exist some pixel grey scales to be greater than or less than 0 such as the positive and negative position of Fig. 1 mark.Ignore (setting to 0) wherein less than 0 part, namely gray scale is from top to bottom got rid of from bright dimmed marginal point, only keep difference value greater than 0 point, so just got rid of the impact of negative marginal point, obtain image edge11Pos, as shown in Figure 3.
To carrying out horizontal projection behind the edge11Pos image binaryzation.Because substrate boundaries can not carried out photoetching with interior 5mm, should be unable to there be too many horizontal edge point in the image of its counterpart.And can there be a large amount of marginal points in the substrate boundaries place.So the y value of substrate edges point is usually near the extreme value of projection.Therefore follow-up will be near each extreme value place the search marginal point, until find correct substrate edges.In the binaryzation process, the threshold value automatic setting.With the difference of bright spot in the image and the brightness value of dim spot contrast the most, if contrast is larger, then with fixed value, carry out binaryzation such as 20 for threshold value.If contrast is lower, then carry out binaryzation with empirical value (number of marginal point is about three times and marginal point the darkest general characteristics in image of picture traverse in the image).
Even if after filtering, often there are many burrs in the projection, therefore should not directly look for Local Extremum.The method that this patent has adopted non-maximal value to suppress is looked for extreme point in projection, makes more accurate and effective of the extreme point found out.
Adopt projection and look for the method for extreme value, roughly determined substrate edges position (such as capable capable to nEnd from nStart).The benefit of doing like this is to have greatly reduced operand, and has got rid of the impact of the interference beyond the zone.
Near edge11Pos image substrate edge possible position, for example every row from nStart walk to nEnd capable in search value store into the edgesCand array greater than 0 the extreme point candidate point as this row substrate edges.Select extreme point namely to select the right and left to change the fiercest place as marginal point as the edge.Then the candidate marginal in the edgesCand array is filtered.Substrate boundaries has formed straight line in image, and the gradient direction of the point on the straight line should be consistent.Can be with some noise removes that may exist in the edgesCand array according to this knowledge, reject such as the marginal point that candidate marginal gradient direction and intermediate value difference is large.For example, calculate the gradient direction of described substrate edges candidate point, and the intermediate value of compute gradient direction, gradient direction is departed from the candidate point rejecting that described intermediate value surpasses the intermediate value threshold value.Be subject to the impact of some interference, nStart, nEnd may depart from true value, and the marginal point that extracts all is wrong.Therefore the marginal point that extracts is given a mark, if minute not high enough, then re-start extraction take the possible position of next substrate edges in image as the basis.
With reference to shown in Figure 4, add under the lighting system of bias light at the prospect of employing light, brightness generally has very high consistance in the real marginal point both sides certain limit, as shown in Figure 6.Among Fig. 4, light source 2 emission of lights are by projection objective 3, and a part incides on the substrate 4, and a part incides that catoptron 5 is rear to be returned along former road, imageing sensor or camera 1 are positioned at projection objective 3 tops, and this has formed the lighting system that prospect light adds background light.According to the gradient both forward and reverse directions of marginal point, choose the variance of gray scale in two zones and the zoning as the tolerance of brightness uniformity for this reason.The marking height if variance is little, variance is greatly then given a mark low.With the marking average of each marginal point score as whole edge.
At last, adopt the method for match so that the substrate edges point that extracts reaches sub-pixel precision.
About the position of marginal point, the calibration point coordinate that match obtains can adopt some camera calibration algorithms to calculate respectively the transformational relation of two camera image coordinate systems and certain physical coordinates (such as the XY coordinate system) all take pixel as unit.By this transformational relation, calculating the substrate edges point is position among the XY at physical coordinates.Among Fig. 5, the coordinate of marginal point in the XY coordinate system of establishing on the vertical edge 6 is (xi, yi), and the coordinate of the marginal point on the horizontal edge 7 in the XY coordinate system is (xj, yj).
Position and the attitude that can calculate substrate according to the marginal point that obtains and physical coordinates thereof.
According to the SEMI standard, substrate is a rectangle, its verticality should long limit 1/1000 in.The verticality that this shows substrate is better.This patent utilizes this characteristics, has proposed a kind of pose computing method of utilizing the board structure characteristic.Computation process is as follows:
Be located in the XY coordinate system, the straight-line equation of vertical edge 6 is y=k1*x+b1, and the straight-line equation of horizontal edge 7 is y=-1/k1*x+b2.Solve k1 by least square method, b1, b2.That is:
Solve k1, b1, b2 ask the intersection point of two straight lines again, in conjunction with the nominal value of the size of substrate, can calculate the position deviation (namely eccentric) of substrate.
Need to prove that the method is thought the substrate edges error that has been vertical introducing.But this error is on not impact of repdocutbility.Influence factor mainly is the quality of pattern, optical system and the CCD imaging of substrate edges.
By least square method, find the solution the straight-line equation (take vertical edge 6 as example) of horizontal edge 7 or vertical edge 6:
Solve vertical edge 6 straight-line equation parameters, with the angle of itself and coordinate system as deflection.
The present invention utilizes the method for the architectural characteristic of substrate own, and the structural parameters that the marginal point on the both sides that collect is put together to substrate carry out once fitting, can obtain preferably measuring accuracy.The structural parameters that the marginal point that two imageing sensors are collected is put together to substrate carry out once fitting, under worst case (the substrate verticality is poor), the method that the method is mentioned in than US6847730 on directed reproducibility is low, orientation accuracy is better than the method for US6847730, and reproducibility is higher in general.
Substrate described in the present invention is glass substrate.
Described in this instructions is preferred embodiment of the present invention, and above embodiment is only in order to illustrate technical scheme of the present invention but not limitation of the present invention.All those skilled in the art all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (9)
1. a substrate prealignment pose measuring method is characterized in that, comprising:
Step 1, imageing sensor are surveyed described substrate and are obtained input picture, and described input picture is carried out difference and gets rid of marginal edge point, obtain difference image;
Step 2, to described difference image binaryzation and after carrying out projection, described substrate intersects both sides and is respectively first side and Second Edge, adopts non-maximal value to suppress to determine that described first side and described Second Edge divide the possible position of other substrate edges in image;
Step 3 is searched for described difference image near the possible position of described substrate edges in image, with the difference extreme point as the substrate edges candidate point;
Step 4 according to the falt characteristic of substrate edges, is rejected the flase drop point that the image noise in the described substrate edges candidate point causes, obtains described first side and described Second Edge substrate edges point;
Step 5 judges whether described substrate edges point satisfies the requirement of brightness uniformity, if satisfy then enter step 6, if do not satisfy, then jumps to the possible position of next substrate edges in image, returns step 3;
Step 6, utilize described first side vertical with described Second Edge, go out the position that calculates described substrate after the straight-line equation parameter of described first side and described Second Edge according to described substrate edges point by least square fitting, simulate separately the attitude that described substrate wherein calculates described substrate after on one side the straight-line equation parameter.
2. substrate prealignment pose measuring method according to claim 1 is characterized in that, the threshold value of the binaryzation of difference image described in the step 2 presets.
3. substrate prealignment pose measuring method according to claim 2, it is characterized in that, spend as a comparison with bright spot in the image and the difference of the brightness value of dim spot, if contrast is greater than setting value, then establishing default value is threshold value, if contrast is less than or equal to setting value, then be about three times and marginal point the darkest general automatic selected threshold of characteristics in image of picture traverse according to the number of marginal point in the image.
4. substrate prealignment pose measuring method according to claim 1, it is characterized in that, calculate the gradient direction of described substrate edges candidate point in the step 4, and the intermediate value of compute gradient direction, gradient direction is departed from the candidate point rejecting that described intermediate value surpasses the intermediate value threshold value.
5. substrate prealignment pose measuring method according to claim 1 is characterized in that, the fitting formula of the straight-line equation parameter on substrate both sides is in the step 6
Wherein, (xi, yi) is the substrate edges point of described first side, (xj, yj) be the substrate edges point of described Second Edge, k1 is the slope of described first side place straight line, and b1, b2 are respectively the intercept of described first side, described Second Edge place straight line.
6. substrate prealignment pose measuring method according to claim 1 is characterized in that, in the step 6 substrate wherein on one side the fitting formula of straight-line equation parameter be
，
Wherein, (xi, yi) is the substrate edges point of described first side, and k1 is the slope of described first side place straight line, and b1 is the intercept of described first side place straight line.
7. substrate prealignment pose measuring method according to claim 1 is characterized in that, comprises that also the image coordinate with described substrate edges point is converted to physical coordinates before the step 6.
8. substrate prealignment pose measuring method according to claim 1 is characterized in that, in the step 1 described input picture being carried out difference is to carry out convolution algorithm by vertical difference operator.
9. substrate prealignment pose measuring method according to claim 1 is characterized in that, described non-maximal value suppress for described difference image binaryzation and the extreme value after carrying out projection as the possible position of described substrate edges in image.
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| CN108074225A (en) * | 2016-11-11 | 2018-05-25 | 中国石油化工股份有限公司抚顺石油化工研究院 | Sulfide information extracting method and device |
| CN108416787A (en) * | 2018-03-06 | 2018-08-17 | 昆山海克易邦光电科技有限公司 | Workpiece linear edge localization method applied to Machine Vision Detection |
| CN109642785A (en) * | 2016-09-21 | 2019-04-16 | 株式会社斯库林集团 | The detection method of the positional shift of sample container and the detection device for using the image pickup method of this method and the positional shift of sample container |
| CN111724346A (en) * | 2020-05-21 | 2020-09-29 | 北京配天技术有限公司 | Linear edge detection method, robot and storage device |
| CN112509940A (en) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |
| CN112992735A (en) * | 2021-02-07 | 2021-06-18 | 锋睿领创(珠海)科技有限公司 | Semiconductor bonding pose compensation repairing method and device and storage medium |
| WO2024004326A1 (en) * | 2022-06-29 | 2024-01-04 | キヤノントッキ株式会社 | Alignment device, film forming device, and alignment method |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106204531A (en) * | 2016-06-24 | 2016-12-07 | 安徽理工大学 | Noise and the method for marginal point in a kind of synchronous detecting coloured image |
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| CN108074225A (en) * | 2016-11-11 | 2018-05-25 | 中国石油化工股份有限公司抚顺石油化工研究院 | Sulfide information extracting method and device |
| CN108074225B (en) * | 2016-11-11 | 2022-03-08 | 中国石油化工股份有限公司抚顺石油化工研究院 | Sulfide information extraction method and device |
| CN108416787A (en) * | 2018-03-06 | 2018-08-17 | 昆山海克易邦光电科技有限公司 | Workpiece linear edge localization method applied to Machine Vision Detection |
| CN112509940A (en) * | 2019-09-13 | 2021-03-16 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |
| CN112509940B (en) * | 2019-09-13 | 2024-03-26 | 株式会社斯库林集团 | Substrate processing apparatus and substrate processing method |
| CN111724346A (en) * | 2020-05-21 | 2020-09-29 | 北京配天技术有限公司 | Linear edge detection method, robot and storage device |
| CN112992735A (en) * | 2021-02-07 | 2021-06-18 | 锋睿领创(珠海)科技有限公司 | Semiconductor bonding pose compensation repairing method and device and storage medium |
| CN112992735B (en) * | 2021-02-07 | 2021-09-10 | 锋睿领创(珠海)科技有限公司 | Semiconductor bonding pose compensation repairing method and device and storage medium |
| WO2024004326A1 (en) * | 2022-06-29 | 2024-01-04 | キヤノントッキ株式会社 | Alignment device, film forming device, and alignment method |
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